KR20250100800A - 극도의 균일성의 가열식 기판 지지 조립체 - Google Patents

극도의 균일성의 가열식 기판 지지 조립체 Download PDF

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Publication number
KR20250100800A
KR20250100800A KR1020257021454A KR20257021454A KR20250100800A KR 20250100800 A KR20250100800 A KR 20250100800A KR 1020257021454 A KR1020257021454 A KR 1020257021454A KR 20257021454 A KR20257021454 A KR 20257021454A KR 20250100800 A KR20250100800 A KR 20250100800A
Authority
KR
South Korea
Prior art keywords
substrate
support assembly
substrate support
temperature
heaters
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257021454A
Other languages
English (en)
Korean (ko)
Inventor
데이비드 벤자민슨
비제이 디. 파케
온카라 스와미 코라 시다라마이아
커비 에이치. 플로이드
저스틴 왕
메흐메트 투그룰 사미르
드미트리 루보미르스키
Original Assignee
어플라이드 머티어리얼스, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 어플라이드 머티어리얼스, 인코포레이티드 filed Critical 어플라이드 머티어리얼스, 인코포레이티드
Publication of KR20250100800A publication Critical patent/KR20250100800A/ko
Pending legal-status Critical Current

Links

Classifications

    • H01L21/6833—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H01J37/32724—Temperature
    • H01L21/67103—
    • H01L21/67109—
    • H01L21/67248—
    • H01L21/68735—
    • H01L21/68757—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7611—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/334—Etching
    • H01J2237/3341—Reactive etching

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Resistance Heating (AREA)
  • Chemical Vapour Deposition (AREA)
KR1020257021454A 2018-05-31 2019-05-03 극도의 균일성의 가열식 기판 지지 조립체 Pending KR20250100800A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201862678540P 2018-05-31 2018-05-31
US62/678,540 2018-05-31
PCT/US2019/030741 WO2019231614A1 (en) 2018-05-31 2019-05-03 Extreme uniformity heated substrate support assembly
KR1020227041112A KR20220163508A (ko) 2018-05-31 2019-05-03 극도의 균일성의 가열식 기판 지지 조립체

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020227041112A Division KR20220163508A (ko) 2018-05-31 2019-05-03 극도의 균일성의 가열식 기판 지지 조립체

Publications (1)

Publication Number Publication Date
KR20250100800A true KR20250100800A (ko) 2025-07-03

Family

ID=68693589

Family Applications (3)

Application Number Title Priority Date Filing Date
KR1020257021454A Pending KR20250100800A (ko) 2018-05-31 2019-05-03 극도의 균일성의 가열식 기판 지지 조립체
KR1020207033946A Active KR102471635B1 (ko) 2018-05-31 2019-05-03 극도의 균일성의 가열식 기판 지지 조립체
KR1020227041112A Ceased KR20220163508A (ko) 2018-05-31 2019-05-03 극도의 균일성의 가열식 기판 지지 조립체

Family Applications After (2)

Application Number Title Priority Date Filing Date
KR1020207033946A Active KR102471635B1 (ko) 2018-05-31 2019-05-03 극도의 균일성의 가열식 기판 지지 조립체
KR1020227041112A Ceased KR20220163508A (ko) 2018-05-31 2019-05-03 극도의 균일성의 가열식 기판 지지 조립체

Country Status (6)

Country Link
US (1) US12488967B2 (https=)
JP (3) JP7662339B2 (https=)
KR (3) KR20250100800A (https=)
CN (1) CN112088427A (https=)
TW (1) TWI702685B (https=)
WO (1) WO2019231614A1 (https=)

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Also Published As

Publication number Publication date
KR102471635B1 (ko) 2022-11-29
JP7662339B2 (ja) 2025-04-15
JP2022020732A (ja) 2022-02-01
US20190371577A1 (en) 2019-12-05
JP7662489B2 (ja) 2025-04-15
JP2021525454A (ja) 2021-09-24
TWI702685B (zh) 2020-08-21
TW202004980A (zh) 2020-01-16
US12488967B2 (en) 2025-12-02
JP2025072361A (ja) 2025-05-09
KR20220163508A (ko) 2022-12-09
WO2019231614A1 (en) 2019-12-05
KR20200136495A (ko) 2020-12-07
CN112088427A (zh) 2020-12-15

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