JP7588725B2 - 基板処理装置及び基板処理方法 - Google Patents

基板処理装置及び基板処理方法 Download PDF

Info

Publication number
JP7588725B2
JP7588725B2 JP2023540271A JP2023540271A JP7588725B2 JP 7588725 B2 JP7588725 B2 JP 7588725B2 JP 2023540271 A JP2023540271 A JP 2023540271A JP 2023540271 A JP2023540271 A JP 2023540271A JP 7588725 B2 JP7588725 B2 JP 7588725B2
Authority
JP
Japan
Prior art keywords
substrate
unit
laser irradiation
irradiation unit
substrate processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023540271A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023013468A5 (https=
JPWO2023013468A1 (https=
Inventor
義広 川口
征二 中野
陽平 山脇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of JPWO2023013468A1 publication Critical patent/JPWO2023013468A1/ja
Publication of JPWO2023013468A5 publication Critical patent/JPWO2023013468A5/ja
Priority to JP2024197369A priority Critical patent/JP2025013658A/ja
Application granted granted Critical
Publication of JP7588725B2 publication Critical patent/JP7588725B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462—Nozzles; Features related to nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Cleaning In General (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2023540271A 2021-08-06 2022-07-26 基板処理装置及び基板処理方法 Active JP7588725B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024197369A JP2025013658A (ja) 2021-08-06 2024-11-12 基板処理装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021130301 2021-08-06
JP2021130301 2021-08-06
PCT/JP2022/028734 WO2023013468A1 (ja) 2021-08-06 2022-07-26 基板処理装置及び基板処理方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024197369A Division JP2025013658A (ja) 2021-08-06 2024-11-12 基板処理装置

Publications (3)

Publication Number Publication Date
JPWO2023013468A1 JPWO2023013468A1 (https=) 2023-02-09
JPWO2023013468A5 JPWO2023013468A5 (https=) 2024-04-17
JP7588725B2 true JP7588725B2 (ja) 2024-11-22

Family

ID=85154479

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2023540271A Active JP7588725B2 (ja) 2021-08-06 2022-07-26 基板処理装置及び基板処理方法
JP2024197369A Pending JP2025013658A (ja) 2021-08-06 2024-11-12 基板処理装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2024197369A Pending JP2025013658A (ja) 2021-08-06 2024-11-12 基板処理装置

Country Status (5)

Country Link
JP (2) JP7588725B2 (https=)
KR (1) KR20240038071A (https=)
CN (1) CN117769473A (https=)
TW (1) TW202326839A (https=)
WO (1) WO2023013468A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102903522B1 (ko) * 2020-04-02 2025-12-23 도쿄엘렉트론가부시키가이샤 기판 처리 방법 및 기판 처리 장치

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001321979A (ja) 2000-05-12 2001-11-20 Matsushita Electric Ind Co Ltd レーザー穴加工機の加工粉集塵装置
WO2021131711A1 (ja) 2019-12-26 2021-07-01 東京エレクトロン株式会社 基板処理方法及び基板処理装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3630972B2 (ja) * 1998-03-11 2005-03-23 三菱電機株式会社 レーザ加工装置
JP4993886B2 (ja) 2005-09-07 2012-08-08 株式会社ディスコ レーザー加工装置
JP4682872B2 (ja) * 2006-02-27 2011-05-11 株式会社デンソー レーザ加工における飛散物の除去装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001321979A (ja) 2000-05-12 2001-11-20 Matsushita Electric Ind Co Ltd レーザー穴加工機の加工粉集塵装置
WO2021131711A1 (ja) 2019-12-26 2021-07-01 東京エレクトロン株式会社 基板処理方法及び基板処理装置

Also Published As

Publication number Publication date
CN117769473A (zh) 2024-03-26
TW202326839A (zh) 2023-07-01
WO2023013468A1 (ja) 2023-02-09
JP2025013658A (ja) 2025-01-24
JPWO2023013468A1 (https=) 2023-02-09
KR20240038071A (ko) 2024-03-22

Similar Documents

Publication Publication Date Title
JP7720426B2 (ja) 基板処理方法
TWI814814B (zh) 基板處理系統及基板處理方法
JP6739873B2 (ja) ウェーハの加工方法
JP7422828B2 (ja) 基板処理装置及び基板処理方法
JP7780534B2 (ja) 処理方法及び処理システム
JP2025013658A (ja) 基板処理装置
WO2023176519A1 (ja) 基板処理装置及び基板処理方法
JP7749016B2 (ja) 基板処理装置及び基板処理方法
JP2023143077A (ja) 処理方法及び処理システム
JP2020072238A (ja) 基板処理装置及び基板処理方法
KR20090067033A (ko) 보호막 피복 장치 및 레이저 가공기
JP2020198367A (ja) 基板処理システム及び基板処理方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240126

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240126

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20240618

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240813

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20241015

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20241112

R150 Certificate of patent or registration of utility model

Ref document number: 7588725

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150