KR20230125071A - Manufacturing method of processing device and processed product - Google Patents

Abstract

The present invention simplifies the structure of a processing apparatus having a blade exchange mechanism and reduces the space occupied by cutting tables 2A and 2B on which a substrate W sealed by a cutting mechanism 4 is processed. ), and a cutting movement mechanism 8 for moving the cutting mechanism 4 in the first and second directions orthogonal to each other in a horizontal plane, and a blade for exchanging blades 41A and 41B of the cutting mechanism 4 It is provided with the exchange mechanism 24, and the movement mechanism 8 for cutting is a pair of 1st guide rail 811 provided along the 1st direction with table 2A, 2B for cutting interposed therebetween, and a pair While moving along the 1st guide rail 811 of , it has the support body 812 which movably supports the cutting mechanism 4 along the 2nd direction, The blade exchange mechanism 24 has blade 41A, 41B), and an arm moving mechanism 242 that moves the first suction portion 241a in the second direction.

Description

Manufacturing method of processing device and processed product

The present invention relates to a processing device and a method for manufacturing a processed product.

Conventionally, as shown in Patent Literature 1, a blade exchange mechanism for automatically exchanging blades is provided in a substrate cutting module that cuts a sealed substrate by moving a cutting table relative to a spindle equipped with blades. thought to have been prepared.

Japanese Patent No. 6560714

However, in the above cutting device, a moving mechanism for moving the spindle, a moving mechanism for moving the cutting table, and a moving mechanism for moving the blade exchange mechanism are required, which not only complicates the configuration of the device, but also complicates the space occupied by the device. (footprint) grows

Therefore, the present invention has been made in order to solve the above problems, and while simplifying the device configuration of a processing device having a blade exchange mechanism, its main task is to reduce the occupied space.

That is, a processing device according to the present invention includes a processing table on which an object to be processed is processed by a processing mechanism, a processing moving mechanism for moving the processing mechanism in first and second directions orthogonal to each other on a horizontal plane, and the processing mechanism A processing tool exchanging mechanism for exchanging a processing tool, wherein the processing moving mechanism includes a pair of first guide rails provided along the first direction with the processing table interposed therebetween; and the pair of first guides. It has a supporting body that movably supports the machining tool along the second direction while moving along the rail, and the machining tool exchange mechanism holds a machining tool that is held so as to exchange the machining tool. It is characterized by having a support part and a holding part moving mechanism for moving the machining tool holding part in the second direction.

According to the present invention structured as described above, while simplifying the device configuration of the processing device having the blade exchange mechanism, it is possible to reduce the occupied space.

1 is a diagram schematically showing the configuration of a cutting device according to an embodiment of the present invention.
2 : is a perspective view which shows typically the table for cutting of the same embodiment, and its peripheral structure.
Fig. 3 is a view (plan view) schematically showing the structure of the table for cutting and its peripheral structure of the embodiment, as viewed from the Z direction.
Fig. 4 is a view (front view) schematically showing the structure of the table for cutting and its peripheral structure of the embodiment, as viewed from the Y direction.
Fig. 5 is a view (front view) schematically showing the configurations of the first holding mechanism and the moving mechanism for transport in the embodiment, as viewed from the Y direction.
Fig. 6 is a view (side view) schematically showing the configurations of the first holding mechanism and the movement mechanism for transport in the embodiment, as viewed from the X direction.
Fig. 7 is a view (front view) schematically showing the configurations of the second holding mechanism and transport mechanism of the same embodiment, as viewed from the Y direction.
Fig. 8 is a cross-sectional view schematically showing the configuration of the rack and pinion mechanism of the embodiment.
9 : is a schematic diagram which shows the operation|movement of the cutting device of the same embodiment.
Fig. 10 is a view (plan view) schematically showing the configuration of the substrate supplying mechanism of the embodiment, viewed from the Z direction.
Fig. 11 is a view (front view) schematically showing the configuration of the substrate supply mechanism of the embodiment, as viewed from the Y direction.
Fig. 12 is a cross-sectional view schematically showing the configuration of the stage for carrying in the embodiment.
Fig. 13 is a view (plan view) when viewed from the Z direction schematically showing each position of the carrying stage of the same embodiment.
Fig. 14 is a view (plan view) viewed from the Z direction schematically showing each position of the stage for carrying out of the same embodiment.
Fig. 15 is a view (plan view) schematically showing the configuration of the blade exchanging mechanism of the embodiment as seen from the Z direction.
Fig. 16 is a cross-sectional view schematically showing the configuration of the cutting mechanism of the embodiment.
Fig. 17 is a cross-sectional view schematically showing (a) a state before removal and (b) a state after removal of a blade by the blade exchange mechanism of the same embodiment.
Fig. 18 is a cross-sectional view schematically showing a state before removal of the blade by the blade exchange mechanism of the modified example.
Fig. 19 is a view (plan view) as viewed from the Z direction showing the replacement state of each blade by the blade exchange mechanism of the same embodiment.
Fig. 20 is a flow chart of a full cut conveyance operation and a half cut conveyance operation of the same embodiment.

Next, the present invention will be described in more detail with examples. However, this invention is not limited by the following description.

As described above, the processing apparatus of the present invention includes a processing table on which an object to be processed is processed by the processing mechanism, a processing movement mechanism for moving the processing mechanism in a first direction and a second direction orthogonal to each other in a horizontal plane, and the above A processing tool exchange mechanism for exchanging a processing tool of a processing mechanism is provided, and the processing moving mechanism includes a pair of first guide rails provided along the first direction with the processing table interposed therebetween; 1. A processing tool holding portion having a support body that moves along a guide rail and movably supports the processing tool along the second direction, and the processing tool exchange mechanism holds the processing tool in order to exchange the processing tool. and a holding portion moving mechanism for moving the processing tool holding portion in the second direction.

In this processing device, since the processing mechanism moves the processing mechanism in the first and second directions orthogonal to each other on the horizontal plane, the processing object is moved without moving the processing table in the first and second directions. can be processed For this reason, it is possible to eliminate the need for a moving mechanism for moving the processing table, simplifying the configuration of the device, and reducing the occupied space.

In addition, since the movement direction (first direction) of the support body for supporting the processing mechanism so as to be movable in the second direction and the movement direction (second direction) of the holding unit movement mechanism for moving the holding unit are orthogonal to each other, the support body is While moving in one direction to bring the processing tool closer to the processing tool exchange mechanism, the holding unit moving mechanism moves the processing tool holding unit in the second direction so that the processing tool of the processing mechanism can be exchanged. As described above, in the present invention, the processing movement mechanism for moving the processing mechanism and the holding unit movement mechanism of the processing tool exchange mechanism can be optimally arranged, simplifying the device configuration of the processing device, and reducing the occupied space. there is.

A processing apparatus according to the present invention includes a conveying movement having a first holding mechanism for holding the object to be processed in order to convey it to the processing table, and a transfer shaft for moving the first holding mechanism along the first direction. It is desirable to have an instrument.

With this configuration, since the transfer shaft extends in the first direction, the elongation direction of the transfer shaft and the moving direction of the holding unit moving mechanism are orthogonal to each other in a planar view. Further, the transfer shaft and the support body are orthogonal to each other in plan view, and the elongation direction of the transfer shaft and the moving direction of the support body are parallel to each other in plan view. Such a relationship makes it possible to optimally arrange the moving mechanism for machining, the machining tool changing mechanism, and the transfer shaft.

When dressing a machining tool, a dressing member is used.

At this time, it is preferable that the said 1st holding mechanism has a dressing-member holding part holding the dressing member for dressing the said processing tool.

With this configuration, since the first holding mechanism holding the object to be processed holds the dressing member, there is no need to separately provide a dressing member holding mechanism, and the device configuration can be simplified.

In order to improve the processing capability of an object to be processed in one processing device, it is preferable that the processing device of the present invention includes a plurality of the processing tables along the first direction.

Here, since a plurality of processing tables are arranged along the first direction, the processing mechanism can be moved to a plurality of processing tables by one moving mechanism for processing. As a result, the device configuration can be simplified.

It is preferable that the processing apparatus of the present invention further includes a dressing table for dressing the processing tool using a dressing member.

In this configuration, in order to reduce the space occupied by the apparatus, it is preferable that the dressing table is provided between the processing tables.

