KR20240045964A - Silicon wafers packing machine - Google Patents

Abstract

The wafer packing device is characterized by processing the excess area (burr) formed after storing and sealing the sealed packaging container containing the wafer in a packaging bag to protect it from moisture and static electricity through an automated process, and includes a support means and A packaging pack in which the excess area is minimized or eliminated by performing taping while the support means, including the taping unit, lifts the surplus area of the packaging bag perpendicular to the upper surface of the packaging bag, and then the taping unit folds the lifted excess area in the direction of the upper surface of the packaging bag. By producing (MBB Package), we solve loading problems and device failures caused by surplus areas.

Description

Wafer packing device {SILICON WAFERS PACKING MACHINE}

The present disclosure provides a packing device for silicon wafers, among semiconductor technology equipment.

A wafer refers to a single crystal ingot made by growing silicon, etc., thinly sliced to an appropriate thickness.

The wafer manufacturing process involves making a single crystal silicon ingot, slicing it to obtain a thin disk-shaped wafer, then performing a processing process to remove damage caused by the slicing process, and improving the flatness of the wafer by removing damage caused by processing. It includes a process of mirror-finishing the wafer and then cleaning it.

In order to prevent contamination and protect the wafers produced through various processes like this from external shocks, they are packed in separate packaging containers and bags before being transported when shipped out.

However, since wafer packing work is generally partially or entirely performed manually, process efficiency is reduced and packaging defects frequently occur. In addition, in the process of packing wafers in a packaging bag, a surplus area is formed in which the sealed entrance of the packaging bag protrudes long. This excess area reduces loading efficiency and is likely to cause machine failure during the process, so the excess area must be disposed of. is required.

The present invention provides a device for packing silicon wafers in the field of semiconductor technology. The technical challenges that this embodiment aims to achieve are not limited to the technical challenges described above, and other technical challenges can be inferred from the following embodiments.

As a technical means for achieving the above-described technical problem, a first aspect of the present disclosure is a packing device for packing a sealed packaging container containing wafers, including an opening means for opening the entrance portion of the loaded packaging bag; Insertion means that enters the storage space of the opened packaging bag and pushes the sealed packaging container into the storage space; Vacuum means for vacuumizing the interior of the packaging bag containing the sealed packaging container; a sealing means that seals the entrance portion of the packaging bag in which the sealed packaging container is stored and the inside of which is in a vacuum state, thereby creating a surplus area including the upper and lower surfaces; a support means that rises to push up the lower surface of the surplus area and arranges the surplus area parallel to a direction intersecting the upper surface of the packaging bag; and the upper surface of the surplus area supported by the support means is folded so that it comes into contact with the upper surface of the packaging bag, and the packaging bag that is not covered by the lower surface of the surplus area is removed from the first position of the lower surface of the surplus area exposed upward. A wafer packing device including a taping unit that performs taping to a second position on the upper surface.

According to the means for solving the problem of the present disclosure described above, there is an effect of achieving production efficiency and reduction of defect rate by fully automating all or part of the wafer packing process, which was previously performed manually.

In addition, the packing device according to an embodiment of the present invention produces packaging packs in a shape in which surplus areas are minimized or eliminated during the packing process, enabling efficient loading of as many packaging packs as possible in a limited space, and enabling transportation or processing. It has the effect of eliminating device failures or process defects caused by surplus areas of the packaging pack during the process.

1 is a conceptual diagram showing a wafer method according to an embodiment of the present invention.
Figure 2 is a block diagram showing a wafer packing system according to an embodiment of the present invention.
FIG. 3 is a flowchart showing a process in which the components of FIG. 2 pack a wafer.
Figure 4 shows a packaging bag used in a device according to an embodiment of the present invention.
Figure 5 is a flowchart specifically showing the steps performed in the packing device according to an embodiment of the present invention.
Figure 6 is a block diagram showing each component included in the packing device according to an embodiment of the present invention.
FIGS. 7 and 9 are flowcharts specifically showing operations performed in the packing device of FIG. 6.
Figure 10 shows examples in which the support means establishes a surplus area according to an embodiment of the present invention.
Figure 11 is a cross-sectional view showing the first part of a taping unit according to an embodiment of the present invention.
Figure 12 is a conceptual diagram showing the taping method of the taping unit included in the packing device according to an embodiment of the present invention.

Below, with reference to the attached drawings, embodiments of the present invention will be described in detail so that those skilled in the art can easily implement the present invention. However, the present invention may be implemented in many different forms and is not limited to the embodiments described herein. In order to clearly explain the present invention in the drawings, parts unrelated to the description are omitted, similar parts are given similar reference numerals throughout the specification, and identical or corresponding components are given the same reference numerals. Redundant explanations will be omitted.

