KR20210155802A - Led 칩 패키지 및 그 제조방법 - Google Patents
Led 칩 패키지 및 그 제조방법 Download PDFInfo
- Publication number
- KR20210155802A KR20210155802A KR1020217038625A KR20217038625A KR20210155802A KR 20210155802 A KR20210155802 A KR 20210155802A KR 1020217038625 A KR1020217038625 A KR 1020217038625A KR 20217038625 A KR20217038625 A KR 20217038625A KR 20210155802 A KR20210155802 A KR 20210155802A
- Authority
- KR
- South Korea
- Prior art keywords
- light emitting
- led sub
- protective layer
- connection electrodes
- substrate
- Prior art date
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
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Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201962847875P | 2019-05-14 | 2019-05-14 | |
| US62/847,875 | 2019-05-14 | ||
| US201962870855P | 2019-07-05 | 2019-07-05 | |
| US62/870,855 | 2019-07-05 | ||
| US16/858,674 | 2020-04-26 | ||
| US16/858,674 US11756980B2 (en) | 2019-05-14 | 2020-04-26 | LED chip package and manufacturing method of the same |
| PCT/KR2020/006280 WO2020231173A1 (en) | 2019-05-14 | 2020-05-13 | Led chip package and manufacturing method of the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20210155802A true KR20210155802A (ko) | 2021-12-23 |
Family
ID=72623313
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020217038625A KR20210155802A (ko) | 2019-05-14 | 2020-05-13 | Led 칩 패키지 및 그 제조방법 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20230387178A1 (pt) |
| EP (1) | EP3970203A4 (pt) |
| JP (1) | JP2022532155A (pt) |
| KR (1) | KR20210155802A (pt) |
| CN (2) | CN211629110U (pt) |
| BR (1) | BR112021022881A2 (pt) |
| MX (1) | MX2021013719A (pt) |
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| JP4636501B2 (ja) * | 2005-05-12 | 2011-02-23 | 株式会社沖データ | 半導体装置、プリントヘッド及び画像形成装置 |
| JP2008263127A (ja) * | 2007-04-13 | 2008-10-30 | Toshiba Corp | Ｌｅｄ装置 |
| US8058663B2 (en) * | 2007-09-26 | 2011-11-15 | Iii-N Technology, Inc. | Micro-emitter array based full-color micro-display |
| JP2012028749A (ja) * | 2010-07-22 | 2012-02-09 | Seoul Opto Devices Co Ltd | 発光ダイオード |
| JP5906396B2 (ja) * | 2011-03-24 | 2016-04-20 | パナソニックＩｐマネジメント株式会社 | フレキシブル半導体装置及びその製造方法 |
| KR102049384B1 (ko) * | 2013-06-28 | 2019-11-28 | 엘지이노텍 주식회사 | 발광 소자, 발광 소자 패키지 및 발광 소자 구동 장치 |
| KR101476688B1 (ko) * | 2013-10-24 | 2014-12-26 | 엘지전자 주식회사 | 반도체 발광 소자를 이용한 디스플레이 장치 및 이의 제조방법 |
| KR102422246B1 (ko) * | 2015-07-30 | 2022-07-19 | 삼성전자주식회사 | 발광 소자 패키지 |
| JP6604786B2 (ja) * | 2015-09-11 | 2019-11-13 | 三星電子株式会社 | 半導体発光装置およびその製造方法 |
| CN106935607A (zh) * | 2015-12-31 | 2017-07-07 | 晶能光电（江西）有限公司 | 一种倒装高压led芯片及其制备方法 |
| KR20170129983A (ko) * | 2016-05-17 | 2017-11-28 | 삼성전자주식회사 | 발광소자 패키지, 이를 이용한 디스플레이 장치 및 그 제조방법 |
| US10355043B2 (en) * | 2017-06-28 | 2019-07-16 | Globalfoundries Inc. | Integrated vertical transistors and light emitting diodes |
| US10749076B2 (en) * | 2017-06-29 | 2020-08-18 | Epistar Corporation | Light-emitting device |
| US11282981B2 (en) * | 2017-11-27 | 2022-03-22 | Seoul Viosys Co., Ltd. | Passivation covered light emitting unit stack |
| CN108258095B (zh) * | 2018-01-18 | 2019-05-31 | 湘能华磊光电股份有限公司 | Led芯片电极及其制作方法和led芯片 |
| US11450648B2 (en) * | 2019-03-19 | 2022-09-20 | Seoul Viosys Co., Ltd. | Light emitting device package and application thereof |
| CN211605176U (zh) * | 2019-05-14 | 2020-09-29 | 首尔伟傲世有限公司 | 发光芯片 |
| US11587914B2 (en) * | 2019-05-14 | 2023-02-21 | Seoul Viosys Co., Ltd. | LED chip and manufacturing method of the same |
-
2020
- 2020-05-13 MX MX2021013719A patent/MX2021013719A/es unknown
- 2020-05-13 CN CN202020794218.XU patent/CN211629110U/zh active Active
- 2020-05-13 CN CN202080035650.3A patent/CN113853688A/zh active Pending
- 2020-05-13 KR KR1020217038625A patent/KR20210155802A/ko unknown
- 2020-05-13 EP EP20805270.4A patent/EP3970203A4/en active Pending
- 2020-05-13 BR BR112021022881A patent/BR112021022881A2/pt unknown
- 2020-05-13 JP JP2021566350A patent/JP2022532155A/ja active Pending
-
2023
- 2023-08-10 US US18/232,371 patent/US20230387178A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| EP3970203A4 (en) | 2023-05-10 |
| BR112021022881A2 (pt) | 2022-01-04 |
| CN211629110U (zh) | 2020-10-02 |
| MX2021013719A (es) | 2021-12-10 |
| EP3970203A1 (en) | 2022-03-23 |
| CN113853688A (zh) | 2021-12-28 |
| US20230387178A1 (en) | 2023-11-30 |
| JP2022532155A (ja) | 2022-07-13 |
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