Further, the processing apparatus of the present invention includes: a processing object accommodating portion for accommodating an object; a receiving stage for receiving the processing object from the processing object accommodating portion; and movement for moving the receiving stage along the second direction. It is preferable to further include a stage moving mechanism that has a rail and moves the receiving stage to a transfer position.

By using the moving rail to move the receiving stage in the second direction to the transfer position, the space occupied by the processing device can be reduced. Specifically, since the receiving stage is moved in the second direction by the moving rail, the transfer shafts for moving the first holding mechanism are orthogonal to each other in plan view, and the space occupied by the processing device can be reduced.

In this configuration, in order to simplify the device configuration, it is preferable that the holding member moving mechanism be movable along the moving rail.

Moreover, it is thought that the processing apparatus of this invention further includes the dressing-member accommodating part which accommodates the dressing member for dressing the said processing tool.

In order to simplify an apparatus structure in this structure, it is preferable that the said dressing member accommodating part is provided so that a movement along the said moving rail is possible.

When the processing device of the present invention is a cutting device, the processing mechanism has a blade as the processing tool, a spindle portion rotating the blade, and a flange detachably fixing the blade to the spindle portion.

In this case, the machining tool exchanging mechanism includes a first adsorption unit that is the machining tool holding unit that adsorbs and holds the blade, and a second adsorber that is provided separately from the first adsorber and adsorbs and holds the flange. It is preferable that an adsorption surface having an adsorption unit and adsorbed to the second adsorption unit in the flange is a plane orthogonal to the axis of rotation of the spindle unit.

With this configuration, the flange can be stably suctioned and held by the second suction unit, and the possibility of the flange shifting or falling when the second suction unit is moved by the holding unit moving mechanism can be reduced.

Moreover, the manufacturing method of the processed goods which manufactures a processed goods using the said processing apparatus is also one aspect of this invention.

<One embodiment of the present invention>

EMBODIMENT OF THE INVENTION Below, one Embodiment of the processing apparatus concerning this invention is described with reference to drawings. On the other hand, in any drawing shown below, in order to make it easy to understand, it is appropriately abbreviated or exaggeratedly drawn schematically. About the same component, the same code|symbol is added and description is abbreviate|omitted suitably.

<Overall configuration of processing equipment>

The processing device 100 of the present embodiment is a cutting device that separates a sealed substrate W, which is an object to be processed, into a plurality of products P, which are processed products.

Specifically, as shown in FIG. 1 , the cutting device 100 cuts two cutting tables (processing tables) 2A and 2B holding the sealed substrate W and the sealed substrate W. 1st holding mechanism 3 which holds the board|substrate W which was sealed for conveyance to the table 2A, 2B for conveyance, and the board|substrate W which was sealed which was held by the table 2A, 2B for cutting, A cutting mechanism (processing mechanism) 4 for cutting, a moving loading table 5 on which a plurality of products P are transferred, and a plurality of products P from the tables 2A and 2B for cutting To move the second holding mechanism 6, the first holding mechanism 3 and the second holding mechanism 6 holding a plurality of products P for conveyance to the moving loading table 5 A transport movement mechanism 7 having a common transfer shaft 71 for cutting and a cutting movement for moving the cutting mechanism 4 with respect to the sealed substrate W held on the cutting tables 2A and 2B. A mechanism (moving mechanism for processing) 8 is provided.

Here, the sealed board|substrate W is a board|substrate to which electronic elements, such as a semiconductor chip, a resistor element, and a capacitor element, are connected, and resin molding is carried out so that at least an electronic element may be resin-sealed. As the substrate constituting the sealed substrate W, a lead frame and a printed wiring board can be used. In addition to these, semiconductor substrates (including semiconductor wafers such as silicon wafers), metal substrates, ceramic substrates, glass substrates, A resin substrate or the like can be used. In addition, the substrate constituting the sealed substrate W may or may not be provided with wiring.

In the following description, directions orthogonal to each other within the plane (horizontal plane) along the upper surfaces of the cutting tables 2A and 2B are the X direction and the Y direction, respectively, and the vertical direction orthogonal to the X and Y directions is the Z direction. do. Specifically, the left-right direction in FIG. 1 is the X direction (first direction), and the vertical direction is the Y-direction (second direction). As will be described later, the X direction is the movement direction of the support body 812, and also the beam part on which the pair of legs in the gate-shaped support body 812 are straddled ( It is a direction orthogonal to the longitudinal direction (the direction in which the beam part extends) of the beam part) (see Fig. 2).

<table for cutting>

Two table 2A, 2B for cutting are fixed in the X direction, the Y direction, and the Z direction, and are provided. On the other hand, table 2A for cutting is rotatable in the (theta) direction by 9 A of rotation mechanisms provided under table 2A for cutting. Moreover, the table 2B for cutting is rotatable in the (theta) direction by the rotation mechanism 9B provided under the table 2B for cutting.

These two table 2A, 2B for cutting are provided along the X direction on a horizontal surface. Specifically, the two cutting tables 2A, 2B are arranged so that their upper surfaces are located on the same horizontal plane (located at the same height in the Z direction) (see Fig. 4), and their upper surfaces It is arrange|positioned so that the center (specifically, the rotation center by rotation mechanism 9A, 9B) may be located on the same straight line extending in the X direction (refer FIG. 2 and FIG. 3).

In addition, the two cutting tables 2A, 2B adsorb and hold the sealed substrate W, and as shown in Fig. 1, corresponding to the two cutting tables 2A, 2B, the adsorption-holding is performed. Two vacuum pumps 10A and 10B for support are arranged. Each vacuum pump 10A, 10B is a water ring type vacuum pump, for example.

Here, since the cutting tables 2A, 2B are fixed in the XYZ direction, the piping (not shown) connected from the vacuum pump 10A, 10B to the cutting tables 2A, 2B can be shortened, By reducing the pressure loss in the piping, it is possible to prevent a decrease in adsorption force. As a result, for example, even a very small package with one side of 1 mm or less can be reliably adsorbed to the cutting tables 2A and 2B. In addition, since the reduction in adsorption force due to pressure loss in the piping can be prevented, the capacity of the vacuum pumps 10A and 10B can be reduced, leading to downsizing and cost reduction.

<First holding mechanism>

As shown in FIG. 1 , the first holding mechanism 3 is configured to transport the sealed substrate W from the substrate supply mechanism 11 to the cutting tables 2A and 2B. to hold and support As shown in FIGS. 5 and 6 , the first holding mechanism 3 includes a suction head 31 provided with a plurality of suction portions 311 for adsorbing and holding the sealed substrate W; It has a vacuum pump (not shown) connected to the suction part 311 of the suction head 31. Then, the suction head 31 is moved to a desired position by a transfer mechanism 7 or the like described later, so that the sealed substrate W is moved from the substrate supply mechanism 11 to the cutting tables 2A, 2B. return to

As shown in FIG. 1 , the substrate supply mechanism 11 includes a substrate accommodating portion 111 in which a plurality of sealed substrates W are accommodated from the outside, and a sealed substrate W accommodated in the substrate accommodating portion 111. ) to the holding position RP adsorbed and held by the first holding mechanism 3. This holding position RP is set so that it may become the same line in two cutting table 2A, 2B and the X direction. On the other hand, the substrate supply mechanism 11 has a substrate heating unit 113 that heats the sealed substrate W adsorbed by the first holding mechanism 3 in a flexible state to facilitate adsorption. There may be. On the other hand, the substrate accommodating portion 111 corresponds to an object accommodating portion. In addition, the substrate accommodating portion 111 may be configured to directly accommodate a plurality of sealed substrates W as an object to be processed, or configured to accommodate a magazine that is a container for accommodating a plurality of sealed substrates W as an object to be processed. It can be. A specific configuration of the other substrate supply mechanism 11 will be described later.

<Cutting mechanism (processing mechanism)>

As shown in Figs. 1, 2 and 3, the cutting mechanism 4 includes two rotary tools 40 composed of blades 41A and 41B corresponding to processing tools and two spindle parts 42A and 42B. will have The two spindle parts 42A and 42B are provided so that their rotation axes follow the Y direction, and the blades 41A and 41B mounted (attached) to them are arranged so as to face each other (see Fig. 3). The blade 41A of the spindle portion 42A and the blade 41B of the spindle portion 42B are held by the respective cutting tables 2A and 2B by rotating in a plane including the X and Z directions. The sealed substrate W is cut. On the other hand, in the cutting device 100 of the present embodiment, as shown in Figs. 3 and 4, cutting water (processing fluid) is sprayed in order to suppress the frictional heat generated by the blades 41A and 41B. A liquid supply mechanism 12 having a spray nozzle 121 is provided. This injection nozzle 121 is supported by a Z-direction moving part 83 described later, for example.

