KR20230066345A - 중합체 조성물, 바니시, 및 폴리이미드 필름 - Google Patents

중합체 조성물, 바니시, 및 폴리이미드 필름 Download PDF

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Publication number
KR20230066345A
KR20230066345A KR1020237007962A KR20237007962A KR20230066345A KR 20230066345 A KR20230066345 A KR 20230066345A KR 1020237007962 A KR1020237007962 A KR 1020237007962A KR 20237007962 A KR20237007962 A KR 20237007962A KR 20230066345 A KR20230066345 A KR 20230066345A
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South Korea
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group
formula
polymer
compound
structural unit
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KR1020237007962A
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English (en)
Korean (ko)
Inventor
요헤이 아비코
아오이 다이토
켄타로 이시이
타카히로 무라야
Original Assignee
미쯔비시 가스 케미칼 컴파니, 인코포레이티드
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Publication of KR20230066345A publication Critical patent/KR20230066345A/ko
Pending legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1039Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18Manufacture of films or sheets
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/49Phosphorus-containing compounds
    • C08K5/51Phosphorus bound to oxygen
    • C08K5/52Phosphorus bound to oxygen only
    • C08K5/521Esters of phosphoric acids, e.g. of H3PO4
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
KR1020237007962A 2020-09-10 2021-09-06 중합체 조성물, 바니시, 및 폴리이미드 필름 Pending KR20230066345A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2020-152368 2020-09-10
JP2020152368 2020-09-10
PCT/JP2021/032709 WO2022054765A1 (ja) 2020-09-10 2021-09-06 重合体組成物、ワニス、及びポリイミドフィルム

Publications (1)

Publication Number Publication Date
KR20230066345A true KR20230066345A (ko) 2023-05-15

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Family Applications (1)

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KR1020237007962A Pending KR20230066345A (ko) 2020-09-10 2021-09-06 중합체 조성물, 바니시, 및 폴리이미드 필름

Country Status (4)

Country Link
JP (1) JPWO2022054765A1 (enrdf_load_stackoverflow)
KR (1) KR20230066345A (enrdf_load_stackoverflow)
CN (1) CN116057109B (enrdf_load_stackoverflow)
WO (1) WO2022054765A1 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2022220286A1 (enrdf_load_stackoverflow) * 2021-04-16 2022-10-20

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015080139A1 (ja) 2013-11-27 2015-06-04 宇部興産株式会社 ポリイミド前駆体組成物、ポリイミドの製造方法、ポリイミド、ポリイミドフィルム、及び基板
WO2016121817A1 (ja) 2015-01-29 2016-08-04 宇部興産株式会社 ポリイミド前駆体組成物およびそれを用いた絶縁被覆層の製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102976983B (zh) * 2012-10-25 2015-10-21 华中科技大学 一种砜基含氟二胺化合物和聚酰亚胺薄膜材料及其制法
JP6456293B2 (ja) * 2013-09-30 2019-01-23 株式会社ネオス 親水撥油性付与剤およびこれを含有する組成物
KR102463845B1 (ko) * 2015-12-24 2022-11-04 주식회사 두산 접착력이 향상된 폴리아믹산 조성물 및 이를 포함하는 폴리이미드 필름
JP6672987B2 (ja) * 2016-04-21 2020-03-25 三菱エンジニアリングプラスチックス株式会社 熱可塑性樹脂組成物及びその成形品
KR102376154B1 (ko) * 2016-08-03 2022-03-18 닛산 가가쿠 가부시키가이샤 박리층 형성용 조성물
KR102471861B1 (ko) * 2017-12-22 2022-11-29 주식회사 두산 폴리아믹산 용액 및 이를 이용한 투명 폴리이미드 수지 필름
KR102730124B1 (ko) * 2018-03-28 2024-11-15 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 폴리이미드 수지, 폴리이미드 바니시 및 폴리이미드 필름
JP7375318B2 (ja) * 2018-05-16 2023-11-08 東レ株式会社 ポリイミド前駆体樹脂組成物、ポリイミド樹脂組成物およびその膜状物、それを含む積層体、ならびにフレキシブルデバイス
WO2020110947A1 (ja) * 2018-11-28 2020-06-04 三菱瓦斯化学株式会社 ポリイミド樹脂、ポリイミドワニス及びポリイミドフィルム
WO2020121949A1 (ja) * 2018-12-13 2020-06-18 三菱瓦斯化学株式会社 ポリイミド樹脂組成物及びポリイミドフィルム

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015080139A1 (ja) 2013-11-27 2015-06-04 宇部興産株式会社 ポリイミド前駆体組成物、ポリイミドの製造方法、ポリイミド、ポリイミドフィルム、及び基板
WO2016121817A1 (ja) 2015-01-29 2016-08-04 宇部興産株式会社 ポリイミド前駆体組成物およびそれを用いた絶縁被覆層の製造方法

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CN116057109B (zh) 2024-05-14
TW202219122A (zh) 2022-05-16
CN116057109A (zh) 2023-05-02
WO2022054765A1 (ja) 2022-03-17
JPWO2022054765A1 (enrdf_load_stackoverflow) 2022-03-17

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