KR20240001822A - Antenna pattern and manufacturing method thereof - Google Patents

Abstract

The present disclosure proposes an antenna pattern and a method of manufacturing the same that form a fine and precise line spacing of the antenna pattern by forming a plating layer on the inner wall of a through hole formed in a metal sheet. The presented antenna pattern manufacturing method involves forming a first half groove and a second half groove on both sides of a metal sheet using a half etching process and/or a half punching process, and forming the inner wall of the through hole consisting of the first half groove and the second half groove. Plating is performed to form an antenna pattern.

Description

Antenna pattern and manufacturing method thereof {ANTENNA PATTERN AND MANUFACTURING METHOD THEREOF}

The present invention relates to a method of manufacturing an antenna pattern, and more specifically, to a method of manufacturing a loop-shaped antenna pattern that is mounted on a portable terminal and used for wireless power transmission and reception or communication.

Recently, market demand for high power wireless charging of 20W or more is increasing for fast charging. Compared to general charging methods, high-output wireless charging applies a higher voltage to the antenna and substrate for wireless power transmission/reception, which can reduce charging efficiency or, in extreme cases, cause a fire.

Accordingly, in the high-output wireless charging market, the importance of not only wireless charging efficiency but also heat suppression is increasing, and the thickness of the antenna is becoming thicker for charging efficiency and heat suppression.

Coil winding method, pattern printing method, and hybrid method are mainly used to manufacture antennas for wireless power transmission/reception.

However, the conventional manufacturing method cannot precisely form the line spacing (or line width) of the pattern when the thickness of the antenna becomes thick. Accordingly, antennas manufactured using conventional manufacturing methods can suppress heat generation, but have the problem of reduced charging efficiency.

The matters described in the above background technology are intended to aid understanding of the background of the invention and may include matters that are not disclosed prior art.

Korean Patent No. 10-1218755

The present invention has been proposed to solve the above problems, and its purpose is to provide a method of manufacturing an antenna pattern that precisely forms the line spacing (or line width) of the antenna pattern by plating the inner wall of the through hole.

In order to achieve the above object, the antenna pattern according to an embodiment of the present invention is a loop-shaped antenna pattern, and the vertical cross-section of the antenna pattern includes a first metal pattern, a second metal pattern spaced apart from the first metal pattern, and a first metal pattern. It includes a through hole interposed between the pattern and the second metal pattern to form a space between the first metal pattern and the second metal pattern, and a plating layer formed on an inner wall of the through hole.

The through hole includes a first half hole disposed toward the top of the antenna pattern and a second half hole disposed toward the bottom of the antenna pattern, and at least a portion of the first half hole and the second half hole overlap to form the antenna pattern. It may be configured to form a vertically penetrating through hole.

The plating layer may be formed on at least one end of the first end of the first metal pattern facing the second metal pattern and the first end of the second metal pattern facing the first metal pattern.

A groove may be formed in the first end of the first metal pattern facing the second metal pattern, and a plating layer may be plated in the groove to flatten the first end of the first metal pattern.

A groove may be formed in the first end of the second metal pattern facing the first metal pattern, and a plating layer may be plated in the groove to flatten the first end of the second metal pattern.

In order to achieve the above object, the method of manufacturing an antenna pattern according to an embodiment of the present invention includes the steps of laminating a carrier sheet to the first side of a metal sheet, forming a first half groove on the second side of the metal sheet, and forming a first half groove on the second side of the metal sheet. Laminating the coverlay sheet on the second side of the sheet, removing the carrier sheet laminated on the first side of the metal sheet, forming a second half groove on the first side of the metal sheet, and forming a first half groove. and forming a plating layer on the inner wall surface of at least one of the second half grooves.

In the step of forming the first half groove, the first half groove may be formed on the second side of the metal sheet toward the inside of the metal sheet through a half etching and punching process.

In the step of forming the second half groove, the second half groove may be formed on the first side of the metal sheet toward the inside of the metal sheet through a half etching and punching process.

In the step of forming the second half groove, the second half groove is formed so that at least a portion overlaps the first half groove, and the first half groove and the second half groove penetrate the first and second sides of the metal sheet. A through hole can be formed.

The first half groove formed in the step of forming the first half groove has a first central axis vertically penetrating the first and second sides of the metal sheet, and the second half groove formed in the step of forming the second half groove It has a second central axis that passes perpendicularly through the first and second surfaces of the metal sheet, and the first central axis and the second central axis can be spaced apart or arranged on the same line.