＜Moving and loading table＞

As shown in Fig. 1, the movable loading table 5 of this embodiment is a table on which a plurality of products P inspected by an inspection unit 13 described later are transferred. This movable loading table 5 is what is called an index table, and a plurality of products P are temporarily placed before dividing the plurality of products P into various trays 21 . Moreover, the movable stacking table 5 is arranged along the X direction on a horizontal plane with the two cutting tables 2A and 2B. Further, the movable stacking table 5 can move back and forth along the Y direction and can move up to the sorting mechanism 20 . A plurality of products P placed on the movable stacking table 5 are classified into various trays 21 by a sorting mechanism 20 according to the inspection result (defective product, defective product, etc.) by the inspection unit 13. .

On the other hand, various trays 21 are transported to desired positions by the tray conveying mechanism 22 moving along the transfer shaft 71, and products P classified by the sorting mechanism 20 are placed thereon. After being sorted, various trays 21 are accommodated in the tray accommodating portion 23 by the tray transport mechanism 22 . In this embodiment, in the tray accommodating part 23, for example, the tray 21 before accommodating the product P, the tray 21 accommodating the product P of good quality, and rework (re-inspection) are required. It is configured to accommodate three types of trays 21 called trays 21 for accommodating defective products P.

<Inspection Department>

Here, as shown in FIG. 1 , the inspection unit 13 is provided between the cutting tables 2A and 2B and the moving stacking table 5, and a plurality of products held by the second holding mechanism 6 ( P) to check. The inspection unit 13 of the present embodiment includes a first inspection unit 131 that inspects the sealing surface (package surface) of the product P and a second inspection unit 132 that inspects the lead surface of the product P. . The first inspection unit 131 is an imaging camera having an optical system for inspecting the package surface, and the second inspection unit 132 is an imaging camera having an optical system for inspecting the lead surface. On the other hand, it is good also considering the 1st inspection part 131 and the 2nd inspection part 132 in common.

The sealed substrate W and the product P of this embodiment have a configuration in which one surface of the substrate is resin-molded. In such a configuration, the resin-molded surface is a surface on which the electronic element connected to the substrate is resin-sealed, and is referred to as a "encapsulated surface" or a "package surface". On the other hand, the non-resin-molded surface opposite to the resin-molded surface is called a lead surface because leads functioning as external connection electrodes of ordinary products are exposed. When this lead is a protruding electrode used in electronic components such as BGA (Ball, Grid, Array), it is sometimes called a "ball face". In addition, since the non-resin-molded surface opposite to the resin-molded surface may have a form in which no lead is formed, it is sometimes referred to as a "substrate surface". In the description of this embodiment, the resin-molded surface is described as "sealing surface" or "package surface", and the resin-molded surface and the non-resin-molded surface opposite to the resin-molded surface are described as "lead surface".

In addition, in order to enable inspection of both surfaces of the plurality of products P by the inspection unit 13, an inversion mechanism 14 for inverting the plurality of products P is provided (see Fig. 1). This reversing mechanism 14 includes a holding table 141 holding a plurality of products P and an inverting part 142 such as a motor which inverts the holding table 141 so that the front and back are reversed. Have.

When the 2nd holding mechanism 6 hold|maintains some product P from cutting table 2A, 2B, the package surface of product P faces downward. In this state, the package surface of the product P is inspected by the 1st inspection part 131 in the middle of conveying several products P from table 2A, 2B for cutting to the inversion mechanism 14. After that, the plurality of products P held by the second holding mechanism 6 are reversed by the reversing mechanism 14 . In this state, the lead surface of the product P faces downward, and the lead surface of the product P is inspected by moving the reversing mechanism 14 to the second inspection unit 132 .

<Second holding mechanism>

As shown in FIG. 1 , the second holding mechanism 6 holds a plurality of products P in order to convey the plurality of products P from the cutting tables 2A and 2B to the transfer table 5. to hold and support As shown in FIG. 8 , this second holding mechanism 6 includes a suction head 61 provided with a plurality of suction parts 611 for suction and holding a plurality of products P, and the suction head ( 61) has a vacuum pump (not shown) connected to the adsorption unit 611. Then, the suction head 61 is moved to a desired position by a transfer mechanism 7 or the like described later, thereby moving the plurality of products P from the cutting tables 2A, 2B to the holding table 141. Alternatively, it is conveyed to the movable loading table 5.

<Movement Mechanism for Transport>

As shown in FIG. 1, the movement mechanism 7 for conveyance moves the 1st holding mechanism 3 at least between the board|substrate supply mechanism 11 and table 2A for cutting, 2B, and the 2nd The holding mechanism 6 is moved at least between the tables 2A and 2B for cutting and the holding table 141 .

And, as shown in FIG. 1, the transport mechanism 7 extends in a straight line along the arrangement direction (X direction) of the two cutting tables 2A, 2B and the movable loading table 5, It has the common transfer shaft 71 for moving 1 holding mechanism 3 and the 2nd holding mechanism 6.

This transfer shaft 71 allows the first holding mechanism 3 to move upward of the substrate supplying part 112 of the substrate supplying mechanism 11, and the second holding mechanism 6 to move and load the table. It is provided in the range which can move upward of (5) (refer FIG. 1). Moreover, with respect to this transfer shaft 71, the 1st holding mechanism 3, the 2nd holding mechanism 6, the cutting tables 2A, 2B, and the movable loading table 5 are in planar view. It is provided on the same side (front side). In addition, the inspection unit 13, the inversion mechanism 14, various trays 21, the tray transport mechanism 22, the tray receiving unit 23, the first cleaning mechanism 18 and the second cleaning mechanism 19 described later , The collection container 172 is also provided on the same side (front side) with respect to the transfer shaft 71 .

Moreover, as shown in FIG. 5, FIG. 6 and FIG. 8, the movement mechanism 7 for conveyance has the 1st holding mechanism 3 and the 2nd holding mechanism 6 in the X direction along the transfer shaft 71 A main moving mechanism 72 for moving the , a lifting mechanism 73 for lifting and moving the first holding mechanism 3 and the second holding mechanism 6 in the Z direction with respect to the transfer shaft 71; It has a horizontal movement mechanism 74 for horizontally moving the first holding mechanism 3 and the second holding mechanism 6 relative to the transfer shaft 71 in the Y direction.

As shown in FIGS. 5 to 8 , the main moving mechanism 72 is provided on the transfer shaft 71 and has a common guide rail for guiding the first holding mechanism 3 and the second holding mechanism 6. 721 and a rack and pinion mechanism 722 for moving the first holding mechanism 3 and the second holding mechanism 6 along the guide rail 721.

The guide rail 721 extends in a straight line in the X direction along the transfer shaft 71, and like the transfer shaft 71, the first holding mechanism 3 is a substrate supply unit of the substrate supply mechanism 11 ( 112) While being able to move upward, the second holding mechanism 6 is provided within the range of being able to move upward of the movable loading table 5. The slide member 723 provided with the 1st holding mechanism 3 and the 2nd holding mechanism 6 slides on this guide rail 721 via the lifting mechanism 73 and the horizontal movement mechanism 74. possible is available. Here, the guide rail 721 is common to the first holding mechanism 3 and the second holding mechanism 6, but the lifting mechanism 73, the horizontal movement mechanism 74 and the slide member 723 are, It is provided individually for each of the 1st holding mechanism 3 and the 2nd holding mechanism 6.

The rack and pinion mechanism 722 includes a cam rack 722a common to the first holding mechanism 3 and the second holding mechanism 6, the first holding mechanism 3 and the second holding mechanism ( 6) Each has a pinion gear 722b provided and rotated by an actuator (not shown). The cam rack 722a is provided on a common transfer shaft 71, and can be changed to various lengths by connecting a plurality of cam rack elements. In addition, the pinion gear 722b is provided on the slide member 723 and is called a so-called roller pinion, and as shown in FIG. Between the pair of roller main bodies 722b1, it is provided in the circumferential direction at regular intervals, and has a plurality of roller pins 722b2 provided so as to be able to roll with respect to the roller main body 722b1. Since the rack and pinion mechanism 722 of the present embodiment uses the roller pinion described above, two or more roller pins 722b2 come into contact with the cam rack 722a, causing backlash in the forward and reverse directions. This does not occur, and the positioning accuracy improves when the first holding mechanism 3 and the second holding mechanism 6 are moved in the X direction.

