KR20240045963A - Silicon wafers packing machine and silicon wafers packing and unpacking system including thereof - Google Patents

Abstract

The wafer packing and unpacking system packs the wafer loaded in the mobile container into a packaging container or packaging bag according to the change of mode, unpacks the packaging container containing the wafer, and then loads the wafer into the mobile container. It includes a switching control unit, a wafer terminal, a packaging container terminal, a packing-unpacking unit, and a first sealed packaging container terminal. Here, the packing mode includes a first packing mode in which the wafer is packed into a packaging container and a second packing mode in which the packaging container containing the wafer is packed in a packaging bag. For this purpose, the system includes a barcode recognition unit, a transfer unit, and a second sealing unit. It further includes a packaging container terminal, a packaging bag loading unit, a packaging bag packing unit, and a packaging bag unloading unit.

Description

Wafer packing device and wafer packing and unpacking system including the same

The present disclosure provides, among semiconductor technology equipment, a silicon wafer packing device and a system for packing and unpacking silicon wafers including the same.

A wafer refers to a single crystal ingot made by growing silicon, etc., thinly sliced to an appropriate thickness.

The wafer manufacturing process involves making a single crystal silicon ingot, slicing it to obtain a thin disk-shaped wafer, then performing a processing process to remove damage caused by the slicing process, and improving the flatness of the wafer by removing damage caused by processing. It includes a process of mirror-finishing the wafer and then cleaning it.

In order to prevent contamination and protect against external shock, wafers produced through various processes are loaded and transported in mobile containers within the production facility, and are packed in separate packaging containers when taken out to the outside. Meanwhile, wafers stored in packaging containers brought in from outside the production facility are unpacked, loaded into mobile containers, and then transported inside the production facility.

However, since the packing or unpacking of wafers is generally partially or entirely performed manually, process efficiency is reduced and packaging defects and unopening defects frequently occur. Additionally, because the wafer packing or unpacking process is performed by different devices, management and maintenance of the equipment is difficult.

The present invention provides a silicon wafer packing device and a silicon wafer packing and unpacking system including the same in the field of semiconductor technology. The technical challenges that this embodiment aims to achieve are not limited to the technical challenges described above, and other technical challenges can be inferred from the following embodiments.

As a technical means for achieving the above-described technical problem, a first aspect of the present disclosure is a packing device for packing a sealed packaging container containing wafers, including an opening means for opening the entrance portion of the loaded packaging bag; A guide means for entering the storage space of the opened packaging bag and then spreading and supporting both sides to secure the storage space; Insertion and vacuum means that enters the secured storage space, pushes the sealed packaging container into the storage space, and creates a vacuum inside the packaging bag containing the sealed packaging container; and a sealing means for sealing the entrance of the packaging bag in which the sealed packaging container is stored and the inside of which is in a vacuum state. It provides a wafer packing device including.

As a technical means for achieving the above-described technical problem, the second aspect of the present disclosure includes packing the wafer into a packaging container or packaging bag in the first mode and unpacking the wafer from the sealed packaging container in the second mode. A wafer packing and unpacking system comprising: a barcode recognition unit that determines a wafer packing mode by recognizing a barcode attached to a mobile container in which a plurality of wafers are stored in the first mode; a wafer terminal for removing and loading the wafer from the transport container; a packaging container terminal for loading a packaging container for storing the wafer; A packing-unpacking unit connected to the wafer terminal and the packaging container terminal and storing the wafer loaded from the wafer terminal in the packaging container loaded from the packaging container terminal and sealing the wafer to create a sealed packaging container; A first sealed packaging container terminal for unloading the sealed packaging container; a second sealed packaging container terminal for loading the sealed packaging container for packaging bag packing; It is connected to the packing and unpacking unit, and if the packing mode determined by the barcode recognition unit is the first packing mode, the sealed packaging container is delivered to the first sealed packaging container terminal, and if the packing mode is in the second packing mode, the sealed packaging container is delivered. A transfer unit that delivers the packaging container to the second sealed packaging container terminal; A packaging bag loading unit that has a storage space inside and loads a packaging bag made of a material that prevents static electricity; The sealed packaging container loaded in the second sealed packaging container terminal is placed in the storage space of the packaging bag loaded in the packaging bag loading unit. A packaging bag packing unit that creates a packaging pack by storing, sealing, and taping; And a packaging pack unloading unit that unloads the packaging pack; Provides a wafer packing and unpacking system including.

According to the means for solving the problem of the present disclosure described above, there is an effect of achieving production efficiency and reduction of defect rate by fully automating all or part of the wafer packing and unpacking process, which was previously performed manually.

In addition, by enabling the packing and unpacking process of the wafer in one system, there is no need to maintain a separate system for the packing process or unpacking process, which has the advantage of being economical and easy to manage and maintain the device.

In addition, by producing packaging packs in a shape in which surplus areas are minimized or eliminated during the packing process of the system according to an embodiment of the present invention, efficient loading of as many packaging packs as possible in a limited space is possible, and transport or processing processes are possible. It has the effect of eliminating device failures or process defects caused by surplus areas of the packaging pack.