The first half groove and the second half groove form a through hole penetrating the first and second sides of the metal sheet, and in the step of forming the plating layer, at least one inner wall surface of the first half groove and the second half groove By forming a plating layer on the inner wall surface of the through hole can be flattened.

The first half groove and the second half groove form a through hole penetrating the first and second sides of the metal sheet, and in the step of forming the plating layer, the plating layer may be formed on the inner wall of the through hole.

According to the present invention, the antenna pattern is formed by forming a plating layer on the end of the metal pattern, thereby flattening the end of the metal pattern (i.e., the side of the antenna pattern) to reduce the width of the through hole (i.e., the line spacing (or line width) of the antenna pattern). It has the effect of being able to form narrower and more precisely.

In addition, the antenna pattern manufacturing method divides the etching process and/or the punching process into two stages to form a through hole, thereby reducing the width of the through hole formed in the metal sheet (i.e., the line spacing of the antenna pattern) compared to the conventional antenna pattern manufacturing method. or line width) can be reduced by about 50%.

In addition, the antenna pattern manufacturing method reduces the width of the through hole (i.e., the line spacing or line width of the antenna pattern) by about 50% compared to the conventional method, allowing a line spacing (pitch) of 100um or less even in a metal sheet with a thickness of 3oz (105um) or more. There is an effect of being able to produce an antenna pattern with

In addition, the antenna pattern manufacturing method allows the production of an antenna pattern with a line spacing of about 80% to 120% of the metal thickness, which increases design freedom and enables performance-optimized design.

In addition, the antenna pattern manufacturing method forms a through hole and then forms a plating layer on the inner wall of the through hole, so that the line spacing (or line width) of the antenna pattern can be formed more finely and precisely.

Additionally, the antenna pattern manufacturing method forms a plating layer on the inner wall of the through hole, thereby minimizing the width of the through hole and minimizing the line spacing of the antenna pattern.

In addition, the antenna pattern manufacturing method forms a plating layer on the inner wall of the through hole, thereby flattening the inner wall of the through hole and forming the line spacing of the antenna pattern precisely.

1 is a diagram for explaining an antenna pattern and a method of manufacturing the pattern according to an embodiment of the present invention.
Figure 2 is a diagram for explaining an antenna pattern according to an embodiment of the present invention.
FIGS. 3 and 4 are views for explaining the through hole shown in FIG. 2.
Figure 5 is a diagram for explaining the line spacing of an antenna pattern according to an embodiment of the present invention.
6 is a flowchart illustrating a method of manufacturing an antenna pattern according to an embodiment of the present invention.
7 is a diagram for explaining a method of manufacturing an antenna pattern according to an embodiment of the present invention.
8 and 9 are diagrams for comparing and explaining the conventional antenna pattern manufacturing method and the antenna pattern manufacturing method of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings.

The examples are provided to more completely explain the present invention to those skilled in the art, and the following examples may be modified in various other forms, and the scope of the present invention is limited to the following examples. It is not limited. Rather, these embodiments are provided to make the disclosure more faithful and complete and to fully convey the spirit of the invention.

The terms used herein are used to describe specific embodiments and are not intended to limit the invention. Additionally, in this specification, singular forms may include plural forms, unless the context clearly indicates otherwise.

In the description of the embodiment, each layer (film), region, pattern or structure is said to be formed “on” or “under” the substrate, each layer (film), region, pad or pattern. Where described, “on” and “under” include both being formed “directly” or “indirectly” through another layer. In addition, in principle, the standards for the top or bottom of each floor are based on the drawing.

The drawings are only intended to enable understanding of the spirit of the present invention, and should not be construed as limiting the scope of the present invention by the drawings. Additionally, in the drawings, relative thickness, length, or relative size may be exaggerated for convenience and clarity of explanation.

Referring to FIG. 1, the antenna pattern and its manufacturing method according to an embodiment of the present invention manufacture a loop-shaped antenna pattern 100 using a metal sheet 110. The antenna pattern 100 manufactured through the antenna pattern manufacturing method is an antenna pattern for wireless power transmission/reception (WPC; Wireless Power Consortium), an antenna pattern for near field communication (NFC; Near Field Communication), and an antenna pattern for electronic payment (MST; Magnetic Secure). It can be used as an antenna pattern for transmission, etc.

