KR20250006133A - 두께 분포 계측 장치 및 두께 분포 계측 방법 - Google Patents

두께 분포 계측 장치 및 두께 분포 계측 방법 Download PDF

Info

Publication number
KR20250006133A
KR20250006133A KR1020247038019A KR20247038019A KR20250006133A KR 20250006133 A KR20250006133 A KR 20250006133A KR 1020247038019 A KR1020247038019 A KR 1020247038019A KR 20247038019 A KR20247038019 A KR 20247038019A KR 20250006133 A KR20250006133 A KR 20250006133A
Authority
KR
South Korea
Prior art keywords
light
thickness
unit
thickness distribution
image sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247038019A
Other languages
English (en)
Korean (ko)
Inventor
구니히코 츠치야
도루 마츠모토
데츠야 다카
겐이치 오츠카
Original Assignee
하마마츠 포토닉스 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 하마마츠 포토닉스 가부시키가이샤 filed Critical 하마마츠 포토닉스 가부시키가이샤
Publication of KR20250006133A publication Critical patent/KR20250006133A/ko
Pending legal-status Critical Current

Links

Images

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/02Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0625Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/02Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0691Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of objects while moving
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/30Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/02Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
    • G01B21/04Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness by measuring coordinates of points
    • G01B21/045Correction of measurements
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B5/00Measuring arrangements characterised by the use of mechanical techniques
    • G01B5/0002Arrangements for supporting, fixing or guiding the measuring instrument or the object to be measured
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/89Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
    • G01N21/8901Optical details; Scanning details
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B2210/00Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
    • G01B2210/40Caliper-like sensors
    • G01B2210/46Caliper-like sensors with one or more detectors on a single side of the object to be measured and with a transmitter on the other side
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B2210/00Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
    • G01B2210/50Using chromatic effects to achieve wavelength-dependent depth resolution

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Textile Engineering (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Length Measuring Devices By Optical Means (AREA)
KR1020247038019A 2022-04-27 2023-03-01 두께 분포 계측 장치 및 두께 분포 계측 방법 Pending KR20250006133A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2022-073083 2022-04-27
JP2022073083 2022-04-27
PCT/JP2023/007633 WO2023210154A1 (ja) 2022-04-27 2023-03-01 厚み分布計測装置および厚み分布計測方法

Publications (1)

Publication Number Publication Date
KR20250006133A true KR20250006133A (ko) 2025-01-10

Family

ID=88518443

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247038019A Pending KR20250006133A (ko) 2022-04-27 2023-03-01 두께 분포 계측 장치 및 두께 분포 계측 방법

Country Status (7)

Country Link
US (1) US20250244123A1 (https=)
EP (1) EP4477990A4 (https=)
JP (1) JP7849465B2 (https=)
KR (1) KR20250006133A (https=)
CN (1) CN119156517A (https=)
TW (1) TW202409513A (https=)
WO (1) WO2023210154A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119915190B (zh) * 2025-04-02 2025-07-29 成都沃特塞恩电子技术有限公司 晶体生长厚度实时在线测量方法、装置、设备及介质

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015141176A (ja) 2014-01-30 2015-08-03 浜松ホトニクス株式会社 膜厚計測方法及び膜厚計測装置
JP2017046241A (ja) 2015-08-27 2017-03-02 キヤノン・コンポーネンツ株式会社 画像読取装置
JP2020170973A (ja) 2019-04-04 2020-10-15 キヤノン・コンポーネンツ株式会社 センサユニット、読取装置、画像形成装置及び判定装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000241125A (ja) * 1999-02-19 2000-09-08 Nippon Electro Sensari Device Kk 寸法測定装置
JP2004219108A (ja) 2003-01-09 2004-08-05 Dainippon Printing Co Ltd 着色膜の膜厚ムラ検査方法及び装置
JP2009168581A (ja) * 2008-01-15 2009-07-30 Saki Corp:Kk 被検査体の検査装置
JP5942494B2 (ja) * 2012-03-12 2016-06-29 コニカミノルタ株式会社 厚さ測定装置及び厚さ測定方法
JP6592281B2 (ja) * 2015-06-11 2019-10-16 住友化学株式会社 目付量測定方法、積層フィルム製造方法、及び目付量測定装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015141176A (ja) 2014-01-30 2015-08-03 浜松ホトニクス株式会社 膜厚計測方法及び膜厚計測装置
JP2017046241A (ja) 2015-08-27 2017-03-02 キヤノン・コンポーネンツ株式会社 画像読取装置
JP2020170973A (ja) 2019-04-04 2020-10-15 キヤノン・コンポーネンツ株式会社 センサユニット、読取装置、画像形成装置及び判定装置

Also Published As

Publication number Publication date
JPWO2023210154A1 (https=) 2023-11-02
EP4477990A1 (en) 2024-12-18
JP7849465B2 (ja) 2026-04-21
TW202409513A (zh) 2024-03-01
CN119156517A (zh) 2024-12-17
EP4477990A4 (en) 2026-02-11
US20250244123A1 (en) 2025-07-31
WO2023210154A1 (ja) 2023-11-02

Similar Documents

Publication Publication Date Title
JP6763971B2 (ja) 光学距離センサを較正するためのシステム及び方法
CN112985603B (zh) 用于非接触式感测物质的基准开关架构
US10382701B2 (en) Active imaging systems and method
JP2019504331A5 (https=)
CN114127520A (zh) 光谱仪装置
US10088428B2 (en) Surface refractive index scanning system and method
JP7325500B2 (ja) 分光計装置
US11156566B2 (en) High sensitivity image-based reflectometry
US20150346484A1 (en) Optical scanning device, method of adjusting optical scanning device, and image forming apparatus
KR20250006133A (ko) 두께 분포 계측 장치 및 두께 분포 계측 방법
KR102783910B1 (ko) 방사선 화상 독취 장치
US20160011075A1 (en) Measurement of Focal Points and other Features in Optical Systems
CN109346492A (zh) 线阵图像传感器像素阵列及物体表面缺陷检测方法
KR20150114199A (ko) 자동초점거리 조절 기능을 갖는 렌즈 검사장치
CN108027317B (zh) 参考方案中的测量时间分布
US8928883B1 (en) Optical device for detection of an agent
US8582104B2 (en) Optical device for detection of an agent
US20250052562A1 (en) Solid-state imaging device, shape-measuring device, and shape-measuring method
US9423359B2 (en) Wafer charging electromagnetic inspection tool and method of using
US20190204159A1 (en) Apparatus and method for producing thermal image data
KR20250006099A (ko) 굴절률 분포 계측 장치, 막 두께 분포 계측 장치, 굴절률 분포 계측 방법, 및 막 두께 분포 계측 방법
JP2008139062A (ja) 分光測定装置よび分光測定方法
JP7199945B2 (ja) 光学的測定装置
CN1603868A (zh) 光束诊断装置和方法
JP2021045579A (ja) 放射線画像読取装置

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20241114

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application