KR20240046516A - 연마 장치 - Google Patents

연마 장치 Download PDF

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Publication number
KR20240046516A
KR20240046516A KR1020247005887A KR20247005887A KR20240046516A KR 20240046516 A KR20240046516 A KR 20240046516A KR 1020247005887 A KR1020247005887 A KR 1020247005887A KR 20247005887 A KR20247005887 A KR 20247005887A KR 20240046516 A KR20240046516 A KR 20240046516A
Authority
KR
South Korea
Prior art keywords
polishing
substrate
infrared radiation
polishing pad
temperature
Prior art date
Application number
KR1020247005887A
Other languages
English (en)
Korean (ko)
Inventor
히사노리 마츠오
게이스케 스즈키
Original Assignee
가부시키가이샤 에바라 세이사꾸쇼
고쿠리츠 다이가쿠 호진 큐슈 코교 다이가쿠
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 에바라 세이사꾸쇼, 고쿠리츠 다이가쿠 호진 큐슈 코교 다이가쿠 filed Critical 가부시키가이샤 에바라 세이사꾸쇼
Publication of KR20240046516A publication Critical patent/KR20240046516A/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/14—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
KR1020247005887A 2021-08-24 2022-07-19 연마 장치 KR20240046516A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021136064A JP2023030756A (ja) 2021-08-24 2021-08-24 研磨装置
JPJP-P-2021-136064 2021-08-24
PCT/JP2022/027983 WO2023026723A1 (ja) 2021-08-24 2022-07-19 研磨装置

Publications (1)

Publication Number Publication Date
KR20240046516A true KR20240046516A (ko) 2024-04-09

Family

ID=85322987

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247005887A KR20240046516A (ko) 2021-08-24 2022-07-19 연마 장치

Country Status (3)

Country Link
JP (1) JP2023030756A (ja)
KR (1) KR20240046516A (ja)
WO (1) WO2023026723A1 (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019084614A (ja) 2017-11-06 2019-06-06 株式会社荏原製作所 研磨方法および研磨装置
JP2020110859A (ja) 2019-01-10 2020-07-27 株式会社荏原製作所 研磨装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001009699A (ja) * 1999-07-05 2001-01-16 Nichiden Mach Ltd 平面研磨装置
JP2004106174A (ja) * 2002-08-30 2004-04-08 Toray Ind Inc 研磨パッド、定盤ホールカバー及び研磨装置並びに研磨方法及び半導体デバイスの製造方法
JP2008145133A (ja) * 2006-12-06 2008-06-26 Horiba Ltd 放射温度計
JP2009060044A (ja) * 2007-09-03 2009-03-19 Tokyo Seimitsu Co Ltd Ｃｍｐ装置の研磨モニタ窓
JP2009224384A (ja) * 2008-03-13 2009-10-01 Toyo Tire & Rubber Co Ltd 研磨パッド及び半導体デバイスの製造方法
KR102626038B1 (ko) * 2016-11-16 2024-01-17 주식회사 케이씨텍 화학 기계적 연마장치

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019084614A (ja) 2017-11-06 2019-06-06 株式会社荏原製作所 研磨方法および研磨装置
JP2020110859A (ja) 2019-01-10 2020-07-27 株式会社荏原製作所 研磨装置

Also Published As

Publication number Publication date
JP2023030756A (ja) 2023-03-08
WO2023026723A1 (ja) 2023-03-02

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