1 is a conceptual diagram showing a wafer packing and unpacking method according to an embodiment of the present invention.
Figure 2 is a block diagram showing a wafer packing and unpacking system according to an embodiment of the present invention.
FIG. 3 shows components corresponding to the first mode of FIG. 2.
FIG. 4 is a flowchart showing a process in which the components of FIG. 3 pack a wafer.
Figure 5 shows a packaging bag used in a system according to an embodiment of the present invention.
Figure 6 is a flow chart specifically showing steps performed in the packaging bag packing unit of Figure 6 according to an embodiment of the present invention.
Figure 7 is a block diagram showing each component included in the packaging bag packing unit according to an embodiment of the present invention.
Figures 8 to 10 are flowcharts specifically showing the operations performed in the packaging bag packing unit of Figure 7.
Figure 11 is a conceptual diagram showing the taping method of the taping unit included in the system according to an embodiment of the present invention.
FIG. 12 shows components corresponding to the second mode of FIG. 2.
Figure 13 shows components corresponding to the second mode of the system according to another embodiment of the present invention.
Figure 14 is a flow chart showing the process of unpacking the sealed packaging container by the components of Figure 13.

Below, with reference to the attached drawings, embodiments of the present invention will be described in detail so that those skilled in the art can easily implement the present invention. However, the present invention may be implemented in many different forms and is not limited to the embodiments described herein. In order to clearly explain the present invention in the drawings, parts unrelated to the description are omitted, similar parts are given similar reference numerals throughout the specification, and identical or corresponding components are given the same reference numerals. Redundant explanations will be omitted.

Throughout the specification, when a part is said to be "connected" to another part, this includes not only the case where it is "directly connected," but also the case where it is "electrically connected" with another element in between. . Additionally, when a part "includes" a certain component, this means that it may further include other components rather than excluding other components, unless specifically stated to the contrary.

Throughout the specification, terms such as first and second are used not in a limiting sense but for the purpose of distinguishing one component from another component. Additionally, singular expressions include plural expressions unless the context clearly dictates otherwise. Throughout the specification, terms such as include or have mean that the features or components described in the specification exist, and do not preclude the possibility of adding one or more other features or components. In addition, when a part of a membrane, area, component, etc. is said to be on or on another part, it includes not only the case where it is directly on top of the other part, but also the case where another membrane, area, component, etc. is interposed between them. do.

In the drawings, the sizes of components may be exaggerated or reduced for convenience of explanation. For example, the size and thickness of each component shown in the drawings are shown arbitrarily for convenience of explanation, so the present invention is not necessarily limited to what is shown.

Hereinafter, the present disclosure will be described in detail with reference to the attached drawings.

1 is a conceptual diagram showing a wafer packing and unpacking method according to an embodiment of the present invention.

In this specification, packing refers to the process of producing a sealed packaging container (11) containing a wafer (W) by removing the wafer (W) from the mobile container (51) loaded with the wafer (W) and storing it in a packaging container. It means process. Packing also includes the process of producing a packaging pack (21) containing the sealed packaging container (11) by storing the sealed packaging container (11) selectively produced according to the packing mode in a packaging bag.

Meanwhile, in this specification, unpacking refers to the process of opening the sealed packaging container 11 containing the wafer W and loading the wafer W taken out into the mobile container 51 again.

According to an embodiment of the present invention, which will be described later, these processes are performed in different modes in one system, and all operations required for packing and unpacking of wafers are automated and performed in one system. .

In this specification, the wafer (W) may refer to a silicon wafer of a predetermined diameter obtained by slicing a silicon ingot and then going through a polishing process. However, the material of the wafer may be non-silicon in addition to silicon, and the wafer may be not limited to a bare wafer but may include a semiconductor wafer with a completed IC (Integrated Circuit) chip.

In this specification, the mobile container 51 loaded with wafers may mean a Front Opening Shipping Box (FOSB). However, it is not limited to this, and in addition to FOSB, it may be a FOUP (Front Opening Unified Pod), a mobile container used in the process line of a semiconductor manufacturing company.

In this specification, the packaging container 10 may refer to a jar box. The packaging container 10 is a container for transferring wafers, can accommodate a plurality of wafers, and has a structure that can block the inflow of external particles. In addition, the packaging container 10 can be automatically transported by the system and multi-stage stacking is possible. Meanwhile, the packaging container 10 in which the wafer is stored and sealed is referred to as a sealed packaging container 11, and may refer to a sealed jar box.

In this specification, the packaging bag 20 may refer to a Moisture Barrier Bag (MBB). The packaging bag 20 protects the contents from moisture and ESD (Electro Static Discharge). In detail, the packaging bag 20 protects the contents by forming a Faraday shield around the contents, and can protect the contents from moisture through a special film layer that controls the MVTR (Moisture Vapor Transfer Rate). there is. Meanwhile, the packaging bag in which the sealed packaging container 11 is stored and sealed is referred to as a packaging pack (MBB Package) 21.

Figure 2 is a block diagram showing a wafer packing and unpacking system 100 according to an embodiment of the present invention.

Referring to FIG. 2, the system 100 packs the wafer into a packaging container or packaging bag in the first mode, and unpacks the wafer from the sealed packaging container in the second mode.

The first mode is a packing mode and includes the process of packing wafers loaded in a mobile container into a packaging container or packaging bag. The first mode includes a first packing mode in which wafers are packed in a packaging container and a second packing mode in which wafers are packed in a packaging container and a packaging bag.

The second mode is the unpacking mode and includes the process of unpacking the wafers packed in the packaging container and loading them into the mobile container.

Both the first mode and the second mode are characterized in that they are performed in one system 100. Therefore, according to one embodiment of the present invention, there is no need to maintain a separate system for packing or unpacking, which has the advantage of being economical and making it easy to manage and maintain the device.

The first mode and the second mode can be switched by the control unit 150, and the change conditions can be determined by the user's selection, a predetermined period setting, or the direction of the inserted object.

