KR20230147574A - Camera Module - Google Patents

Abstract

A camera module of the present invention comprises: a first printed circuit board on which an image sensor is mounted; a housing unit placed on an upper side of the first printed circuit board; a holder module spaced apart from an inner floor surface of the housing by a certain distance, and having a first coil wound on the outer circumferential surface, and including one or more lenses therein; a plate member engaged with a floor surface of the holder module; a second printed circuit board installed on an upper side of the holder module; a plurality of wire springs having one end connected to the plate member and the other end connected to the second printed circuit board; and a buffering unit provided on a connection unit between the wire springs and the plate member. An objective of the present invention is to provide a camera module with an optical image stabilizer (OIS) function.

Description

Camera Module {Camera Module}

The present invention relates to a camera module.

In the case of camera modules mounted on small electronic products, the camera module may frequently receive impacts during use, and the camera module may be slightly shaken due to the user's hand shaking during filming. Taking this into consideration, recently, a camera module having a means for preventing hand shake has been disclosed. For example, in Korean Patent No. 10-0741823 (registered on July 16, 2007), a gyro sensor IC or angular velocity sensor is installed inside a device where a camera module, such as a mobile phone, is mounted to correct hand tremor. A method is introduced.

However, when providing a separate angular velocity detection sensor like this, a separate detection sensor must be provided to implement the hand shake prevention function, which causes an increase in manufacturing cost, and it is necessary to configure and install the hand shake prevention device separately from the camera module. There is the hassle of having to prepare space.

(Patent Document 1) KR10-0741823 B1

The purpose of the present invention is to provide a camera module with an optical image stabilization (OIS) function.

Another object of the present invention is to provide a camera module with an improved shock absorbing structure of the wire and soldering portion so that impact resistance can be improved.

A camera module according to the present invention includes a first printed circuit board on which an image sensor is mounted; a housing unit disposed above the first printed circuit board; a holder module disposed at a predetermined distance from the inner bottom of the housing unit, having a first coil wound on an outer circumferential surface, and including at least one lens therein; a plate member coupled to the bottom of the holder module; a second printed circuit board installed above the holder module; a plurality of wire springs, one end of which is connected to the plate member and the other end of which are connected to the second printed circuit board; and a buffer portion provided at a connection portion between the wire spring and the plate member.

The buffer portion may be formed to be capable of reciprocating movement around the connection portion.

In addition, the buffer portion may be formed by a slit formed through the plate member around the spring hole through which the wire spring is connected to the plate member through a connecting material, and the slit may be formed through a slit of the plate member. It may be configured to penetrate the portion excluding the buffer portion in an arc shape.

In addition, it is possible to further include a buffer hole formed through the space between the spring hole and the buffer unit.

Additionally, the connecting material may be made of a conductive material such as lead.

The housing unit includes: a first housing disposed above the first printed circuit board; a second housing disposed above the first housing and on which the second printed circuit board is installed; first and second permanent magnets disposed between the first and second housings; It is preferable to include a yoke disposed between the first and second permanent magnets or located on an inner surface of the first and second housings to transmit magnetic force into the holder module.

The yoke may have a central portion protruding toward the holder module.

The second housing and the second printed circuit board may be fixed with double-sided tape.

It may further include a shield can having a through hole at a position corresponding to the connection portion of the second printed circuit board and the wire spring and the lens module, and installed to surround the housing unit.

The holder module includes an outer blade on which a first coil is wound on an outer peripheral surface; A bobbin is elastically supported by an elastic member on the upper side of the outer blade and is movable up and down inside the outer blade, a second coil is wound around the outer circumferential surface, and at least one lens is installed inside the bobbin; And upper and lower elastic members disposed on the upper and lower sides of the bobbin, respectively, to elastically support the bobbin with respect to the outer blade; wherein the center of the first coil is capable of investing magnetic force toward the second coil. A space may be formed so that

The wire spring may be made of a metal material and may be electrically connected to the plate member and the second printed circuit board.

At least six wire springs are provided to supply power of two polarities for auto-focusing control and four polarities for OIS driving to the holder module through connection with the plate member and the second printed circuit board. desirable.

The wire springs may be of the same length, two each at the corners of the holder module, for a total of eight wire springs.

According to the camera module according to the present invention, a buffer is provided on the plate member installed below the outer blade, so even if repetitive loads occur, damage to the wire soldering connection due to impact of the camera module can be minimized.

