TW202434008A - 積層構造物、其之製造方法、硬化物及電子零件 - Google Patents

積層構造物、其之製造方法、硬化物及電子零件 Download PDF

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Publication number
TW202434008A
TW202434008A TW112140603A TW112140603A TW202434008A TW 202434008 A TW202434008 A TW 202434008A TW 112140603 A TW112140603 A TW 112140603A TW 112140603 A TW112140603 A TW 112140603A TW 202434008 A TW202434008 A TW 202434008A
Authority
TW
Taiwan
Prior art keywords
resin layer
mass
resin
film
inorganic filler
Prior art date
Application number
TW112140603A
Other languages
English (en)
Chinese (zh)
Inventor
青山良朋
中佑介
仲田和貴
Original Assignee
日商太陽控股股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商太陽控股股份有限公司 filed Critical 日商太陽控股股份有限公司
Publication of TW202434008A publication Critical patent/TW202434008A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
TW112140603A 2022-10-24 2023-10-24 積層構造物、其之製造方法、硬化物及電子零件 TW202434008A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2022169932 2022-10-24
JP2022-169932 2022-10-24
JP2023095020 2023-06-08
JP2023-095020 2023-06-08

Publications (1)

Publication Number Publication Date
TW202434008A true TW202434008A (zh) 2024-08-16

Family

ID=90830944

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112140603A TW202434008A (zh) 2022-10-24 2023-10-24 積層構造物、其之製造方法、硬化物及電子零件

Country Status (6)

Country Link
EP (1) EP4610048A1 (https=)
JP (1) JPWO2024090394A1 (https=)
KR (1) KR20250114308A (https=)
CN (1) CN120379837A (https=)
TW (1) TW202434008A (https=)
WO (1) WO2024090394A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02261858A (ja) * 1989-03-31 1990-10-24 Unitika Ltd 耐衝撃性樹脂組成物
US20050159542A1 (en) * 2004-01-17 2005-07-21 General Electric Company Compositions useful as coatings, their preparation, and articles made therefrom
JP6205692B2 (ja) 2012-09-03 2017-10-04 味の素株式会社 熱硬化性エポキシ樹脂組成物、絶縁層形成用接着フィルム及び多層プリント配線板
TWI620763B (zh) * 2017-04-27 2018-04-11 Taiwan Union Technology Corporation 樹脂組成物、及使用該樹脂組成物所製得之預浸漬片、金屬箔積層板及印刷電路板
JP2020176239A (ja) * 2019-04-22 2020-10-29 帝人株式会社 エポキシ樹脂組成物、プリプレグ、プリプレグの製造方法、及び繊維強化複合材料の製造方法

Also Published As

Publication number Publication date
CN120379837A (zh) 2025-07-25
EP4610048A1 (en) 2025-09-03
JPWO2024090394A1 (https=) 2024-05-02
KR20250114308A (ko) 2025-07-29
WO2024090394A1 (ja) 2024-05-02

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