As shown in FIGS. 5 and 8 , the lifting mechanism 73 is provided corresponding to each of the first holding mechanism 3 and the second holding mechanism 6 . As shown in FIGS. 5 and 6 , the lifting mechanism 73 of the first holding mechanism 3 includes the transfer shaft 71 (specifically, the main moving mechanism 72) and the first holding mechanism ( 3) A Z-direction guide rail 73a provided interposed therebetween and provided along the Z-direction, and an actuator portion 73b that moves the first holding mechanism 3 along the Z-direction guide rail 73a Have. On the other hand, the actuator portion 73b may be, for example, a ball screw mechanism, an air cylinder, or a linear motor. On the other hand, the structure of the lifting mechanism 73 of the 2nd holding mechanism 6 is the same as that of the lifting mechanism 73 of the 1st holding mechanism 3, as shown in FIG.

The horizontal movement mechanism 74 is provided correspondingly to each of the 1st holding mechanism 3 and the 2nd holding mechanism 6, as shown in FIG.5, FIG.6 and FIG.8. As shown in FIGS. 5 and 6 , the horizontal movement mechanism 74 of the first holding mechanism 3 includes the transfer shaft 71 (specifically, the lifting mechanism 73) and the first holding mechanism ( 3) a Y-direction guide rail 74a provided interposed therebetween and provided along the Y-direction, and an elastic body that applies force to one side of the Y-direction guide rail 74a with respect to the first holding mechanism 3 ( 74b) and a cam mechanism 74c for moving the first holding mechanism 3 to the other side of the Y-direction guide rail 74a. Here, the cam mechanism 74c uses an eccentric cam, and the amount of movement in the Y direction of the first holding mechanism 3 can be adjusted by rotating the eccentric cam with an actuator such as a motor.

On the other hand, the structure of the horizontal movement mechanism 74 of the 2nd holding mechanism 6 is the same as that of the lifting mechanism 73 of the 1st holding mechanism 3, as shown in FIG. Moreover, it is good also as a structure which does not provide the horizontal movement mechanism 74 in the 2nd holding mechanism 6, and the horizontal movement mechanism ( 74) may be provided. In addition, the horizontal movement mechanism 74 may be, for example, a ball screw mechanism, or an air cylinder, without using a cam mechanism 74c, similarly to the lifting mechanism 73, or may be linear. It may be that a motor is used.

<Movement Mechanism for Cutting (Movement Mechanism for Processing)>

The moving mechanism 8 for cutting linearly moves each of the two spindle parts 42A, 42B independently in the X direction, the Y direction, and the Z direction, respectively.

Specifically, as shown in Figs. 2, 3, 9 and 10, the moving mechanism 8 for cutting includes an X-direction moving part 81 that linearly moves the spindle parts 42A and 42B in the X direction, A Y-direction moving unit 82 for linearly moving the spindle units 42A and 42B in the Y-direction and a Z-direction moving unit 83 for linearly moving the spindle units 42A and 42B in the Z-direction are provided.

The X-direction moving part 81 is common in the two cutting tables 2A, 2B, and as shown in Figs. 2 and 3 in particular, the X direction across the two cutting tables 2A, 2B. A pair of X-direction guide rails (first guide rails) 811 provided along and moving along the pair of X-direction guide rails 811, the Y-direction moving part 82 and the Z-direction movement It has a support body 812 that supports the spindle portions 42A and 42B via the portion 83. A pair of X-direction guide rails 811 are provided on the side of two tables for cutting 2A, 2B provided along the X-direction. Further, the support body 812 is, for example, gate-shaped, and has a shape extending in the Y direction. Specifically, the support body 812 has a pair of legs extending upward from the pair of X-direction guide rails 811, and a beam part (beam part) placed across the pair of legs, and the beam part It extends in the Y direction.

And the support body 812 linearly reciprocates along the X direction on a pair of X direction guide rail 811 by the ball screw mechanism 813 extending in the X direction, for example. This ball screw mechanism 813 is driven by a drive source (not shown) such as a servo motor. In addition, the support body 812 may be configured to reciprocate by another linear motion mechanism such as a linear motor.

As especially shown in FIG. 3, the Y-direction moving part 82 is Y-direction guide rail 821 provided along the Y-direction in the support body 812, and Y moving along the Y-direction guide rail 821. It has a direction slider 822. The Y-direction slider 822 is driven by, for example, a linear motor 823, and linearly reciprocates on the Y-direction guide rail 821. In this embodiment, two Y-direction sliders 822 are provided corresponding to the two spindle portions 42A and 42B. Thereby, the two spindle parts 42A, 42B can move in the Y direction independently of each other. In addition, the Y-direction slider 822 may be configured to reciprocate by another linear motion mechanism using a ball screw mechanism.

As shown in FIGS. 2 to 4 , the Z-direction moving unit 83 includes a Z-direction guide rail 831 provided along the Z-direction in each Y-direction slider 822 and the Z-direction guide rail 831 It has a Z-direction slider 832 that moves along and supports the spindle portions 42A and 42B. In other words, the Z-direction moving part 83 is provided corresponding to each spindle part 42A, 42B. The Z-direction slider 832 is driven by, for example, an eccentric cam mechanism (not shown), and linearly reciprocates on the Z-direction guide rail 831. In addition, the Z-direction slider 832 may be configured to reciprocate by another linear mechanism such as a ball screw mechanism.

As the positional relationship between the moving mechanism 8 for cutting and the transfer shaft 71 is shown in Figs. 1 and 4 , the transfer shaft 71 moves above the moving mechanism 8 for cutting. It is arranged so as to cross the instrument (8). Specifically, the transfer shaft 71 is disposed above the support 812 so as to cross the support 812, and the transfer shaft 71 and the support 812 have a positional relationship orthogonal to each other in plan view. do.

<Processed Chip Receptacle>

Further, as shown in FIG. 1 , the cutting device 100 of the present embodiment has a processing chip accommodating portion for accommodating processing chips S such as cut materials generated by cutting the sealed substrate W. (17) is further provided.

As shown in FIGS. 2 to 4 , this processing chip accommodation portion 17 is provided below the cutting tables 2A and 2B, and the upper portion surrounds the cutting tables 2A and 2B in plan view. It has a guide shooter 171 having an opening 171X and a collection container 172 for collecting processing chips S guided by the guide shooter 171. By providing the processing chip accommodating part 17 below the cutting table 2A, 2B, the recovery rate of the processing chip S can be improved.

The guide shooter 171 guides the processed chips S scattered or fallen from the cutting tables 2A and 2B to the recovery container 172 . In this embodiment, since the upper opening 171X of the guide shooter 171 is configured to surround the cutting tables 2A and 2B (see Fig. 3), it is difficult to miss the processing chip S, and the processing chip ( The recovery rate of S) can be further improved. In addition, the guide shooter 171 is provided so as to surround the rotation mechanisms 9A and 9B provided under the cutting tables 2A and 2B (see FIG. 4 ), and the rotation mechanism ( 9A, 9B) are configured to protect.

In this embodiment, although the processing chip accommodating part 17 is common to two cutting tables 2A, 2B, it may be provided correspondingly to each cutting table 2A, 2B.

The collection container 172 collects the processed chips S that passed through the guide shooter 171 by its own weight, and in this embodiment, as shown in FIG. 4 and the like, two cutting tables 2A , 2B) are provided corresponding to each. And the two collection containers 172 are arrange|positioned on the front side of the transfer shaft 71, and are comprised so that each can independently remove from the front side of the cutting device 100. With this structure, it is possible to improve maintenance such as disposal of the processing chips S. On the other hand, one collection container 172 may be provided under all the cutting tables in consideration of the size of the sealed substrate W, the size and quantity of the processing chips S, workability, and the like. It is possible to provide more than one.