The antenna pattern manufacturing method according to an embodiment of the present invention may be used to manufacture a combo antenna pattern including two or more of WPC, NFC, and MST.

Additionally, one or more antenna patterns 100 manufactured by the antenna pattern manufacturing method according to an embodiment of the present invention may be assembled on a circuit board (FPCB) to form a single antenna or a combo antenna. At this time, the antenna pattern 100 may be assembled on the circuit board through a soldering process, ultrasonic welding process, etc.

At this time, at least one antenna pattern among the NFC antenna pattern and the MST antenna pattern and terminal portions for connecting the antenna patterns to an external board (for example, the main board of a mobile terminal) are formed on the circuit board, and in an embodiment of the present invention, The WPC antenna pattern 100 manufactured by the following antenna pattern manufacturing method may be assembled into a circuit board through a soldering process, an ultrasonic welding process, etc., and a combo antenna may be formed by assembling a shielding sheet, a heat dissipation sheet, etc.

Referring to FIG. 2, the vertical cut surface of the antenna pattern 100 according to an embodiment of the present invention has a plurality of metal patterns 111 and a plurality of through holes 112 arranged alternately. Hereinafter, in order to easily explain the antenna pattern 100 according to an embodiment of the present invention, the description will be made based on the vertical cut surface of the antenna pattern 100.

The metal pattern 111 has a groove formed at an end adjacent to the through hole 112. At this time, the groove may be formed only at the end of one of the two metal patterns 111 adjacent to both sides of the through hole 112.

For example, the first end of the first metal pattern 111a has a first groove biased toward the top of the first metal pattern 111a and a second groove biased toward the bottom of the first metal pattern 111a based on the drawing. This is formed. At this time, a first protrusion formed by connecting the first end of the first groove and the first end of the second groove is further formed at the first end of the first metal pattern 111a. Here, the first protrusion protrudes in the direction in which the first through hole 112a is disposed.

The first end of the second metal pattern 111b may include a third groove formed to be biased toward the upper surface of the second metal pattern 111b and a fourth groove formed to be biased to the lower surface of the second metal pattern 111b. . At this time, a second protrusion formed by connecting the first end of the third groove and the first end of the fourth groove is further formed at the first end of the second metal pattern 111b. Here, the second protrusion protrudes in the direction in which the first through hole 112a is disposed.

Here, it has been shown and explained that grooves are formed in both the first metal pattern 111a and the second metal pattern 111b, but this is not limited to this and only one of the first metal pattern 111a and the second metal pattern 111b Grooves may be formed only on one end.

A plating layer 113 is formed at an end of the metal pattern 111 adjacent to the through hole 112. The plating layer 113 is formed at the end of the metal pattern 111 through a plating process, and is formed on the groove formed at the end of the metal pattern 111. The plating layer 113 may be formed to cover only the grooves of the metal pattern 111, and may be formed into a multi-layer structure by repeating the plating process.

The through hole 112 is interposed between two adjacent metal patterns 111 to form a space, and the space formed by the through hole 112 forms a line spacing of the antenna pattern 100.

For example, the first through hole 112a is interposed between the first metal pattern 111a and the second metal pattern 111b, thereby separating the first metal pattern 111a and the second metal pattern 111b. The second through hole 112b is interposed between the second metal pattern 111b and the third metal pattern 111c, thereby separating the second metal pattern 111b and the third metal pattern 111c. The third to tenth through holes 112c to 112j are also interposed between the two adjacent metal patterns 111 to space the two metal patterns 111 apart.

The through hole 112 includes a first half hole (H1) and a second half hole (H2). At this time, the first half hole (H1) and the second half hole (H2) are configured to overlap at least a portion to form a through hole 112 that vertically penetrates the upper and lower surfaces of the antenna pattern 100. Here, the first half hole H1 and the second half hole H2 respectively correspond to the first half groove 114 and the second half groove 115, which will be described later.

Referring to FIG. 3, the central axis (A) of the first half hole (H1) and the central axis (B) of the second half hole (H2) are perpendicular to the upper and lower surfaces of the antenna pattern 100, and the central axis ( A) and the central axis (B) are arranged on the same line. Accordingly, the through hole 112 has an “8” shape that vertically penetrates the antenna pattern 100.

