KR20220066237A - Camera Module - Google Patents

Abstract

The present invention relates to a camera module. According to the present invention, the camera module comprises: a first printed circuit board on which an image sensor is mounted; a housing unit placed on an upper side of the first printed circuit board; a holder module placed apart from an inner floor surface of the housing for a certain distance, and have a first coil wound on the outer circumferential surface, and including one or more lenses inside; a plate member engaged with a floor surface of the holder module; a second printed circuit board installed on an upper side of the holder module; a plurality of wire springs having one end connected to the plate member, and having the other end connected to the second printed circuit board; and a buffering unit placed on a connection unit between the wire springs and the plate member. The present invention aims to provide a camera module which is capable of preventing a fault.

Description

Camera Module

The present invention relates to a camera module.

In the case of a camera module mounted on a small electronic product, the camera module may frequently be impacted during use, and the camera module may be slightly shaken according to a user's hand shake while shooting. In view of this point, recently, a camera module having an anti-shake means has been disclosed. As an example, in Korea Patent Registration No. 10-0741823 (registered on July 16, 2007), a gyro sensor IC or an angular velocity sensor is installed inside a device in which a camera module such as a mobile phone is mounted in order to correct hand shake. How to do it is introduced.

However, when a separate angular velocity detection sensor is provided in this way, it is necessary to provide a separate detection sensor to implement the hand shake prevention function, thereby causing an increase in manufacturing cost, and for configuring and installing the hand shake prevention device separately from the camera module. There is a hassle of having to prepare a space.

(Patent Document 1) KR10-0741823 B1

An object of the present invention is to provide a camera module having an optical image stabilizer (OIS) function.

Another object of the present invention is to provide a camera module in which the buffer structure of the wire and the soldering part is improved so that the impact resistance can be improved.

The camera module according to the present invention includes a first printed circuit board on which an image sensor is mounted; a housing unit disposed above the first printed circuit board; a holder module disposed at a predetermined distance from an inner bottom surface of the housing unit, a first coil wound around an outer circumferential surface, and including at least one lens therein; a plate member coupled to the bottom surface of the holder module; a second printed circuit board installed above the holder module; a plurality of wire springs having one end connected to the plate member and the other end connected to the second printed circuit board; and a buffer portion provided at a connection portion between the wire spring and the plate member.

The buffer part may be formed to be reciprocally movable around the connection part.

In addition, the buffer part may be formed by a slit penetrating through the plate member and formed around a spring through hole through which the wire spring is connected to the plate member by a connecting material, the slit being the It may be configured by penetrating the portion except for the buffer part in an arc shape.

In addition, it is also possible to further include a buffer hole formed through the space between the spring through-hole and the buffer part.

In addition, the connecting material may be made of a conductive material such as lead.

The housing unit may include a first housing disposed above the first printed circuit board; a second housing disposed above the first housing and having the second printed circuit board installed thereon; first and second permanent magnets interposed between the first and second housings; It is preferable to include a yoke disposed between the first and second permanent magnets or located on the inner surface of the first and second housings to transmit a magnetic force into the holder module.

The yoke may be formed so that a central portion facing the holder module protrudes.

The second housing and the second printed circuit board may be fixed with a double-sided tape.

A shield can having a through hole at a position corresponding to the connection portion between the second printed circuit board and the wire spring and the lens module, and installed to surround the housing unit; may further include.

The holder module may include: an outer blade on which a first coil is wound on an outer circumferential surface; a bobbin elastically supported by an elastic member on the upper side of the outer blade, arranged to be movable up and down inside the outer blade, a second coil wound on an outer circumferential surface thereof, and at least one lens installed therein; and upper and lower elastic members respectively disposed on the upper and lower sides of the bobbin to elastically support the bobbin with respect to the outer blade, wherein the center of the first coil has a magnetic force to be invested toward the second coil. A space portion may be formed so that the

The wire spring may be made of a metal material, and may be electrically connected to the plate member and the second printed circuit board.

The wire spring is provided in at least six, and it is to supply two polarity power for auto-focusing control and four polarity power for OIS driving to the holder module through connection with the plate member and the second printed circuit board. desirable.

The wire springs, having the same length, are arranged two by two at the corners of the holder module, so that a total of eight may be provided.