Throughout the specification, when a part is said to be "connected" to another part, this includes not only the case where it is "directly connected," but also the case where it is "electrically connected" with another element in between. . Additionally, when a part is said to “include” a certain component, this means that it may further include other components, rather than excluding other components, unless specifically stated to the contrary.

Throughout the specification, terms such as first and second are used not in a limiting sense but for the purpose of distinguishing one component from another component. Additionally, singular expressions include plural expressions unless the context clearly dictates otherwise. Throughout the specification, terms such as include or have mean that the features or components described in the specification exist, and do not preclude the possibility of adding one or more other features or components. In addition, when a part of a membrane, area, component, etc. is said to be on or on another part, it includes not only the case where it is directly on top of the other part, but also the case where another membrane, area, component, etc. is interposed between them. do.

In the drawings, the sizes of components may be exaggerated or reduced for convenience of explanation. For example, the size and thickness of each component shown in the drawings are shown arbitrarily for convenience of explanation, so the present invention is not necessarily limited to what is shown.

Hereinafter, the present disclosure will be described in detail with reference to the attached drawings.

1 is a conceptual diagram showing a wafer packing method according to an embodiment of the present invention.

In this specification, packing refers to removing the wafer (W) from the mobile container (51) loaded with the wafer (W) and storing it in the packaging container and packaging bag (20). 21) refers to the process of producing.

In this specification, the wafer (W) may refer to a silicon wafer of a predetermined diameter obtained by slicing a silicon ingot and then going through a polishing process. However, the material of the wafer may be non-silicon in addition to silicon, and the wafer may be not limited to a bare wafer but may include a semiconductor wafer with a completed IC (Integrated Circuit) chip.

In this specification, the mobile container 51 loaded with wafers may mean a Front Opening Shipping Box (FOSB). However, it is not limited to this, and in addition to FOSB, it may be a FOUP (Front Opening Unified Pod), a mobile container used in the process line of a semiconductor manufacturing company.

In this specification, the packaging container 10 may refer to a jar box. The packaging container 10 is a container for transferring wafers, can accommodate a plurality of wafers, and has a structure that can block the inflow of external particles. In addition, the packaging container 10 can be automatically transported by the system and multi-stage stacking is possible. Meanwhile, the packaging container 10 in which the wafer is stored and sealed is referred to as a sealed packaging container 11, and may refer to a sealed jar box.

In this specification, the packaging bag 20 may refer to a Moisture Barrier Bag (MBB). The packaging bag 20 protects the contents from moisture and ESD (Electro Static Discharge). In detail, the packaging bag 20 protects the contents by forming a Faraday shield around the contents, and can protect the contents from moisture through a special film layer that controls the MVTR (Moisture Vapor Transfer Rate). there is. Meanwhile, the packaging bag in which the sealed packaging container 11 is stored and sealed is referred to as a packaging pack (MBB Package) 21.

Figure 2 is a block diagram showing a wafer packing system 100 according to an embodiment of the present invention. FIG. 3 is a flowchart showing a process in which the components of FIG. 2 pack a wafer.

Referring to FIG. 2, the system 100 includes a barcode recognition unit 101, a wafer terminal 102, a packaging container terminal 103, a first packing unit 104, a transfer unit 105, and a first sealed packaging container terminal. (106), first cart loading unit (107), second sealed packaging container terminal (108), packaging bag preparation unit (110), packaging bag loading unit (111), second packing unit (112), packaging bag unloading unit It may include a loading unit 113, a second cart loading unit 114, and a control unit 150 that comprehensively controls all of these components.

The components are divided according to their functions for convenience of explanation, and each component is connected to each other by a moving conveyor belt, so that the object can automatically move to each component.

The components are not limited to those shown, and one component may be implemented by combining with other components, or one component may be implemented separately into several components. Additionally, some components, such as the first cart loading unit and the second cart loading unit, may be implemented externally and separately from the system 100.

The control unit 150 generally controls each component. In detail, the control unit 150 can control all components by transmitting and sharing information recognized by one component to other components.

The barcode recognition unit 101 includes a barcode reader and determines the packing mode of the wafer (W) by recognizing the barcode attached to the mobile container 51 in which the plurality of wafers are stored. (S101a in FIG. 3) Later, depending on the packing mode determined in this step, the transfer unit 105 moves the object to the first sealed packaging container terminal 106 or moves the object to the second sealed packaging container terminal 108. . Meanwhile, the type of code that is attached to the mobile container 51 and contains information about the packing mode is not limited to barcodes and can be implemented in various ways, such as QR codes. If the information can be read by various readers, the type can be It can be implemented in various ways without being limited by it.