In an embodiment of the present invention, the through hole 112 is formed through a double etching process, but in an actual process, it is very difficult to etch the first half hole (H1) and the second half hole (H2) to be accurately aligned.

Accordingly, referring to FIG. 4, the first half hole (H1) and the second half hole (H2) are formed to be offset, and the through hole 112 diagonally (or obliquely, diagonally) the antenna pattern 100. It can penetrate.

For example, the central axis (A) of the first half hole (H1) and the central axis (B) of the second half hole (H2), which are perpendicular to the upper and lower surfaces of the antenna pattern 100, are offset from each other in the horizontal direction in the drawing. (or parallel), and the through hole 112 penetrates the antenna pattern 100 diagonally. Accordingly, the cross section of the through hole 112 has an inclined “8” shape.

As the grooves at the ends of the metal pattern 111 are covered and flattened by the plating layer 113, the width of the through hole 112 (i.e., the line spacing (or line width) of the antenna pattern 100) becomes narrower and more precise. can be formed.

Referring to FIG. 5 as an example, as the plating layer 113 is formed at the end of the metal pattern 111, the width W of the through hole 112 is less than that of the metal pattern 111 without the plating layer 113. It is formed to be narrower than the width (W2) by a+b. Therefore, the antenna pattern 100 according to an embodiment of the present invention precisely forms the line spacing (or line width) of the antenna pattern 100 even if the thickness of the antenna pattern 100 (i.e., the metal sheet 110) increases. can do.

In this way, the antenna pattern 100 according to an embodiment of the present invention forms the plating layer 113 at the end of the metal pattern 111, thereby forming the end of the metal pattern 111 (i.e., the side surface of the antenna pattern 110). By flattening, the width of the through hole 112 (i.e., the line spacing (or line width) of the antenna pattern 100) can be formed narrower and more precisely.

Referring to Figures 6 and 7, the antenna pattern manufacturing method according to an embodiment of the present invention includes a carrier sheet laminating step (S110), a first half groove forming step (S120), a coverlay sheet laminating step (S130), and a carrier sheet laminating step (S130). It includes a removal step (S140), a second half groove forming step (S150), and a plating layer forming step (S160).

In the carrier sheet lamination step (S110), the carrier sheet 120 is laminated to the first side of the metal sheet 110. In the carrier sheet lamination step (S110), the carrier sheet 120 is laminated to the first surface (that is, the upper surface of the metal sheet 110) of the metal sheet 110 having a thickness equal to or greater than the set thickness.

In the carrier sheet lamination step (S110), a metal sheet 110 having a thickness of approximately 2oz (i.e., approximately 70um) or more is prepared. At this time, in the carrier sheet lamination step (S110), a metal sheet 110 made of copper (Cu) used for the general antenna pattern 100 is prepared.

In the carrier sheet lamination step (S110), an amorphous solid or semi-solid resin made of polymers such as polyimide (PI), polyethylene terephthalate (PET), or organic compounds and their derivatives is prepared as the carrier sheet 120.

In the carrier sheet lamination step (S110), for example, the carrier sheet 120 is laminated to the first side of the metal sheet 110 through a roll to roll process.

In the first half groove forming step (S120), the first half groove 114 is formed in the metal sheet 110 through an etching process, a punching process, etc. In the first half groove forming step (S120), a first half groove 114 is formed on the second surface of the metal sheet 110 toward the inside of the metal sheet 110.

In the first half groove forming step (S120), the first half groove 114 may be formed on the second surface of the metal sheet 110 through an etching process.

In the first half groove forming step (S120), the second surface of the metal sheet 110 is exposed to form an exposure layer on the second surface of the metal sheet 110.

In the first half groove forming step (S120), a photoresist film is laminated to the metal sheet 110 on which the carrier sheet 120 is laminated, or a photoresist is applied to the second side of the metal sheet 110. This forms an exposed layer.

In the first half groove forming step (S120), the antenna pattern 100 mask is stacked (or placed) on the second side of the metal sheet 110 on which the exposure layer is formed, and the metal sheet 110 is formed through an exposure device. ) and shine UV light on the second side. Accordingly, the exposed layer formed on the second surface of the metal sheet 110 is hardened into the same shape as the antenna pattern 100 of the antenna pattern 100 mask.