In addition, even if soldering exceeds the standard due to an operator's mistake during the assembly process, excess solder can seep into the buffer hole formed near the soldering portion of the wire, thereby preventing camera module defects.

1 is a schematic plan view of a camera module according to an embodiment of the present invention;
Figure 2 is a cross-sectional view taken along line AA of Figure 1;
3 and 4 are side views of a camera module according to an embodiment of the present invention;
5 and 6 are plan views showing the pattern of the buffer portion of the plate member according to the first embodiment of the present invention, and
7 and 8 are plan views showing the pattern of the buffer portion of the plate member according to the second embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

1 is a schematic plan view of a camera module according to an embodiment of the present invention, FIG. 2 is a cross-sectional view A-A of FIG. 1, FIGS. 3 and 4 are side views of a camera module according to an embodiment of the present invention, FIGS. 5 and FIG. 6 is a plan view showing the pattern of the buffer part of the plate member according to the first embodiment of the present invention, and FIGS. 7 and 8 are plan views showing the pattern of the buffer part of the plate member according to the second embodiment of the present invention. .

As shown in FIG. 2, which shows a schematic plan view of FIG. 1 and a schematic side view showing the cross section A-A of FIG. 1, the camera module according to the present invention includes a first printed circuit board 10 and a housing unit 20. , a holder module 30, a plate member 40, a second printed circuit board 50, a wire spring 60, and a buffer portion 100 provided on the plate member 40. The plate member 40 may be referred to as a 'buffering member'.

The image sensor 11 is mounted approximately near the center of the first printed circuit board 10, and is preferably provided as a PCB board. Components for operating the image sensor 11 may be disposed on the first printed circuit board 10, or a plurality of terminals capable of supplying power and outputting information about the image sensor 11 may be provided. .

The housing unit 20 is disposed on the upper side of the first printed circuit board 10 and forms the framework of the camera module. According to a preferred embodiment of the present invention, the housing unit 20 includes a first housing 21, a second housing 22, first and second permanent magnets 23 and 24, and a yoke 25. Includes.

The first housing 21 is a base, which is disposed on the upper side of the first printed circuit board 10 and is spaced a certain distance away from the image sensor 11. If necessary, a filter member capable of filtering the image incident on the image sensor 11 may be further installed in the first housing 21 .

The second housing 22 is disposed above the first housing 21 and covers the first housing 21 . An opening is formed approximately in the center of the second housing 22 at a corresponding position so that an image can be transmitted to the image sensor 11. On the upper side of the second housing 22, a second printed circuit board 50, which will be described later, is adhesively fixed by a fixing member such as double-sided tape or adhesive, but this is not limited, and depending on the product design, the It is also possible to provide a separate third housing, such as a case or shield can, for the second printed circuit board 50 and fix the second printed circuit board 50 to the inner surface of the housing using the above-described fixing member. If a third housing is provided, the second printed circuit board 50 may be supported by pressing the third housing without a separate fixing member.

The first and second permanent magnets 23 and 24 are interposed between the first and second housings 21 and 22 and apply magnetic force to the holder module 30. The first and second permanent magnets 23 and 24 may be provided with the same size. Additionally, the first and second permanent magnets 23, 24 and the yoke 25 may be disposed on the inner surfaces of the first and second housings if possible within the design tolerance range.

On the other hand, as the size of the first and second permanent magnets 23 and 24 increases, OIS driving increases even with a small current, and if the first and second permanent magnets 23 and 24 are configured to have a constant size, In this case, as the current flowing through the first and second coils 31a and 32a disposed at positions corresponding to the first and second permanent magnets 23 and 24 increases, the OIS drive increases. In conclusion, the larger the size of the first and second permanent magnets 23 and 24, the better the OIS operation, but it is desirable to design the optimal size within other design tolerances.

The yoke 25 is interposed between the first and second permanent magnets 23 and 24. In addition, the yoke 25 is provided in a protruding shape near the center so that the magnetic force of the first and second permanent magnets 23 and 24 can be invested into the internal space of the holder module 30. Preferably, the width is provided to be the same as that of the first and second permanent magnets 23 and 24, and the center protrudes to a certain size, so that the permanent magnet and the yoke are formed to have an approximately "T" shape. desirable.

The holder module 30 is disposed at a certain distance from the inner bottom surface of the housing unit 20 and is composed of an outer blade 31 and a bobbin 32. The holder module 30 can make a pendulum movement in the forward/left/right and diagonal directions while hanging on the wire spring 60.

