KR20230107048A - 적층형 전자 부품 - Google Patents

적층형 전자 부품 Download PDF

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Publication number
KR20230107048A
KR20230107048A KR1020220002964A KR20220002964A KR20230107048A KR 20230107048 A KR20230107048 A KR 20230107048A KR 1020220002964 A KR1020220002964 A KR 1020220002964A KR 20220002964 A KR20220002964 A KR 20220002964A KR 20230107048 A KR20230107048 A KR 20230107048A
Authority
KR
South Korea
Prior art keywords
disposed
electronic components
stacked electronic
band
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020220002964A
Other languages
English (en)
Korean (ko)
Inventor
최형종
이유정
이충열
원광연
안소정
이강하
성우경
박명준
이종호
Original Assignee
삼성전기주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전기주식회사 filed Critical 삼성전기주식회사
Priority to KR1020220002964A priority Critical patent/KR20230107048A/ko
Priority to US17/972,722 priority patent/US12354803B2/en
Priority to JP2022178062A priority patent/JP2023101384A/ja
Priority to CN202310012932.7A priority patent/CN116417261A/zh
Publication of KR20230107048A publication Critical patent/KR20230107048A/ko
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/018Dielectrics
    • H01G4/06Solid dielectrics
    • H01G4/08Inorganic dielectrics
    • H01G4/12Ceramic dielectrics
    • H01G4/1209Ceramic dielectrics characterised by the ceramic dielectric material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02Mountings
    • H01G2/06Mountings specially adapted for mounting on a printed-circuit support
    • H01G2/065Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/005Electrodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/005Electrodes
    • H01G4/012Form of non-self-supporting electrodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/018Dielectrics
    • H01G4/06Solid dielectrics
    • H01G4/08Inorganic dielectrics
    • H01G4/12Ceramic dielectrics
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/224Housing; Encapsulation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/228Terminals
    • H01G4/232Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/30Stacked capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/018Dielectrics
    • H01G4/06Solid dielectrics
    • H01G4/08Inorganic dielectrics
    • H01G4/12Ceramic dielectrics
    • H01G4/1209Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1218Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
    • H01G4/1227Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/228Terminals
    • H01G4/232Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/13Energy storage using capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
KR1020220002964A 2022-01-07 2022-01-07 적층형 전자 부품 Pending KR20230107048A (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020220002964A KR20230107048A (ko) 2022-01-07 2022-01-07 적층형 전자 부품
US17/972,722 US12354803B2 (en) 2022-01-07 2022-10-25 Multilayer electronic component having structure for improved adhesion force and moisture protection
JP2022178062A JP2023101384A (ja) 2022-01-07 2022-11-07 積層型電子部品
CN202310012932.7A CN116417261A (zh) 2022-01-07 2023-01-05 多层电子组件

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020220002964A KR20230107048A (ko) 2022-01-07 2022-01-07 적층형 전자 부품

Publications (1)

Publication Number Publication Date
KR20230107048A true KR20230107048A (ko) 2023-07-14

Family

ID=87057170

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020220002964A Pending KR20230107048A (ko) 2022-01-07 2022-01-07 적층형 전자 부품

Country Status (4)

Country Link
US (1) US12354803B2 (https=)
JP (1) JP2023101384A (https=)
KR (1) KR20230107048A (https=)
CN (1) CN116417261A (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016178219A (ja) 2015-03-20 2016-10-06 株式会社村田製作所 電子部品およびその製造方法

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4479747B2 (ja) * 2007-05-30 2010-06-09 Tdk株式会社 積層コンデンサ
JP4835686B2 (ja) * 2008-12-22 2011-12-14 Tdk株式会社 積層コンデンサ
KR101422926B1 (ko) 2012-10-26 2014-07-23 삼성전기주식회사 적층 칩 전자부품 및 그 실장 기판
JP5920303B2 (ja) * 2013-09-25 2016-05-18 株式会社村田製作所 電子部品およびその製造方法
JP5920304B2 (ja) * 2013-09-25 2016-05-18 株式会社村田製作所 電子部品およびその製造方法
JP6156345B2 (ja) * 2014-12-10 2017-07-05 株式会社村田製作所 電子部品及びその製造方法
JP6421138B2 (ja) * 2016-03-25 2018-11-07 太陽誘電株式会社 積層セラミックコンデンサ
KR101883061B1 (ko) * 2016-09-08 2018-07-27 삼성전기주식회사 적층 세라믹 전자부품 및 그 제조방법
JP2018046131A (ja) * 2016-09-14 2018-03-22 太陽誘電株式会社 積層セラミックコンデンサ
KR102715894B1 (ko) 2016-11-21 2024-10-11 삼성전기주식회사 커패시터 및 그 제조 방법
JP7019946B2 (ja) * 2016-12-05 2022-02-16 株式会社村田製作所 積層コンデンサ内蔵基板
KR101992450B1 (ko) * 2017-08-23 2019-06-25 삼성전기주식회사 커패시터 부품 및 그 제조 방법
JP7017893B2 (ja) * 2017-09-25 2022-02-09 太陽誘電株式会社 積層セラミックコンデンサ
KR102620541B1 (ko) * 2018-08-22 2024-01-03 삼성전기주식회사 커패시터 부품
JP7221616B2 (ja) * 2018-08-27 2023-02-14 太陽誘電株式会社 セラミック電子部品、セラミック電子部品の製造方法および電子部品実装回路基板
KR102142515B1 (ko) * 2018-10-17 2020-08-07 삼성전기주식회사 전자 부품
JP2020088191A (ja) * 2018-11-27 2020-06-04 株式会社村田製作所 積層セラミック電子部品
JP7275951B2 (ja) * 2019-07-16 2023-05-18 株式会社村田製作所 積層セラミックコンデンサ
JP7115461B2 (ja) * 2019-12-12 2022-08-09 株式会社村田製作所 積層セラミックコンデンサ
JP7522585B2 (ja) * 2020-06-01 2024-07-25 太陽誘電株式会社 電子部品、回路基板および電子部品の製造方法
JP2022142213A (ja) * 2021-03-16 2022-09-30 太陽誘電株式会社 セラミック電子部品、実装基板およびセラミック電子部品の製造方法
JP2022142214A (ja) * 2021-03-16 2022-09-30 太陽誘電株式会社 セラミック電子部品、実装基板およびセラミック電子部品の製造方法
JP2022142212A (ja) * 2021-03-16 2022-09-30 太陽誘電株式会社 セラミック電子部品、実装基板およびセラミック電子部品の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016178219A (ja) 2015-03-20 2016-10-06 株式会社村田製作所 電子部品およびその製造方法

Also Published As

Publication number Publication date
JP2023101384A (ja) 2023-07-20
CN116417261A (zh) 2023-07-11
US12354803B2 (en) 2025-07-08
US20230223195A1 (en) 2023-07-13

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