The system 100 in FIG. 2 includes a barcode recognition unit 101, a wafer terminal 102, a packaging container terminal 103, a packing-unpacking unit 104, a transfer unit 105, and a first sealed packaging container terminal 106. , first cart loading unit (107), second sealed packaging container terminal (108), packaging bag preparation unit (110), packaging bag loading unit (111), packaging bag packing unit (112), packaging bag unloading unit ( 113), a second cart loading unit 114, and a control unit 150 that comprehensively controls all of these components.

The components are divided according to their functions for convenience of explanation, and each component is connected to each other by a moving conveyor belt, so that the object can automatically move to each component. Meanwhile, the moving conveyor belt may move in a first direction in the first mode, and may move in a second direction opposite to the first direction in the second mode.

The components are not limited to those shown, and one component may be implemented by combining with other components, or one component may be implemented separately into several components. Additionally, some components, such as the first cart loading unit and the second cart loading unit, may be implemented externally and separately from the system 100.

Referring to FIG. 2, the control unit 150 generally controls each component. In detail, the control unit 150 can control all components by transmitting and sharing information recognized by one component to other components. In addition, the control unit 150 controls switching between the first mode and the second mode of the system 100, and changes the direction of the moving conveyor belt (not shown) of the system 100 according to the change in the first mode and the second mode. You can control it.

Hereinafter, for convenience of explanation, each component will be described separately into the first mode and the second mode. It is clear that the constituent parts of the second mode that have the same name as the constituent parts referred to in the first mode are the same constituent parts.

FIG. 3 shows components corresponding to the first mode of FIG. 2. FIG. 4 is a flowchart showing a process in which the components of FIG. 3 pack a wafer. Hereinafter, each component and its operation will be described with reference to FIGS. 3 and 4.

The barcode recognition unit 101 includes a barcode reader and determines the packing mode of the wafer (W) by recognizing the barcode attached to the mobile container 51 in which the plurality of wafers are stored. (S101a in FIG. 4) Later, depending on the packing mode determined in this step, the transfer unit 105 moves the object to the first sealed packaging container terminal 106 or moves the object to the second sealed packaging container terminal 108. . Meanwhile, the type of code that is attached to the mobile container 51 and contains information about the packing mode is not limited to barcodes and can be implemented in various ways, such as QR codes. If the information can be read by various readers, the type can be It can be implemented in various ways without being limited by it.

The wafer terminal 102 includes a wafer transfer means such as a wafer transfer robot (WTR), and removes and loads one or more wafers (W) from the mobile container 51 containing a plurality of wafers.

Referring to FIG. 4, in step S102, the first WTR of the wafer terminal 102 takes out the wafer W from the mobile container 51 containing a plurality of wafers, aligns it through OCR (Optical Character Recognition), and detects defects. First check to see if there are any. If defects such as cracks are identified, the wafer is not packed. In step S103, the second WTR receives the inspected wafer W from the first WTR and loads it for packing.

The packaging container terminal 103 includes a device into which the packaging container 10 is input, and loads the packaging container 10 to accommodate the wafer (W).

Referring to FIG. 4, in step S101b, an empty packaging container 10 to accommodate the wafer W is loaded into the packaging container terminal 103. The packaging container terminal 103 may further include a smart sensor, and the smart sensor checks the direction, type, defect, etc. of the inserted packaging container 10. Here, the packaging container 10 may be a jar box as described in FIG. 1.

The packing and unpacking unit 104 is connected to the above-described wafer terminal 102 and the packaging container terminal 103 through a moving conveyor belt. The packing and unpacking unit 104 may include a packaging device including wafer W and packaging container 10 transfer equipment, sealing equipment, barcode printer, etc. The packing and unpacking unit 104 generates a sealed packaging container 11 by storing the wafer W loaded from the wafer terminal 102 in the packaging container 10 loaded from the packaging container terminal 103 and sealing it. Here, the sealed packaging container 11 may be a sealed jar box as described in FIG. 1.

Referring to FIG. 4, in step S104, the packaging device of the packing and unpacking unit 104 stores the wafer (W) in the empty packaging container 10, seals it, and then places a barcode containing information related to the wafer (W). Attached to the outside of the packaging container (10) to create a sealed packaging container (11). Here, information related to the wafer W may match information recognized by the barcode recognition unit 101.

The packing and unpacking unit 104 may further include a displacement sensor. Displacement sensors can determine whether defects occur during the packing process. For example, when storing multiple wafers (W), check whether the buffer (R in FIG. 7(d)), which prevents collision between wafers (W), is correctly intervened through the height measured by the displacement sensor. This is possible.

The transfer unit 105 is connected to the packing and unpacking unit 104 and may include a transfer conveyor belt. When the packing mode determined by the barcode recognition unit 101 is the first packing mode, the transfer unit 105 transfers the sealed packaging container 11 to the first sealed packaging container terminal 106. Meanwhile, the transfer unit 105 transfers the sealed packaging container 11 to the second sealed packaging container terminal 108 when the packing mode determined by the barcode recognition unit 101 is the second packing mode. The transfer unit 105 may receive information read from the barcode recognition unit 101 by the control unit 150, distinguish objects according to the packing mode, and then transfer the information. However, it is not limited to this, and the transfer unit 105 may further include a separate barcode reader to directly read the barcode of the object flowing into the transfer unit 105, distinguish the objects, and deliver them to each terminal. (S105 in Figure 4)

The first sealed packaging container terminal 106 is connected to the transfer unit 105 and unloads the sealed packaging container 11 corresponding to the first packing mode (S106 in FIG. 4).

The first cart loading unit 107 is connected to the first sealed packaging container terminal 106, and unloaded sealed packaging containers 11 are loaded onto the first cart and taken out of the system 100. (S107 in FIG. 4) The sealed packaging container 11 taken out can be inspected and then transported to an external company.