Spring members 35 and 36 are provided on the upper and lower sides of the outer blade 31, are elastically supported by the spring members 35, and are connected to enable vertical movement of the bobbin 32.

As shown in FIG. 1, the outer blade 31 has a total of four first coils (31a to 31d) wound on the outer peripheral surface of the four sides, and the central portion of the four sides where the coils (31a to 31d) are wound. It is open without a coil. The yoke 25 is disposed at a position corresponding to the open space, so that the yoke 25 is partially inserted into the space.

The plate member 40 may be fixed to the bottom of the outer blade 31 with a fixing member 33 such as double-sided tape or adhesive. The outer blade 31 moves forward, backward, left or right as shown by the arrows in FIG. 2 according to the interaction of the magnetic force of the first and second permanent magnets 22 and 23 and the first coils 31a to 31d. It is suspended by a plurality of wire springs 60 so that it can move diagonally, and is spaced apart from the bottom surface of the first housing 21 at a predetermined distance.

In addition, the outer blade 31 may be provided with a plurality of spring holes 37 through which the wire spring 60 can pass and be connected to the plate member 40.

The bobbin 32 is arranged to be movable up and down inside the outer blade 31, and at least one lens 34 is installed therein. A second coil 32a is wound on the outer peripheral surface of the bobbin 32, and the second coil 32a is connected to the first coils 31a to 31d of the outer blade 31 through the yoke 25. The bobbin 32 is raised and lowered by interaction with the magnetic force applied through the empty space. As the size of the yoke (25) increases, AF operation improves, but this may also vary depending on the optimal design value. It is possible to automatically adjust the focus of the image transmitted to the image sensor 11 by the lifting action of the bobbin 32.

The plate member 40 is preferably made of a metal material capable of conducting electricity, and is disposed on the bottom surface of the outer blade 31 as described above to supply power to the first and second coils 31a and 32a. The wire spring 60 is connected so that Any connection method is possible as long as it can be connected by soldering or other conductive material. That is, the connection portion (w') of the plate member 40 is connected to the first and second coils 31a and 32a, respectively, as shown in FIG. 2, through the wire spring 60. The supplied power is transmitted to the first and second coils 31a and 32a to generate electromagnetic force. The plate member 40 includes a coupling portion 44 coupled to the wire spring 60, a body portion 43 coupled to the outer blade 31, and a first portion 47 extending from the body portion 43. and a second part 48. The coupling portion 44 may be disposed between the first part 47 and the second part 48 and spaced from the first part 47 and the second part 48 at the same distance. The plate member 40 has a connecting portion 45 extending from a first portion of the outer edge of the engaging portion 44, and a connecting portion 45 extending from a second portion of the outer edge of the engaging portion 44 and having a distal end with the body portion 43. It may include spaced apart extensions 46.

At this time, in the case of the second coil 32a, it may be directly connected to the plate member 40, and as shown in FIG. 2, it is first connected to the lower spring 36 and then connected to the lower spring 36. It is also possible to connect with the plate member 40.

The second printed circuit board 50 is fixed to the upper side of the second housing 22 with a fixing member such as double-sided tape or an adhesive member as described above. The second printed circuit board 50 connected to the first printed circuit board 10 Power transmitted through the terminal portion 52 of the printed circuit board 50 is transmitted to the plate member 40 through the wire spring 60. Any connection method is possible as long as it can be connected by soldering or other conductive material.

As shown in FIGS. 3 and 4, the second printed circuit board 50 is provided to cover one wall of the first and second housings 21 and 22. In this case, the first and A window 55 is formed on the surface facing the second permanent magnets 23, 24 and the yoke 25, so that interference with them can be avoided.

This is a configuration to avoid this because the first and second permanent magnets 23, 24 and the yoke 25 are generally directly attached to the shield can 70, which will be described later, using a fixing means such as epoxy.

Meanwhile, the second printed circuit board 50 can be a flexible printed circuit board (FPCB), printed circuit board (PCB), or R-FPCB (Rigid FPCB integrated type), but is not limited to this and can be electrically connected. Any substrate is possible. In the case of the present invention, the plate member 40 may be formed of a thin metal plate to form a buffer 100 for absorbing shock at the connection portion (w') where the wire spring 60 is soldered against external shock. .