In addition, the processing chip accommodating portion 17 has a separator 173 for separating cutting water and processing chips, as shown in FIG. 4 and the like. As a configuration of this separation unit 173, it is conceivable to provide a filter such as a perforated plate through which cutting water passes on the bottom surface of the collection container 172, for example. With this separator 173, the processing chip S can be recovered without storing cutting water in the collection container 172.

<First cleaning mechanism>

Moreover, as shown in FIG. 1 and FIG. 5, the cutting device 100 of this invention cleans the upper surface side (lead surface) of the some product P held by cutting table 2A, 2B A first cleaning mechanism 18 is further provided. This first cleaning mechanism 18 includes a spray nozzle 18a for spraying a cleaning liquid and/or compressed air onto the upper surfaces of a plurality of products P held on the cutting tables 2A and 2B (see Fig. 5). By this, the upper surface side of the product P is cleaned.

As shown in FIG. 5 , the first cleaning mechanism 18 is configured to be movable along the transfer shaft 71 together with the first holding mechanism 3 . Here, the first cleaning mechanism 18 is provided on a slide member 723 that slides a guide rail 721 provided on the transfer shaft 71 . Here, between the first cleaning mechanism 18 and the slide member 723, a lifting mechanism 181 for lifting and moving the first cleaning mechanism 18 in the Z direction is provided. As the lift mechanism 181, a rack and pinion mechanism, a ball screw mechanism, or an air cylinder may be used, for example.

<Second Cleaning Mechanism>

Moreover, as shown in FIG. 1, the cutting device 100 of this invention cleans the lower surface side (package surface) of the some product P held by the 2nd holding mechanism 6, the 2nd cleaning A mechanism 19 is further provided. This 2nd cleaning mechanism 19 is provided between the cutting table 2B and the inspection part 13, and the cleaning liquid and/or the lower surface of the plurality of products P held by the 2nd holding mechanism 6 are provided. Alternatively, the lower surface side of the product P is cleaned by blowing compressed air. In other words, while the second holding mechanism 6 is being moved along the transfer shaft 71, the second cleaning mechanism 19 cleans the lower surface side of the product P.

<An example of the operation of the cutting device>

Next, an example of the operation of the cutting device 100 will be described. In FIG. 9, the movement route of the 1st holding mechanism 3 in operation|movement of the cutting device 100, and the movement route of the 2nd holding mechanism 6 are shown. On the other hand, in this embodiment, the operation of the cutting device 100, for example, transport of the sealed substrate W, cutting of the sealed substrate W, inspection of the product P, replacement of a blade described later, All operations and control, such as dressing, are performed by the controller CTL (see Fig. 1).

The substrate supply unit 112 of the substrate supply mechanism 11 moves the sealed substrate W accommodated in the substrate accommodating unit 111 toward the holding position RP held by the first holding mechanism 3 . move the

Next, the transport mechanism 7 moves the first holding mechanism 3 to the holding position RP, and the first holding mechanism 3 adsorbs and holds the sealed substrate W. . After that, the transport mechanism 7 moves the first holding mechanism 3 holding the sealed substrate W to the cutting tables 2A and 2B, and the first holding mechanism 3 ) cancels the suction holding and places the sealed substrate W on the cutting tables 2A and 2B. At this time, the position of the sealed substrate W in the X direction is adjusted by the main movement mechanism 72, and the position of the Y direction of the sealed substrate W is adjusted by the horizontal movement mechanism 74. And cutting table 2A, 2B adsorbs and holds the board|substrate W which has been sealed.

Here, when the first holding mechanism 3 holding the sealed substrate W is moved to the cutting table 2B, the lifting mechanism 73 cuts the first holding mechanism 3 It is raised to a position where it does not physically interfere with the dragon moving mechanism 8 (support 812). On the other hand, when the first holding mechanism 3 holding the sealed substrate W is moved to the cutting table 2B, the support body 812 is moved from the cutting table 2B to the moving loading table 5. In the case of retracting to the side, it is not necessary to elevate the first holding mechanism 3 as described above.

In this state, the moving mechanism 8 for cutting sequentially moves the two spindle parts 42A, 42B in the X and Y directions, and the cutting tables 2A, 2B rotate, thereby sealing the bag. The finished substrate W is cut into a lattice shape and separated into individual pieces.

After cutting, the transportation mechanism 7 moves the first cleaning mechanism 18 to clean the upper surface side (lead surface) of a plurality of products P held on the cutting tables 2A and 2B. do. After this cleaning, the movement mechanism 7 for conveyance retracts the 1st holding mechanism 3 and the 1st cleaning mechanism 18 to a predetermined position.

Next, the moving mechanism 7 for conveyance moves the 2nd holding mechanism 6 to the table 2A, 2B for cutting after cutting, and the 2nd holding mechanism 6 carries out several products P Adsorption retention support. After that, the moving mechanism 7 for conveyance moves the second holding mechanism 6 holding the plurality of products P to the second cleaning mechanism 19 . In this way, the second cleaning mechanism 19 cleans the lower surface side (package surface) of the plurality of products P held by the second holding mechanism 6 .

After cleaning, the plurality of products P held by the second holding mechanism 6 are inspected on both sides by the inspecting unit 13 and the reversing mechanism 14 . After that, the moving mechanism 7 for conveyance moves the second holding mechanism 6 to the moving and loading table 5, the second holding mechanism 6 releases the suction holding mechanism, and a plurality of products. (P) is placed on the movable loading table 5. A plurality of products P placed on the movable stacking table 5 are classified into various trays 21 by a sorting mechanism 20 according to the inspection result (defective product, defective product, etc.) by the inspection unit 13. .

On the other hand, regarding the double-sided inspection, first, for example, one side of the product P is inspected in a state in which it is adsorbed and held by the second holding mechanism 6 . Next, in a state where the product P is moved and loaded from the second holding mechanism 6 to the holding table 141 of the reversing mechanism 14, and is adsorbed and held by the holding table 141 after inversion. By inspecting the other side of the product P, double-sided inspection can be performed. In addition, conveyance of the product P from the reversing mechanism 14 to the moving loading table 5 after this can be performed by moving and loading the product P from the holding table 141 to the second holding mechanism 6 . Further, the holding table 141 is configured to be movable in the X direction, and at least one of the holding table 141 or the movable loading table 5 is configured to be movable in the Z direction. By moving the upper side of the moving loading table 5, the product P can be transported to the moving loading table 5 and loaded.

<Specific configuration of substrate supply mechanism>

Below, the detailed structure of the substrate supply mechanism 11 is demonstrated.

The substrate supply mechanism 11 supplies the substrate W sealed by the first holding mechanism 3 as described above. Specifically, as shown in FIGS. 1, 10 and 11 , the substrate supply mechanism 11 includes a substrate accommodating portion 111 in which a plurality of sealed substrates W are accommodated from the outside, and the substrate accommodating portion 111 ) has a substrate supply unit 112 that moves the sealed substrate W accommodated in the holding position RP to a holding position RP where it is adsorbed and held by the first holding mechanism 3 .

As shown in FIGS. 10 and 11 , in the substrate accommodating portion 111 , an extrusion mechanism 114 for pushing a part of the sealed substrate W accommodated out of the substrate accommodating portion 111 is provided. It is provided. This extrusion mechanism 114 has a movable pushing member 114a that presses one end of the sealed substrate W, and an actuator unit 114b that moves the pushing member 114a. As the actuator unit 114b, one using a motor, one using an air cylinder, one using a solenoid, or the like can be used.

As shown in FIGS. 10 and 11 , the substrate supply unit 112 includes a receiving stage 115 for receiving the sealed substrate W from the substrate receiving unit 111 and a receiving stage ( A substrate moving unit 116 for moving the substrate W sealed by 115) and a stage moving mechanism 117 for moving the receiving stage 115 to a predetermined transfer position X2 are provided.

As shown in FIG. 10 , the receiving stage 115 of this embodiment not only receives the sealed substrate W from the substrate accommodating portion 111, but also receives the sealed substrate W from the substrate accommodating portion 111. It is configured to receive and hand over. Specifically, the receiving stage 115 includes a carrying stage 115A that receives the sealed substrate W from the substrate accommodating portion 111, and a carrying stage 115A that receives the sealed substrate W from the substrate accommodating portion 111 and hands it over. It has stage 115B for carrying out. The loading stage 115A is an adsorption stage, and can adsorb and hold the placed sealed substrate W. Moreover, the stage 115B for carrying out of this embodiment receives and passes the half-cut sealed board|substrate W. On the other hand, half-cutting is a process of forming grooves by cutting a part of the upper surface (lead surface) of the sealed substrate W.

