KR20210143224A - 반도체 패키지, 반도체 패키지의 제조 방법, 및 이에 이용하는 열전도성 조성물 - Google Patents

반도체 패키지, 반도체 패키지의 제조 방법, 및 이에 이용하는 열전도성 조성물 Download PDF

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KR20210143224A
KR20210143224A KR1020217033313A KR20217033313A KR20210143224A KR 20210143224 A KR20210143224 A KR 20210143224A KR 1020217033313 A KR1020217033313 A KR 1020217033313A KR 20217033313 A KR20217033313 A KR 20217033313A KR 20210143224 A KR20210143224 A KR 20210143224A
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South Korea
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thermally conductive
conductive composition
metal
particle
semiconductor package
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KR1020217033313A
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English (en)
Korean (ko)
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나오키 와타베
마코토 다카모토
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스미또모 베이크라이트 가부시키가이샤
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=72519866&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR20210143224(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 스미또모 베이크라이트 가부시키가이샤 filed Critical 스미또모 베이크라이트 가부시키가이샤
Publication of KR20210143224A publication Critical patent/KR20210143224A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4068—Heatconductors between device and heatsink, e.g. compliant heat-spreaders, heat-conducting bands

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Inorganic Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR1020217033313A 2019-03-20 2020-03-11 반도체 패키지, 반도체 패키지의 제조 방법, 및 이에 이용하는 열전도성 조성물 KR20210143224A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019052739 2019-03-20
JPJP-P-2019-052739 2019-03-20
PCT/JP2020/010573 WO2020189446A1 (ja) 2019-03-20 2020-03-11 半導体パッケージ、半導体パッケージの製造方法、およびそれに用いる熱伝導性組成物

Publications (1)

Publication Number Publication Date
KR20210143224A true KR20210143224A (ko) 2021-11-26

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ID=72519866

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KR1020217033313A KR20210143224A (ko) 2019-03-20 2020-03-11 반도체 패키지, 반도체 패키지의 제조 방법, 및 이에 이용하는 열전도성 조성물

Country Status (4)

Country Link
JP (1) JP6950848B2 (ja)
KR (1) KR20210143224A (ja)
CN (1) CN113631675A (ja)
WO (1) WO2020189446A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230174805A (ko) 2022-06-21 2023-12-29 주식회사 비에스테크닉스 열전도 부재가 임베디드된 방열 반도체 패키지 및 그 제조방법 그리고 그 제조에 이용하는 유도 가열 솔더링장치

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015072428A1 (ja) 2013-11-12 2015-05-21 Jnc株式会社 ヒートシンク

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JP2001315244A (ja) * 2000-05-01 2001-11-13 Jsr Corp 熱伝導性シート、その製造方法およびその熱伝導性シートを用いた放熱構造
US9070660B2 (en) * 2013-03-15 2015-06-30 Intel Corporation Polymer thermal interface material having enhanced thermal conductivity
JP6511721B2 (ja) * 2014-03-26 2019-05-15 住友ベークライト株式会社 ダイアタッチペースト、および半導体装置
JP6310799B2 (ja) * 2014-07-22 2018-04-11 京セラ株式会社 熱硬化性樹脂組成物、半導体装置、電気・電子部品及びプレート型銀微粒子の製造方法
CN107709418B (zh) * 2015-05-08 2021-04-27 汉高知识产权控股有限责任公司 可烧结的膜和膏及其使用方法
JP6164256B2 (ja) * 2015-07-08 2017-07-19 住友ベークライト株式会社 熱伝導性組成物、半導体装置、半導体装置の製造方法、および放熱板の接着方法
JP2017022033A (ja) * 2015-07-13 2017-01-26 住友ベークライト株式会社 銀ペーストおよび銀ペーストの硬化体の製造方法
KR102487472B1 (ko) * 2015-08-03 2023-01-12 나믹스 가부시끼가이샤 고성능, 열 전도성 표면 실장 (다이 부착) 접착제
CN105355610B (zh) * 2015-08-27 2019-01-18 华为技术有限公司 一种电路装置及制造方法
WO2017111945A1 (en) * 2015-12-22 2017-06-29 Intel Corporation Adhesive polymer thermal interface material with sintered fillers for thermal conductivity in micro-electronic packaging
JP6747000B2 (ja) * 2016-03-25 2020-08-26 住友ベークライト株式会社 ペースト状接着剤組成物、半導体装置、半導体装置の製造方法および放熱板の接着方法
WO2019111778A1 (ja) * 2017-12-04 2019-06-13 住友ベークライト株式会社 ペースト状接着剤組成物、および半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015072428A1 (ja) 2013-11-12 2015-05-21 Jnc株式会社 ヒートシンク

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230174805A (ko) 2022-06-21 2023-12-29 주식회사 비에스테크닉스 열전도 부재가 임베디드된 방열 반도체 패키지 및 그 제조방법 그리고 그 제조에 이용하는 유도 가열 솔더링장치

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WO2020189446A1 (ja) 2020-09-24
JPWO2020189446A1 (ja) 2021-09-13
TW202100703A (zh) 2021-01-01
JP6950848B2 (ja) 2021-10-13
CN113631675A (zh) 2021-11-09

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