KR20230051671A - 질화 붕소 입자, 수지 조성물, 및 수지 조성물의 제조 방법 - Google Patents

질화 붕소 입자, 수지 조성물, 및 수지 조성물의 제조 방법 Download PDF

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Publication number
KR20230051671A
KR20230051671A KR1020237005816A KR20237005816A KR20230051671A KR 20230051671 A KR20230051671 A KR 20230051671A KR 1020237005816 A KR1020237005816 A KR 1020237005816A KR 20237005816 A KR20237005816 A KR 20237005816A KR 20230051671 A KR20230051671 A KR 20230051671A
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South Korea
Prior art keywords
boron nitride
nitride particles
particles
less
resin composition
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KR1020237005816A
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English (en)
Korean (ko)
Inventor
유스케 사사키
겐지 미야타
미치하루 나카시마
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덴카 주식회사
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Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B21/00—Nitrogen; Compounds thereof
    • C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
    • C01B21/064—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/20—Compounding polymers with additives, e.g. colouring
    • C08J3/203—Solid polymers with solid and/or liquid additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2002/00—Crystal-structural characteristics
    • C01P2002/70—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data
    • C01P2002/72—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data by d-values or two theta-values, e.g. as X-ray diagram
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/01—Particle morphology depicted by an image
    • C01P2004/03—Particle morphology depicted by an image obtained by SEM
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/32—Thermal properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C08K2003/385—Binary compounds of nitrogen with boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/004—Additives being defined by their length

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
KR1020237005816A 2020-08-20 2021-08-19 질화 붕소 입자, 수지 조성물, 및 수지 조성물의 제조 방법 Ceased KR20230051671A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2020-139482 2020-08-20
JP2020139482 2020-08-20
PCT/JP2021/030450 WO2022039239A1 (ja) 2020-08-20 2021-08-19 窒化ホウ素粒子、樹脂組成物、及び樹脂組成物の製造方法

Publications (1)

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KR20230051671A true KR20230051671A (ko) 2023-04-18

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KR1020237005816A Ceased KR20230051671A (ko) 2020-08-20 2021-08-19 질화 붕소 입자, 수지 조성물, 및 수지 조성물의 제조 방법

Country Status (5)

Country Link
US (1) US20240025741A1 (https=)
JP (2) JP7241248B2 (https=)
KR (1) KR20230051671A (https=)
CN (1) CN115697898B (https=)
WO (1) WO2022039239A1 (https=)

Families Citing this family (4)

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Publication number Priority date Publication date Assignee Title
JP2019130148A (ja) * 2018-01-31 2019-08-08 株式会社三洋物産 遊技機
JP2019130142A (ja) * 2018-01-31 2019-08-08 株式会社三洋物産 遊技機
JP2019130140A (ja) * 2018-01-31 2019-08-08 株式会社三洋物産 遊技機
JP2019130150A (ja) * 2018-01-31 2019-08-08 株式会社三洋物産 遊技機

Citations (1)

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Publication number Priority date Publication date Assignee Title
JP2016160134A (ja) 2015-03-02 2016-09-05 株式会社トクヤマ 六方晶窒化ホウ素粉末及びその製造方法

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JP4706077B2 (ja) * 2005-07-22 2011-06-22 独立行政法人物質・材料研究機構 窒化ホウ素ナノホーンの製造方法
JP5069432B2 (ja) * 2006-06-30 2012-11-07 帝人株式会社 耐熱樹脂複合組成物及びその製造方法
JP4971836B2 (ja) * 2007-03-05 2012-07-11 帝人株式会社 窒化ホウ素ナノチューブ分散液、及びそれより得られる不織布
JP5059589B2 (ja) * 2007-12-27 2012-10-24 帝人株式会社 窒化ホウ素ナノ繊維及びその製造方法
DE102010050900A1 (de) * 2010-11-10 2012-05-10 Esk Ceramics Gmbh & Co. Kg Bornitrid-Agglomerate, Verfahren zu deren Herstellung und deren Verwendung
JP6816920B2 (ja) * 2016-02-22 2021-01-20 昭和電工株式会社 六方晶窒化ホウ素粉末、その製造方法、樹脂組成物及び樹脂シート
CN109790025B (zh) * 2016-10-07 2023-05-30 电化株式会社 氮化硼块状粒子、其制造方法及使用了其的导热树脂组合物
EP3575369A4 (en) * 2017-01-30 2020-09-02 Sekisui Chemical Co., Ltd. RESIN AND LAMINATE MATERIAL
JP6734239B2 (ja) * 2017-08-31 2020-08-05 デンカ株式会社 六方晶窒化ホウ素粉末及び化粧料
CN110240130A (zh) * 2018-03-07 2019-09-17 罗杰斯公司 通过模板化制备六方氮化硼的方法
US11332369B2 (en) * 2018-03-22 2022-05-17 BNNano, Inc. Compositions and aggregates comprising boron nitride nanotube structures, and methods of making
CN109704296B (zh) * 2019-02-22 2020-10-02 中国科学院苏州纳米技术与纳米仿生研究所 柔性氮化硼纳米带气凝胶及其制备方法
WO2022039237A1 (ja) * 2020-08-20 2022-02-24 デンカ株式会社 窒化ホウ素粒子、樹脂組成物、及び樹脂組成物の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016160134A (ja) 2015-03-02 2016-09-05 株式会社トクヤマ 六方晶窒化ホウ素粉末及びその製造方法

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Publication number Publication date
CN115697898A (zh) 2023-02-03
WO2022039239A1 (ja) 2022-02-24
US20240025741A1 (en) 2024-01-25
JP7241248B2 (ja) 2023-03-16
JP2023060177A (ja) 2023-04-27
CN115697898B (zh) 2025-02-25
JPWO2022039239A1 (https=) 2022-02-24
JP7580512B2 (ja) 2024-11-11

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