KR20240009403A - 조화 처리 구리박, 캐리어 구비 구리박, 동장 적층판 및 프린트 배선판 - Google Patents

조화 처리 구리박, 캐리어 구비 구리박, 동장 적층판 및 프린트 배선판 Download PDF

Info

Publication number
KR20240009403A
KR20240009403A KR1020237038900A KR20237038900A KR20240009403A KR 20240009403 A KR20240009403 A KR 20240009403A KR 1020237038900 A KR1020237038900 A KR 1020237038900A KR 20237038900 A KR20237038900 A KR 20237038900A KR 20240009403 A KR20240009403 A KR 20240009403A
Authority
KR
South Korea
Prior art keywords
copper foil
roughened
valleys
carrier
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020237038900A
Other languages
English (en)
Korean (ko)
Inventor
사오리 고이데
마코토 호소카와
미호 구리하라
치사토 다사카
아야코 요츠이
미사토 미조구치
Original Assignee
미쓰이금속광업주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미쓰이금속광업주식회사 filed Critical 미쓰이금속광업주식회사
Publication of KR20240009403A publication Critical patent/KR20240009403A/ko
Pending legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/16—Electroplating with layers of varying thickness
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
KR1020237038900A 2021-05-20 2022-05-18 조화 처리 구리박, 캐리어 구비 구리박, 동장 적층판 및 프린트 배선판 Pending KR20240009403A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2021-085489 2021-05-20
JP2021085489 2021-05-20
PCT/JP2022/020747 WO2022244826A1 (ja) 2021-05-20 2022-05-18 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板

Publications (1)

Publication Number Publication Date
KR20240009403A true KR20240009403A (ko) 2024-01-22

Family

ID=84141650

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237038900A Pending KR20240009403A (ko) 2021-05-20 2022-05-18 조화 처리 구리박, 캐리어 구비 구리박, 동장 적층판 및 프린트 배선판

Country Status (5)

Country Link
JP (1) JPWO2022244826A1 (https=)
KR (1) KR20240009403A (https=)
CN (1) CN117321253A (https=)
TW (1) TWI804323B (https=)
WO (1) WO2022244826A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117321254A (zh) * 2021-05-20 2023-12-29 三井金属矿业株式会社 粗糙化处理铜箔、带载体的铜箔、覆铜层叠板及印刷电路板

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016117587A1 (ja) 2015-01-22 2016-07-28 三井金属鉱業株式会社 キャリア付極薄銅箔及びその製造方法
JP2018026590A (ja) 2015-08-06 2018-02-15 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
WO2020031721A1 (ja) 2018-08-10 2020-02-13 三井金属鉱業株式会社 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5242710B2 (ja) * 2010-01-22 2013-07-24 古河電気工業株式会社 粗化処理銅箔、銅張積層板及びプリント配線板
JP5204908B1 (ja) * 2012-03-26 2013-06-05 Ｊｘ日鉱日石金属株式会社 キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板用キャリア付銅箔及びプリント配線板
JP5481577B1 (ja) * 2012-09-11 2014-04-23 Ｊｘ日鉱日石金属株式会社 キャリア付き銅箔
JP6591893B2 (ja) * 2013-06-04 2019-10-16 Ｊｘ金属株式会社 キャリア付銅箔、銅張積層板、プリント配線板、電子機器、樹脂層、キャリア付銅箔の製造方法、及びプリント配線板の製造方法
JP6373166B2 (ja) * 2014-10-30 2018-08-15 Ｊｘ金属株式会社 表面処理銅箔及び積層板
JP6682516B2 (ja) * 2015-04-28 2020-04-15 三井金属鉱業株式会社 粗化処理銅箔及びプリント配線板
JP6182584B2 (ja) * 2015-12-09 2017-08-16 古河電気工業株式会社 プリント配線板用表面処理銅箔、プリント配線板用銅張積層板及びプリント配線板
KR102297790B1 (ko) * 2017-05-19 2021-09-06 미쓰이금속광업주식회사 조화 처리 구리박, 캐리어를 구비한 구리박, 동장 적층판 및 프린트 배선판
US11781236B2 (en) * 2017-11-10 2023-10-10 Namics Corporation Composite copper foil
US10581081B1 (en) * 2019-02-01 2020-03-03 Chang Chun Petrochemical Co., Ltd. Copper foil for negative electrode current collector of lithium ion secondary battery

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016117587A1 (ja) 2015-01-22 2016-07-28 三井金属鉱業株式会社 キャリア付極薄銅箔及びその製造方法
JP2018026590A (ja) 2015-08-06 2018-02-15 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
WO2020031721A1 (ja) 2018-08-10 2020-02-13 三井金属鉱業株式会社 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板

Also Published As

Publication number Publication date
WO2022244826A1 (ja) 2022-11-24
CN117321253A (zh) 2023-12-29
TWI804323B (zh) 2023-06-01
JPWO2022244826A1 (https=) 2022-11-24
TW202302914A (zh) 2023-01-16

Similar Documents

Publication Publication Date Title
JP6352449B2 (ja) キャリア付極薄銅箔及びその製造方法
JP6430092B1 (ja) 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
WO2017179416A1 (ja) 表面処理銅箔、キャリア付銅箔、並びにそれらを用いた銅張積層板及びプリント配線板の製造方法
WO2021157363A1 (ja) 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
TWI756039B (zh) 粗糙化處理銅箔、附有載體銅箔、覆銅層壓板及印刷配線板
TWI808765B (zh) 粗化處理銅箔、附載體銅箔、銅箔積層板及印刷配線板
KR20240166990A (ko) 조화 처리 동박, 캐리어 구비 동박, 동장 적층판 및 프린트 배선판
KR20240009403A (ko) 조화 처리 구리박, 캐리어 구비 구리박, 동장 적층판 및 프린트 배선판
TWI888714B (zh) 粗化處理銅箔、附載體銅箔、銅箔積層板及印刷配線板
JP7834714B2 (ja) 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
KR20240009404A (ko) 조화 처리 구리박, 캐리어 구비 구리박, 동장 적층판 및 프린트 배선판
KR20230161954A (ko) 조화 처리 구리박, 동장 적층판 및 프린트 배선판
TWI808700B (zh) 粗化處理銅箔、銅箔積層板及印刷佈線板
TWI808777B (zh) 粗化處理銅箔、銅箔積層板及印刷佈線板
CN117337344A (zh) 粗糙化处理铜箔、带载体的铜箔、覆铜层叠板及印刷电路板
CN117480281A (zh) 粗糙化处理铜箔、覆铜层叠板和印刷电路板
TW202403110A (zh) 粗化處理銅箔、附載體銅箔、銅箔積層板及印刷配線板

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

R11 Change to the name of applicant or owner or transfer of ownership requested

Free format text: ST27 STATUS EVENT CODE: A-3-3-R10-R11-ASN-PN2301 (AS PROVIDED BY THE NATIONAL OFFICE)

R13 Change to the name of applicant or owner recorded

Free format text: ST27 STATUS EVENT CODE: A-3-3-R10-R13-ASN-PN2301 (AS PROVIDED BY THE NATIONAL OFFICE)