According to the camera module according to the present invention, since the buffer part is provided on the plate member installed under the outer blade, even if repeated loads occur, damage to the wire soldering connection part due to the impact of the camera module can be minimized.

In addition, during the assembly process, even if the soldering is made more than the standard due to the operator's mistake, the excess solder permeates into the buffer hole formed at the position close to the soldering part of the wire, thereby preventing the camera module from being defective.

1 is a schematic plan view of a camera module according to an embodiment of the present invention;
Figure 2 is a cross-sectional view AA of Figure 1,
3 and 4 are side views of a camera module according to an embodiment of the present invention;
5 and 6 are plan views showing the pattern of the buffer portion of the plate member according to the first embodiment of the present invention, and,
7 and 8 are plan views illustrating a pattern of a buffer part of a plate member according to a second embodiment of the present invention.

Hereinafter, a preferred embodiment of the present invention will be described with reference to the drawings.

1 is a schematic plan view of a camera module according to an embodiment of the present invention, FIG. 2 is a cross-sectional view taken along line A-A of FIG. 1, and FIGS. 3 and 4 are side views of a camera module according to an embodiment of the present invention, FIGS. 5 and FIG. 6 is a plan view showing the pattern of the buffer part of the plate member according to the first embodiment of the present invention, and FIGS. 7 and 8 are plan views showing the pattern of the buffer part of the plate member according to the second embodiment of the present invention. .

As shown in Fig. 2 showing a schematic plan view of Fig. 1 and a schematic side view showing a cross section A-A of Fig. 1, the camera module according to the present invention is a first printed circuit board (10), a housing unit (20) , the holder module 30 , the plate member 40 , the second printed circuit board 50 , the wire spring 60 and the buffer part 100 provided in the plate member 40 . The plate member 40 may be referred to as a 'buffering member'.

The image sensor 11 is mounted in the vicinity of the center of the first printed circuit board 10, and it is preferable that the first printed circuit board 10 is provided as a PCB board. Components for operating the image sensor 11 may be disposed on the first printed circuit board 10 , or a plurality of terminal units capable of supplying power and outputting information of the image sensor 11 may be provided. .

The housing unit 20 is disposed on the upper side of the first printed circuit board 10 and forms a skeleton of the camera module. According to a preferred embodiment of the present invention, the housing unit 20 includes a first housing 21 , a second housing 22 , first and second permanent magnets 23 and 24 and a yoke 25 . includes

The first housing 21 as a base is disposed on the upper surface of the first printed circuit board 10 and is provided to be spaced apart from the image sensor 11 by a predetermined distance. A filter member capable of filtering an image incident to the image sensor 11 may be further installed in the first housing 21 , if necessary.

The second housing 22 is disposed above the first housing 21 to cover the first housing 21 . An opening is formed at a corresponding position in the vicinity of the center of the second housing 22 so that an image can be transmitted to the image sensor 11 side. A second printed circuit board 50, which will be described later, is adhesively fixed to the upper surface of the second housing 22 by a fixing member such as a double-sided tape or an adhesive, but is not limited thereto. It is also possible to provide a separate third housing such as a case or a shield can for the second printed circuit board 50 , and fix the second printed circuit board 50 to the inner surface thereof with the fixing member. If the third housing is provided, the second printed circuit board 50 may be supported by pressing the third housing without a separate fixing member.

The first and second permanent magnets 23 and 24 are interposed between the first and second housings 21 and 22 to invest magnetic force into the holder module 30 . The first and second permanent magnets 23 and 24 may have the same size. In addition, the first and second permanent magnets 23 and 24 and the yoke 25 may be disposed on the inner side surfaces of the first and second housings if possible within the design tolerance range.

On the other hand, when the sizes of the first and second permanent magnets 23 and 24 are increased, the OIS operation is increased even with a small current. In this case, as the current flowing through the first and second coils 31a and 32a disposed at positions corresponding to the first and second permanent magnets 23 and 24 increases, the OIS driving increases. In conclusion, the larger the size of the first and second permanent magnets 23 and 24, the better the OIS drive, but it is desirable to design the optimal size within the other design tolerances.

