CN116783258A - 膜状黏合剂、切割晶粒接合一体型膜、以及半导体装置及其制造方法 - Google Patents

膜状黏合剂、切割晶粒接合一体型膜、以及半导体装置及其制造方法 Download PDF

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Publication number
CN116783258A
CN116783258A CN202280010958.1A CN202280010958A CN116783258A CN 116783258 A CN116783258 A CN 116783258A CN 202280010958 A CN202280010958 A CN 202280010958A CN 116783258 A CN116783258 A CN 116783258A
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CN
China
Prior art keywords
adhesive
film
semiconductor element
semiconductor
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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CN202280010958.1A
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English (en)
Chinese (zh)
Inventor
青柳翔太
山本和弘
中村奏美
谷口纮平
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Resonac Corp
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Resonac Corp
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Publication of CN116783258A publication Critical patent/CN116783258A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
CN202280010958.1A 2021-03-05 2022-03-02 膜状黏合剂、切割晶粒接合一体型膜、以及半导体装置及其制造方法 Pending CN116783258A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021035424 2021-03-05
JP2021-035424 2021-03-05
PCT/JP2022/008906 WO2022186285A1 (ja) 2021-03-05 2022-03-02 フィルム状接着剤、ダイシング・ダイボンディング一体型フィルム、並びに半導体装置及びその製造方法

Publications (1)

Publication Number Publication Date
CN116783258A true CN116783258A (zh) 2023-09-19

Family

ID=83154625

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280010958.1A Pending CN116783258A (zh) 2021-03-05 2022-03-02 膜状黏合剂、切割晶粒接合一体型膜、以及半导体装置及其制造方法

Country Status (5)

Country Link
JP (1) JPWO2022186285A1 (https=)
KR (1) KR20230157294A (https=)
CN (1) CN116783258A (https=)
TW (1) TW202244230A (https=)
WO (1) WO2022186285A1 (https=)

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004315688A (ja) * 2003-04-17 2004-11-11 Sumitomo Bakelite Co Ltd 半導体用接着フィルム、半導体装置、及び半導体装置の製造方法。
JP2012162676A (ja) * 2011-02-08 2012-08-30 Hitachi Chemical Co Ltd 感光性接着剤組成物、接着剤パターン、接着剤層付半導体ウェハ、及び、半導体装置の製造方法。
CN104412392A (zh) * 2012-07-09 2015-03-11 迪睿合电子材料有限公司 太阳能电池用导电性粘接剂以及太阳能电池模块及其制造方法
WO2018003590A1 (ja) * 2016-06-28 2018-01-04 住友ベークライト株式会社 熱硬化性樹脂組成物、キャリア付樹脂膜、プリント配線基板および半導体装置
JP2019172996A (ja) * 2018-03-28 2019-10-10 三菱ケミカル株式会社 エポキシ樹脂、エポキシ樹脂組成物及び硬化物
CN110709487A (zh) * 2017-06-07 2020-01-17 田中贵金属工业株式会社 导热性导电性粘接剂组合物
CN110862664A (zh) * 2018-08-28 2020-03-06 日东电工株式会社 表面保护薄膜用基材、该基材的制造方法、使用该基材的表面保护薄膜
WO2020183581A1 (ja) * 2019-03-11 2020-09-17 日立化成株式会社 接着剤組成物、フィルム状接着剤、接着シート、及び半導体装置の製造方法
WO2021002248A1 (ja) * 2019-07-03 2021-01-07 昭和電工マテリアルズ株式会社 接着剤組成物、フィルム状接着剤、接着シート、ダイシング・ダイボンディング一体型接着シート、並びに半導体装置及びその製造方法
CN112210333A (zh) * 2019-07-10 2021-01-12 互应化学工业株式会社 感光性粘接剂组合物、干膜和多层基板的制造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3408805B2 (ja) 2000-09-13 2003-05-19 浜松ホトニクス株式会社 切断起点領域形成方法及び加工対象物切断方法
JP4358502B2 (ja) 2002-03-12 2009-11-04 浜松ホトニクス株式会社 半導体基板の切断方法
JP2015211080A (ja) 2014-04-24 2015-11-24 日東電工株式会社 半導体装置の製造方法
JP6445315B2 (ja) 2014-12-12 2018-12-26 日東電工株式会社 ダイシングシート、ダイシング・ダイボンドフィルム及び半導体装置の製造方法
WO2019220599A1 (ja) * 2018-05-17 2019-11-21 日立化成株式会社 ダイシング・ダイボンディング一体型フィルム及びその製造方法、並びに、半導体装置の製造方法

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004315688A (ja) * 2003-04-17 2004-11-11 Sumitomo Bakelite Co Ltd 半導体用接着フィルム、半導体装置、及び半導体装置の製造方法。
JP2012162676A (ja) * 2011-02-08 2012-08-30 Hitachi Chemical Co Ltd 感光性接着剤組成物、接着剤パターン、接着剤層付半導体ウェハ、及び、半導体装置の製造方法。
CN104412392A (zh) * 2012-07-09 2015-03-11 迪睿合电子材料有限公司 太阳能电池用导电性粘接剂以及太阳能电池模块及其制造方法
WO2018003590A1 (ja) * 2016-06-28 2018-01-04 住友ベークライト株式会社 熱硬化性樹脂組成物、キャリア付樹脂膜、プリント配線基板および半導体装置
CN110709487A (zh) * 2017-06-07 2020-01-17 田中贵金属工业株式会社 导热性导电性粘接剂组合物
JP2019172996A (ja) * 2018-03-28 2019-10-10 三菱ケミカル株式会社 エポキシ樹脂、エポキシ樹脂組成物及び硬化物
CN110862664A (zh) * 2018-08-28 2020-03-06 日东电工株式会社 表面保护薄膜用基材、该基材的制造方法、使用该基材的表面保护薄膜
WO2020183581A1 (ja) * 2019-03-11 2020-09-17 日立化成株式会社 接着剤組成物、フィルム状接着剤、接着シート、及び半導体装置の製造方法
WO2021002248A1 (ja) * 2019-07-03 2021-01-07 昭和電工マテリアルズ株式会社 接着剤組成物、フィルム状接着剤、接着シート、ダイシング・ダイボンディング一体型接着シート、並びに半導体装置及びその製造方法
CN112210333A (zh) * 2019-07-10 2021-01-12 互应化学工业株式会社 感光性粘接剂组合物、干膜和多层基板的制造方法

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Publication number Publication date
WO2022186285A1 (ja) 2022-09-09
JPWO2022186285A1 (https=) 2022-09-09
TW202244230A (zh) 2022-11-16
KR20230157294A (ko) 2023-11-16

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