Both ends of the wire spring 60 are connected to the plate member 40 and the second printed circuit board 50. At this time, one end of the wire spring 60 is connected to the second printed circuit board 50, and the wire spring 60 connected to the second printed circuit board 50 is The power supplied through the terminal portion 52 is supplied to the plate member 40, so that the first and second coils 31a and 32a are connected to the first and second permanent magnets 23 and 24. Make interaction possible.

In addition, the other end of the wire spring 60 passes through the spring through hole 37 formed in the outer blade 31, as shown in FIG. 2, and is connected to the plate member installed on the bottom surface of the outer blade 31. It is connected to (40). At this time, the other end of the wire spring 60, although not shown, is connected to a pad (not shown) formed on the plate member 40 like the second printed circuit board 50, and the pad (not shown) ) A spring hole 41 through which the wire spring 60 passes is formed in the center. Any connection method is possible as long as it can be connected by soldering or other conductive materials. According to this configuration, the outer blade 31 is suspended from the wire spring 60 and can be spaced apart from the bottom surface of the first housing 21 by a certain distance or more. Then, according to the interaction between the first coil 31a and the first and second permanent magnets 23 and 24, the outer blade 31 performs a pendulum movement, causing the outer blade ( It is possible to correct the vibration of 31) through the interaction of the first coil 31a and the first and second permanent magnets 23 and 24. For this purpose, the wire spring 60 is preferably made of a metal material that has elasticity and can conduct electricity to withstand impact.

On the other hand, the thinner the thickness of the wire spring 60, the better the camera shake correction movement even with a small current, but this may vary depending on the optimal design value. Preferably, the thickness of the wire spring 60 ranges from several ㎛ to hundreds of ㎛, preferably from 1 to 100 ㎛.

In addition, it is preferable that at least six wire springs 60 are provided, and at least two polarities for auto focusing control and four polarities for hand shake correction and motion shake correction are provided on the second printed circuit board (50). ) and the plate member 40 need to be supplied to the holder module 30 through the connection.

According to a preferred embodiment of the present invention, as shown in FIGS. 1 and 2, it is better to provide a total of 8 holders of the same length, 2 at each corner of the holder module 30, to ensure balance. .

Meanwhile, as shown in FIG. 2, when a separate third housing such as a shield can 70 is further included, as described above, the second printed circuit board 50 is connected to the first and second permanent housings. Since the magnets 23, 24 and the yoke 25 are fixedly coupled to the shield can 70 with epoxy or the like, to avoid this coupling portion, a window 55 is formed to separate the first and second housings. (21) Covers the side walls of (22).

If the shield can 70 is removed, the second printed circuit board 50 is formed of a PCB or the like, and the first and second permanent magnets 23 and 24 and the yoke ( 25) can also be attached and fixed. As described above, the second printed circuit board 50 is composed of a PCB, but a window 55 as described above is provided, and the second printed circuit board 50 is provided in this window 55. The first and second permanent magnets 23, 24 and the yoke 25 can be inserted, and it is also possible to reinforce the outside with shielding tape, etc.

The buffer portion 100 is formed at the connection portion (w') where the wire spring 60 and the plate member 40 are electrically connected by soldering or Ag bonding to absorb shock and repetitive loads applied to the wire spring 60. Allow it to be absorbed.

As shown in FIG. 5, the buffer portion 100 is formed near the edge of the plate member 40 and has a slit 42 formed around the spring hole 41 through which the wire spring 60 passes. It is formed to be a connection part with the plate member 40 and can be configured to move back and forth around the spring hole 41 in a direction parallel to the direction of acceleration with the buffer unit 100 as the center.

At this time, according to the first preferred embodiment of the present invention, the shape of the slit 42 may be configured such that the portion excluding the buffer portion 100 has a circular ring shape, as shown in FIG. 5. . At this time, as shown in FIG. 6, an additional buffer hole 200 may be formed through the spring hole 41 at a location close to the spring hole 41. The buffer hole 200 is connected to the wire spring 60 through the spring hole 41 in an electrically conductive manner, such as by soldering. When solder is poured in excess of the standard and overflows, the overflowed lead flows into the buffer portion. It is designed to prevent it from flowing into the (100) side. In other words, if too much lead is injected due to an operator's mistake, the lead may flow toward the buffer unit 100. In this case, if a buffer hole 200 formed through the path is provided, the overflowing lead will flow back into the buffer unit. Since it flows into the hole 200, it no longer flows toward the buffer unit 100. Therefore, the buffer unit 100 can maintain the flexible nature of the plate member 40, so even if an impact occurs on the wire spring 60, the impact is transmitted through the reciprocating movement of the connection part w'. It can be absorbed through shape transformation.