The wafer terminal 102 includes a wafer transfer means such as a wafer transfer robot (WTR), and removes and loads one or more wafers (W) from the mobile container 51 containing a plurality of wafers.

Referring to FIG. 3, in step S102, the first WTR of the wafer terminal 102 takes out the wafer (W) from the mobile container 51 containing a plurality of wafers, aligns it through OCR (Optical Character Recognition), and detects defects. First check to see if there are any. If defects such as cracks are identified, the wafer is not packed. In step S103, the second WTR receives the inspected wafer W from the first WTR and loads it for packing.

The packaging container terminal 103 includes a device into which the packaging container 10 is input, and loads the packaging container 10 to accommodate the wafer (W).

Referring to FIG. 3, in step S101b, an empty packaging container 10 to accommodate the wafer W is loaded into the packaging container terminal 103. The packaging container terminal 103 may further include a smart sensor, and the smart sensor checks the direction, type, defect, etc. of the inserted packaging container 10. Here, the packaging container 10 may be a jar box as described in FIG. 1.

The first packing unit 104 is connected to the above-described wafer terminal 102 and the packaging container terminal 103 through a moving conveyor belt. The first packing unit 104 may include a packaging device including wafer W and packaging container 10 transfer equipment, packaging container sealing equipment, and a barcode printer. The first packing unit 104 generates a sealed packaging container 11 by storing the wafer W loaded from the wafer terminal 102 in the packaging container 10 loaded from the packaging container terminal 103 and sealing it. Here, the sealed packaging container 11 may be a sealed jar box as described in FIG. 1.

Referring to FIG. 3, in step S104, the packaging device of the first packing unit 104 stores the wafer W in the empty packaging container 10, seals it, and then places a barcode containing information related to the wafer W. Attached to the outside of the packaging container (10) to create a sealed packaging container (11). Here, information related to the wafer W may match information recognized by the barcode recognition unit 101.

The first packing unit 104 may further include a displacement sensor. Displacement sensors can determine whether defects occur during the packing process. For example, when storing multiple wafers (W), check whether the buffer (R in FIG. 4(d)), which prevents collision between wafers (W), is correctly intervened through the height measured by the displacement sensor. This is possible.

The transfer unit 105 is connected to the first packing unit 104 and may include a transfer conveyor belt. When the packing mode determined by the barcode recognition unit 101 is the first packing mode, the transfer unit 105 transfers the sealed packaging container 11 to the first sealed packaging container terminal 106. Meanwhile, the transfer unit 105 transfers the sealed packaging container 11 to the second sealed packaging container terminal 108 when the packing mode determined by the barcode recognition unit 101 is the second packing mode. The transfer unit 105 may receive information read from the barcode recognition unit 101 by the control unit 150, distinguish objects according to the packing mode, and then transfer the information. However, it is not limited to this, and the transfer unit 105 may further include a separate barcode reader to directly read the barcode of the object flowing into the transfer unit 105, distinguish the objects, and deliver them to each terminal. (S105 in Figure 3)

The first sealed packaging container terminal 106 is connected to the transfer unit 105 and unloads the sealed packaging container 11 corresponding to the first packing mode (S106 in FIG. 3).

The first cart loading unit 107 is connected to the first sealed packaging container terminal 106, and unloaded sealed packaging containers 11 are loaded onto the first cart and taken out of the system 100. (S107 in FIG. 3) The sealed packaging container 11 taken out can be inspected and then transported to an external company.

The second sealed packaging container terminal 108 is connected to the transfer unit 105, and loads the sealed packaging container 11 corresponding to the second packing mode for packaging bag packing. (S108a in Figure 3)

The packaging bag loading unit 111 includes a device into which the packaging bag 20 is loaded, and loads the prepared packaging bag 20 (S108c in FIG. 3). Here, the packaging bag 20 is the MBB described in FIG. 1. You can.

Meanwhile, Figure 4 shows a packaging bag used in a system according to an embodiment of the present invention.

Referring to FIG. 4, the packaging bag 20 has a storage space (S) inside and is made of a material (eg, aluminum) that prevents static electricity. Figure 4(a) is a perspective view showing the packaging bag 20 in which the sealed packaging container 11 is not accommodated. Figure 4(b) is a front view showing an example in which the sealed packaging container 11 is stored in the storage space S inside the packaging bag 20. Figure 4(c) is a plan view showing an example in which the sealed packaging container 11 is stored in the storage space S inside the packaging bag 20. Figure 4(d) is a cross-sectional view taken along the D'-D cutting line of Figure 4(c).