The yoke 25 is interposed between the first and second permanent magnets 23 and 24 . In addition, the yoke 25 is provided in a protruding shape near the center so that the magnetic force of the first and second permanent magnets 23 and 24 can be invested into the inner space of the holder module 30 . Preferably, the width is provided to be the same as the first and second permanent magnets 23 and 24, and the center protrudes to a certain size so that the permanent magnet and the yoke are formed to have an approximately “T” shape. desirable.

The holder module 30 is spaced apart from the inner bottom surface of the housing unit 20 by a predetermined distance, and includes an outer blade 31 and a bobbin 32 . The holder module 30 may perform pendulum motion in forward/backward/left/right and diagonal directions while being suspended from the wire spring 60 .

Spring members 35 and 36 are provided on upper and lower sides of the outer blade 31 , and are elastically supported by the spring member 35 , and are connected to enable vertical movement of the bobbin 32 .

As shown in FIG. 1 , the outer blade 31 has a total of four first coils 31a to 31d wound on the outer circumferential surface of four sides, and the central portion of the four sides on which the coils 31a to 31d are wound. It is drilled without a coil. The yoke 25 is disposed at a position corresponding to the open space, so that the yoke 25 may be partially inserted into the space.

A plate member 40 may be fixed to a lower surface of the outer blade 31 by a fixing member 33 such as a double-sided tape or an adhesive. The outer blade 31 is front, rear, left, right, or forward, as shown in the arrow of FIG. 2 according to the interaction between the magnetic force of the first and second permanent magnets 22 and 23 and the first coils 31a to 31d. It is suspended by a plurality of wire springs 60 so as to be able to move in a diagonal direction, and is disposed at a predetermined distance from the bottom surface of the first housing 21 .

In addition, a plurality of spring through-holes 37 may be provided in the outer blade 31 so that the wire spring 60 may pass through and be connected to the plate member 40 .

In the bobbin 32 , the outer blade 31 is vertically movable inside, and at least one lens 34 is installed therein. A second coil 32a is wound around the outer circumferential surface of the bobbin 32, and the second coil 32a is connected to the first coils 31a to 31d of the outer blade 31 through the yoke 25. An operation of raising and lowering the bobbin 32 is performed by interaction with the magnetic force invested through the empty space. As the size of the yoke 25 increases, AF driving improves, but this may also vary depending on an optimal design value. It is possible to automatically adjust the focus of the image transmitted to the image sensor 11 by the lifting action of the bobbin 32 as described above.

The plate member 40 is preferably made of a conductive metal material, and is disposed on the bottom surface of the outer blade 31 as described above to supply power to the first and second coils 31a and 32a. The wire spring 60 is connected so as to The connection method can be any method as long as it can be connected by soldering or other conductive material. That is, the connection portion w' of the plate member 40 is connected to the first and second coils 31a and 32a, respectively, as shown in FIG. 2 , and through the wire spring 60 The supplied power is transferred to the first and second coils 31a and 32a to form an electromagnetic force. The plate member 40 includes a coupling portion 44 coupled to the wire spring 60 , a body portion 43 coupled to the outer blade 31 , and a first portion 47 extending from the body portion 43 . and a second portion 48 . The coupling portion 44 is disposed between the first portion 47 and the second portion 48 and may be spaced apart from the first portion 47 and the second portion 48 by the same distance. The plate member 40 includes a connecting portion 45 extending from a first portion of the outer edge of the engaging portion 44 , and extending from a second portion of the outer edge of the engaging portion 44 and having a distal end of the body portion 43 and It may include extended portions 46 that are spaced apart.

In this case, in the case of the second coil 32a, it may be directly connected to the plate member 40, and as shown in FIG. 2, first, it is connected to the lower spring 36, and then the lower spring 36 is It is also possible to connect with the plate member 40 .

The second printed circuit board 50 is fixed to the upper side of the second housing 22 by a fixing member such as a double-sided tape or an adhesive member as described above, and the second Power transmitted through the terminal part 52 of the printed circuit board 50 is transmitted to the plate member 40 through the wire spring 60 . The connection method can be any method as long as it can be connected by soldering or other conductive material.

As shown in FIGS. 3 and 4, the second printed circuit board 50 is provided to cover one side wall of the first and second housings 21 and 22. In this case, the first and A window 55 is formed on the surface facing the second permanent magnets 23 and 24 and the yoke 25 , and may be configured to avoid interference with them.