Meanwhile, according to a second preferred embodiment of the present invention, as shown in FIG. 7, the shape of the buffer unit 100 may be configured to be symmetrical about the spring hole 41. In this case as well, as shown in FIG. 8, a buffer hole 200 may be formed around the spring hole 41. The function of the buffer hole 200 is the same.

In addition, the shape of the buffer hole 200 may be arc-shaped, as shown in FIG. 6, or circular, as shown in FIG. 8, but is not limited thereto, and the solder Any shape is possible as long as it allows a conductive connecting member such as to flow into it.

However, the buffer hole 200 needs to be formed between the buffer unit 100 and the spring through hole 41, and if it is formed too large, the strength around the buffer unit 100 is reduced, so It is desirable to configure it to be smaller than the area of the spring through hole 41. According to this configuration, it is possible to prevent the connection portion (w') of the plate member 40 from being damaged by external impact.

Meanwhile, the general assembly sequence is to combine the bobbin 32 and the outer blade 31, then use a jig to assemble the second housing 22, the plate member 40, the second printed circuit board 50, and the wire spring ( 60) is connected, the bobbin 32 provided with the lens barrel is connected, and then the first housing 21 is connected and mounted on the first printed circuit board 10. Before connecting the first housing 21, the permanent magnet and yoke may be combined first. This assembly sequence may be changed as needed. In other words, it may be possible right on the equipment without a jig. In this process, even if the force for inserting and coupling the bobbin 32 on which the lens barrel is provided is excessively large and puts a strain on the connection portion (w'), the buffer portion 100 can absorb this excessive force. That is, when a load occurs on the wire spring 60 near the connection part (w') between the wire spring 60 and the plate member 40, the buffer unit 100 is pulled in the direction of gravity or shakes left and right. The connection part (w') absorbs the generated load as strain energy due to reciprocating movement around the buffer part 100.

Therefore, it is possible to prevent the inconvenience of having to reconnect or parts becoming unusable due to damage to the connection part (w') during the assembly process, and it is possible to produce a more reliable camera module.

Meanwhile, according to a preferred embodiment of the present invention, there is a through hole at a position corresponding to the holder module 30 around the connection portion (w) of the second printed circuit board 50 and the wire spring 60, and the housing It may further include a shield can 70 installed to surround the units 21 and 22. In this case, as described above, the second printed circuit board 50 may be attached and fixed to the inner peripheral surface of the shield can 70. Meanwhile, the shield can 70 is not necessarily necessary, and may be omitted depending on the configuration of the housing units 21 and 22.

Meanwhile, as shown in FIG. 2, hook units 80 may be provided on four sides or at least one side to fix the shield can 70 to the first housing 21. The location may be within the range allowed by the center or edge design, and the number may be one or multiple.

The hook unit 80 may be composed of a hook 81 protruding from the first housing 21 and a hook hole 82 formed through the shield can 70 facing the hook 81. , it may be configured in the opposite direction as needed.

The embodiments of the present invention described above and shown in the drawings should not be construed as limiting the technical idea of the present invention. The scope of protection of the present invention is limited only by the matters stated in the claims, and those skilled in the art can improve and change the technical idea of the present invention into various forms. Therefore, such improvements and changes will fall within the scope of protection of the present invention as long as they are obvious to those skilled in the art.

10; First printed circuit board 20; housing unit
21; first housing 22; second housing
23; first permanent magnet 24; 2nd permanent magnet
25; York 30; holder module
31; Outer blade 31a; first coil
32; Bobbin 32a; second coil
40; plate member 50; 2nd printed circuit board
52; terminal 60; wire spring
70; shield can 80; Hook unit
100; buffer part 200; Buffer hole

Claims (1)

Base;
an outer blade disposed on the base;
A bobbin disposed within the outer blade;
a second coil disposed on the bobbin;
a permanent magnet that moves the bobbin in the optical axis direction through interaction with the second coil;
A buffer member coupled to the outer blade; and
Includes a wire coupled to the buffer member,
The shock absorbing member includes a coupling portion coupled to the wire, a body portion coupled to the outer blade, and a connection portion connecting the coupling portion and the body portion.