The packaging bag 20 includes an upper surface (U), a lower surface (L), and both sides. Both sides of the packaging bag 20 are folded inward at least once, the entrance part O is open, and the end opposite to the entrance part O is closed. The portion of the storage space (S) that does not contain the sealed packaging container (11) from the open entrance portion (O) of the packaging bag (20) is created as a surplus area (B, burr) by subsequent sealing.

The packaging bag 20 is formed with a large surplus area B (approximately 30% to 50% of the total packaging bag) in order to easily accommodate the sealed packaging container 11 and prevent it from leaking during the sealing process. However, the packaging pack (MBB package) 21 in which the sealed packaging container 11 is stored in the packaging bag 20 must be capable of maximum loading in a limited space. Therefore, in order to realize maximum loading in a limited space, the packaging pack 21 must be processed so that the surplus area B is minimized or eliminated. The purpose of the packing device according to an embodiment of the present invention is to produce a packaging pack (21) with a minimized surplus area (B). This will be described in detail in the content related to the second packing unit 112 of FIGS. 5 to 9.

Meanwhile, the packaging bag loading unit 111 may be connected to the packaging bag preparation unit 110. The packaging bag preparation unit 110 may include a desiccant injection device, a barcode printer, etc. Referring to FIG. 3, in step S108b, the packaging bag preparation unit 110 injects a desiccant into the packaging bag 20 and attaches a barcode containing information related to the wafer W to the outside of the packaging bag 20. Prepare a packaging bag (20). Here, information related to the wafer W may match information recognized by the barcode recognition unit 101.

The second packing unit 112 stores the sealed packaging container 11 loaded on the second sealed packaging container terminal 108 in the storage space of the packaging bag 20 loaded from the packaging bag loading unit 111, The inside of the packaging bag (20) is vacuumed, sealed, and taped to create the packaging pack (21). (S109 in FIG. 3) Meanwhile, in this specification, the second packing unit 112 may be referred to as a “packing device.”

The second packing unit 112 according to an embodiment of the present invention is characterized by producing a packaging pack that occupies a minimum space and enables maximum loading. In addition, the second packing unit 112 is characterized by increasing production efficiency by fully automating some operations that were previously performed manually. In addition, as shown in FIG. 4, the second packing unit 112 is characterized by having an improved configuration to fit the packaging bag 20 in which the surplus portion B is designed to be long. Specific components of the second packing unit 112 and specific operations of each component will be described later with reference to FIGS. 5 to 9.

The packaging pack unloading unit 113 is connected to the second packaging unit 112, and the sealed packaging container 11 is stored in the packaging bag 20 to unload the packaging pack 21 that has gone through the sealing and taping process. . (S110 in Figure 3)

The second cart loading unit 114 is connected to the packaging pack unloading unit 113, and the unloaded packaging packs 21 are loaded onto the second cart and taken out of the system. (S111 in FIG. 3) The packaging pack 21 taken out may be inspected and then transported to an external company.

The packing mode (first mode) of the system 100 according to an embodiment of the present invention is a first packing mode in which the wafer (W) is packed in the packaging container 10, and the wafer (W) is packed in the packaging container 10. and a second packing mode for packing in the packaging bag 20, allowing two types of packing depending on the wafer (W). In addition, this system 100 has the effect of achieving production efficiency and reduction of defect rate by fully automating all or part of the packing process, which was previously performed manually. In addition, the packaging pack 21 produced during the packing process of this system 10 is implemented to occupy the minimum space and has the characteristic of allowing maximum loading.

Hereinafter, the second packing unit 112 operating in the second packing mode of the system 100 and the packaging pack 21 produced by the second packing unit 112 will be described in detail.

FIG. 5 is a flowchart specifically showing a step (S109 in FIG. 2) performed in the second packing unit 112 according to an embodiment of the present invention.

First, in the second packing mode, the sealed packaging container 11 is loaded into the second sealed packaging container terminal 108, and the packaging bag 20 is loaded into the packaging bag loading unit 111.

In step 109a, the second packing unit 112 opens the mouth of the packaging bag 20 and then inserts the sealed packaging container 11. In step 109b, the second packing unit 112 creates a vacuum inside the packaging bag 20 and then seals the entrance portion O of the packaging bag 20 to create a surplus area B of the packaging bag 20. . In step 109c, the second packing unit 112 vertically sets the surplus area (O) of the packaging bag 20 and then tapes the upper surface so that the main body of the packaging bag 20 and the surplus area (B) come into contact with each other and are folded. .

