KR20240119078A - 기판 처리 방법, 반도체 장치의 제조 방법, 기판 처리 장치, 및 프로그램 - Google Patents
기판 처리 방법, 반도체 장치의 제조 방법, 기판 처리 장치, 및 프로그램 Download PDFInfo
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- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/65—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials
- H10P14/6516—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials
- H10P14/6529—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials by exposure to a gas or vapour
- H10P14/6532—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials by exposure to a gas or vapour by exposure to a plasma
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
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- C23C16/40—Oxides
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
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- C23C16/45574—Nozzles for more than one gas
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/338—Changing chemical properties of treated surfaces
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Inorganic Chemistry (AREA)
- Analytical Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Formation Of Insulating Films (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021211201 | 2021-12-24 | ||
| JPJP-P-2021-211201 | 2021-12-24 | ||
| PCT/JP2022/031498 WO2023119726A1 (ja) | 2021-12-24 | 2022-08-22 | 基板処理方法、半導体装置の製造方法、基板処理装置、およびプログラム |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20240119078A true KR20240119078A (ko) | 2024-08-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| KR1020247020285A Pending KR20240119078A (ko) | 2021-12-24 | 2022-08-22 | 기판 처리 방법, 반도체 장치의 제조 방법, 기판 처리 장치, 및 프로그램 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20240234132A1 (https=) |
| JP (1) | JP7828977B2 (https=) |
| KR (1) | KR20240119078A (https=) |
| CN (1) | CN117981061A (https=) |
| TW (1) | TWI864491B (https=) |
| WO (1) | WO2023119726A1 (https=) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016066688A (ja) | 2014-09-24 | 2016-04-28 | 株式会社日立国際電気 | 半導体装置の製造方法、基板処理装置およびプログラム |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5864637B2 (ja) * | 2013-03-19 | 2016-02-17 | 株式会社日立国際電気 | 半導体装置の製造方法、基板処理装置、プログラム及び記録媒体 |
| JP5788448B2 (ja) * | 2013-09-09 | 2015-09-30 | 株式会社日立国際電気 | 半導体装置の製造方法、基板処理装置及びプログラム |
| KR101846850B1 (ko) * | 2013-09-30 | 2018-04-09 | 가부시키가이샤 히다치 고쿠사이 덴키 | 반도체 장치의 제조 방법, 기판 처리 장치, 기판 처리 시스템 및 기록 매체 |
| US20180033614A1 (en) * | 2016-07-27 | 2018-02-01 | Versum Materials Us, Llc | Compositions and Methods Using Same for Carbon Doped Silicon Containing Films |
| CN118315255A (zh) * | 2017-08-14 | 2024-07-09 | 株式会社国际电气 | 等离子体生成装置 |
| US10971357B2 (en) * | 2018-10-04 | 2021-04-06 | Applied Materials, Inc. | Thin film treatment process |
-
2022
- 2022-08-22 WO PCT/JP2022/031498 patent/WO2023119726A1/ja not_active Ceased
- 2022-08-22 CN CN202280062453.XA patent/CN117981061A/zh active Pending
- 2022-08-22 JP JP2023569054A patent/JP7828977B2/ja active Active
- 2022-08-22 KR KR1020247020285A patent/KR20240119078A/ko active Pending
- 2022-11-15 TW TW111143497A patent/TWI864491B/zh active
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- 2024-03-22 US US18/614,067 patent/US20240234132A1/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016066688A (ja) | 2014-09-24 | 2016-04-28 | 株式会社日立国際電気 | 半導体装置の製造方法、基板処理装置およびプログラム |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2023119726A1 (https=) | 2023-06-29 |
| CN117981061A (zh) | 2024-05-03 |
| US20240234132A1 (en) | 2024-07-11 |
| JP7828977B2 (ja) | 2026-03-12 |
| TWI864491B (zh) | 2024-12-01 |
| TW202330971A (zh) | 2023-08-01 |
| WO2023119726A1 (ja) | 2023-06-29 |
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