KR20240140978A - 열전도성 실리콘 조성물 - Google Patents

열전도성 실리콘 조성물 Download PDF

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Publication number
KR20240140978A
KR20240140978A KR1020247029728A KR20247029728A KR20240140978A KR 20240140978 A KR20240140978 A KR 20240140978A KR 1020247029728 A KR1020247029728 A KR 1020247029728A KR 20247029728 A KR20247029728 A KR 20247029728A KR 20240140978 A KR20240140978 A KR 20240140978A
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KR
South Korea
Prior art keywords
thermally conductive
silicone composition
hardness
conductive silicone
cured product
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247029728A
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English (en)
Korean (ko)
Inventor
토모히사 미즈노
Original Assignee
가부시키가이샤 타이카
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Publication date
Application filed by 가부시키가이샤 타이카 filed Critical 가부시키가이샤 타이카
Publication of KR20240140978A publication Critical patent/KR20240140978A/ko
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020247029728A 2022-03-31 2023-03-17 열전도성 실리콘 조성물 Pending KR20240140978A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2022-057768 2022-03-31
JP2022057768 2022-03-31
PCT/JP2023/010516 WO2023189699A1 (ja) 2022-03-31 2023-03-17 熱伝導性シリコーン組成物

Publications (1)

Publication Number Publication Date
KR20240140978A true KR20240140978A (ko) 2024-09-24

Family

ID=88201803

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247029728A Pending KR20240140978A (ko) 2022-03-31 2023-03-17 열전도성 실리콘 조성물

Country Status (6)

Country Link
US (1) US20250101227A1 (https=)
JP (1) JPWO2023189699A1 (https=)
KR (1) KR20240140978A (https=)
CN (1) CN118946637A (https=)
TW (1) TW202403011A (https=)
WO (1) WO2023189699A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025187619A1 (ja) * 2024-03-05 2025-09-12 信越化学工業株式会社 熱伝導性シリコーン組成物

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002016126A (ja) 2000-04-25 2002-01-18 Tokyo Electron Ltd 被処理体の載置装置
JP2002033376A (ja) 2000-07-17 2002-01-31 Tokyo Electron Ltd 被処理体の載置装置
KR20220036899A (ko) 2020-09-16 2022-03-23 (주)뤼이드 사용자의 학습효과를 반영하여 추천문제를 결정하는 학습 컨텐츠 추천 장치, 시스템 및 그것의 동작 방법
KR102623380B1 (ko) 2021-05-10 2024-01-09 전북대학교산학협력단 다공질 귀리엿의 제조방법 및 이에 의해 제조된 다공질 귀리엿

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010120979A (ja) * 2008-11-17 2010-06-03 Taika:Kk 熱伝導性シリコーンゲル硬化物
JP6006649B2 (ja) * 2013-01-29 2016-10-12 株式会社タイカ 耐熱性に優れた熱伝導性樹脂組成物およびそれを用いた放熱部品
CN111295422B (zh) * 2017-11-07 2022-11-04 陶氏东丽株式会社 有机聚硅氧烷组成物
JP6981914B2 (ja) * 2018-04-09 2021-12-17 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
JP7055255B1 (ja) * 2020-09-03 2022-04-15 富士高分子工業株式会社 熱伝導性シリコーン組成物の製造方法
CN113736266B (zh) * 2021-09-27 2023-07-07 广州集泰化工股份有限公司 一种双组份导热凝胶及其制备方法和应用

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002016126A (ja) 2000-04-25 2002-01-18 Tokyo Electron Ltd 被処理体の載置装置
JP2002033376A (ja) 2000-07-17 2002-01-31 Tokyo Electron Ltd 被処理体の載置装置
KR20220036899A (ko) 2020-09-16 2022-03-23 (주)뤼이드 사용자의 학습효과를 반영하여 추천문제를 결정하는 학습 컨텐츠 추천 장치, 시스템 및 그것의 동작 방법
KR102623380B1 (ko) 2021-05-10 2024-01-09 전북대학교산학협력단 다공질 귀리엿의 제조방법 및 이에 의해 제조된 다공질 귀리엿

Also Published As

Publication number Publication date
US20250101227A1 (en) 2025-03-27
CN118946637A (zh) 2024-11-12
WO2023189699A1 (ja) 2023-10-05
TW202403011A (zh) 2024-01-16
JPWO2023189699A1 (https=) 2023-10-05

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