In the first half groove forming step ( S130 ), the first half groove 114 is formed in the metal sheet 110 by etching the second surface of the metal sheet 110 that has undergone the first exposure step.

In the first half groove forming step (S130), the second surface of the metal sheet 110 on which the exposure layer is formed is etched. In the first half groove forming step (S130), the second surface of the metal sheet 110 on which the exposure film is laminated is etched through an etching process such as wet etching or dry etching. Accordingly, a first half groove 114 is formed in the metal sheet 110 from the second surface of the metal sheet 110 toward the inside of the metal sheet 110. In the first half groove forming step (S130), the cured exposure layer is removed after the first half groove 114 is formed.

In the first half groove forming step (S120), the first half groove 114 may be formed on the second surface of the metal sheet 110 through a punching process.

In the first half groove forming step (S120), the first half groove 114 is formed on the second side of the metal sheet 110 by half punching the second side of the metal sheet 110. In the first half groove forming step (S120), a plurality of first half grooves 114 are formed on the second surface of the metal sheet 110 by controlling the punching pressure.

In the coverlay sheet lamination step (S130), the coverlay sheet 130 is laminated to the second side of the metal sheet 110 on which the first half groove 114 is formed. In the coverlay sheet lamination step (S130), the coverlay sheet 130 is laminated to the second side of the metal sheet 110 on which the first half groove 114 is formed. At this time, the coverlay sheet 130 is an example of a sheet formed of a material such as PI, PET, or thermosetting resin.

In the carrier sheet removal step (S140), the carrier sheet 120 is removed from the metal sheet 110 on which the coverlay sheet 130 is laminated to the first side. In the carrier sheet removal step (S140), the carrier sheet 120 laminated to the second side of the metal sheet 110 is removed.

In the second half groove forming step (S150), the second half groove 115 is formed in the metal sheet 110 through an etching process, a punching process, etc. In the second half groove forming step (S150), a second half groove 115 is formed on the first surface of the metal sheet 110 in the inner direction of the metal sheet 110.

In the second half groove forming step (S150), the second half groove 115 is formed so that at least part of the first half groove 114 formed in the first half groove forming step (S130) overlaps. Accordingly, the first half groove 114 and the second half groove 115 form a through hole 112 penetrating the metal sheet 110, and the through hole 112 is formed by the metal sheet 110. The line spacing of the antenna pattern 100 is formed.

In the plating layer forming step (S160), the plating layer 113 is formed on the inner wall of the through hole 112. In the plating layer forming step (S160), the plating layer 113 is formed on the inner wall surface of the through hole 112 (i.e., the end of the metal sheet 110) through a plating process.

The antenna pattern manufacturing method according to an embodiment of the present invention forms a plating layer 113 on the inner wall of the through hole 112 through the plating layer forming step (S160), thereby minimizing the width of the through hole 112 and forming the antenna pattern. Line spacing can be minimized.

In addition, the method of manufacturing an antenna pattern according to an embodiment of the present invention flattens the inner wall surface of the through hole 112 by forming a plating layer 113 on the inner wall surface of the through hole 112 through the plating layer forming step (S160). The line spacing of the antenna pattern can be formed precisely.

In the plating layer forming step (S160), a plating layer may be formed on the inner wall of at least one of the first half grooves 114 and the second half grooves 115. In the plating layer forming step (S160), for example, a plating layer is formed on the inner wall of a half groove formed through an etching process.

When forming the first half groove 114 and the second half groove 115 through etching in the first half groove forming step (S120) and/or the second half groove forming step (S150), the through hole 112 A groove may be formed at an end of the metal sheet 110 adjacent to . Accordingly, in the plating layer forming step (S160), the plating layer 113 is formed on the groove formed at the end of the metal sheet 110.

In the plating layer forming step (S160), the plating layer 113 may be formed to cover only the grooves of the metal sheet 110, or the plating process may be repeated to form the plating layer 113 having a multilayer structure.

Through the plating layer forming step (S160), the through hole 112 is interposed between the ends of the two adjacent metal sheets 110 to form a separation space, and the separation space formed by the through hole 112 is the antenna pattern 100. ) to form a line spacing.

Referring to FIG. 8, the conventional antenna pattern manufacturing method forms through holes 11 that form the line spacing of the antenna pattern in the metal sheet 10 through one-time etching. In this case, due to the limitations of etching technology, the width W3 of the through hole 11 increases in proportion to the thickness T of the metal sheet 10, and the width W3 of the through hole 11 formed through the conventional etching process is That is, the line spacing of the antenna pattern) is formed to be about twice (200%) the thickness (T) of the metal sheet 10.

