KR20240005118A - 보호 필름을 갖는 무기 기판/엔지니어링 플라스틱 필름 적층체, 적층체의 스택, 적층체의 보관 방법 및 적층체의 수송 방법 - Google Patents
보호 필름을 갖는 무기 기판/엔지니어링 플라스틱 필름 적층체, 적층체의 스택, 적층체의 보관 방법 및 적층체의 수송 방법 Download PDFInfo
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- KR20240005118A KR20240005118A KR1020237043849A KR20237043849A KR20240005118A KR 20240005118 A KR20240005118 A KR 20240005118A KR 1020237043849 A KR1020237043849 A KR 1020237043849A KR 20237043849 A KR20237043849 A KR 20237043849A KR 20240005118 A KR20240005118 A KR 20240005118A
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- film
- inorganic substrate
- protective film
- laminate
- engineering plastic
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- B32B9/045—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/12—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/04—4 layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/538—Roughness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2379/00—Other polymers having nitrogen, with or without oxygen or carbon only, in the main chain
- B32B2379/08—Polyimides
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Ceramic Engineering (AREA)
- Laminated Bodies (AREA)
- Packages (AREA)
- Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020064158 | 2020-03-31 | ||
| JPJP-P-2020-064158 | 2020-03-31 | ||
| KR1020227029868A KR102665141B1 (ko) | 2020-03-31 | 2021-02-24 | 보호 필름을 갖는 무기 기판/엔지니어링 플라스틱 필름 적층체, 적층체의 스택, 적층체의 보관 방법 및 적층체의 수송 방법 |
| PCT/JP2021/006844 WO2021199798A1 (ja) | 2020-03-31 | 2021-02-24 | 保護フィルム付きの無機基板／エンジニアリングプラスチックフィルム積層体、積層体のスタック、積層体の保管方法、および積層体の輸送方法 |
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| KR1020227029868A Active KR102665141B1 (ko) | 2020-03-31 | 2021-02-24 | 보호 필름을 갖는 무기 기판/엔지니어링 플라스틱 필름 적층체, 적층체의 스택, 적층체의 보관 방법 및 적층체의 수송 방법 |
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| KR (2) | KR20240005118A (enrdf_load_stackoverflow) |
| CN (1) | CN115243881A (enrdf_load_stackoverflow) |
| TW (1) | TWI811636B (enrdf_load_stackoverflow) |
| WO (1) | WO2021199798A1 (enrdf_load_stackoverflow) |
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| CN116917124A (zh) | 2021-03-04 | 2023-10-20 | 东洋纺株式会社 | 附带保护膜的无机基板/高分子膜层的层叠体、层叠体的组、层叠体的保管方法以及层叠体的运输方法 |
| CN118119507A (zh) * | 2021-10-27 | 2024-05-31 | 东洋纺株式会社 | 附有保护膜的无机基板与耐热高分子膜的层叠体 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5152104B2 (ja) | 2009-06-08 | 2013-02-27 | 東洋紡株式会社 | 積層体およびその製造方法 |
| JP5699606B2 (ja) | 2011-01-06 | 2015-04-15 | 東洋紡株式会社 | フィルムデバイス製造用ポリイミド前駆体溶液 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JPS5152104U (enrdf_load_stackoverflow) | 1974-10-17 | 1976-04-20 | ||
| JPS5699606U (enrdf_load_stackoverflow) | 1979-12-27 | 1981-08-06 | ||
| JP2004269624A (ja) * | 2003-03-06 | 2004-09-30 | Sekisui Film Kk | 光学部品保護シート |