As shown in FIGS. 11 and 12 , the sealed substrate W placed on the carrying stage 115A is heated while being pressed to the upper surface of the carrying stage 115A by the substrate heating unit 113 from the top. do. For this reason, the sheet-shaped cushioning material 115x which absorbs the impact at the time of being heated by the board|substrate heating part 113 is provided in 115 A of stages for carrying in.

Moreover, as shown in FIG. 12, the stage 115A for carrying in is provided with the positioning mechanism 118 which positions the board|substrate W which has been sealed. This positioning mechanism 118 enables one side wall 115m of a pair of side walls 115m and 115n of a carrying stage 115A to be movable relative to the other side wall 115n. By closing the gap between the sidewalls 115m and 115n, the sealed substrate W touches the other sidewall 115n and is positioned relative to the inner surface of the other sidewall 115n. On the other hand, in this embodiment, one side wall 115m is movable by the actuator 115j, and the other side wall 115n is movable by the actuator 115k. When the substrate W that has been sealed is heated by the substrate heating unit 113, the side walls 115m and 115n are retracted so as not to interfere with each other by the respective actuators 115j and 115k.

As shown in FIG. 11 , the substrate moving unit 116 includes a clip portion 116a holding the end of the sealed substrate W and an X-direction moving portion that moves the clip portion 116a in the X direction ( 116b) and a Z-direction moving portion 116c for moving the clip portion 116a in the Z-direction.

Substrate W that has been sealed from the substrate accommodating portion 111 using the extrusion mechanism 114 and the substrate moving portion 116 to the receiving stage 115 (carrying-in stage 115A and carrying-out stage 115B) The order of receiving and handing is as follows.

The sealed substrate W accommodated in the substrate accommodating portion 111 is pressed by the push member 114a of the extrusion mechanism 114, and a part of the sealed substrate W is transferred from the substrate accommodating portion 111 to the stage ( 115A) side. Then, the portion of the sealed substrate W protruding from the substrate accommodating portion 111 is held by the clip portion 116a of the substrate moving portion 116, and the clip portion 116a is held by the X-direction moving portion 116b. By moving in the X direction, the sealed substrate W is taken out from the substrate accommodating portion 111 and placed on a carrying stage 115A.

As shown in FIGS. 10 and 11 , the stage moving mechanism 117 includes a pair of moving rails 117a for moving the receiving stage 115 (carrying-in stage 115A and carrying-out stage 115B). And while moving along the moving rail 117a, it has the slide member 117b provided with the receiving stage 115. The slide member 117b linearly reciprocates along the Y direction on the pair of moving rails 117a by the ball screw mechanism 117c extending in the Y direction, for example. This ball screw mechanism 117c is driven by a drive source (not shown) such as a servo motor. In addition, the slide member 117b may be configured to reciprocate by another linear motion mechanism such as a linear motor.

The moving rail 117a is located below the transfer shaft 71, and the moving rail 117a and the transfer shaft 71 of the moving mechanism 7 for conveyance are orthogonal to each other in a planar view. In this embodiment, the transfer shaft 71 extends in the X direction, and the moving rail 117a extends in the Y direction. On the other hand, "they are orthogonal to each other in a plan view" includes not only crossing the transfer shaft 71 and the moving rail 117a perpendicularly (90°), but also substantially orthogonal. Substantially orthogonal is a state of crossing with a slight error from the vertical, for example, a state of crossing at 85° or more and 95° or less.

Moreover, since the moving rail 117a is orthogonal to the transfer shaft 71, the moving rail 117a is the X direction guide rail 811 which moves the support body 812 of the moving mechanism 8 for cutting, and become orthogonal. In other words, the moving rail 117a is parallel to the support body 812 of the moving mechanism 8 for cutting in planar view.

Here, if the peripheral structures of the transfer shaft 71 and the moving rail 117a are mentioned (explained), the substrate accommodating portion 111 and the first holding mechanism 3 are opposite to each other with respect to the transfer shaft 71. is provided in Specifically, the substrate accommodating portion 111 is provided on the rear side of the transfer shaft 71 in the Y direction, and the first holding mechanism 3 is provided on the front side of the transfer shaft 71 in the Y direction. there is.

And, as shown in FIG. 13, the stage movement mechanism 117 moves the stage 115A for carrying in to a receiving position X1 for receiving the sealed substrate W from the substrate accommodating part 111, and the first It moves linearly between the conveyance positions X2 where the board|substrate W which has been sealed by the holding mechanism 3 is held. The receiving position X1 is located on the rear side of the transfer shaft 71 in the Y-axis direction, and the transfer position X2 is located on the front side of the transfer shaft 71 in the Y-axis direction. Moreover, the board|substrate W which has been sealed on the receiving stage 115 (carrying-in stage 115A) in the conveyance position X2 is located in the holding position RP.

Further, the stage moving mechanism 117 moves the carrying stage 115A to a heating position X3 for heating the placed sealed substrate W by the substrate heating unit 113 (see FIG. 13 ). ). Heating position X3 of this embodiment is set to the rear side in the Y direction rather than receiving position X1. At this heating position X3, the substrate heating unit 113 heats the sealed substrate W by contacting the upper surface of the sealed substrate W placed on the carrying stage 115A.

Moreover, as shown in FIG. 14, the stage moving mechanism 117 moves the stage 115B for carrying out to the conveyance position X2. At this position, the half-cut and sealed substrate W is conveyed by the first holding mechanism 3 to the carrying out stage 115B. Moreover, the stage moving mechanism 117 moves the stage 115B for carrying out to the receiving position X1. In this position, the board|substrate W which has been sealed in the board|substrate accommodating part 111 is accommodated by the board|substrate moving part 116 from the stage 115B for carrying out. On the other hand, although the half-cut sealed substrate W is accommodated in the receiving position X1, a receiving position for accommodating the sealed substrate W is separately set, and the sealed substrate W is received at the receiving position. You may accommodate it in the board|substrate accommodating part 111.

＜Blade replacement mechanism＞

As shown in FIG. 10 and FIG. 15, the cutting device 100 of this embodiment has the blade exchange mechanism 24 which automatically replaces blade 41A, 41B. Specifically, the blade exchange mechanism 24 is capable of exchanging the blades 41A and 41B from the two spindle portions 42A and 42B, respectively, in this embodiment. Then, the blade exchange mechanism 24 accommodates the blades 41A, 41B in the blade accommodating portion 25 while holding the removed blades 41A, 41B, and replaces the new blades 41A, 41B. ) is held, conveyed to the spindle portions 42A and 42B, and mounted. On the other hand, the blade exchange mechanism 24 corresponds to a machining tool exchange mechanism.

Here, if the structure of the cutting mechanism 4 is explained, as shown in FIG. 16, blade 41A, 41B, the spindle part 42A, 42B which rotates the blade 41A, 41B, and blade 41A , 41B) to the spindle portions 42A, 42B in a detachable manner and has a pair of flanges 43 and 44. The pair of flanges 43 and 44 are fixed to the spindle parts 42A and 42B and can be detached from the inner flange 43 closer to the spindle parts 42A and 42B and the spindle parts 42A and 42B. It is composed of an outer flange 44 on the far side from the spindle portions 42A and 42B. The outer flange 44 is fixed by a detachable member 45, such as a nut, in a state of being attached to the central shaft portion of the inner flange 43, for example. By this detachable member 45, the blades 41A, 41B can be detached from the spindle portions 42A, 42B.

And, as shown in FIGS. 10 and 15 , the blade exchange mechanism 24 includes an adsorption arm 241 that adsorbs and holds the blades 41A and 41B and the outer flange 44, and the adsorption arm 241. It is provided with an arm movement mechanism 242 that relatively moves the with respect to the cutting mechanism 4. On the other hand, the arm moving mechanism corresponds to the holding unit moving mechanism.

