KR20240038071A - 기판 처리 장치 및 기판 처리 방법 - Google Patents

기판 처리 장치 및 기판 처리 방법 Download PDF

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Publication number
KR20240038071A
KR20240038071A KR1020247006512A KR20247006512A KR20240038071A KR 20240038071 A KR20240038071 A KR 20240038071A KR 1020247006512 A KR1020247006512 A KR 1020247006512A KR 20247006512 A KR20247006512 A KR 20247006512A KR 20240038071 A KR20240038071 A KR 20240038071A
Authority
KR
South Korea
Prior art keywords
substrate
wafer
substrate processing
laser irradiation
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247006512A
Other languages
English (en)
Korean (ko)
Inventor
요시히로 카와구치
세이지 나카노
요헤이 야마와키
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20240038071A publication Critical patent/KR20240038071A/ko
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462—Nozzles; Features related to nozzles
    • H01L21/67092—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Cleaning In General (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR1020247006512A 2021-08-06 2022-07-26 기판 처리 장치 및 기판 처리 방법 Pending KR20240038071A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2021-130301 2021-08-06
JP2021130301 2021-08-06
PCT/JP2022/028734 WO2023013468A1 (ja) 2021-08-06 2022-07-26 基板処理装置及び基板処理方法

Publications (1)

Publication Number Publication Date
KR20240038071A true KR20240038071A (ko) 2024-03-22

Family

ID=85154479

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247006512A Pending KR20240038071A (ko) 2021-08-06 2022-07-26 기판 처리 장치 및 기판 처리 방법

Country Status (5)

Country Link
JP (2) JP7588725B2 (https=)
KR (1) KR20240038071A (https=)
CN (1) CN117769473A (https=)
TW (1) TW202326839A (https=)
WO (1) WO2023013468A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102903522B1 (ko) * 2020-04-02 2025-12-23 도쿄엘렉트론가부시키가이샤 기판 처리 방법 및 기판 처리 장치

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007069249A (ja) 2005-09-07 2007-03-22 Disco Abrasive Syst Ltd レーザー加工装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3630972B2 (ja) * 1998-03-11 2005-03-23 三菱電機株式会社 レーザ加工装置
JP2001321979A (ja) 2000-05-12 2001-11-20 Matsushita Electric Ind Co Ltd レーザー穴加工機の加工粉集塵装置
JP4682872B2 (ja) * 2006-02-27 2011-05-11 株式会社デンソー レーザ加工における飛散物の除去装置
JP7304433B2 (ja) 2019-12-26 2023-07-06 東京エレクトロン株式会社 基板処理方法及び基板処理装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007069249A (ja) 2005-09-07 2007-03-22 Disco Abrasive Syst Ltd レーザー加工装置

Also Published As

Publication number Publication date
CN117769473A (zh) 2024-03-26
TW202326839A (zh) 2023-07-01
WO2023013468A1 (ja) 2023-02-09
JP7588725B2 (ja) 2024-11-22
JP2025013658A (ja) 2025-01-24
JPWO2023013468A1 (https=) 2023-02-09

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PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000