KR20240137093A - 열전도성 실리콘 조성물 및 그 제조 방법 - Google Patents

열전도성 실리콘 조성물 및 그 제조 방법 Download PDF

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Publication number
KR20240137093A
KR20240137093A KR1020247028952A KR20247028952A KR20240137093A KR 20240137093 A KR20240137093 A KR 20240137093A KR 1020247028952 A KR1020247028952 A KR 1020247028952A KR 20247028952 A KR20247028952 A KR 20247028952A KR 20240137093 A KR20240137093 A KR 20240137093A
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South Korea
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component
group
thermally conductive
mass
components
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Korean (ko)
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구니히로 야마다
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신에쓰 가가꾸 고교 가부시끼가이샤
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C09D183/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/01—Hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/06—Preparatory processes
    • C08G77/08—Preparatory processes characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C08K3/105—Compounds containing metals of Groups 1 to 3 or of Groups 11 to 13 of the Periodic Table
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/20—Diluents or solvents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/02—Materials undergoing a change of physical state when used
    • C09K5/06—Materials undergoing a change of physical state when used the change of state being from liquid to solid or vice versa
    • C09K5/063—Materials absorbing or liberating heat during crystallisation; Heat storage materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2296—Oxides; Hydroxides of metals of zinc
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020247028952A 2022-02-02 2023-01-16 열전도성 실리콘 조성물 및 그 제조 방법 Pending KR20240137093A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022014638 2022-02-02
JPJP-P-2022-014638 2022-02-02
PCT/JP2023/000956 WO2023149175A1 (ja) 2022-02-02 2023-01-16 熱伝導性シリコーン組成物及びその製造方法

Publications (1)

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KR20240137093A true KR20240137093A (ko) 2024-09-19

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KR1020247028952A Pending KR20240137093A (ko) 2022-02-02 2023-01-16 열전도성 실리콘 조성물 및 그 제조 방법

Country Status (7)

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US (1) US20250115784A1 (cg-RX-API-DMAC7.html)
EP (1) EP4474429A4 (cg-RX-API-DMAC7.html)
JP (1) JP7882275B2 (cg-RX-API-DMAC7.html)
KR (1) KR20240137093A (cg-RX-API-DMAC7.html)
CN (1) CN118742609A (cg-RX-API-DMAC7.html)
TW (1) TWI926166B (cg-RX-API-DMAC7.html)
WO (1) WO2023149175A1 (cg-RX-API-DMAC7.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025039021A (ja) * 2023-09-08 2025-03-21 信越化学工業株式会社 熱伝導性シリコーン組成物

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53408U (cg-RX-API-DMAC7.html) 1976-06-23 1978-01-06
JPS5388329U (cg-RX-API-DMAC7.html) 1976-12-18 1978-07-20
JPS541390B2 (cg-RX-API-DMAC7.html) 1974-03-07 1979-01-24
JP2000169873A (ja) 1998-12-02 2000-06-20 Shin Etsu Chem Co Ltd シリコーングリース組成物
JP2004210856A (ja) 2002-12-27 2004-07-29 Shin Etsu Chem Co Ltd 熱伝導性シリコーングリース組成物
JP2005162975A (ja) 2003-12-05 2005-06-23 Ge Toshiba Silicones Co Ltd 熱伝導性シリコーン組成物
JP2006143978A (ja) 2004-11-25 2006-06-08 Ge Toshiba Silicones Co Ltd 熱伝導性シリコーン組成物
JP3195277U (ja) 2014-08-06 2015-01-15 横尾 雅道 毛鉤用携帯糸通し器

