KR20220122663A - 땜납 범프 형성용 부재, 땜납 범프 형성용 부재의 제조 방법, 및 땜납 범프 부착 전극 기판의 제조 방법 - Google Patents

땜납 범프 형성용 부재, 땜납 범프 형성용 부재의 제조 방법, 및 땜납 범프 부착 전극 기판의 제조 방법 Download PDF

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Publication number
KR20220122663A
KR20220122663A KR1020227023758A KR20227023758A KR20220122663A KR 20220122663 A KR20220122663 A KR 20220122663A KR 1020227023758 A KR1020227023758 A KR 1020227023758A KR 20227023758 A KR20227023758 A KR 20227023758A KR 20220122663 A KR20220122663 A KR 20220122663A
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KR
South Korea
Prior art keywords
solder
particles
bumps
electrode
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020227023758A
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English (en)
Korean (ko)
Inventor
준이치 가케하타
구니히코 아카이
마사유키 미야지
요시노리 에지리
Original Assignee
쇼와덴코머티리얼즈가부시끼가이샤
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Publication of KR20220122663A publication Critical patent/KR20220122663A/ko
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/742—Apparatus for manufacturing bump connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/118—Post-treatment of the bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/81009—Pre-treatment of the bump connector or the bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/81053—Bonding environment
    • H01L2224/81091—Under pressure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/81053—Bonding environment
    • H01L2224/81095—Temperature settings
    • H01L2224/81096—Transient conditions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/812—Applying energy for connecting
    • H01L2224/81201—Compression bonding
    • H01L2224/81203—Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/81909—Post-treatment of the bump connector or bonding area
    • H01L2224/8191—Cleaning, e.g. oxide removal step, desmearing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
KR1020227023758A 2019-12-27 2020-12-15 땜납 범프 형성용 부재, 땜납 범프 형성용 부재의 제조 방법, 및 땜납 범프 부착 전극 기판의 제조 방법 Pending KR20220122663A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019238428 2019-12-27
JPJP-P-2019-238428 2019-12-27
PCT/JP2020/046731 WO2021131897A1 (ja) 2019-12-27 2020-12-15 はんだバンプ形成用部材、はんだバンプ形成用部材の製造方法、及びはんだバンプ付き電極基板の製造方法

Publications (1)

Publication Number Publication Date
KR20220122663A true KR20220122663A (ko) 2022-09-02

Family

ID=76576058

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227023758A Pending KR20220122663A (ko) 2019-12-27 2020-12-15 땜납 범프 형성용 부재, 땜납 범프 형성용 부재의 제조 방법, 및 땜납 범프 부착 전극 기판의 제조 방법

Country Status (4)

Country Link
JP (2) JP7661891B2 (enrdf_load_stackoverflow)
KR (1) KR20220122663A (enrdf_load_stackoverflow)
CN (1) CN115152007A (enrdf_load_stackoverflow)
WO (1) WO2021131897A1 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12318870B2 (en) * 2022-12-22 2025-06-03 Samsung Electronics Co., Ltd. Ball attachment apparatus

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004080024A (ja) 2002-08-02 2004-03-11 Senju Metal Ind Co Ltd はんだボール配置シート、その製造方法およびはんだバンプ形成方法
WO2006043377A1 (ja) 2004-10-19 2006-04-27 Senju Metal Industry Co., Ltd. はんだバンプ形成用シートとその製造方法
JP2017157626A (ja) 2016-02-29 2017-09-07 三菱マテリアル株式会社 はんだバンプの形成方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4896817A (en) * 1988-10-17 1990-01-30 International Business Machines Corp. Flux composition and method of decreasing tin content in lead/tin solder joints
AT392231B (de) * 1989-03-22 1991-02-25 Alcatel Austria Ag Flussmittel zum loeten von verzinnten leiterplatten
JP3207506B2 (ja) * 1991-08-28 2001-09-10 株式会社日立製作所 電子回路装置の製造方法
JP2917595B2 (ja) * 1991-07-19 1999-07-12 松下電器産業株式会社 金属ボールの形成方法
JPH07249631A (ja) * 1994-01-20 1995-09-26 Fujitsu Ltd はんだバンプ及びはんだボールの製造方法及び半導体装置の製造方法
JP3315871B2 (ja) * 1996-09-03 2002-08-19 日本特殊陶業株式会社 半田バンプを有する配線基板及びその製造方法
JP4087876B2 (ja) * 1998-08-10 2008-05-21 富士通株式会社 ハンダバンプの形成方法
JP2009283734A (ja) * 2008-05-23 2009-12-03 Alps Electric Co Ltd フラックス転写方法及びフラックス転写装置
JP5118574B2 (ja) 2008-08-07 2013-01-16 三井金属鉱業株式会社 はんだ粉及びはんだペースト
TWI462676B (zh) * 2009-02-13 2014-11-21 Senju Metal Industry Co The solder bumps for the circuit substrate are formed using the transfer sheet
JP5238598B2 (ja) * 2009-04-30 2013-07-17 昭和電工株式会社 回路基板の製造方法
KR101376888B1 (ko) * 2012-10-11 2014-03-20 삼성전기주식회사 회로기판의 솔더 볼 범핑을 위한 마스크 및 그를 이용한 솔더 볼 범핑 방법
JP6750228B2 (ja) * 2015-01-13 2020-09-02 デクセリアルズ株式会社 バンプ形成用フィルム、半導体装置及びその製造方法、並びに接続構造体
JP2019029135A (ja) * 2017-07-27 2019-02-21 日立化成株式会社 異方性導電フィルム及びその製造方法、並びに接続構造体及びその製造方法
JP2019169371A (ja) * 2018-03-23 2019-10-03 株式会社タムラ製作所 導電性組成物および電子基板の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004080024A (ja) 2002-08-02 2004-03-11 Senju Metal Ind Co Ltd はんだボール配置シート、その製造方法およびはんだバンプ形成方法
WO2006043377A1 (ja) 2004-10-19 2006-04-27 Senju Metal Industry Co., Ltd. はんだバンプ形成用シートとその製造方法
JP2017157626A (ja) 2016-02-29 2017-09-07 三菱マテリアル株式会社 はんだバンプの形成方法

Also Published As

Publication number Publication date
JPWO2021131897A1 (enrdf_load_stackoverflow) 2021-07-01
WO2021131897A1 (ja) 2021-07-01
JP2025092693A (ja) 2025-06-19
JP7661891B2 (ja) 2025-04-15
CN115152007A (zh) 2022-10-04

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