KR20230133292A - 배선 회로 기판 - Google Patents

배선 회로 기판 Download PDF

Info

Publication number
KR20230133292A
KR20230133292A KR1020237023723A KR20237023723A KR20230133292A KR 20230133292 A KR20230133292 A KR 20230133292A KR 1020237023723 A KR1020237023723 A KR 1020237023723A KR 20237023723 A KR20237023723 A KR 20237023723A KR 20230133292 A KR20230133292 A KR 20230133292A
Authority
KR
South Korea
Prior art keywords
opening
circuit board
terminal portion
wiring circuit
projection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020237023723A
Other languages
English (en)
Korean (ko)
Inventor
유사쿠 다마키
슈사쿠 시바타
테페이 니노
Original Assignee
닛토덴코 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2021174535A external-priority patent/JP7204856B2/ja
Application filed by 닛토덴코 가부시키가이샤 filed Critical 닛토덴코 가부시키가이샤
Publication of KR20230133292A publication Critical patent/KR20230133292A/ko
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B21/00—Head arrangements not specific to the method of recording or reproducing
    • G11B21/16—Supporting the heads; Supporting the sockets for plug-in heads
    • G11B21/20—Supporting the heads; Supporting the sockets for plug-in heads while the head is in operative position but stationary or permitting minor movements to follow irregularities in surface of record carrier
    • G11B21/21—Supporting the heads; Supporting the sockets for plug-in heads while the head is in operative position but stationary or permitting minor movements to follow irregularities in surface of record carrier with provision for maintaining desired spacing of head from record carrier, e.g. fluid-dynamic spacing, slider
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/58—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed with provision for moving the head for the purpose of maintaining alignment of the head relative to the record carrier during transducing operation, e.g. to compensate for surface irregularities of the latter or for track following
    • G11B5/60—Fluid-dynamic spacing of heads from record-carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/0939—Curved pads, e.g. semi-circular or elliptical pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09445—Pads for connections not located at the edge of the PCB, e.g. for flexible circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
KR1020237023723A 2021-01-19 2021-12-03 배선 회로 기판 Pending KR20230133292A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2021006128 2021-01-19
JPJP-P-2021-006128 2021-01-19
JP2021174535A JP7204856B2 (ja) 2021-01-19 2021-10-26 配線回路基板
JPJP-P-2021-174535 2021-10-26
PCT/JP2021/043378 WO2022158118A1 (ja) 2021-01-19 2021-12-03 配線回路基板

Publications (1)

Publication Number Publication Date
KR20230133292A true KR20230133292A (ko) 2023-09-19

Family

ID=82549656

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237023723A Pending KR20230133292A (ko) 2021-01-19 2021-12-03 배선 회로 기판

Country Status (5)

Country Link
US (1) US12598698B2 (https=)
JP (1) JP2023024891A (https=)
KR (1) KR20230133292A (https=)
TW (1) TW202231138A (https=)
WO (1) WO2022158118A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012235013A (ja) 2011-05-06 2012-11-29 Nitto Denko Corp 配線回路基板およびその製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001209918A (ja) 1999-11-19 2001-08-03 Nitto Denko Corp 回路付サスペンション基板
JP2008028376A (ja) * 2006-06-20 2008-02-07 Sanyo Electric Co Ltd 回路基板、半導体モジュールおよび回路基板の製造方法
JP2009129490A (ja) * 2007-11-21 2009-06-11 Nitto Denko Corp 配線回路基板
JP2011049316A (ja) 2009-08-26 2011-03-10 Nitto Denko Corp 配線回路基板およびその製造方法
JP5603657B2 (ja) 2010-05-20 2014-10-08 日東電工株式会社 回路付サスペンション基板およびその製造方法
JP5713718B2 (ja) 2011-02-17 2015-05-07 日本発條株式会社 フレキシャ及びこれを備えたヘッドサスペンション
JP5513637B2 (ja) * 2013-02-07 2014-06-04 日東電工株式会社 配線回路基板の製造方法
JP6169894B2 (ja) 2013-05-28 2017-07-26 日東電工株式会社 配線回路基板
US20170288202A1 (en) 2016-03-30 2017-10-05 Faraday&Future Inc. Battery circuit contactors
WO2017209296A1 (ja) 2016-06-03 2017-12-07 大日本印刷株式会社 貫通電極基板及びその製造方法、並びに実装基板
JP6782132B2 (ja) 2016-09-15 2020-11-11 日東電工株式会社 回路付サスペンション基板、および、回路付サスペンション基板の製造方法
JP7511320B2 (ja) 2018-05-31 2024-07-05 日東電工株式会社 配線回路基板

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012235013A (ja) 2011-05-06 2012-11-29 Nitto Denko Corp 配線回路基板およびその製造方法

Also Published As

Publication number Publication date
TW202231138A (zh) 2022-08-01
WO2022158118A1 (ja) 2022-07-28
JP2023024891A (ja) 2023-02-17
US20240090128A1 (en) 2024-03-14
US12598698B2 (en) 2026-04-07

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