As shown in FIG. 17, the adsorption arm 241 is a first adsorption unit (processing tool holding unit) that adsorbs and holds one surface (surface on the outer flange 44 side) of the blades 41A and 41B ( 241a) and the second suction portion 241b located inside the first suction portion 241a and adsorbing and holding the outer surface of the outer flange 44 (surface opposite to the inner flange 43). is provided. Further, the adsorption arm 241 is located inside the second adsorption portion 241b, and engages the detachable member 45 (here, a nut) of the spindle portions 42A and 42B to detach the detachable member 45. A detachable member rotation unit 241c is provided. On the other hand, the first adsorption portion 241a and the second adsorption portion 241b are connected to a suction pump (not shown) provided outside the adsorption arm 241 . In addition, the detachable member rotation unit 241c is configured using a rotating mechanism (not shown) such as a motor for rotating the detachable member 45 .

In FIGS. 16 and 17 , the outer side adsorption surface 44a of the outer flange 44 adsorbed by the second adsorption portion 241b has a tapered shape, but the structure shown in FIG. 18 may be used. The outer flange 44 shown in FIG. 18 is a flat plane in which the outer suction surface 44a sucked by the second suction portion 241b is orthogonal to the rotational axes of the spindle portions 42A and 42B. On the other hand, the configuration of the second adsorbing portion 241b has a shape corresponding to this flat plane, and is different from that in FIG. 17 . With this configuration, the outer flange 44 can be stably adsorbed and held by the second adsorption portion 241b of the adsorption arm 241, and when the adsorption arm 241 is moved by the arm moving mechanism 242 Thus, the possibility of the outer flange 44 falling can be reduced.

As shown in FIG. 15 , the arm movement mechanism 242 includes a Y-direction movement mechanism 242a that moves the suction arm 241 in the Y direction and an X-direction movement mechanism that moves the suction arm 241 in the X direction. (242b) is provided. On the other hand, the arm moving mechanism 242 may have a mechanism for moving the adsorption arm 241 in the Z direction.

The Y-direction moving mechanism 242a is configured using the moving rail 117a of the stage moving mechanism 117 described above, and has a Y-direction slider 242a1 that slides along the moving rail 117a. . The Y-direction slider 242a1 is driven by a linear motor, for example, and linearly reciprocates on the moving rail 117a. On the other hand, the Y-direction slider 242a1 may be configured to reciprocate by another linear motion mechanism using a ball screw mechanism.

The X-direction moving mechanism 242b includes an X-direction guide rail 242b2 provided along the X-direction in the Y-direction slider 242a1 and an X-direction slider 242b1 that moves along the X-direction guide rail 242b2. Have. The X-direction slider 242b1 is driven by a linear motor, for example, and linearly reciprocates on the X-direction guide rail 242b2. On the other hand, the X-direction slider 242b1 may be configured to reciprocate by another linear motion mechanism using a ball screw mechanism.

By constituting the blade exchange mechanism 24 in this way, the movement direction of the blade exchange mechanism 24 (the direction along the movement rail 117a) and the movement of the support body 812 in the movement mechanism 83 for processing Directions (direction along the X-direction guide rail 811) are orthogonal to each other in plan view. In other words, the suction arm 241 of the blade exchange mechanism 24 moves along the longitudinal direction of the support body 812 . On the other hand, "they are orthogonal to each other in plan view" includes not only crossing the moving rail 117a and the X-direction guide rail 811 perpendicularly (90°), but also substantially orthogonal. Substantially orthogonal is a state of crossing with a slight error from the vertical, for example, a state of crossing at 85° or more and 95° or less.

Moreover, when exchanging blade 41A, 41B, as shown in FIG. 19, the moving mechanism 83 for processing moves the cutting mechanism 4 to a predetermined exchange position. Specifically, while the X-direction moving part 81 moves the support body 812 to the moving rail 117a side (blade exchange mechanism 24 side), the Y-direction moving part 82 (see Fig. 2) By moving the temporary cutting mechanism 4 along the support 812, the cutting mechanism 4 is moved to a predetermined exchange position.

Then, the blade exchange mechanism 24 exchanges the blades 41A, 41B of the cutting mechanism 4 at the predetermined exchange position. Specifically, the arm moving mechanism 242 moves the suction arm 241 along the moving rail 117a to remove (separate) the blades 41A and 41B of the cutting mechanism 4 in the exchange position. Further, the arm moving mechanism 242 moves the suction arm 241 along the moving rail 117a, so that the blade exchange mechanism 24 accommodates the removed blades 41A and 41B in the blade accommodating portion 25, Then, the new blades 41A and 41B are taken out of the blade accommodating portion 25 and mounted on the cutting mechanism 4 in the replacement position. When replacing the blades 41A, 41B of the two cutting mechanisms 4, the suction arm 241 is rotated 180 degrees by a rotation mechanism (not shown) to perform the same operation.

On the other hand, when the blade exchange mechanism 24 moves along the moving rail 117a, the slide member 117b provided with the receiving stage 115 is retracted to a position that does not obstruct the movement of the blade exchange mechanism 24. (See Figure 19). Conversely, when the slide member 117b provided with the receiving stage 115 moves along the moving rail 117a, the blade exchange mechanism 24 is retracted to a position that does not obstruct the movement of the slide member 117b ( 13 and 14).

As shown in FIG. 10, the cutting device 100 of this embodiment includes the dressing member accommodating portion 26 for accommodating the dressing member DP for dressing the blades 41A and 41B, and the dressing member DP. has a dressing table 27 on which is placed and the blades 41A and 41B are dressed.

The dressing member accommodating part 26 accommodates the new dressing member DP and the old dressing member DP, respectively. The dressing member accommodating part 26 of this embodiment is provided on the moving rail 117a, and is specifically, provided on the Y-direction slider 242a1 which moves the moving rail 117a.

Table 27 for dressing of this embodiment is provided between two tables 2A for cutting, 2B in the X direction. The dressing member DP is conveyed to this table 27 for dressing by the 1st holding mechanism 3 and the moving mechanism 7 for conveyance. And the dressing table 27 adsorbs and holds the conveyed dressing member DP. On the other hand, the 1st holding mechanism 3 is provided with the dressing member adsorption part (dressing member holding part) 32 (refer FIG. 6 and FIG. 10) for adsorbing and holding the dressing member DP. In the state where the dressing member DP is held by the dressing table 27, the moving mechanism 8 for cutting moves the cutting mechanism 4 to the dressing table 27, and the cutting mechanism 4 Blades 41A and 41B are dressed. After dressing, the dressing member DP is conveyed from the table 27 for dressing to the dressing member accommodating part 26 by the 1st holding mechanism 3 and the moving mechanism 7 for conveyance.

Next, a case in which the sealed substrate W is full cut (individualized) and a case in which the half cut (grooving) is described with reference to FIG. 20 . On the other hand, the full cut is a process of singling the sealed substrate W by cutting it.

(1) In the case of full cut (individualization) (see Fig. 20 (a))

The sealed substrates in the substrate accommodating portion 111 are received and delivered to the loading stage 115A of the receiving stage 115 using the extruding mechanism 114 and the substrate moving portion 116 .

The carrying stage 115A is moved to the transfer position by the stage moving mechanism 117, the sealed substrate W is held by the first holding mechanism 3, and the cutting tables 2A, 2B (reporting process).

And the board|substrate W which has been sealed by cutting table 2A, 2B is fully cut (cut) and separated into pieces (full-cut process).

The product P is held by the second conveyance mechanism 6 and conveyed to the holding stage 141 of the inspection unit 14 or the movable loading stage 5 (carrying out step). Subsequent operations are the same as those described above <an example of the operation of the cutting device>.

(2) In the case of half-cutting (grooving) (see Fig. 20 (b))

The board|substrate W which has been sealed in the board|substrate accommodating part 111 to be half-cut is received by the extrusion mechanism 114 and the board|substrate moving part 116, and it receives it to the stage 115A for carrying in of the receiving stage 115, and hands it over. give.

The stage 115A for carrying in is moved to the conveying position X2, the sealed substrate W is held by the first holding mechanism 3, and conveyed to the cutting tables 2A, 2B (carrying in process).

And the board|substrate W which has been sealed by cutting table 2A, 2B is half-cut (groove-processed) (half-cut process).

The half-cut and sealed board|substrate W is held by the 1st holding mechanism 3, and is conveyed to the carrying out stage 115B in the carrying position X2 (carrying out process).

The stage 115B for carrying out, on which the half-cut and sealed substrates W are received and handed over, is moved to a receiving position (receiving position X1) by the stage moving mechanism 117 . Then, the substrate moving unit 116 accommodates the half-cut sealed substrate W in the substrate receiving unit 111 (accommodating process).