Through this process, the surplus area (B) is minimized, thereby creating a packaging pack (21) that occupies the minimum space and can be loaded to the maximum.

Hereinafter, the components included in the second packing unit 112 and their operations will be described in detail.

Figure 6 is a block diagram showing each component included in the second packing unit 112 according to an embodiment of the present invention. 7 to 9 are flowcharts specifically showing operations performed in the second packing unit 112 of FIG. 6. In the case of FIGS. 7 and 8, the left column included in each (a), (b), and (c) drawings shows a front view of the second packing unit 112, and the right column shows a front view of the second packing unit 112. A side cross-sectional view is shown, and the process of loading the packaging bag 20 into the second packing unit 112 and packaging the sealed storage container 11 is schematically shown. The second packing unit 112 may also be referred to as a wafer packaging device, and hereinafter, the operation of each component included in the second packing unit 112 will be described in detail.

Referring to Figure 6, the second packing unit 112 according to an embodiment of the present invention includes a controller 200, a table 210, a grip means 215, an opening means 220, a guide means 225, It includes an insertion and vacuum means 230, a sealing means 250, a support means 260, and a taping unit 270.

The components are divided according to their functions for convenience of explanation, and the components are not limited to what is shown, and one configuration may be implemented by combining with other components, or one configuration may be implemented by separating into multiple components. It may be possible.

First, the second packing unit 112 may be connected to the components of the system 100 (for example, the second sealed packaging container terminal 108 and the packaging bag loading unit 111) by a moving conveyor belt.

The packaging bag 20 loaded from the packaging bag loading unit 111 is placed on the upper surface of the table 210 (FIG. 6). The table 210 may be equipped with a sensing means (light sensor, weight sensor) for detecting the packaging bag 20. The direction and movement of the table 210 may be controlled by the controller 200. Meanwhile, in some drawings, only one table 210 is shown, but a plurality of tables 210 may be provided. For example, the second packing unit 112 is a first table on which the grip means 215, the opening means 220, the guide means 225, the insertion and vacuum means 230, and the sealing means 250 work. And a second table on which the support means 260 and the taping unit 270 work may be separately included.

When the packaging bag 20 is placed on the table 210, the grip means 215 grabs and secures the entrance portion O of the packaging bag 20. The grip means 215 may be composed of at least one pair. In detail, the grip means 215 can grab and fix both upper corners or both upper corners formed at the entrance portion O of the packaging bag 20, both sides of which are folded inward at least once. ( Figure 8 (a)) According to an optional embodiment, the grip means 215 is packaged until the entrance portion (O) of the packaging bag 20 is sealed after the sealed storage container 11 is stored in the packaging bag 20. The bag (20) can be held and fixed.

With the grip means 215 holding and fixing the entrance part O of the packaging bag 20, the opening means 220 descends or rises from the top or bottom to adsorb the entrance part O of the packaging bag 20. Open by gripping. (FIG. 7(b)) The opening means 220 is centered around the table 210 so as to open the entrance portion O of the packaging bag 20 placed on the table 210. It moves vertically and may include robot arms installed on the upper and lower parts of the table 210. The robot arm may be equipped with a vacuum suction means or a gripper capable of rotating at a predetermined angle at both edges of the entrance portion (O) of the packaging bag (20).

When the entrance of the packaging bag (20) is opened, the guide means (225) operates to enter the storage space (S) of the opened packaging bag (20) and then moves toward both sides of the packaging bag (20) to bag the packaging bag (225). Open both sides of (20) and support them to secure storage space (S). (FIG. 8(c)) The guide means 225 may be composed of a pair, and the height of the guide means 225 is equal to or smaller than the height of both sides of the packaging bag 20. The length may be equal to or greater than the length of the packaging bag 20.

When the storage space (S) is secured by the guide means (225), the insertion and vacuum means (230) operates to insert the sealed packaging container (11) loaded into the second sealed packaging container terminal (108) through the guide means (225). The entrance portion (O) is pushed into the storage space (S) inside the opened packaging bag (20). (FIG. 8(a)) The insertion and vacuum means 230 may be located at the bottom of the table 210 or at the front of the table 210, and when the entrance of the packaging bag 20 is opened, it rises or moves forward, It can move forward along the upper surface of the table 210 from the entrance part (O) of the packaging bag 20 to a predetermined point in the storage space (S). The insertion and vacuum means 230 may be a pusher with an integrated nozzle, and serves to push the sealed packaging container 11 into the storage space S and later to insert the entrance portion O of the packaging bag 20. It can also perform the role of creating a vacuum inside the storage space (S) by suctioning it while it is located in the storage space (S) until the sealing step.

