CN115443202A - 加热嘴及加热嘴单元 - Google Patents
加热嘴及加热嘴单元 Download PDFInfo
- Publication number
- CN115443202A CN115443202A CN202180027305.XA CN202180027305A CN115443202A CN 115443202 A CN115443202 A CN 115443202A CN 202180027305 A CN202180027305 A CN 202180027305A CN 115443202 A CN115443202 A CN 115443202A
- Authority
- CN
- China
- Prior art keywords
- soldering iron
- connecting arm
- heating nozzle
- heating
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 181
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 483
- 229910052742 iron Inorganic materials 0.000 claims abstract description 237
- 238000005476 soldering Methods 0.000 claims abstract description 231
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 47
- 238000009529 body temperature measurement Methods 0.000 claims description 41
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 20
- 230000003647 oxidation Effects 0.000 claims description 17
- 238000007254 oxidation reaction Methods 0.000 claims description 17
- 239000011247 coating layer Substances 0.000 claims description 10
- 229910052759 nickel Inorganic materials 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 230000003247 decreasing effect Effects 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 17
- 239000011347 resin Substances 0.000 description 17
- 229920005989 resin Polymers 0.000 description 17
- 230000007547 defect Effects 0.000 description 11
- 230000020169 heat generation Effects 0.000 description 8
- 230000007423 decrease Effects 0.000 description 7
- 238000007747 plating Methods 0.000 description 7
- 238000003466 welding Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000036544 posture Effects 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 229910001080 W alloy Inorganic materials 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000012217 deletion Methods 0.000 description 1
- 230000037430 deletion Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/10—Connecting leads to windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Resistance Heating (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Electrodes For Cathode-Ray Tubes (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020-151043 | 2020-09-09 | ||
JP2020151043A JP7137235B2 (ja) | 2020-09-09 | 2020-09-09 | ヒーターチップ、および、ヒーターチップユニット |
PCT/JP2021/027194 WO2022054419A1 (ja) | 2020-09-09 | 2021-07-20 | ヒーターチップ、および、ヒーターチップユニット |
Publications (1)
Publication Number | Publication Date |
---|---|
CN115443202A true CN115443202A (zh) | 2022-12-06 |
Family
ID=80632531
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202180027305.XA Pending CN115443202A (zh) | 2020-09-09 | 2021-07-20 | 加热嘴及加热嘴单元 |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP7137235B2 (ja) |
KR (1) | KR20220126795A (ja) |
CN (1) | CN115443202A (ja) |
MY (1) | MY196750A (ja) |
TW (1) | TW202211743A (ja) |
WO (1) | WO2022054419A1 (ja) |
Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS586773A (ja) * | 1981-06-29 | 1983-01-14 | ク−パ−・インダストリ−ズ・インコ−ポレイテツド | ハンダ付け及びハンダ除去用こて先き、及びその製造方法 |
JP2001284781A (ja) * | 2000-03-30 | 2001-10-12 | Taiyo Yuden Co Ltd | 熱圧着用ヒーターチップ及びその製造方法 |
JP2005340599A (ja) * | 2004-05-28 | 2005-12-08 | Kobo Pda Co Ltd | 配線接続用のヒーターチップ |