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3541390B2 (ja) 1991-02-22 2004-07-07 東レ・ダウコーニング・シリコーン株式会社 グリース状シリコーン組成物およびその製造方法
JP3195277B2 (ja) 1997-08-06 2001-08-06 信越化学工業株式会社 熱伝導性シリコーン組成物
JP3948642B2 (ja) 1998-08-21 2007-07-25 信越化学工業株式会社 熱伝導性グリース組成物及びそれを使用した半導体装置
CA2343486A1 (en) * 2000-10-17 2002-04-17 The Bergquist Company Method of preparing thermally conductive compounds by liquid metal bridged particle clusters
JP4796704B2 (ja) 2001-03-30 2011-10-19 株式会社タイカ 押出可能な架橋済グリース状放熱材を充填・封入した容器の製法
US6620515B2 (en) * 2001-12-14 2003-09-16 Dow Corning Corporation Thermally conductive phase change materials
JP4130091B2 (ja) 2002-04-10 2008-08-06 信越化学工業株式会社 放熱用シリコーングリース組成物
JP2005194479A (ja) * 2004-01-09 2005-07-21 Inoac Corp 放熱成形品用の混練剤及び放熱成形品
JP4860229B2 (ja) * 2005-10-11 2012-01-25 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 熱伝導性グリース組成物
JP5300408B2 (ja) 2008-10-21 2013-09-25 信越化学工業株式会社 熱伝導性シリコーングリース組成物
JP5388329B2 (ja) 2008-11-26 2014-01-15 株式会社デンソー 放熱用シリコーングリース組成物
JP5565758B2 (ja) * 2011-06-29 2014-08-06 信越化学工業株式会社 硬化性でグリース状の熱伝導性シリコーン組成物および半導体装置
JP5640945B2 (ja) * 2011-10-11 2014-12-17 信越化学工業株式会社 硬化性オルガノポリシロキサン組成物及び半導体装置
JP5843368B2 (ja) * 2013-05-07 2016-01-13 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
JP6705426B2 (ja) * 2017-05-09 2020-06-03 信越化学工業株式会社 熱伝導性シリコーン組成物
CN112805334B (zh) * 2018-11-07 2023-08-04 陶氏环球技术有限责任公司 导热组合物以及使用所述组合物的方法和装置
EP4050068B1 (en) * 2019-10-24 2025-01-29 Shin-Etsu Chemical Co., Ltd. Thermally conductive silicone composition and production method therefor
CN112980189B (zh) * 2019-12-13 2022-05-20 赛伦(厦门)新材料科技有限公司 一种渗油率低和耐热性好的导热硅胶垫及制备方法
JP7325324B2 (ja) * 2019-12-23 2023-08-14 信越化学工業株式会社 熱伝導性シリコーン組成物
FI4134392T3 (fi) * 2020-04-06 2025-09-24 Sekisui Chemical Co Ltd Hartsikoostumus, lämpöä säteilevä elementti ja elektroninen laite
JP7237884B2 (ja) * 2020-04-17 2023-03-13 信越化学工業株式会社 熱伝導性シリコーン組成物
CN112694869A (zh) * 2020-12-07 2021-04-23 杭州诺麦科科技有限公司 导热材料、制备方法及其应用
EP4333047A4 (en) * 2021-04-28 2025-04-30 Shin-Etsu Chemical Co., Ltd. CURABLE SILICONE COMPOSITION AND SEMICONDUCTOR DEVICE
JP2024060273A (ja) * 2022-10-19 2024-05-02 信越化学工業株式会社 硬化性オルガノポリシロキサン組成物及び半導体装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS541390B2 (cg-RX-API-DMAC7.html) 1974-03-07 1979-01-24
JPS53408U (cg-RX-API-DMAC7.html) 1976-06-23 1978-01-06
JPS5388329U (cg-RX-API-DMAC7.html) 1976-12-18 1978-07-20
JP2000169873A (ja) 1998-12-02 2000-06-20 Shin Etsu Chem Co Ltd シリコーングリース組成物
JP2004210856A (ja) 2002-12-27 2004-07-29 Shin Etsu Chem Co Ltd 熱伝導性シリコーングリース組成物
JP2005162975A (ja) 2003-12-05 2005-06-23 Ge Toshiba Silicones Co Ltd 熱伝導性シリコーン組成物
JP2006143978A (ja) 2004-11-25 2006-06-08 Ge Toshiba Silicones Co Ltd 熱伝導性シリコーン組成物
JP3195277U (ja) 2014-08-06 2015-01-15 横尾 雅道 毛鉤用携帯糸通し器

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JPWO2023149175A1 (cg-RX-API-DMAC7.html) 2023-08-10
EP4474429A4 (en) 2026-02-25
WO2023149175A1 (ja) 2023-08-10
US20250115784A1 (en) 2025-04-10
TW202340376A (zh) 2023-10-16
TWI926166B (zh) 2026-05-21
EP4474429A1 (en) 2024-12-11
CN118742609A (zh) 2024-10-01
JP7882275B2 (ja) 2026-06-30

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