| JP2005125659A (ja) * | 2003-10-24 | 2005-05-19 | Nitto Denko Corp | 表面保護フィルム |
| KR101266712B1 (ko) * | 2005-05-16 | 2013-05-28 | 니폰샤신인사츠가부시키가이샤 | 재박리 가능한 보호패널의 실장구조와 이에 이용되는실장용 시트 |
| JP2008074037A (ja) * | 2006-09-25 | 2008-04-03 | Toray Ind Inc | 耐熱性フレキシブル金属積層板の製造方法 |
| CN103959106B (zh) * | 2011-12-02 | 2015-09-09 | 夏普株式会社 | 层叠体 |
| EP2839953B1 (en) * | 2012-03-29 | 2020-08-05 | Lintec Corporation | Gas barrier laminate, method for producing same, member for electronic devices, and electronic device |
| JP6353184B2 (ja) * | 2012-07-26 | 2018-07-04 | 味の素株式会社 | 保護フィルム付き接着シート、積層体の製造方法、及びプリント配線板の製造方法 |
| US20140120315A1 (en) * | 2012-10-25 | 2014-05-01 | Bruce Gardiner Aitken | Flexible multilayer hermetic laminate |
| JP6372352B2 (ja) * | 2013-07-16 | 2018-08-15 | 東洋紡株式会社 | フレキシブル電子デバイスの製造方法 |
| TWI735411B (zh) * | 2014-06-18 | 2021-08-11 | 日商味之素股份有限公司 | 附保護薄膜之接著片 |
| JP6427459B2 (ja) * | 2015-04-17 | 2018-11-21 | 富士フイルム株式会社 | 機能性フィルムおよび機能性フィルムの製造方法 |
| KR102720278B1 (ko) * | 2016-03-04 | 2024-10-21 | 린텍 가부시키가이샤 | 반도체 가공용 시트 |
| CN108966671B (zh) * | 2016-03-24 | 2023-09-26 | 琳得科株式会社 | 支撑片及保护膜形成用复合片 |
| JP6998734B2 (ja) * | 2016-11-29 | 2022-01-18 | 住友化学株式会社 | 積層体及びこれを含むデバイス |
| CN110225823A (zh) * | 2017-01-18 | 2019-09-10 | 柯尼卡美能达株式会社 | 功能性膜层叠体及电子器件的制造方法 |
| JP2018173542A (ja) * | 2017-03-31 | 2018-11-08 | 株式会社半導体エネルギー研究所 | 素子、半導体装置、発光装置、表示装置、剥離方法、半導体装置の作製方法、発光装置の作製方法及び表示装置の作製方法 |
| JP2019133049A (ja) * | 2018-02-01 | 2019-08-08 | 日東電工株式会社 | 表面保護フィルム付光学積層体 |
| JP2020033400A (ja) * | 2018-08-27 | 2020-03-05 | 日東電工株式会社 | 積層体 |
| CN112752813B (zh) * | 2018-09-28 | 2023-02-28 | 琳得科株式会社 | 阻气性层叠体 |
| JP7115510B2 (ja) * | 2019-06-06 | 2022-08-09 | Ａｇｃ株式会社 | 積層基板、および梱包体 |
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2021
- 2021-02-23 TW TW110106237A patent/TWI811636B/zh active
- 2021-02-24 KR KR1020237043849A patent/KR20240005118A/ko not_active Ceased
- 2021-02-24 KR KR1020227029868A patent/KR102665141B1/ko active Active
- 2021-02-24 WO PCT/JP2021/006844 patent/WO2021199798A1/ja not_active Application Discontinuation
- 2021-02-24 CN CN202180019216.0A patent/CN115243881A/zh active Pending
- 2021-02-24 JP JP2021526614A patent/JP6962506B1/ja active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5152104B2 (ja) | 2009-06-08 | 2013-02-27 | 東洋紡株式会社 | 積層体およびその製造方法 |
| JP5699606B2 (ja) | 2011-01-06 | 2015-04-15 | 東洋紡株式会社 | フィルムデバイス製造用ポリイミド前駆体溶液 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2021199798A1 (enrdf_load_stackoverflow) | 2021-10-07 |
| CN115243881A (zh) | 2022-10-25 |
| WO2021199798A1 (ja) | 2021-10-07 |
| KR102665141B1 (ko) | 2024-05-10 |
| KR20220154099A (ko) | 2022-11-21 |
| TW202204145A (zh) | 2022-02-01 |
| TWI811636B (zh) | 2023-08-11 |
| JP6962506B1 (ja) | 2021-11-05 |
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