KR20230103096A - 적층형 전자 부품 - Google Patents

적층형 전자 부품 Download PDF

Info

Publication number
KR20230103096A
KR20230103096A KR1020210193707A KR20210193707A KR20230103096A KR 20230103096 A KR20230103096 A KR 20230103096A KR 1020210193707 A KR1020210193707 A KR 1020210193707A KR 20210193707 A KR20210193707 A KR 20210193707A KR 20230103096 A KR20230103096 A KR 20230103096A
Authority
KR
South Korea
Prior art keywords
disposed
electronic components
stacked electronic
insulating layer
average size
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020210193707A
Other languages
English (en)
Korean (ko)
Inventor
최소은
이강하
강범석
박진수
박윤아
Original Assignee
삼성전기주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전기주식회사 filed Critical 삼성전기주식회사
Priority to KR1020210193707A priority Critical patent/KR20230103096A/ko
Priority to US17/952,511 priority patent/US12148571B2/en
Priority to JP2022160633A priority patent/JP2023099436A/ja
Priority to CN202211658860.5A priority patent/CN116387027A/zh
Publication of KR20230103096A publication Critical patent/KR20230103096A/ko
Priority to KR1020240182886A priority patent/KR20250002039A/ko
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
    • H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H01G4/0085—Fried electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/224—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/13—Energy storage using capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
  • Coils Or Transformers For Communication (AREA)
KR1020210193707A 2021-12-31 2021-12-31 적층형 전자 부품 Pending KR20230103096A (ko)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020210193707A KR20230103096A (ko) 2021-12-31 2021-12-31 적층형 전자 부품
US17/952,511 US12148571B2 (en) 2021-12-31 2022-09-26 Mutilayer electronic component
JP2022160633A JP2023099436A (ja) 2021-12-31 2022-10-05 積層型電子部品
CN202211658860.5A CN116387027A (zh) 2021-12-31 2022-12-22 多层电子组件
KR1020240182886A KR20250002039A (ko) 2021-12-31 2024-12-10 적층형 전자 부품

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020210193707A KR20230103096A (ko) 2021-12-31 2021-12-31 적층형 전자 부품

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020240182886A Division KR20250002039A (ko) 2021-12-31 2024-12-10 적층형 전자 부품

Publications (1)

Publication Number Publication Date
KR20230103096A true KR20230103096A (ko) 2023-07-07

Family

ID=86962104

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020210193707A Pending KR20230103096A (ko) 2021-12-31 2021-12-31 적층형 전자 부품
KR1020240182886A Pending KR20250002039A (ko) 2021-12-31 2024-12-10 적층형 전자 부품

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020240182886A Pending KR20250002039A (ko) 2021-12-31 2024-12-10 적층형 전자 부품

Country Status (4)

Country Link
US (1) US12148571B2 (https=)
JP (1) JP2023099436A (https=)
KR (2) KR20230103096A (https=)
CN (1) CN116387027A (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102881004B1 (ko) * 2021-11-11 2025-11-04 삼성전기주식회사 복합　전자부품

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004037588A1 (de) 2004-08-03 2006-02-23 Epcos Ag Elektrisches Bauelement und Verfahren zur Herstellung eines elektrischen Bauelements
CN101346310B (zh) * 2005-12-27 2012-01-25 株式会社村田制作所 镁橄榄石粉末的制造方法、镁橄榄石粉末、镁橄榄石烧结体、绝缘体陶瓷组合物以及层叠陶瓷电子器件
JP2013026392A (ja) * 2011-07-20 2013-02-04 Tdk Corp 電子部品及び電子部品の製造方法
JP5920303B2 (ja) * 2013-09-25 2016-05-18 株式会社村田製作所 電子部品およびその製造方法
JP6315403B2 (ja) 2013-11-29 2018-04-25 日本電気硝子株式会社 粉末材料及び粉末材料ペースト
KR101641574B1 (ko) * 2014-02-03 2016-07-22 삼성전기주식회사 기판 내장용 적층 세라믹 전자부품, 그 제조방법 및 적층 세라믹 전자부품 내장형 인쇄회로기판
US9390858B2 (en) * 2014-04-03 2016-07-12 Murata Manufacturing Co., Ltd. Electronic component, method of manufacturing the same, and mount structure of electronic component
JP6156345B2 (ja) 2014-12-10 2017-07-05 株式会社村田製作所 電子部品及びその製造方法
JP6592923B2 (ja) 2015-03-20 2019-10-23 株式会社村田製作所 電子部品およびその製造方法
JP6395322B2 (ja) * 2015-12-01 2018-09-26 太陽誘電株式会社 電子部品及びその製造方法、並びに回路基板
JP6405329B2 (ja) * 2016-02-26 2018-10-17 太陽誘電株式会社 積層セラミックコンデンサ
JP6512139B2 (ja) * 2016-03-04 2019-05-15 株式会社村田製作所 電子部品の実装構造及びその電子部品の製造方法
JP7017893B2 (ja) * 2017-09-25 2022-02-09 太陽誘電株式会社 積層セラミックコンデンサ
US10770232B2 (en) * 2017-09-29 2020-09-08 Samsung Electro-Mechanics Co., Ltd. Multilayer electronic component and method of manufacturing the same
WO2019073762A1 (ja) 2017-10-11 2019-04-18 パナソニックＩｐマネジメント株式会社 積層電子部品の製造方法
JP6806035B2 (ja) * 2017-10-31 2021-01-06 株式会社村田製作所 積層セラミックコンデンサ
JP7241472B2 (ja) * 2018-06-01 2023-03-17 太陽誘電株式会社 積層セラミックコンデンサおよびその製造方法

Also Published As

Publication number Publication date
US20230215638A1 (en) 2023-07-06
CN116387027A (zh) 2023-07-04
KR20250002039A (ko) 2025-01-07
JP2023099436A (ja) 2023-07-13
US12148571B2 (en) 2024-11-19

Similar Documents

Publication Publication Date Title
KR20250002039A (ko) 적층형 전자 부품
KR20250009006A (ko) 적층형 전자 부품
KR20250009563A (ko) 적층형 전자 부품
KR20250013273A (ko) 적층형 전자 부품
KR20250012696A (ko) 적층형 전자 부품
KR20250009005A (ko) 적층형 전자 부품
KR20250012185A (ko) 적층형 전자 부품
KR20250010733A (ko) 적층형 전자 부품
KR20230120835A (ko) 적층형 전자 부품 및 그 제조방법
KR20230107048A (ko) 적층형 전자 부품
US12255025B2 (en) Multilayer electronic component
KR20230103059A (ko) 적층형 전자 부품
KR20230103352A (ko) 적층형 전자 부품
KR20230103546A (ko) 적층형 전자 부품
KR20230114068A (ko) 적층형 전자 부품
KR20230103547A (ko) 적층형 전자 부품

Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20211231

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20241126

Comment text: Request for Examination of Application