KR20230157294A - 필름상 접착제, 다이싱·다이본딩 일체형 필름, 및 반도체장치 및 그 제조 방법 - Google Patents

필름상 접착제, 다이싱·다이본딩 일체형 필름, 및 반도체장치 및 그 제조 방법 Download PDF

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KR20230157294A
KR20230157294A KR1020237023164A KR20237023164A KR20230157294A KR 20230157294 A KR20230157294 A KR 20230157294A KR 1020237023164 A KR1020237023164 A KR 1020237023164A KR 20237023164 A KR20237023164 A KR 20237023164A KR 20230157294 A KR20230157294 A KR 20230157294A
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South Korea
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adhesive
film
semiconductor element
semiconductor
semiconductor device
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KR1020237023164A
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Korean (ko)
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쇼타 아오야기
가즈히로 야마모토
가나미 나카무라
고헤이 다니구치
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가부시끼가이샤 레조낙
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • H01L21/30—
    • H01L21/6836—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H01L2221/68327—

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
KR1020237023164A 2021-03-05 2022-03-02 필름상 접착제, 다이싱·다이본딩 일체형 필름, 및 반도체장치 및 그 제조 방법 Pending KR20230157294A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2021-035424 2021-03-05
JP2021035424 2021-03-05
PCT/JP2022/008906 WO2022186285A1 (ja) 2021-03-05 2022-03-02 フィルム状接着剤、ダイシング・ダイボンディング一体型フィルム、並びに半導体装置及びその製造方法

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Publication Number Publication Date
KR20230157294A true KR20230157294A (ko) 2023-11-16

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KR1020237023164A Pending KR20230157294A (ko) 2021-03-05 2022-03-02 필름상 접착제, 다이싱·다이본딩 일체형 필름, 및 반도체장치 및 그 제조 방법

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JP (1) JPWO2022186285A1 (https=)
KR (1) KR20230157294A (https=)
CN (1) CN116783258A (https=)
TW (1) TW202244230A (https=)
WO (1) WO2022186285A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002192370A (ja) 2000-09-13 2002-07-10 Hamamatsu Photonics Kk レーザ加工方法
JP2003338467A (ja) 2002-03-12 2003-11-28 Hamamatsu Photonics Kk 半導体基板の切断方法
JP2015211080A (ja) 2014-04-24 2015-11-24 日東電工株式会社 半導体装置の製造方法
JP2016115775A (ja) 2014-12-12 2016-06-23 日東電工株式会社 ダイシングシート、ダイシング・ダイボンドフィルム及び半導体装置の製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4449325B2 (ja) * 2003-04-17 2010-04-14 住友ベークライト株式会社 半導体用接着フィルム、半導体装置、及び半導体装置の製造方法。
JP5648514B2 (ja) * 2011-02-08 2015-01-07 日立化成株式会社 感光性接着剤組成物、接着剤パターン、接着剤層付半導体ウェハ、及び、半導体装置の製造方法。
JP5877133B2 (ja) * 2012-07-09 2016-03-02 デクセリアルズ株式会社 太陽電池用導電性接着剤、並びに太陽電池モジュール、及びその製造方法
WO2018003590A1 (ja) * 2016-06-28 2018-01-04 住友ベークライト株式会社 熱硬化性樹脂組成物、キャリア付樹脂膜、プリント配線基板および半導体装置
CN110709487B (zh) * 2017-06-07 2022-01-14 田中贵金属工业株式会社 导热性导电性粘接剂组合物
JP2019172996A (ja) * 2018-03-28 2019-10-10 三菱ケミカル株式会社 エポキシ樹脂、エポキシ樹脂組成物及び硬化物
WO2019220599A1 (ja) * 2018-05-17 2019-11-21 日立化成株式会社 ダイシング・ダイボンディング一体型フィルム及びその製造方法、並びに、半導体装置の製造方法
JP7193272B2 (ja) * 2018-08-28 2022-12-20 日東電工株式会社 表面保護フィルム用基材、該基材の製造方法、該基材を用いた表面保護フィルム、および表面保護フィルム付光学フィルム
WO2020183581A1 (ja) * 2019-03-11 2020-09-17 日立化成株式会社 接着剤組成物、フィルム状接着剤、接着シート、及び半導体装置の製造方法
JP2021011512A (ja) * 2019-07-03 2021-02-04 昭和電工マテリアルズ株式会社 接着剤組成物、フィルム状接着剤、接着シート、ダイシング・ダイボンディング一体型接着シート、並びに半導体装置及びその製造方法
JP7495708B2 (ja) * 2019-07-10 2024-06-05 互応化学工業株式会社 多層基板の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002192370A (ja) 2000-09-13 2002-07-10 Hamamatsu Photonics Kk レーザ加工方法
JP2003338467A (ja) 2002-03-12 2003-11-28 Hamamatsu Photonics Kk 半導体基板の切断方法
JP2015211080A (ja) 2014-04-24 2015-11-24 日東電工株式会社 半導体装置の製造方法
JP2016115775A (ja) 2014-12-12 2016-06-23 日東電工株式会社 ダイシングシート、ダイシング・ダイボンドフィルム及び半導体装置の製造方法

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CN116783258A (zh) 2023-09-19
JPWO2022186285A1 (https=) 2022-09-09
TW202244230A (zh) 2022-11-16

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