The second sealed packaging container terminal 108 is connected to the transfer unit 105, and loads the sealed packaging container 11 corresponding to the second packing mode for packaging bag packing. (S108a in Figure 4)

The packaging bag loading unit 111 includes a device into which the packaging bag 20 is input, and loads the prepared packaging bag 20 (S108c in FIG. 4). Here, the packaging bag 20 is the MBB described in FIG. 1. You can.

Meanwhile, Figure 5 shows a packaging bag used in a system according to an embodiment of the present invention.

Referring to Figure 5, the packaging bag 20 has a storage space (S) inside and is made of a material (eg, aluminum) that prevents static electricity. Figure 5(a) is a perspective view showing the packaging bag 20 in which the sealed packaging container 11 is not accommodated. Figure 5(b) is a front view showing an example in which the sealed packaging container 11 is stored in the storage space S inside the packaging bag 20. Figure 5(c) is a plan view showing an example in which the sealed packaging container 11 is stored in the storage space S inside the packaging bag 20. Figure 5(d) is a cross-sectional view taken along the D'-D cutting line of Figure 5(c).

The packaging bag 20 includes an upper surface (U), a lower surface (L), and both sides. Both sides of the packaging bag 20 are folded inward at least once, the entrance part O is open, and the end opposite to the entrance part O is closed. The portion of the storage space (S) that does not contain the sealed packaging container (11) from the open entrance portion (O) of the packaging bag (20) is created as a surplus area (B, burr) by subsequent sealing.

The packaging bag 20 is formed with a large surplus area B (approximately 30% to 50% of the total packaging bag) in order to easily accommodate the sealed packaging container 11 and prevent it from leaking during the sealing process. However, the packaging pack (MBB package) 21 containing the sealed packaging container 11 stored in the packaging bag 20 must be capable of maximum loading in a limited space. Therefore, in order to realize maximum loading in a limited space, the packaging pack 21 must be processed to minimize the surplus area B. The purpose of the system 100 according to an embodiment of the present invention is to produce a packaging pack 21 with a minimized surplus area B. This will be described in detail in the content related to the packaging bag packing unit 112 of FIGS. 6 to 10.

Meanwhile, the packaging bag loading unit 111 may be connected to the packaging bag preparation unit 110. The packaging bag preparation unit 110 may include a desiccant injection device, a barcode printer, etc. Referring to FIG. 4, in step S108b, the packaging bag preparation unit 110 injects a desiccant inside the packaging bag 20 and attaches a barcode containing information related to the wafer W to the outside of the packaging bag 20. Prepare a packaging bag (20). Here, information related to the wafer W may match information recognized by the barcode recognition unit 101.

The packaging bag packing unit 112 stores the sealed packaging container 11 loaded on the second seal packaging container terminal 108 in the storage space of the packaging bag 20 loaded from the packaging bag loading unit 111, The inside of the packaging bag (20) is vacuumed, sealed, and taped to create the packaging pack (21). (S109 in Figure 4)

The packaging bag packing unit 112 according to an embodiment of the present invention is characterized by producing a packaging pack that occupies a minimum space and enables maximum loading. In addition, the packaging bag packing unit 112 is characterized by increasing production efficiency by fully automating some operations that were previously performed manually. In addition, the packaging bag packing part 112 is characterized by having an improved configuration to fit the packaging bag 20 in which the surplus portion B is designed to be long, as shown in FIG. 5. Specific components of the packaging bag packing unit 112 and specific operations of each component will be described later with reference to FIGS. 6 to 10.

The packaging pack unloading unit 113 is connected to the packaging bag packing unit 112, and the sealed packaging container 11 is stored in the packaging bag 20 to unload the packaging pack 21 that has gone through the sealing and taping process. . (S110 in Figure 4)

The second cart loading unit 114 is connected to the packaging pack unloading unit 113, and the unloaded packaging packs 21 are loaded onto the second cart and taken out of the system. (S111 in FIG. 4) The packaging pack 21 taken out may be inspected and then transported to an external company.

The system 100 according to an embodiment of the present invention has the feature of enabling packing and unpacking in one system. The packing mode (first mode) of this system 100 is a first packing mode in which the wafer (W) is packed in the packaging container (10), and the wafer (W) is packed in the packaging container (10) and the packaging bag (20). There are two second packing modes, allowing two types of packing depending on the wafer (W). In addition, this system 100 has the effect of achieving production efficiency and reduction of defect rate by fully automating all or part of the packing process, which was previously performed manually. In addition, the packaging pack 21 produced during the packing process of this system 100 is implemented to occupy the minimum space and has the characteristic of allowing maximum loading.

Hereinafter, the packaging bag packing unit 112 operating in the second packing mode of the system 100 and the packaging pack 21 produced by the packaging bag packing unit 112 will be described in detail.

Figure 6 is a flowchart specifically showing a step (S109 in Figure 4) performed in the packaging bag packing unit 112 of Figure 6 according to an embodiment of the present invention.

First, in the second packing mode, the sealed packaging container 11 is loaded into the second sealed packaging container terminal 108, and the packaging bag 20 is loaded into the packaging bag loading unit 111.

In step 109a, the packaging bag packing unit 112 opens the mouth of the packaging bag 20 and then inserts the sealed packaging container 11. In step 109b, the packaging bag packing unit 112 creates a vacuum inside the packaging bag 20 and then seals the entrance portion O of the packaging bag 20 to create a surplus area B of the packaging bag 20. . In step 109c, the packaging bag packing unit 112 vertically sets the surplus area (O) of the packaging bag (20) and then tapes the upper surface so that the main body of the packaging bag (20) and the surplus area (B) come into contact with each other and are folded. .