When the sealed packaging container 11 is stored in the packaging bag 20, the sealing means 250 operates to compress the inlet portion O of the packaging bag 20 so that the inside of the packaging bag 20 is sealed. The sealing means (250) is a first sealing means (251) that seals the entrance part (O) of the packaging bag (2) by pressing it up and down, and a first sealing means (251) that presses both sides of the packaging bag (20) in the direction of the storage space (S). It may include a second sealing means (252). (FIG. 9(b)) The first sealing means 251 may be a pair of robot arms that face each other and include silicone pads at the ends, and can seal the entrance portion (O) of the packaging bag through heat or high frequency. . A pair of first sealing means 251 face each other at the top and bottom, and the pair of silicone pads move to correspond to each other, and the entrance portion (o) of the packaging bag 20 is between the pair of silicone pads. ) is inserted, thereby sealing the inlet portion (o). The second sealing means 252 is a cylinder push, and presses the folded portion in the direction of the storage space S according to the shape of the packaging bag 20 with both sides folded at least once to seal the packaging bag 20. It holds the shape of

As described above, before the sealing means 250 completely seals the packaging bag 20, the air inside the packaging bag 20 is sucked through the insertion and vacuum means 230 located inside the packaging bag 20. By bringing it in and discharging it to the outside, the inside of the packaging bag 20 is made into a vacuum state. When the inside of the packaging bag (20) is in a vacuum state, the insertion and vacuum means (230) moves backwards and falls out of the storage space (S), and the sealing means (250) applies heat or high frequency to the entrance of the packaging bag (20). Part (O) can be completely sealed. (FIG. 8(c)) When the entrance part (O) of the packaging bag 20 is sealed, a portion of the storage space (S) from the entrance part (O) close to the entrance part (O) is compressed, including the upper and lower surfaces. A surplus area (B) is created.

If this surplus area (B) is left alone, problems will occur in future processes. The packaging pack 21 is later loaded in the second card loading unit 114. If a surplus area B exists, the space occupied by one packaging pack 21 increases, so a large number of packaging packs are stored in a limited space. (21) cannot be loaded. In addition, unlike the space where the sealed packaging container 11 is stored, the surplus area B can easily change its shape due to physical force, so it may cause mechanical failure during movement of the packaging pack 21 within the system 100. there is. To solve this problem, the second packing unit 112 according to an embodiment of the present invention includes a support means 260 and a taping unit 270 that are configured to minimize the surplus area B.

When sealing is completed, the sealing means 250 and the vacuum means 240 descend and return to the waiting position, and the support means 260, which was waiting at the lower part of the table 210, rises. The support means 260 may be a cylinder, and the controller 200 may control the rising speed and height of the cylinder by controlling air pressure. The support means 260 rises and pushes up the lower surface of the surplus area (B), thereby forming the surplus area (B) into the upper surface (U) of the packaging bag 20, in which the sealed packaging container 11 is stored and the inside of which is in a vacuum state. It is placed parallel to the direction that intersects. (FIG. 9(a)) In other words, if the upper surface (U) of the packaging bag 20 is the xy plane, the upper surface (U) of the packaging bag 20 and the upper surface of the surplus area (B) are perpendicular to each other. Set up (B).

Figure 10 shows embodiments in which the support means 160 establishes the surplus area (B) according to an embodiment of the present invention.

According to one embodiment of Figure 10 (a), the support means 260 rises only to the upper surface (U) of the packaging bag 20 and pushes up the lower surface of the surplus area (B), thereby making it possible to erect the surplus area (B). there is. That is, the top of the support means 160 rises only up to the H1 line. In this case, the upward path of the support means 260 does not interfere with the moving path of the taping unit 270, so the taping unit 270 can determine the taping position on the packaging bag 20 without being disturbed by the support means 260. There is a characteristic.

According to another embodiment of Figure 10(b), the support means 260 rises beyond the upper surface (U) of the packaging bag 20 to the end of the surplus area (B) and pushes up the lower surface of the surplus area (B). In this way, the surplus area (B) can be established. That is, the upper end of the support means 160 rises within the area from line H1 to line H2. In this case, since the upward path of the support means 260 may overlap with the movement path of the taping unit 270, the support means 260 is placed on an avoidance path that avoids the path along which the taping unit 270 moves so that it can rise. You can. For example, the avoidance path may be a surplus area (B) located at a location corresponding to the area where the barcode shown in FIG. 11 is attached. If the surplus area (B) is not stiff and easily deformed, the support means 260 according to another embodiment supports the surplus area (B) more efficiently and has the effect of reducing taping defects.