That is, if the thickness (T) of the metal sheet (10, antenna pattern) is about 2oz (approximately 70um), the width (W3, that is, the line of the antenna pattern) of the through hole 11 formed by the conventional antenna pattern manufacturing method is The spacing or line width) is formed to be approximately 140um.

If the thickness (T) of the metal sheet (10, antenna pattern) is about 3oz (approximately 105um), the width (W3, that is, the line spacing of the antenna pattern or The line width) is formed to be approximately 210um.

On the other hand, the antenna pattern manufacturing method according to an embodiment of the present invention involves an etching process and/or a punching process in two steps (i.e., a first half groove forming step (S130) and a second half groove forming step (S130) to form the through hole 112. By performing the groove forming step (S180), the width of the through hole 112 formed in the metal sheet 110 (i.e., the line spacing or line width of the antenna pattern 100) is formed to be less than or equal to the thickness of the metal sheet 110. can do.

At this time, the width of the through hole 112 (i.e., the line spacing or line width of the antenna pattern 100) may be formed to be about 80% to 120% of the thickness of the metal sheet 110, including errors during the manufacturing process.

For example, referring to FIG. 9, if the thickness T of the metal sheet 110 (i.e., the antenna pattern 100) is about 2oz (approximately 70um), it is formed by the antenna pattern manufacturing method according to an embodiment of the present invention. The width (W4, that is, the line spacing or line width of the antenna pattern 100) of the through hole 112 is formed to be approximately 70 um.

If the thickness (T) of the metal sheet 110 (i.e., the antenna pattern 100) is about 3 oz (approximately 105 um), the width (W4, i.e., the antenna) of the through hole 112 formed by the conventional antenna pattern manufacturing method is The line spacing or line width of the pattern 100 is formed to be approximately 100 um.

As such, the antenna pattern manufacturing method according to an embodiment of the present invention is performed by dividing the etching process and/or punching process into two steps (i.e., the first half groove forming step (S130) and the second half groove forming step (S150)) By forming the through hole 112, the width of the through hole 112 formed in the metal sheet 110 (i.e., the line spacing or line width of the antenna pattern 100) is reduced by about 50% compared to the conventional antenna pattern manufacturing method. can be reduced.

In addition, the antenna pattern manufacturing method according to an embodiment of the present invention reduces the width of the through hole 112 (i.e., the line spacing or line width of the antenna pattern 100) by about 50% compared to the prior art, thereby reducing the thickness to 3oz (105um). ) or more, there is an effect of producing an antenna pattern 100 with a line spacing (pitch) of 100 um or less.

In addition, the antenna pattern manufacturing method enables the manufacturing of the antenna pattern 100 with a line spacing of approximately 80% to 120% of the metal thickness, thereby increasing design freedom and enabling performance-optimized design.

In addition, the antenna pattern manufacturing method forms the through hole 112 and then forms the plating layer 113 on the inner wall of the through hole 112, so that the line spacing (or line width) of the antenna pattern 100 is finer and more precise. can be formed.

Here, although not shown in FIGS. 6 and 7, the antenna pattern manufacturing method according to an embodiment of the present invention may further include a surface treatment step and a stamping step that are performed step by step after the secondary plating layer forming step (S160). .

In the surface treatment step, the first side of the metal sheet 110 is surface treated. In the surface treatment step, an organic material is applied through an Organic Solderability Preservative (OSP) process to form a rust prevention film 118 on the first side of the metal sheet 110. Through this, the first surface of the metal sheet 110 is flattened and air is blocked from contact with the metal sheet 110 to prevent oxidation of the metal sheet 110 (that is, the antenna pattern 100). In the surface treatment step, the plating layer 113 may be formed by plating tin (Sn) or nickel (Ni) on the first surface of the metal sheet 110 to prevent oxidation of the metal sheet 110 along with the OSP process.

In the stamping step, an outline of the antenna pattern 100 is formed on the metal sheet 110 through a stamping process. In the stamping step, the metal sheet 110 is stamped using a stamping device to form an outline of the antenna pattern 100.