Through this process, the surplus area (B) is minimized, thereby creating a packaging pack (21) that occupies the minimum space and can be loaded to the maximum.

Hereinafter, the components included in the packaging bag packing unit 112 and their operations will be described in detail.

Figure 7 is a block diagram showing each component included in the packaging bag packing unit 112 according to an embodiment of the present invention. Figures 8 to 10 are flowcharts specifically showing operations performed in the packaging bag packing unit 112 of Figure 7. In the case of FIGS. 8 and 9, the left column included in each (a), (b), and (c) drawings shows a front view of the packaging bag packing unit 112, and the right column shows a front view of the packaging bag packing unit 112. A side cross-sectional view is shown, and the process of loading the packaging bag 20 into the packaging bag packing unit 112 and packaging the sealed storage container 11 is schematically shown. The packaging bag packing unit 112 may also be referred to as a wafer packaging device, and hereinafter, the operation of each component included in the packaging bag packing unit 112 will be described in detail.

Referring to Figure 7, the packaging bag packing unit 112 according to an embodiment of the present invention includes a controller 200, a table 210, a grip means 215, an opening means 220, a guide means 225, It may include insertion and vacuum means 230, and sealing means 250. The packaging bag packing unit 112 may further include a support means 260 and a taping unit 270 in addition to the above-described components.

The components are divided according to their functions for convenience of explanation, and the components are not limited to what is shown, and one configuration may be implemented by combining with other components, or one configuration may be implemented by separating into multiple components. It may be possible.

First, the packaging bag packing unit 112 may be connected to the components of the system 100 (for example, the second sealed packaging container terminal 108 and the packaging bag loading unit 111) by a moving conveyor belt.

The packaging bag 20 loaded from the packaging bag loading unit 111 is placed on the upper surface of the table 210 (FIG. 7). The table 210 may be equipped with a sensing means (light sensor, weight sensor) for detecting the packaging bag 20. The direction and movement of the table 210 may be controlled by the controller 200. Meanwhile, in some drawings, only one table 210 is shown, but a plurality of tables 210 may be provided. For example, the packaging bag packing unit 112 includes a first table on which the grip means 215, the opening means 220, the guide means 225, the insertion and vacuum means 230, and the sealing means 250 work, and A second table on which the support means 260 and the taping unit 270 work may be separately included.

When the packaging bag 20 is placed on the table 210, the grip means 215 grabs and secures the entrance portion O of the packaging bag 20. The grip means 215 may be composed of at least one pair. In detail, the grip means 215 can grab and fix both upper corners or both upper corners formed at the entrance portion O of the packaging bag 20, both sides of which are folded inward at least once. ( Figure 8 (a)) According to an optional embodiment, the grip means 215 is packaged until the entrance portion (O) of the packaging bag 20 is sealed after the sealed storage container 11 is stored in the packaging bag 20. The bag (20) can be held and fixed.

With the grip means 215 holding and fixing the entrance part O of the packaging bag 20, the opening means 220 descends or rises from the top or bottom to adsorb the entrance part O of the packaging bag 20. Open by gripping. (FIG. 8(b)) The opening means 220 is centered around the table 210 so as to open the entrance portion O of the packaging bag 20 placed on the table 210. It moves vertically and may include a robot arm installed on the upper or lower part of the table 210. The robot arm may be equipped with vacuum suction means or grippers that can rotate at a predetermined angle at both edges of the entrance portion (O) of the packaging bag (20).

When the entrance of the packaging bag (20) is opened, the guide means (225) operates to enter the storage space (S) of the opened packaging bag (20) and then moves toward both sides of the packaging bag (20) to bag the packaging bag (225). Open both sides of (20) and support them to secure storage space (S). (FIG. 8(c)) The guide means 225 may be composed of a pair, and the height of the guide means 225 is equal to or smaller than the height of both sides of the packaging bag 20. The length may be equal to or greater than the length of the packaging bag 20.

When the storage space (S) is secured by the guide means (225), the insertion and vacuum means (230) operates to insert the sealed packaging container (11) loaded into the second sealed packaging container terminal (108) through the guide means (225). The entrance portion (O) is pushed into the storage space (S) inside the opened packaging bag (20). (FIG. 9(a)) The insertion and vacuum means 230 may be located at the bottom of the table 210 or at the front of the table 210, and when the entrance of the packaging bag 20 is opened, it rises or moves forward, It can move forward along the upper surface of the table 210 from the entrance part (O) of the packaging bag 20 to a predetermined point in the storage space (S). The insertion and vacuum means 230 may be a pusher with an integrated nozzle, and serves to push the sealed packaging container 11 into the storage space S and later to insert the entrance portion O of the packaging bag 20. It can also perform the role of creating a vacuum inside the storage space (S) by suctioning it while it is located in the storage space (S) until the sealing step.