<Effects of the present embodiment>

According to the cutting device 100 of this embodiment, the moving mechanism 8 for cutting moves the cutting mechanism 4 to each of the first direction (X direction) and the second direction (Y direction) orthogonal to each other in a horizontal plane. Since it is moved, it is possible to process the sealed substrate W without moving the cutting tables 2A and 2B in the X and Y directions. For this reason, while the moving mechanism which moves table 2A for cutting, 2B can be made unnecessary, and while simplifying an apparatus structure, occupied space can be reduced.

In addition, the moving direction (X direction) of the support 812 that supports the cutting mechanism 4 so as to be movable in the Y direction and the arm moving mechanism that moves the adsorption arm 241 (first adsorption portion 241a) ( 242) are orthogonal to each other, moving the support 812 in the X direction to bring the cutting mechanism 4 closer to the blade exchange mechanism 24, and the arm moving mechanism 242 The blades 41A and 41B of the cutting mechanism 4 can be exchanged by moving the suction arm 241 (first suction portion 241a) in the Y direction. Thus, in this embodiment, the moving mechanism 8 for cutting which moves the cutting mechanism 4 and the arm moving mechanism 242 of the blade exchange mechanism 24 can be optimally arranged, and the cutting device 100 occupied space can be reduced.

Further, the extension direction (X direction) of the transfer shaft 71 and the movement direction (Y direction) of the arm moving mechanism 242 are orthogonal to each other in a planar view, and the extension direction of the transfer shaft and the movement direction of the support body are in a planar view. Since they are parallel to each other, it is possible to optimally arrange the cutting moving mechanism 8, the blade changing mechanism 24 and the transfer shaft 71, thereby simplifying the device configuration and reducing the occupied space. there is.

In this embodiment, since the 1st holding mechanism 3 holds dressing member DP, there is no need to provide a dressing member holding mechanism separately, and an apparatus structure can be simplified. Moreover, since the table 27 for dressing is provided between table 2A, 2B for cutting in the X direction, the space occupied by the cutting device 100 can be reduced.

Moreover, in this embodiment, the space occupied by the cutting device 100 is reduced by setting it as the structure which moves the receiving stage 115 in the Y direction by the moving rail 117a, and moves it to the predetermined conveyance position X2. can be reduced Specifically, since the receiving stage 115 is moved in the Y direction by the moving rail 117a, the transfer shafts 71 that move the first holding mechanism 3 are orthogonal to each other in a planar view, and cutting The occupied space of the device 100 can be reduced. Here, since the arm movement mechanism 242 is constituted using the movement rail 117a, the space occupied by the cutting device 100 can be reduced while simplifying the device configuration. Moreover, since the dressing member accommodation part 26 is comprised so that a movement is possible along the movement rail 117a, while simplifying an apparatus structure, the space occupied by the cutting device 100 can be reduced.

<Other modified embodiments>

On the other hand, the present invention is not limited to the above embodiment.

For example, in the above embodiment, the blade exchange mechanism 24 is made movable by the moving rail 117a of the stage moving mechanism 117, but it may be configured to be movable along another rail.

Although the cutting device 100 of the said embodiment performed both (both) of a full-cut operation|movement and a half-cut operation|movement, it may perform only a full-cut operation|movement. In this case, the receiving stage 115 only needs to be the carrying stage 115A. Moreover, it may be to perform only a half-cut operation|movement. In this case, the structure for carrying out the product P like the 2nd holding mechanism 6 etc. is not needed.

In the above embodiment, the twin-spindle configuration cutting device has been described as a twin-cut table method, but it is not limited to this, and a single-spindle configuration cutting device as a single-cut table method or a twin-spindle configuration as a single cut table method may be a cutting device or the like.

Further, the movable loading table 5 of the above embodiment is an index table temporarily placed before being divided into various trays 21, but the movable loading table 5 is replaced by the holding table 141 of the reversing mechanism 14. can be done with

Further, in the above embodiment, the structure is divided into the tray 21 from the movable loading table 5, but the structure in which the product P is conveyed and attached by the adhesive tape disposed inside the frame member may be used. .

In addition, since a plurality of cam rack elements constituting the transfer shaft 71 can be configured by connecting them, for example, the cutting device (processing device) 100 is placed between the second cleaning mechanism 19 and the inspection unit 13. It can be separated and connected (detachable) module configuration. In this case, for example, between the module on the second cleaning mechanism 19 side and the module on the inspection unit 13 side, a module that performs a different type of inspection from that performed by the inspection unit 13 can be added. . On the other hand, in addition to the configuration exemplified here, the cutting device (processing device) 100 may be detached and connected (detachable) from anywhere, and the module to be added may be a module with various functions other than inspection.

Further, the machining apparatus of the present invention may perform processing other than cutting, and may perform other machining such as cutting and grinding, for example.

In addition, the present invention is not limited to the above embodiment, and it goes without saying that various modifications are possible within a range that does not deviate (deviate) from the gist thereof.

industrial applicability

ADVANTAGE OF THE INVENTION According to this invention, while simplifying the apparatus structure of the processing apparatus which has a blade exchange mechanism, it is possible to reduce the space occupied.

100... Cutting device (processing device)
W… Encapsulated board (processing object)
P… Product (processed product)
2A, 2B... Table for cutting (processing table)
3... First holding mechanism
4… Cutting mechanism (processing mechanism)
6... Second holding mechanism
7... transport mechanism
71... transfer shaft
8… Moving mechanism for cutting (moving mechanism for processing)
811... X-direction guide rail (first guide rail)
812... support
115... receiving stage
117a... moving rail
117... stage moving mechanism
24... Blade exchange mechanism (processing tool exchange mechanism)
241a... 1st suction part (processing tool holding part)
242... Arm moving mechanism (holding unit moving mechanism)
DP… no dressing
32... Dressing member holding part
26... Dressing member receiving part
27... dressing table

Claims (9)

A processing table on which the object to be processed is processed by the processing mechanism;
A processing movement mechanism for moving the processing mechanism in a first direction and a second direction orthogonal to each other in a horizontal plane;
A processing tool exchange mechanism for exchanging a processing tool of the processing mechanism is provided;
The moving mechanism for processing moves along a pair of first guide rails provided along the first direction with the processing table interposed therebetween, and along the pair of first guide rails, along the second direction. A support for movably supporting the processing mechanism,
The machining device, wherein the machining tool exchange mechanism includes a machining tool holding portion that is held for exchanging the machining tool, and a holding portion moving mechanism that moves the machining tool holding portion in the second direction. According to claim 1,
a first holding mechanism for holding the object to be processed in order to convey it to the processing table;
A processing apparatus comprising: a conveying movement mechanism having a transfer shaft for moving the first holding mechanism along the first direction. According to claim 2,
The processing apparatus wherein the first holding mechanism has a dressing member holding portion holding a dressing member for dressing the processing tool. According to any one of claims 1 to 3,
A plurality of the processing tables are provided along the first direction. According to any one of claims 1 to 4,
Further comprising a dressing table for dressing the processing tool using a dressing member,
The said dressing table is provided between the said processing tables, The processing apparatus. According to any one of claims 1 to 5,
A processing object accommodating portion for accommodating the processing object;
a receiving stage for receiving the object to be processed from the object receiving unit;
a stage moving mechanism having a moving rail for moving the receiving stage along the second direction and moving the receiving stage to a transfer position;
The holding unit moving mechanism is movable along the moving rail, the processing device. According to claim 6,
Further comprising a dressing member accommodating portion for accommodating a dressing member for dressing the processing tool,
The said dressing member accommodating part is provided movably along the said moving rail, The processing apparatus. According to any one of claims 1 to 7,
The processing mechanism has a blade as the processing tool, a spindle unit for rotating the blade, and a flange for detachably fixing the blade to the spindle unit,
The machining tool exchange mechanism includes a first adsorption unit that is the processing tool holding unit that adsorbs and holds the blade, and a second adsorption unit that is provided separately from the first adsorption unit and adsorbs and holds the flange. ,
A suction surface adsorbed to the second suction unit in the flange is a plane orthogonal to the axis of rotation of the spindle unit. A method for producing a processed product using the processing device according to any one of claims 1 to 8.