KR20220126795A - 히터 칩 및 히터 칩 유닛 - Google Patents
히터 칩 및 히터 칩 유닛 Download PDFInfo
- Publication number
- KR20220126795A KR20220126795A KR1020227030262A KR20227030262A KR20220126795A KR 20220126795 A KR20220126795 A KR 20220126795A KR 1020227030262 A KR1020227030262 A KR 1020227030262A KR 20227030262 A KR20227030262 A KR 20227030262A KR 20220126795 A KR20220126795 A KR 20220126795A
- Authority
- KR
- South Korea
- Prior art keywords
- iron
- heater chip
- connection arm
- iron body
- plate thickness
- Prior art date
Links
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 383
- 229910052742 iron Inorganic materials 0.000 claims abstract description 175
- 239000004020 conductor Substances 0.000 claims abstract description 43
- 238000009529 body temperature measurement Methods 0.000 claims description 55
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 20
- 230000003647 oxidation Effects 0.000 claims description 15
- 238000007254 oxidation reaction Methods 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 10
- 229910052759 nickel Inorganic materials 0.000 claims description 10
- 229920000742 Cotton Polymers 0.000 claims 1
- 230000007423 decrease Effects 0.000 abstract description 9
- 230000020169 heat generation Effects 0.000 abstract description 9
- 238000010438 heat treatment Methods 0.000 abstract description 2
- 238000003860 storage Methods 0.000 description 21
- 239000011347 resin Substances 0.000 description 17
- 229920005989 resin Polymers 0.000 description 17
- 239000000463 material Substances 0.000 description 15
- 230000004308 accommodation Effects 0.000 description 10
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 9
- 238000007747 plating Methods 0.000 description 8
- 238000003466 welding Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000005452 bending Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000000227 grinding Methods 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 206010037660 Pyrexia Diseases 0.000 description 1
- 229910001080 W alloy Inorganic materials 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 150000002505 iron Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/10—Connecting leads to windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Resistance Heating (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Die Bonding (AREA)
- Electrodes For Cathode-Ray Tubes (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2020-151043 | 2020-09-09 | ||
| JP2020151043A JP7137235B2 (ja) | 2020-09-09 | 2020-09-09 | ヒーターチップ、および、ヒーターチップユニット |
| PCT/JP2021/027194 WO2022054419A1 (ja) | 2020-09-09 | 2021-07-20 | ヒーターチップ、および、ヒーターチップユニット |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20220126795A true KR20220126795A (ko) | 2022-09-16 |
Family
ID=80632531
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020227030262A KR20220126795A (ko) | 2020-09-09 | 2021-07-20 | 히터 칩 및 히터 칩 유닛 |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP7137235B2 (ja) |
| KR (1) | KR20220126795A (ja) |
| CN (1) | CN115443202A (ja) |
| MY (1) | MY196750A (ja) |
| TW (1) | TW202211743A (ja) |
| WO (1) | WO2022054419A1 (ja) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IT202100026912A1 (it) | 2021-10-20 | 2023-04-20 | Ot Lucca S R L | Sistema per il supporto e la movimentazione di una pila di fogli interfogliati durante la produzione di prodotti cartacei in pile di fogli interfogliati in una macchina interfogliatrice |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001284781A (ja) | 2000-03-30 | 2001-10-12 | Taiyo Yuden Co Ltd | 熱圧着用ヒーターチップ及びその製造方法 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4424930A (en) * | 1981-06-29 | 1984-01-10 | Cooper Industries, Inc. | Carbon-based soldering and de-soldering tip and method of manufacturing same |
| JP3917964B2 (ja) * | 2003-08-22 | 2007-05-23 | 株式会社 工房Ｐｄａ | 熱圧着用のヒーターチップ |
| JP4253273B2 (ja) * | 2004-05-28 | 2009-04-08 | 株式会社 工房Ｐｄａ | 配線接続用のヒーターチップ |
| CN201055936Y (zh) * | 2007-05-24 | 2008-05-07 | 昌钰接合科技有限公司 | 一种阶梯形压焊工具 |
| JP2010253503A (ja) * | 2009-04-23 | 2010-11-11 | Miyachi Technos Corp | ヒータチップ及び接合装置 |
| JP5457107B2 (ja) * | 2009-05-19 | 2014-04-02 | ミヤチテクノス株式会社 | ヒータチップ及び接合装置 |
| JP2012183552A (ja) * | 2011-03-04 | 2012-09-27 | Miyachi Technos Corp | ヒータチップ及び接合装置及び接合方法 |
| JP5794577B2 (ja) * | 2011-10-21 | 2015-10-14 | 株式会社アマダミヤチ | ヒータチップ及び接合装置及び接合方法並びに導体細線と端子の接続構造 |
| US10799977B2 (en) * | 2015-08-28 | 2020-10-13 | Kobo Pda Co., Ltd. | Heater chip, joining apparatus and joining method |
| JP6677406B2 (ja) * | 2015-09-25 | 2020-04-08 | 株式会社 工房Ｐｄａ | ヒータチップ及び接合装置及び接合方法 |
| JP6851610B2 (ja) * | 2016-07-19 | 2021-03-31 | 株式会社 工房Ｐｄａ | ヒータチップ及び接合装置及び接合方法 |
| JP6483892B1 (ja) * | 2018-05-08 | 2019-03-13 | 株式会社ジャパンユニックス | はんだ鏝用の鏝先 |
| CN210677259U (zh) * | 2019-08-28 | 2020-06-05 | 重庆市泓禧科技股份有限公司 | 一种排线热压头及自动拉锡丝焊接机 |
-
2020
- 2020-09-09 JP JP2020151043A patent/JP7137235B2/ja active Active
-
2021
- 2021-07-20 CN CN202180027305.XA patent/CN115443202A/zh active Pending
- 2021-07-20 KR KR1020227030262A patent/KR20220126795A/ko not_active Application Discontinuation
- 2021-07-20 MY MYPI2022004864A patent/MY196750A/en unknown
- 2021-07-20 WO PCT/JP2021/027194 patent/WO2022054419A1/ja active Application Filing
- 2021-09-06 TW TW110133047A patent/TW202211743A/zh unknown
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001284781A (ja) | 2000-03-30 | 2001-10-12 | Taiyo Yuden Co Ltd | 熱圧着用ヒーターチップ及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| MY196750A (en) | 2023-05-03 |
| CN115443202A (zh) | 2022-12-06 |
| JP2022045442A (ja) | 2022-03-22 |
| WO2022054419A1 (ja) | 2022-03-17 |
| JP7137235B2 (ja) | 2022-09-14 |
| TW202211743A (zh) | 2022-03-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| E902 | Notification of reason for refusal |