When the sealed packaging container 11 is stored in the packaging bag 20, the sealing means 250 operates to compress the inlet portion O of the packaging bag 20 so that the inside of the packaging bag 20 is sealed. The sealing means (250) is a first sealing means (251) that seals the entrance part (O) of the packaging bag (2) by pressing it up and down, and a first sealing means (251) that presses both sides of the packaging bag (20) in the direction of the storage space (S). It may include a second sealing means (252). (FIG. 9(b)) The first sealing means 251 may be a pair of robot arms that face each other and include silicone pads at the ends, and can seal the entrance portion (O) of the packaging bag through heat or high frequency. . A pair of first sealing means 251 face each other at the top and bottom, and the pair of silicone pads move to correspond to each other, and the entrance portion (O) of the packaging bag 20 is between the pair of silicone pads. ) is inserted, thereby sealing the inlet portion O. The second sealing means 252 is a cylinder push, and presses the folded portion in the direction of the storage space S according to the shape of the packaging bag 20 with both sides folded at least once to seal the packaging bag 20. It holds the shape of

As described above, before the sealing means 250 completely seals the packaging bag 20, the air inside the packaging bag 20 is sucked through the insertion and vacuum means 230 located inside the packaging bag 20. By bringing it in and discharging it to the outside, the inside of the packaging bag 20 is made into a vacuum state. When the inside of the packaging bag (20) is in a vacuum state, the insertion and vacuum means (230) moves backwards and falls out of the storage space (S), and the sealing means (250) applies heat or high frequency to the entrance of the packaging bag (20). Part (O) can be completely sealed. (FIG. 9(c)) When the entrance part (O) of the packaging bag 20 is sealed, a portion of the storage space (S) from the entrance part (O) close to the entrance part (O) is compressed, including the upper and lower surfaces. A surplus area (B) is created. If this surplus area (B) is left alone, problems will occur in future processes. The packaging pack 21 is later loaded on the second cart loading unit 114. If a surplus area B exists, the space occupied by one packaging pack 21 increases, so a large number of packaging packs are stored in a limited space. (21) cannot be loaded. In addition, unlike the space where the sealed packaging container 11 is stored, the surplus area B can easily change its shape due to physical force, so it may cause mechanical failure during movement of the packaging pack 21 within the system 100. there is. To solve this problem, the packaging bag packing unit 112 according to an embodiment of the present invention includes a support means 260 and a taping unit 270 that are configured to minimize the surplus area B.

When sealing is completed, the sealing means 250 and the vacuum means 240 descend and return to the waiting position, and the support means 260, which was waiting at the lower part of the table 210, rises. The support means 260 rises and pushes up the lower surface of the surplus area (B), thereby forming the surplus area (B) into the upper surface (U) of the packaging bag 20, in which the sealed packaging container 11 is stored and the inside of which is in a vacuum state. It is placed parallel to the direction that intersects. (FIG. 10(a)) In other words, if the upper surface (U) of the packaging bag 20 is the xy plane, the upper surface (U) of the packaging bag 20 and the upper surface of the surplus area (B) are perpendicular to each other. Set up (B).

According to one embodiment, the support means 260 rises only to the upper surface (U) of the packaging bag 20 and pushes up the lower surface of the surplus area (B), thereby erecting the surplus area (B). In this case, the upward path of the support means 260 does not interfere with the moving path of the taping unit 270, so the taping unit 270 can determine the taping position on the packaging bag 20 without being disturbed by the support means 260. There is a characteristic.

According to another embodiment, the support means 260 rises beyond the upper surface (U) of the packaging bag 20 to the end of the surplus area (B) and pushes up the lower surface of the surplus area (B). ) can be set up. In this case, since the upward path of the support means 260 may overlap with the movement path of the taping unit 270, the support means 260 is placed on an avoidance path that avoids the path along which the taping unit 270 moves so that it can rise. You can. For example, the avoidance path may be a redundant area (B) located at a location corresponding to the area where the barcode shown in FIG. 11 is attached. If the surplus area (B) is not stiff and easily deformed, the support means 260 according to another embodiment supports the surplus area (B) more efficiently and has the effect of reducing taping defects.

The determination of the upward path of the support means 160 may be determined according to the degree to which the surplus area B can be deformed by physical force, the length of the surplus area B, and the material of the packaging bag 20.

Meanwhile, with respect to the angle at which the surplus area (B) is erected, the surplus area (B) is not limited to being erected perpendicular to the upper surface (U) of the packaging bag (20), but is positioned at the top of the packaging bag (20) to facilitate subsequent taping. The upper surface (U) and the upper surface of the surplus area (B) may be erected to have an acute angle. In this case, the support means 260 rises and then moves toward the end opposite to the entrance area (O) of the packaging bag 20, so that the upper surface (U) of the packaging bag 20 and the upper surface of the surplus area (B) are at an acute angle. can be implemented.

When set up in the surplus area (B), the taping unit 270, which was waiting in the waiting space at a position away from the table 210 in the direction of the surplus area (B), is placed on the opposite side of the entrance portion (O) of the packaging bag (20). While moving in the end direction (first direction), the upper surface of the surplus area (B) is folded so that it is in contact with the upper surface (U) of the packaging bag 20, and the first position of the lower surface of the surplus area (B) exposed upward. Taping is performed from ① to the second position ② on the upper surface (U) of the packaging bag (20) that is not covered by the lower surface of the surplus area (B). (FIG. 10(b)) In other words, the taping unit 270 raises the surplus area (B) formed after sealing the entrance portion of the packaging bag 20 and then moves the upper surface (U) of the packaging bag 20 in the direction. Fold it and tape it. Meanwhile, the support means 260 gradually descends and enters a standby state as the taping unit 270 moves from the first position ① to the second position ②. Meanwhile, it is sufficient that the first position ① is a part of the lower surface of the surplus area (B) exposed upward, and the second position ② is a part of the upper surface (U) of the packaging bag 20 that is not covered by the lower surface of the surplus area (B). This is enough. When taping is completed, the taping unit 270 moves in the second direction opposite to the first direction and waits in the waiting space again. (Figure 10(c))

When the support means 260 is fully raised, the taping unit 270 starts discharging the tape from the tape roll (not shown) on which the tape is wound at the first position ① and moves in the first direction to discharge the tape at the second position ②. A first part 271 that performs taping by cutting and a second part 272 that guides the first part 271 to move in the first direction and a second direction opposite to the first direction, or moves up and down ) includes.

