JPWO2022186285A1 - - Google Patents

Info

Publication number
JPWO2022186285A1
JPWO2022186285A1 JP2023503917A JP2023503917A JPWO2022186285A1 JP WO2022186285 A1 JPWO2022186285 A1 JP WO2022186285A1 JP 2023503917 A JP2023503917 A JP 2023503917A JP 2023503917 A JP2023503917 A JP 2023503917A JP WO2022186285 A1 JPWO2022186285 A1 JP WO2022186285A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023503917A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022186285A1 publication Critical patent/JPWO2022186285A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
JP2023503917A 2021-03-05 2022-03-02 Pending JPWO2022186285A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021035424 2021-03-05
PCT/JP2022/008906 WO2022186285A1 (ja) 2021-03-05 2022-03-02 フィルム状接着剤、ダイシング・ダイボンディング一体型フィルム、並びに半導体装置及びその製造方法

Publications (1)

Publication Number Publication Date
JPWO2022186285A1 true JPWO2022186285A1 (https=) 2022-09-09

Family

ID=83154625

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023503917A Pending JPWO2022186285A1 (https=) 2021-03-05 2022-03-02

Country Status (5)

Country Link
JP (1) JPWO2022186285A1 (https=)
KR (1) KR20230157294A (https=)
CN (1) CN116783258A (https=)
TW (1) TW202244230A (https=)
WO (1) WO2022186285A1 (https=)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014017368A (ja) * 2012-07-09 2014-01-30 Dexerials Corp 太陽電池用導電性接着剤、並びに太陽電池モジュール、及びその製造方法
WO2018225773A1 (ja) * 2017-06-07 2018-12-13 田中貴金属工業株式会社 熱伝導性導電性接着剤組成物
JP2019172996A (ja) * 2018-03-28 2019-10-10 三菱ケミカル株式会社 エポキシ樹脂、エポキシ樹脂組成物及び硬化物
WO2019221246A1 (ja) * 2018-05-17 2019-11-21 日立化成株式会社 ダイシング・ダイボンディング一体型フィルム及びその製造方法、並びに、半導体装置の製造方法
JP2020033419A (ja) * 2018-08-28 2020-03-05 日東電工株式会社 表面保護フィルム用基材、該基材の製造方法、該基材を用いた表面保護フィルム、および表面保護フィルム付光学フィルム
WO2020183581A1 (ja) * 2019-03-11 2020-09-17 日立化成株式会社 接着剤組成物、フィルム状接着剤、接着シート、及び半導体装置の製造方法
JP2021011512A (ja) * 2019-07-03 2021-02-04 昭和電工マテリアルズ株式会社 接着剤組成物、フィルム状接着剤、接着シート、ダイシング・ダイボンディング一体型接着シート、並びに半導体装置及びその製造方法
JP2021015161A (ja) * 2019-07-10 2021-02-12 互応化学工業株式会社 感光性接着剤組成物、ドライフィルム、及び多層基板の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3408805B2 (ja) 2000-09-13 2003-05-19 浜松ホトニクス株式会社 切断起点領域形成方法及び加工対象物切断方法
JP4358502B2 (ja) 2002-03-12 2009-11-04 浜松ホトニクス株式会社 半導体基板の切断方法
JP4449325B2 (ja) * 2003-04-17 2010-04-14 住友ベークライト株式会社 半導体用接着フィルム、半導体装置、及び半導体装置の製造方法。
JP5648514B2 (ja) * 2011-02-08 2015-01-07 日立化成株式会社 感光性接着剤組成物、接着剤パターン、接着剤層付半導体ウェハ、及び、半導体装置の製造方法。
JP2015211080A (ja) 2014-04-24 2015-11-24 日東電工株式会社 半導体装置の製造方法
JP6445315B2 (ja) 2014-12-12 2018-12-26 日東電工株式会社 ダイシングシート、ダイシング・ダイボンドフィルム及び半導体装置の製造方法
WO2018003590A1 (ja) * 2016-06-28 2018-01-04 住友ベークライト株式会社 熱硬化性樹脂組成物、キャリア付樹脂膜、プリント配線基板および半導体装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014017368A (ja) * 2012-07-09 2014-01-30 Dexerials Corp 太陽電池用導電性接着剤、並びに太陽電池モジュール、及びその製造方法
WO2018225773A1 (ja) * 2017-06-07 2018-12-13 田中貴金属工業株式会社 熱伝導性導電性接着剤組成物
JP2019172996A (ja) * 2018-03-28 2019-10-10 三菱ケミカル株式会社 エポキシ樹脂、エポキシ樹脂組成物及び硬化物
WO2019221246A1 (ja) * 2018-05-17 2019-11-21 日立化成株式会社 ダイシング・ダイボンディング一体型フィルム及びその製造方法、並びに、半導体装置の製造方法
JP2020033419A (ja) * 2018-08-28 2020-03-05 日東電工株式会社 表面保護フィルム用基材、該基材の製造方法、該基材を用いた表面保護フィルム、および表面保護フィルム付光学フィルム
WO2020183581A1 (ja) * 2019-03-11 2020-09-17 日立化成株式会社 接着剤組成物、フィルム状接着剤、接着シート、及び半導体装置の製造方法
JP2021011512A (ja) * 2019-07-03 2021-02-04 昭和電工マテリアルズ株式会社 接着剤組成物、フィルム状接着剤、接着シート、ダイシング・ダイボンディング一体型接着シート、並びに半導体装置及びその製造方法
JP2021015161A (ja) * 2019-07-10 2021-02-12 互応化学工業株式会社 感光性接着剤組成物、ドライフィルム、及び多層基板の製造方法

Also Published As

Publication number Publication date
WO2022186285A1 (ja) 2022-09-09
CN116783258A (zh) 2023-09-19
TW202244230A (zh) 2022-11-16
KR20230157294A (ko) 2023-11-16

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