Through the above-described process, the antenna pattern manufacturing method according to an embodiment of the present invention can manufacture the antenna pattern 100 having a line spacing of 80% or more and 120% or less of the thickness of the metal sheet 110. The antenna pattern 100 manufactured through the above-described process is used as an antenna for wireless power transmission/reception (WPC; Wireless Power Consortium), near field communication (NFC; Near Field Communication), electronic payment (MST; Magnetic Secure Transmission), etc. It can work.

The above description is merely an illustrative explanation of the technical idea of the present invention, and various modifications and variations will be possible to those skilled in the art without departing from the essential characteristics of the present invention. Accordingly, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention, but are for illustrative purposes, and the scope of the technical idea of the present invention is not limited by these embodiments. The scope of protection of the present invention should be interpreted in accordance with the claims below, and all technical ideas within the equivalent scope should be construed as being included in the scope of rights of the present invention.

100: antenna pattern 110: metal sheet
111: metal pattern 112: through hole
113: plating layer 114: first half groove
115: second half groove 120: carrier sheet
130: Coverlay sheet

Claims (13)

In the loop-shaped antenna pattern,
The vertical cross section of the antenna pattern is,
first metal pattern;
a second metal pattern spaced apart from the first metal pattern;
a through hole disposed between the first metal pattern and the second metal pattern to form a space between the first metal pattern and the second metal pattern; and
An antenna pattern including a plating layer formed on an inner wall of the through hole. According to paragraph 1,
The through hole is,
a first half hole disposed toward the top of the antenna pattern; and
It includes a second half hole disposed toward the bottom of the antenna pattern,
At least a portion of the first half hole and the second half hole overlap to form the through hole that vertically penetrates the antenna pattern. According to paragraph 1,
The plating layer is
An antenna pattern formed on at least one end of the first end of the first metal pattern facing the second metal pattern and the first end of the second metal pattern facing the first metal pattern. According to paragraph 1,
An antenna pattern in which a groove is formed in a first end of the first metal pattern facing the second metal pattern, and the plating layer is plated in the groove to flatten the first end of the first metal pattern. According to paragraph 1,
An antenna pattern in which a groove is formed in a first end of the second metal pattern facing the first metal pattern, and the plating layer is plated in the groove to flatten the first end of the second metal pattern. laminating a carrier sheet to the first side of the metal sheet;
forming a first half groove on the second side of the metal sheet;
Laminating a coverlay sheet on the second side of the metal sheet;
removing the carrier sheet laminated to the first side of the metal sheet;
forming a second half groove on the first side of the metal sheet; and
An antenna pattern manufacturing method comprising forming a plating layer on an inner wall surface of at least one of the first half groove and the second half groove. According to clause 6,
In the step of forming the first half groove,
A method of manufacturing an antenna pattern in which a first half groove is formed on the second side of the metal sheet toward the inside of the metal sheet through a half etching and punching process. According to clause 6,
In the step of forming the second half groove,
A method of manufacturing an antenna pattern in which a second half groove is formed on the first side of the metal sheet toward the inside of the metal sheet through a half etching and punching process. According to clause 6,
In forming the second half groove, the second half groove is formed so that at least a portion overlaps the first half groove,
The first half groove and the second half groove form a through hole penetrating the first and second surfaces of the metal sheet. According to clause 6,
The first half groove formed in the step of forming the first half groove has a first central axis vertically penetrating the first and second surfaces of the metal sheet,
The second half groove formed in the step of forming the second half groove has a second central axis vertically penetrating the first and second surfaces of the metal sheet,
The first central axis and the second central axis are spaced apart from each other. According to clause 6,
The first half groove formed in the step of forming the first half groove has a first central axis vertically penetrating the first and second surfaces of the metal sheet,
The second half groove formed in the step of forming the second half groove has a second central axis vertically penetrating the first and second surfaces of the metal sheet,
The first central axis and the second central axis are disposed on the same line. According to clause 6,
The first half groove and the second half groove form a through hole penetrating the first and second sides of the metal sheet,
In the step of forming the plating layer,
A method of manufacturing an antenna pattern that flattens the inner wall of the through hole by forming a plating layer on the inner wall of at least one of the first half groove and the second half groove. According to clause 6,
The first half groove and the second half groove form a through hole penetrating the first and second sides of the metal sheet,
In the step of forming the plating layer, the antenna pattern manufacturing method includes forming a plating layer on the inner wall of the through hole.