This is a configuration for avoiding this, since the first and second permanent magnets 23 and 24 and the yoke 25 are generally directly attached to the shield can 70 to be described later with a fixing means such as epoxy.

On the other hand, the second printed circuit board 50 is a flexible printed circuit board (FPCB), a printed circuit board (PCB), or R-FPCB (Rigid FPCB integrated type) is possible, but is not limited thereto, and is configured to be electrically connected. Any substrate is possible. In the case of the present invention, the plate member 40 may be formed of a thin metal plate for the formation of the buffer part 100 for absorbing shock in the connection part w' to which the wire spring 60 is soldered with respect to external shock. .

Both ends of the wire spring 60 are connected to the plate member 40 and the second printed circuit board 50 . At this time, one end of the wire spring 60 is connected to the second printed circuit board 50 as shown in FIG. 2 , and the wire spring 60 connected to the second printed circuit board 50 is Power supplied through the terminal part 52 is supplied to the plate member 40 side, so that the first and second coils 31a and 32a are connected to the first and second permanent magnets 23 and 24 and to enable interaction of

In addition, as shown in FIG. 2 , the other end of the wire spring 60 passes through a spring through hole 37 formed in the outer blade 31 , and a plate member installed on the bottom surface of the outer blade 31 . (40) is connected. At this time, the other end of the wire spring 60, although not shown, is connected to a pad (not shown) formed on the plate member 40 like the second printed circuit board 50 , the pad (not shown). ), a spring through hole 41 through which the wire spring 60 passes is formed in the center. The connection method can be any method as long as it can be connected by soldering or other conductive material. According to this configuration, the outer blade 31 may be suspended from the wire spring 60 and spaced apart from the bottom surface of the first housing 21 by a predetermined distance or more. Then, according to the interaction between the first coil 31a and the first and second permanent magnets 23 and 24, the outer blade 31 performs pendulum movement, It is possible to correct the vibration of 31 ) by the interaction of the first coil 31a with the first and second permanent magnets 23 and 24 . To this end, it is preferable that the wire spring 60 is made of a metal material that has elasticity to withstand impact and can conduct electricity.

On the other hand, the thinner the wire spring 60, the better the hand shake correction movement even with a small current, but this may vary depending on the optimal design value. Preferably, the thickness of the wire spring 60 is several μm to several hundred μm, preferably 1 to 100 μm.

In addition, it is preferable that at least six wire springs 60 are provided. At least two polarities for auto-focusing control and four polarity power sources for hand-shake correction motion image stabilization are supplied to the second printed circuit board 50 ) and it is necessary to supply the holder module 30 through the connection between the plate member 40 .

According to a preferred embodiment of the present invention, as shown in FIGS. 1 and 2 , two of the same length and two each are arranged at the corners of the holder module 30, and it is good to provide a total of eight for balancing .

On the other hand, as shown in FIG. 2 , when a separate third housing such as a shield can 70 is further included, as described above, the second printed circuit board 50 is the first and second permanent Since the magnets 23 and 24 and the yoke 25 are fixedly coupled to the shield can 70 with epoxy or the like, in order to avoid this coupling part, a window 55 is formed to form the first and second housings. (21) and (22) cover the side wall surface.

If the shield can 70 is deleted, the second printed circuit board 50 is formed of a PCB or the like, and the first and second permanent magnets 23 and 24 and the yoke ( 25) can be attached and fixed, and as described above, the second printed circuit board 50 is made of a PCB, and a window 55 as described above is provided, and the second printed circuit board 50 is provided on the window 55. The first and second permanent magnets 23 and 24 and the yoke 25 may be inserted and configured by reinforcing an external shielding tape or the like.

The buffer part 100 is formed in the connection part w ' through which a conductive connection is made by soldering or Ag bond of the wire spring 60 and the plate member 40 to the shock and repeated loads applied to the wire spring 60 allow it to be absorbed.

The buffer unit 100, as shown in FIG. 5, is formed near the edge of the plate member 40, the slit 42 formed around the spring through hole 41 through which the wire spring 60 passes. The plate member 40 and the connecting portion may be formed so as to reciprocate in a direction parallel to the acceleration direction around the spring through hole 41 around the buffer unit 100 .