The determination of the upward path of the support means 260 may be determined according to the degree to which the surplus area B can be deformed by physical force, the length of the surplus area B, and the material of the packaging bag 20.

Meanwhile, with respect to the angle at which the surplus area (B) is erected, the surplus area (B) is not limited to being erected perpendicular to the upper surface (U) of the packaging bag (20), but is positioned at the top of the packaging bag (20) to facilitate subsequent taping. The upper surface (U) and the upper surface of the surplus area (B) may be erected to have an acute angle. In this case, the support means 260 rises and then moves toward the end opposite to the entrance area (O) of the packaging bag 20, so that the upper surface (U) of the packaging bag 20 and the upper surface of the surplus area (B) are at an acute angle. can be implemented.

When set up in the surplus area (B), the taping unit 270, which was waiting in the waiting space at a position away from the table 210 in the direction of the surplus area (B), is placed on the opposite side of the entrance portion (O) of the packaging bag (20). While moving in the end direction (first direction), the upper surface of the surplus area (B) is folded so that it is in contact with the upper surface (U) of the packaging bag 20, and the first position of the lower surface of the surplus area (B) exposed upward. Taping is performed from ① to the second position ② on the upper surface (U) of the packaging bag (20) that is not covered by the lower surface of the surplus area (B). (FIG. 9(b)) In other words, the taping unit 270 raises the surplus area (B) formed after sealing the entrance portion of the packaging bag 20 and then moves the upper surface (U) of the packaging bag 20 in the direction. Fold it and tape it. Meanwhile, the support means 260 gradually descends and enters a standby state as the taping unit 270 moves from the first position ① to the second position ②. Meanwhile, it is sufficient that the first position ① is a part of the lower surface of the surplus area (B) exposed upward, and the second position ② is a part of the upper surface (U) of the packaging bag 20 that is not covered by the lower surface of the surplus area (B). This is enough. When taping is completed, the taping unit 270 moves in the second direction opposite to the first direction and waits in the waiting space again. (Figure 9(c))

When the support means 260 is fully raised, the taping unit 270 starts discharging the tape from the tape roll (not shown) on which the tape is wound at the first position ① and moves in the first direction to discharge the tape at the second position ②. A first part 271 that performs taping by cutting and a second part 272 that guides the first part 271 to move in the first direction and a second direction opposite to the first direction, or moves up and down ) includes.

Figure 11 is a cross-sectional view showing the first part 271 of the taping unit 270 according to an embodiment of the present invention. The cross-sectional view shown in FIG. 11 is a simplified illustration to explain the first part 271, and the taping unit 27 according to an embodiment of the present invention has the shape of the first part 271 shown in FIG. 11. Without being limited to this, any configuration for taping can be applied.

Referring to FIG. 11, the first part 271 of the taping unit 270 is installed to be spaced apart on both sides and is installed between the frames 271a and the frames 271a forming the internal space to form a tape T. A sensor 271c is installed between the wound tape roll 271b and the frames 271a and detects the thickness of the tape T wound around the tape roll 271b to determine whether the tape T is exhausted, and the frames ( A guide roller 271d is disposed to protrude from the bottom of the tape roll 271b and guides the tape T from the tape roll 271b so that one end of the adhesive surface of the tape T is adhered to the first position ① of the packaging bag 20. ), a cutting part 271e and a guide roller 271d that are arranged to be movable up and down between the frames 271a and cut the tape T when the packaging bag 20 moves in the first direction and reaches the second position ②. ) and may include a pressure roller (271f) that pressurizes the tape (T) attached to the packaging bag (20).

11, when the support means 260 raises the surplus area B of the packaging bag 20, the first position ① of the surplus area B is in close contact with the tape T of the guide roller. With the adhesive surface of the tape T attached to the first position ①, when the first part 271 advances toward the end of the packaging bag 20 along the second part 272, the tape roll 271b The tape (T) is unwound and adhered, the guide roller (271d) is pressed by the packaging bag (20), and the cut portion (271e) is lowered to cut the tape (T) at the second position ② of the packaging bag (20), Finally, the adhesive strength is strengthened by pressing the adhesive tape (T) through the pressure roller (271f).

