KR20220158678A - 수지 조성물, 배선 기판 및 도전성 패턴의 제조 방법 - Google Patents

수지 조성물, 배선 기판 및 도전성 패턴의 제조 방법 Download PDF

Info

Publication number
KR20220158678A
KR20220158678A KR1020227021240A KR20227021240A KR20220158678A KR 20220158678 A KR20220158678 A KR 20220158678A KR 1020227021240 A KR1020227021240 A KR 1020227021240A KR 20227021240 A KR20227021240 A KR 20227021240A KR 20220158678 A KR20220158678 A KR 20220158678A
Authority
KR
South Korea
Prior art keywords
group
resin composition
film
pattern
particles
Prior art date
Application number
KR1020227021240A
Other languages
English (en)
Korean (ko)
Inventor
토시야스 히비노
요헤이 코노시마
히로코 미츠이
유카 야마시키
요시히코 이노우에
Original Assignee
도레이 카부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도레이 카부시키가이샤 filed Critical 도레이 카부시키가이샤
Publication of KR20220158678A publication Critical patent/KR20220158678A/ko

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0041—Optical brightening agents, organic pigments
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/35—Heterocyclic compounds having nitrogen in the ring having also oxygen in the ring
    • C08K5/353—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/22—Exposing sequentially with the same light pattern different positions of the same surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)
KR1020227021240A 2020-03-27 2021-03-18 수지 조성물, 배선 기판 및 도전성 패턴의 제조 방법 KR20220158678A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2020-057218 2020-03-27
JP2020057218 2020-03-27
PCT/JP2021/011087 WO2021193354A1 (fr) 2020-03-27 2021-03-18 Composition conductrice, tableau de connexions et procédé de production d'un motif conducteur

Publications (1)

Publication Number Publication Date
KR20220158678A true KR20220158678A (ko) 2022-12-01

Family

ID=77890277

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227021240A KR20220158678A (ko) 2020-03-27 2021-03-18 수지 조성물, 배선 기판 및 도전성 패턴의 제조 방법

Country Status (5)

Country Link
JP (1) JP7095803B2 (fr)
KR (1) KR20220158678A (fr)
CN (1) CN115210322B (fr)
TW (1) TW202204501A (fr)
WO (1) WO2021193354A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115478436B (zh) * 2022-09-30 2023-05-30 建滔(清远)电子材料有限公司 一种超低捻度玻纤纱生产的电子级玻璃纤维布

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000199954A (ja) 1999-01-06 2000-07-18 Toray Ind Inc 感光性導電ペ―ストおよび微細電極パタ―ン形成方法
JP2013196997A (ja) 2012-03-22 2013-09-30 Toray Ind Inc 導電性組成物

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007091825A (ja) * 2005-09-27 2007-04-12 Mitsubishi Rayon Co Ltd 硬化性組成物
JP5281357B2 (ja) * 2008-10-23 2013-09-04 新日鉄住金化学株式会社 ブラックレジスト用感光性樹脂組成物及びカラーフィルター遮光膜
JP5934533B2 (ja) * 2012-03-23 2016-06-15 富士フイルム株式会社 複層フィルム及び光学シート
JP2015193758A (ja) * 2014-03-31 2015-11-05 東洋インキＳｃホールディングス株式会社 オーバーコート用感光性樹脂組成物、ならびにそれを用いた塗膜
JP6476660B2 (ja) * 2014-08-29 2019-03-06 日立化成株式会社 光硬化性樹脂組成物およびそれを用いた光硬化性遮光塗料、液晶表示パネル、液晶表示装置
JP6841233B2 (ja) * 2016-09-30 2021-03-10 東レ株式会社 感光性樹脂組成物、導電性パターンの製造方法、基板、タッチパネル及びディスプレイ
JP6699691B2 (ja) * 2018-08-06 2020-05-27 東洋インキＳｃホールディングス株式会社 黒色組成物、黒色塗膜、および積層体

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000199954A (ja) 1999-01-06 2000-07-18 Toray Ind Inc 感光性導電ペ―ストおよび微細電極パタ―ン形成方法
JP2013196997A (ja) 2012-03-22 2013-09-30 Toray Ind Inc 導電性組成物

Also Published As

Publication number Publication date
JPWO2021193354A1 (fr) 2021-09-30
TW202204501A (zh) 2022-02-01
CN115210322A (zh) 2022-10-18
JP7095803B2 (ja) 2022-07-05
WO2021193354A1 (fr) 2021-09-30
CN115210322B (zh) 2023-10-20

Similar Documents

Publication Publication Date Title
TWI757548B (zh) 著色樹脂組成物、著色膜、彩色濾光片及液晶顯示裝置
KR102399714B1 (ko) 감광성 수지 조성물, 도전성 패턴의 제조 방법, 기판, 터치 패널 및 디스플레이
KR102074712B1 (ko) 감광성 수지 조성물, 도전성 패턴의 제조 방법, 기판, 소자 및 터치패널
TWI648595B (zh) Photosensitive resin composition, method for producing a conductive pattern, Substrate, method of manufacturing touch panel, method of manufacturing display, method of manufacturing image sensor, method of manufacturing organic electroluminescence, and method of manufacturing solar cell
JP6365298B2 (ja) 樹脂ブラックマトリクス基板およびタッチパネル
KR102548098B1 (ko) 착색 수지 조성물
JP7095803B2 (ja) 樹脂組成物、配線基板及び導電性パターンの製造方法
JP7060166B1 (ja) 感光性樹脂組成物、導電パターン付き基板、アンテナ素子、画像表示装置の製造方法およびタッチパネルの製造方法
JP6604251B2 (ja) 感光性樹脂組成物、導電性パターンの製造方法、基板、タッチパネルおよびディスプレイ
JP6773258B1 (ja) 導電層付き基材およびタッチパネル
TW202131096A (zh) 感光性組成物、負型感光性組成物、像素分割層及有機el顯示裝置
JP2023041121A (ja) 着色樹脂組成物、着色膜および有機ｅｌ表示装置
WO2018029747A1 (fr) Composition de résine photosensible, procédé de production de motif conducteur, substrat, écran tactile et dispositif d'affichage