US20070187366A1 (en) * | 2003-08-22 | 2007-08-16 | Tatsuya Ishii | Heater chip for thermocompression bonding |
CN201055936Y (zh) * | 2007-05-24 | 2008-05-07 | 昌钰接合科技有限公司 | 一种阶梯形压焊工具 |
JP2010253503A (ja) * | 2009-04-23 | 2010-11-11 | Miyachi Technos Corp | ヒータチップ及び接合装置 |
JP2011000639A (ja) * | 2009-05-19 | 2011-01-06 | Miyachi Technos Corp | ヒータチップ及び接合装置 |
JP2012183552A (ja) * | 2011-03-04 | 2012-09-27 | Miyachi Technos Corp | ヒータチップ及び接合装置及び接合方法 |
CN103084694A (zh) * | 2011-10-21 | 2013-05-08 | 株式会社工房Pda | 热压焊头及接合装置及接合方法以及细线与端子的连接构造 |
WO2017038282A1 (ja) * | 2015-08-28 | 2017-03-09 | 株式会社工房Pda | ヒータチップ及び接合装置及び接合方法 |
JP2017062945A (ja) * | 2015-09-25 | 2017-03-30 | 株式会社 工房Pda | ヒータチップ及び接合装置及び接合方法 |
JP2018012200A (ja) * | 2016-07-19 | 2018-01-25 | 株式会社 工房Pda | ヒータチップ及び接合装置及び接合方法 |
CN110449686A (zh) * | 2018-05-08 | 2019-11-15 | 日本优尼可思股份有限公司 | 焊烙铁用的烙铁尖 |
CN210677259U (zh) * | 2019-08-28 | 2020-06-05 | 重庆市泓禧科技股份有限公司 | 一种排线热压头及自动拉锡丝焊接机 |
-
2020
- 2020-09-09 JP JP2020151043A patent/JP7137235B2/ja active Active
-
2021
- 2021-07-20 WO PCT/JP2021/027194 patent/WO2022054419A1/ja active Application Filing
- 2021-07-20 MY MYPI2022004864A patent/MY196750A/en unknown
- 2021-07-20 CN CN202180027305.XA patent/CN115443202A/zh active Pending
- 2021-07-20 KR KR1020227030262A patent/KR20220126795A/ko not_active Application Discontinuation
- 2021-09-06 TW TW110133047A patent/TW202211743A/zh unknown
Patent Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS586773A (ja) * | 1981-06-29 | 1983-01-14 | ク−パ−・インダストリ−ズ・インコ−ポレイテツド | ハンダ付け及びハンダ除去用こて先き、及びその製造方法 |
JP2001284781A (ja) * | 2000-03-30 | 2001-10-12 | Taiyo Yuden Co Ltd | 熱圧着用ヒーターチップ及びその製造方法 |
US20070187366A1 (en) * | 2003-08-22 | 2007-08-16 | Tatsuya Ishii | Heater chip for thermocompression bonding |
JP2005340599A (ja) * | 2004-05-28 | 2005-12-08 | Kobo Pda Co Ltd | 配線接続用のヒーターチップ |
CN201055936Y (zh) * | 2007-05-24 | 2008-05-07 | 昌钰接合科技有限公司 | 一种阶梯形压焊工具 |
JP2010253503A (ja) * | 2009-04-23 | 2010-11-11 | Miyachi Technos Corp | ヒータチップ及び接合装置 |
JP2011000639A (ja) * | 2009-05-19 | 2011-01-06 | Miyachi Technos Corp | ヒータチップ及び接合装置 |
JP2012183552A (ja) * | 2011-03-04 | 2012-09-27 | Miyachi Technos Corp | ヒータチップ及び接合装置及び接合方法 |
CN103084694A (zh) * | 2011-10-21 | 2013-05-08 | 株式会社工房Pda | 热压焊头及接合装置及接合方法以及细线与端子的连接构造 |
WO2017038282A1 (ja) * | 2015-08-28 | 2017-03-09 | 株式会社工房Pda | ヒータチップ及び接合装置及び接合方法 |
CN107848063A (zh) * | 2015-08-28 | 2018-03-27 | 株式会社工房Pda | 加热芯片、结合装置和结合方法 |
JP2017062945A (ja) * | 2015-09-25 | 2017-03-30 | 株式会社 工房Pda | ヒータチップ及び接合装置及び接合方法 |
JP2018012200A (ja) * | 2016-07-19 | 2018-01-25 | 株式会社 工房Pda | ヒータチップ及び接合装置及び接合方法 |
CN110449686A (zh) * | 2018-05-08 | 2019-11-15 | 日本优尼可思股份有限公司 | 焊烙铁用的烙铁尖 |
CN210677259U (zh) * | 2019-08-28 | 2020-06-05 | 重庆市泓禧科技股份有限公司 | 一种排线热压头及自动拉锡丝焊接机 |
Also Published As
Publication number | Publication date |
---|---|
JP2022045442A (ja) | 2022-03-22 |
TW202211743A (zh) | 2022-03-16 |
MY196750A (en) | 2023-05-03 |
KR20220126795A (ko) | 2022-09-16 |
WO2022054419A1 (ja) | 2022-03-17 |
JP7137235B2 (ja) | 2022-09-14 |
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Legal Events
Date | Code | Title | Description |
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination |