KR20230173662A - 시스템 온 칩(soc) 상의 다수의 기능 블록 - Google Patents

시스템 온 칩(soc) 상의 다수의 기능 블록 Download PDF

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KR20230173662A
KR20230173662A KR1020237034617A KR20237034617A KR20230173662A KR 20230173662 A KR20230173662 A KR 20230173662A KR 1020237034617 A KR1020237034617 A KR 1020237034617A KR 20237034617 A KR20237034617 A KR 20237034617A KR 20230173662 A KR20230173662 A KR 20230173662A
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South Korea
Prior art keywords
connections
soc
dielectric layer
chip
metal layer
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English (en)
Korean (ko)
Inventor
존 졘홍 주
존 ?컹? 주
쥔징 바오
기리다르 날라파티
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퀄컴 인코포레이티드
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    • H01L23/5226—
    • H01L21/76816—
    • H01L21/76819—
    • H01L21/76877—
    • H01L21/76885—
    • H01L23/5222—
    • H01L23/5283—
    • H01L23/53204—
    • H01L23/538—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/056—Manufacture or treatment of conductive parts of the interconnections by filling conductive material into holes, grooves or trenches
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/062—Manufacture or treatment of conductive parts of the interconnections by smoothing of conductive parts, e.g. by planarisation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/063—Manufacture or treatment of conductive parts of the interconnections by forming conductive members before forming protective insulating material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/063—Manufacture or treatment of conductive parts of the interconnections by forming conductive members before forming protective insulating material
    • H10W20/0633—Manufacture or treatment of conductive parts of the interconnections by forming conductive members before forming protective insulating material using subtractive patterning of the conductive members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/071—Manufacture or treatment of dielectric parts thereof
    • H10W20/081—Manufacture or treatment of dielectric parts thereof by forming openings in the dielectric parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/071—Manufacture or treatment of dielectric parts thereof
    • H10W20/081—Manufacture or treatment of dielectric parts thereof by forming openings in the dielectric parts
    • H10W20/089—Manufacture or treatment of dielectric parts thereof by forming openings in the dielectric parts using processes for implementing desired shapes or dispositions of the openings, e.g. double patterning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/071—Manufacture or treatment of dielectric parts thereof
    • H10W20/092—Manufacture or treatment of dielectric parts thereof by smoothing the dielectric parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/42—Vias, e.g. via plugs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/435—Cross-sectional shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/44—Conductive materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/495—Capacitive arrangements or effects of, or between wiring layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together

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  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
KR1020237034617A 2021-04-19 2022-03-24 시스템 온 칩(soc) 상의 다수의 기능 블록 Ceased KR20230173662A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US17/234,377 2021-04-19
US17/234,377 US20220336351A1 (en) 2021-04-19 2021-04-19 Multiple function blocks on a system on a chip (soc)
PCT/US2022/071320 WO2022226458A1 (en) 2021-04-19 2022-03-24 Multiple function blocks on a system on a chip (soc)

Publications (1)

Publication Number Publication Date
KR20230173662A true KR20230173662A (ko) 2023-12-27

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KR1020237034617A Ceased KR20230173662A (ko) 2021-04-19 2022-03-24 시스템 온 칩(soc) 상의 다수의 기능 블록

Country Status (7)

Country Link
US (1) US20220336351A1 (enExample)
EP (1) EP4327356A1 (enExample)
JP (1) JP2024516123A (enExample)
KR (1) KR20230173662A (enExample)
CN (1) CN117157745A (enExample)
BR (1) BR112023020878A2 (enExample)
WO (1) WO2022226458A1 (enExample)

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* Cited by examiner, † Cited by third party
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US20230031274A1 (en) * 2021-07-28 2023-02-02 Nanya Technology Corporation Semiconductor device structure with conductive contacts of different widths and method for preparing the same
CN115706081A (zh) * 2021-08-16 2023-02-17 联华电子股份有限公司 半导体结构及其制作方法
US20250349711A1 (en) * 2024-05-09 2025-11-13 International Business Machines Corporation Resistance and capacitance tuning in beol regions

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US6720660B1 (en) * 1998-12-22 2004-04-13 Seiko Epson Corporation Semiconductor device and method for manufacturing the same
JP2000188332A (ja) * 1998-12-22 2000-07-04 Seiko Epson Corp 半導体装置及びその製造方法
KR100463895B1 (ko) * 2002-12-31 2004-12-30 엘지.필립스 엘시디 주식회사 콘택홀 형성방법
DE102005041283B4 (de) * 2005-08-31 2017-12-14 Globalfoundries Inc. Verfahren und Halbleiterstruktur zur Überwachung der Herstellung von Verbindungsstrukturen und Kontakten in einem Halbleiterbauelement
DE102008016431B4 (de) * 2008-03-31 2010-06-02 Advanced Micro Devices, Inc., Sunnyvale Metalldeckschicht mit erhöhtem Elektrodenpotential für kupferbasierte Metallgebiete in Halbleiterbauelementen sowie Verfahren zu ihrer Herstellung
JP5601974B2 (ja) * 2010-01-19 2014-10-08 パナソニック株式会社 半導体装置及びその製造方法
WO2012098759A1 (ja) * 2011-01-17 2012-07-26 住友電気工業株式会社 炭化珪素半導体装置の製造方法
KR101883379B1 (ko) * 2012-06-08 2018-07-30 삼성전자주식회사 반도체 장치
US9293412B2 (en) * 2012-12-17 2016-03-22 International Business Machines Corporation Graphene and metal interconnects with reduced contact resistance
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US9070644B2 (en) * 2013-03-15 2015-06-30 Taiwan Semiconductor Manufacturing Company, Ltd. Packaging mechanisms for dies with different sizes of connectors
US9105636B2 (en) * 2013-08-26 2015-08-11 Micron Technology, Inc. Semiconductor constructions and methods of forming electrically conductive contacts
US9564361B2 (en) * 2013-09-13 2017-02-07 Qualcomm Incorporated Reverse self aligned double patterning process for back end of line fabrication of a semiconductor device
US10043703B2 (en) * 2016-12-15 2018-08-07 Globalfoundries Inc. Apparatus and method for forming interconnection lines having variable pitch and variable widths
US10541205B1 (en) * 2017-02-14 2020-01-21 Intel Corporation Manufacture of interconnects for integration of multiple integrated circuits
US10381305B2 (en) * 2017-08-29 2019-08-13 Micron Technology, Inc. Integrated assemblies having structures along a first pitch coupled with structures along a second pitch different from the first pitch, and methods of forming integrated assemblies
US10534888B2 (en) * 2018-01-03 2020-01-14 International Business Machines Corporation Hybrid back end of line metallization to balance performance and reliability
US10586767B2 (en) * 2018-07-19 2020-03-10 International Business Machines Corporation Hybrid BEOL metallization utilizing selective reflection mask
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US11942334B2 (en) * 2018-12-21 2024-03-26 Intel Corporation Microelectronic assemblies having conductive structures with different thicknesses

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Publication number Publication date
JP2024516123A (ja) 2024-04-12
WO2022226458A1 (en) 2022-10-27
BR112023020878A2 (pt) 2023-12-12
US20220336351A1 (en) 2022-10-20
CN117157745A (zh) 2023-12-01
EP4327356A1 (en) 2024-02-28
TW202245213A (zh) 2022-11-16

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