Meanwhile, the tape T included in the taping unit 270 has an adhesive surface on one side and may be made of a material that protects the object from ESD. For example, the tape T may be made of aluminum.

The overall operation of the taping unit 270 and the movement of the first part 271 may be controlled by the controller 200.

Figure 12 is a conceptual diagram showing the taping method of the taping unit 270 according to an embodiment of the present invention.

Figure 12 is a plan view showing the upper surface of the packaging bag 20 on which taping has been performed or is being performed. The taping unit 270 according to an embodiment of the present invention includes a plurality of first parts 271, so that two taping operations can be performed at once, as shown in FIG. 12(a). Meanwhile, the taping unit 270 according to another embodiment of the present invention includes only one first part 271, and performs an initial taping operation on one part of the packaging bag 20 as shown in FIG. 12(b). After performing, the final taping operation can be performed on other parts of the packaging bag 20 in succession. One part and the other part may mean parts that are separated from each other by the same distance (d) on both sides of the center line connecting the entrance part (O) and the end of the packaging bag 20. When the taping operation is performed, it can be performed by avoiding the barcode (C) attached to the upper surface (U) of the packaging bag (20). As a result, the two tapes T can be adhered at the same distance from each other with the center line of the packaging bag 20 in between. Meanwhile, the taping operation of the taping unit 270 according to an embodiment of the present invention is not limited to what is shown in FIG. 12 and can be implemented in various ways.

As such, according to one embodiment of the present invention, the taping of the packaging bag 20 is automatically performed through the taping unit 270, thereby improving process efficiency. In addition, since the excess area (B) is fixed to the upper surface of the packaging bag (20) in a folded state through taping, it is possible to produce packaging packs (21) with a minimized size and as many packaging packs as possible for a limited space. It has the feature of being able to load (21). In addition, by minimizing or eliminating the surplus area (B) of the packaging pack 21, there is an effect of eliminating malfunctions or defects caused by the surplus area (B) during the process.

Unless there is an explicit order or statement to the contrary regarding the steps constituting the method according to the invention, the steps may be performed in any suitable order. The present invention is not necessarily limited by the order of description of the above steps. The use of any examples or illustrative terms (e.g., etc.) in the present invention is merely to describe the present invention in detail, and unless limited by the claims, the scope of the present invention is limited by the examples or illustrative terms. It doesn't work. Additionally, those skilled in the art will recognize that various modifications, combinations and changes may be made depending on design conditions and factors within the scope of the appended claims or their equivalents.

Therefore, the spirit of the present invention should not be limited to the above-described embodiments, and the scope of the patent claims described below as well as all scopes equivalent to or equivalently changed from the scope of the claims are within the scope of the spirit of the present invention. It will be said to belong to

10: Packaging container
11: Sealed packaging container
20: packaging bag
21: Packaging pack

Claims (5)

In the packing device for packing a sealed packaging container containing wafers,
Opening means for opening the entrance portion of the loaded packaging bag;
A guide means for securing storage space by opening and supporting both sides after entering the storage space of the opened packaging bag;
Insertion and vacuum means that enters the secured storage space, pushes the sealed packaging container into the storage space, and creates a vacuum inside the packaging bag containing the sealed packaging container;
a sealing means that seals the entrance portion of the packaging bag in which the sealed packaging container is stored and the inside of which is in a vacuum state, thereby creating a surplus area including the upper and lower surfaces;
a support means that rises to push up the lower surface of the surplus area and arranges the surplus area parallel to a direction intersecting the upper surface of the packaging bag; and
The upper surface of the surplus area supported by the support means is folded to come into contact with the upper surface of the packaging bag, from the first position of the lower surface of the surplus area exposed upward to the upper surface of the packaging bag that is not obscured by the lower surface of the surplus area. a taping unit that performs taping to the second position;
A wafer packing device comprising: According to claim 1,
The support means are
A wafer packing device that raises the upper surface of the packaging bag in which the sealed packaging container is stored and whose interior is in a vacuum state, and pushes up the lower surface of the surplus area. According to claim 1,
The support means are
A wafer packing device that rises beyond the upper surface of the packaging bag in which the sealed packaging container is stored and whose interior is in a vacuum state, to the end of the surplus area, and pushes up the lower surface of the surplus area. According to claim 1,
The taping unit is
A wafer packing device that performs taping multiple times on a packaging bag in which the sealed packaging container is stored and the interior of which is in a vacuum state. According to claim 1,
The packaging bag is a wafer packing device that is an MBB (Moisture Barrier Bag) that protects the sealed packaging container stored inside from moisture and ESD (Electro Static Discharge).

Images