For example, the first part 271 of the taping unit 270 is installed spaced apart on both sides and includes frames forming an internal space, a tape roll installed between the frames and wrapped with tape, and a tape installed between the frames. A sensor that detects the thickness of the tape wound on the roll and determines whether the tape is exhausted. It is placed to protrude from the bottom of the frame and guides the tape from the tape roll so that one end of the adhesive side of the tape is positioned in the first position of the packaging bag (20)① A guide roller that adheres to the frame is arranged to be able to move up and down, and when the packaging bag 20 moves in the first direction and reaches the second position ②, it is installed behind the cutting part and guide roller to cut the tape, and the packaging bag 20 moves in the first direction. It may include a pressure roller that pressurizes the tape attached to the bag 20.

Meanwhile, the tape (T in FIG. 11) included in the taping unit 270 has an adhesive surface on one side and may be made of a material that protects the object from ESD. For example, the tape may be made of aluminum.

The overall operation of the taping unit 270 and the movement of the first part 271 may be controlled by the controller 200.

Figure 11 is a conceptual diagram showing the taping method of the taping unit 270 according to an embodiment of the present invention.

Figure 11 is a plan view showing the upper surface of the packaging bag 20 on which taping has been performed or is being performed. The taping unit 270 according to an embodiment of the present invention includes a plurality of first parts 271, so that two taping operations can be performed at once, as shown in FIG. 11(a). Meanwhile, the taping unit 270 according to another embodiment of the present invention includes only one first part 271, and performs an initial taping operation on one part of the packaging bag 20 as shown in FIG. 11(b). After performing, the final taping operation can be performed on other parts of the packaging bag 20 in succession. One part and the other part may mean parts that are separated from each other by the same distance (d) on both sides of the center line connecting the entrance part (O) and the end of the packaging bag 20. When the taping operation is performed, it can be performed by avoiding the barcode (C) attached to the upper surface (U) of the packaging bag (20). As a result, the two tapes T can be adhered at the same distance from each other with the center line of the packaging bag 20 in between. Meanwhile, the taping operation of the taping unit 270 according to an embodiment of the present invention is not limited to what is shown in FIG. 11 and can be implemented in various ways.

As such, according to one embodiment of the present invention, the taping of the packaging bag 20 is automatically performed through the taping unit 270, thereby improving process efficiency. In addition, since the excess area (B) is fixed to the upper surface of the packaging bag (20) in a folded state through taping, it is possible to produce packaging packs (21) with a minimized size and as many packaging packs as possible for a limited space. It has the feature of being able to load (21). In addition, by minimizing or eliminating the surplus area (B) of the packaging pack 21, there is an effect of eliminating malfunctions or defects caused by the surplus area (B) during the process.

Hereinafter, the second mode (see FIG. 2) of the system 100 will be described.

FIG. 12 shows components corresponding to the second mode of FIG. 2. That is, the system of FIG. 2 and the system of FIG. 13 are the same, but in FIG. 13, only the components used for unpacking are shown in bold for convenience of explanation. Figure 13 shows components corresponding to the second mode of the system 100a according to another embodiment of the present invention. Figure 14 is a flow chart showing the process of unpacking the sealed packaging container by the components of Figure 13.

The system 100 of FIG. 12 includes a first cart loading unit 107, a first sealed packaging container terminal 106, a packing-unpacking unit 104, and a packaging container terminal 103, and the system of FIG. 13 includes The only difference in the system of FIG. 11 is that it further includes a defective sealed packaging container confirmation unit 104a and a defective sealed packaging container terminal 103a. Accordingly, referring to FIG. 14, the system of FIG. 12 includes steps S201 to S206, whereas the system of FIG. 13 further includes steps S201a and S201b. Therefore, hereinafter, the description will be made with reference to FIGS. 13 and 14 together, and the overlapping description of FIG. 12 will be omitted.

The first cart loading unit 107 provides a first cart loaded with sealed packaging containers 11.

The first sealed packaging container terminal 106 is connected to the first cart loading unit and loads the sealed packaging container 11 loaded on the first cart (S201).

The packing and unpacking unit 104 is connected to the first sealed packaging container terminal 106, the wafer terminal 102, and the packaging container terminal 103 through a moving conveyor belt, and in addition to the packaging device used in the first mode, the wafer and an opening device including packaging container transport equipment, opening equipment, etc. Accordingly, the packing-unpacking unit 104 unpacks the sealed packaging container 11 loaded from the first sealed packaging container terminal 106 to create a wafer and an empty packaging container, respectively.

Meanwhile, according to another embodiment, the packing and unpacking unit 104 may further include a defective sealed packaging container confirmation unit 104a. The defective sealed packaging container confirmation unit 104a checks whether the sealed packaging container 11 loaded from the first sealed packaging container terminal 106 has a defective packing before unpacking. If a defect in the packing is confirmed, the defective sealed packaging container is unloaded into the defective sealed packaging container terminal 103a. (S201a, S201b)

The defective sealed packaging container confirmation unit 104a may include a smart vision, which is a type of sensor that detects wafers (W) when a plurality of wafers (W) are stored in the sealed packaging container 11. It is possible to check whether the buffer (R in FIG. 7(d)) that prevents collision between the wafers W and the wafers W is correctly intervened and whether the right number of wafers W is stored.