At this time, according to the first preferred embodiment of the present invention, the shape of the slit 42 may be configured such that the portion except for the buffer 100 has a circular ring shape, as shown in FIG. 5 . . At this time, as shown in FIG. 6 , a buffer hole 200 may be additionally formed through the spring at a position close to the through hole 41 . The buffer hole 200 is the buffer hole 200, when performing a conductive connection such as soldering the wire spring 60 that is through-coupled to the spring through hole 41, when the solder is put in more than the standard and overflows, the overflowing lead is the buffer part (100) is provided so that it does not flow into the side. That is, if too much lead is put in by the operator's mistake, lead may flow toward the buffer unit 100 . At this time, if the buffer hole 200 formed through the buffer hole 200 is provided on the path, the overflowing lead is again the buffer Since it flows into the hole 200 , it no longer flows toward the buffer unit 100 . Therefore, since the buffer unit 100 can maintain the flexible property of the plate member 40 as it is, even if an impact occurs to the wire spring 60, the shock is applied to the reciprocating movement of the connection portion w'. It can be absorbed through shape transformation.

On the other hand, according to the second preferred embodiment of the present invention, as shown in FIG. 7 , the shape of the buffer part 100 may be configured to be symmetrical about the spring through hole 41 . In this case, as shown in FIG. 8 , a buffer hole 200 may be formed around the spring through hole 41 . The function of the buffer hole 200 is the same.

In addition, the shape of the buffer hole 200 may be configured in an arc shape as shown in FIG. 6 , or may be configured in a circular shape as shown in FIG. 8 , but is not limited thereto, and solder Any shape through which a conductive connecting member can flow can be used.

However, the buffer hole 200 needs to be formed between the buffer part 100 and the spring through hole 41, and if it is formed too large, the strength around the buffer part 100 is reduced, so that the It is preferable to configure smaller than the area of the spring through hole (41). According to this configuration, it is possible to prevent damage to the connection portion w' of the plate member 40 due to an external impact.

On the other hand, in a general assembly sequence, after combining the bobbin 32 and the outer blade 31, using a jig, the second housing 22, the plate member 40 and the second printed circuit board 50 and the wire spring ( 60), and after coupling the bobbin 32 provided with the lens barrel, the first housing 21 is connected, and this is mounted on the first printed circuit board 10 . Before connecting the first housing 21, the permanent magnet and the yoke may be coupled first. This assembly sequence may be changed as needed. That is, it may be possible directly from the equipment without a jig. In this process, even if the force for inserting and coupling the bobbin 32 provided with the lens barrel is excessively large and exerts a strain on the connection part w', the buffer part 100 may absorb this excessive force. That is, when a load is generated in the wire spring 60 near the connection portion w ′ of the wire spring 60 and the plate member 40 , the buffer unit 100 is pulled in the direction of gravity or shakes left and right. The generated load is absorbed as deformation energy according to the reciprocating movement of the connection part w' around the buffer part 100 as a center.

Therefore, it is possible to prevent the inconvenience of performing a connection operation again due to damage to the connection part w' during the assembly process, or making the parts unusable, and it is possible to produce a more reliable camera module.

Meanwhile, according to a preferred embodiment of the present invention, a through hole is provided at a position corresponding to the holder module 30 around the connection part w between the second printed circuit board 50 and the wire spring 60, and the housing It may further include a shield can 70 installed to surround the units 21 and 22 . In this case, as described above, the second printed circuit board 50 may be attached and fixed to the inner circumferential surface of the shield can 70 . Meanwhile, the shield can 70 is not necessarily required, and may be omitted depending on the configuration of the housing units 21 and 22 .

Meanwhile, as shown in FIG. 2 , the hook unit 80 may be provided on four surfaces or at least one surface in order to fix the shield can 70 to the first housing 21 . The location may be within a range allowed by the design of the center or the edge, and the number may be provided as one or plural.

The hook unit 80 may include a hook 81 protruding from the first housing 21 and a hook hole 82 formed through the shield can 70 facing the hook 81. , and vice versa, if necessary.

The embodiments of the present invention described above and shown in the drawings should not be construed as limiting the technical spirit of the present invention. The protection scope of the present invention is limited only by the matters described in the claims, and those skilled in the art can improve and change the technical idea of the present invention in various forms. Accordingly, such improvements and modifications will fall within the protection scope of the present invention as long as they are apparent to those of ordinary skill in the art.