The wafer terminal 102 is connected to the packing and unpacking unit 104 and includes a wafer transfer means such as a wafer transfer robot (WTR), and takes out the unpacked wafer (W) and stores it in the transfer container 51. In detail, in step S203, the first WTR of the wafer terminal 102 takes the wafer W out of the unpacked packaging container and unloads it into the wafer terminal 102. In step S204, the wafer (W) unloaded by the second WTR is aligned through OCR (Optical Character Recognition) and inspected for any defects. If defects such as cracks are confirmed, the wafer is not stored in the transfer container 51. In step S205, the wafer W on which the second WTR has been inspected is stored in the transfer container 51. The mobile container 51 containing the wafers is transferred inside for processing.

The packaging container terminal 103 is connected to the packing and unpacking unit 104, includes a device for discharging the packaging container 10, and unloads the unpacked empty packaging container 10. In other words, the empty packaging container 10 unpacked in step S206 is unloaded into the packaging container terminal 103.

According to this embodiment, the system is capable of packing and unpacking wafers just by changing the mode, and all wafer packing and unpacking processes are automated, thereby increasing process efficiency.

Unless there is an explicit order or statement to the contrary regarding the steps constituting the method according to the invention, the steps may be performed in any suitable order. The present invention is not necessarily limited by the order of description of the above steps. The use of any examples or illustrative terms (e.g., etc.) in the present invention is merely to describe the present invention in detail, and unless limited by the claims, the scope of the present invention is limited by the examples or illustrative terms. It doesn't work. Additionally, those skilled in the art will recognize that various modifications, combinations and changes may be made depending on design conditions and factors within the scope of the appended claims or their equivalents.

Therefore, the spirit of the present invention should not be limited to the above-described embodiments, and the scope of the patent claims described below as well as all scopes equivalent to or equivalently changed from the scope of the claims are within the scope of the spirit of the present invention. It will be said to belong to

11: Sealed packaging container
10: Packaging container
20: packaging bag
21: Packaging pack
100: Packing and unpacking system

Claims (9)

In the packing device for packing a sealed packaging container containing wafers,
Opening means for opening the entrance portion of the loaded packaging bag;
A guide means for entering the storage space of the opened packaging bag and then spreading and supporting both sides to secure the storage space;
Insertion and vacuum means that enters the secured storage space, pushes the sealed packaging container into the storage space, and creates a vacuum inside the packaging bag containing the sealed packaging container; and
a sealing means for sealing the entrance of the packaging bag in which the sealed packaging container is stored and the inside of which is in a vacuum state;
A wafer packing device comprising: According to paragraph 1,
Grip means for holding and fixing the entrance portion of the loaded packaging bag;
Further comprising: a wafer packing device. According to paragraph 1,
a first sealing means that seals the entrance of the packaging bag by pressing it up and down; and
a second sealing means that presses both sides of the packaging bag toward the storage space;
A wafer packing device comprising: According to paragraph 1,
A wafer packing device in which the insertion and vacuum means are integrated with a nozzle and a pusher that vacuum the interior of the storage space. In the wafer packing and unpacking system, which packs the wafer into a packaging container or packaging bag in the first mode and unpacks the wafer from the sealed packaging container in the second mode,
In the first mode,
A barcode recognition unit that determines the packing mode of the wafer by recognizing the barcode attached to the mobile container in which the plurality of wafers are stored;
a wafer terminal for removing and loading the wafer from the transport container;
a packaging container terminal for loading a packaging container for storing the wafer;
A packing-unpacking unit connected to the wafer terminal and the packaging container terminal and storing the wafer loaded from the wafer terminal in the packaging container loaded from the packaging container terminal and sealing the wafer to create a sealed packaging container;
A first sealed packaging container terminal for unloading the sealed packaging container;
a second sealed packaging container terminal for loading the sealed packaging container for packaging bag packing;
It is connected to the packing and unpacking unit, and if the packing mode determined by the barcode recognition unit is the first packing mode, the sealed packaging container is delivered to the first sealed packaging container terminal, and if the packing mode is in the second packing mode, the sealed packaging container is delivered. A transfer unit that delivers the packaging container to the second sealed packaging container terminal;
A packaging bag loading unit that has a storage space inside and loads a packaging bag made of a material that prevents static electricity;
a packaging bag packing unit that stores the sealed packaging container loaded in the second sealed packaging container terminal in the storage space of the packaging bag loaded from the packaging bag loading unit, seals it, and tapes it to create a packaging pack; and
a packaging pack unloading unit that unloads the packaging pack;
Packing and unpacking system for wafers, including. According to claim 5,
a packaging bag preparation unit that is connected to the packaging bag loading unit and prepares a packaging bag having a storage space therein and injects a desiccant into the packaging bag;
A packing and unpacking system for wafers, further comprising: According to claim 5,
In the second mode,
The first sealed packaging container terminal loads the sealed packaging container,
The packing and unpacking unit unpacks the sealed packaging container loaded from the first sealed packaging container terminal to remove the wafer from the packaging container and create an empty packaging container,
The wafer terminal is connected to the packing and unpacking unit to unload the wafer and store it in the moving container,
The packaging container terminal is connected to the packing and unpacking unit to unload the empty packaging container. According to claim 5,
The packing and unpacking unit,
A defective sealed packaging container confirmation unit that checks whether the packaging of the sealed packaging container is defective;
It further includes,
The wafer packing and unpacking system in the second mode is,
A defective sealed packaging container terminal connected to the first packing and unpacking unit and configured to unload a sealed packaging container confirmed to be defective in the defective sealed packaging container confirmation unit;
A packing and unpacking system for wafers, further comprising: According to claim 5,
The packaging bag packing part,
A taping unit that folds and taps the excess area formed after sealing the entrance of the packaging bag to be in contact with the upper surface of the packaging bag;
Packing and unpacking system for wafers, including.

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