10; a first printed circuit board 20; housing unit
21; first housing 22; second housing
23; a first permanent magnet 24; 2nd permanent magnet
25; yoke 30; holder module
31; outer blade 31a; first coil
32; bobbin 32a; 2nd coil
40; plate member 50; second printed circuit board
52; terminal 60; wire spring
70; shield can 80; hook unit
100; buffer 200; buffer hole

Claims (20)

Base;
an outer blade disposed on the base;
a bobbin disposed in the outer blade;
a second coil disposed on the bobbin;
a permanent magnet for moving the bobbin in an optical axis direction through interaction with the second coil;
a buffer member coupled to the outer blade; and
It includes a wire coupled to the buffer member,
The buffer member includes a coupling portion coupled to the wire, a body coupled to the outer blade, and a connecting portion connecting the coupling portion and the body portion,
The coupling portion of the buffer member is a hand shake correction device comprising a curved surface. According to claim 1,
The coupling part of the buffer member includes a circular hole through which the wire passes. 3. The method of claim 2,
At least a portion of the curved surface of the coupling part of the buffer member is formed concentrically with the circular hole. 3. The method of claim 2,
The wire passes through the hole of the coupling part of the buffer member and is connected to the coupling part of the buffer member by a first solder,
At least a portion of the buffer member is a hand shake compensation device fixed to the outer blade through an adhesive. According to claim 1,
The connection portion of the buffer member extends from the coupling portion to the body portion with a width smaller than the diameter of the coupling portion. According to claim 1,
The shock absorbing member is a plate member formed of a metal material shake correction device. According to claim 1,
The handshake compensating device is disposed at a position corresponding to the corner of the outer blade and the coupling portion of the buffer member. According to claim 1,
The buffer member includes an extension portion extending from the coupling portion,
The extended portion of the buffer member extends from the curved surface of the coupling portion image stabilization device. 9. The method of claim 8,
The end of the extension portion of the buffer member is a hand shake compensation device that is spaced apart from the body portion of the buffer member. 9. The method of claim 8,
The connection part and the extension part of the buffer member are disposed opposite to each other in the coupling part. 9. The method of claim 8,
A width of the extension portion of the buffer member corresponds to a width of at least a portion of the connection portion of the buffer member. 9. The method of claim 8,
An outer edge of the coupling part of the buffer member is formed in a circular shape other than a portion connected to the extension part and the connection part. According to claim 1,
wherein the second coil is directly connected to the buffer member. According to claim 1,
At least a portion of the connection part of the shock absorber is formed as a shock absorber to absorb the shock and repetitive load applied to the wire. According to claim 1,
a second printed circuit board disposed on the base;
a lower spring connecting a lower portion of the bobbin and a lower portion of the outer blade;
a shield can comprising a top plate and a side plate extending from the top plate, and accommodating the outer blade therein; and
and a second solder coupling the second printed circuit board and the wire;
The second printed circuit board includes a first portion disposed on the base and a second portion extending downward from the first portion,
The second solder is an image stabilization device for coupling the first portion of the second printed circuit board and the wire. Base;
an outer blade disposed on the base;
a bobbin disposed in the outer blade;
a second coil disposed on the bobbin;
a permanent magnet for moving the bobbin in an optical axis direction through interaction with the second coil;
a buffer member coupled to the outer blade; and
It includes a wire coupled to the buffer member,
The buffer member includes a coupling portion coupled to the wire, a body coupled to the outer blade, and a connecting portion connecting the coupling portion and the body portion,
An outer edge of the coupling part of the buffer member is formed in a circular shape at least in part. 17. The method of claim 16,
The shock absorbing member is a plate member formed of a metal material shake correction device. a first printed circuit board;
an image sensor disposed on the first printed circuit board;
The handshake correction device of any one of claims 1 to 17, which is disposed on the first printed circuit board; and
A camera module including a lens coupled to the bobbin of the image stabilization device. A mobile phone comprising the camera module of claim 18 . Base;
an outer blade disposed on the base;
a bobbin disposed in the outer blade;
a second coil disposed on the bobbin; and
and a permanent magnet for moving the bobbin through interaction with the second coil.

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