KR20210133949A - 도전성 접착제 조성물 - Google Patents
도전성 접착제 조성물 Download PDFInfo
- Publication number
- KR20210133949A KR20210133949A KR1020217018539A KR20217018539A KR20210133949A KR 20210133949 A KR20210133949 A KR 20210133949A KR 1020217018539 A KR1020217018539 A KR 1020217018539A KR 20217018539 A KR20217018539 A KR 20217018539A KR 20210133949 A KR20210133949 A KR 20210133949A
- Authority
- KR
- South Korea
- Prior art keywords
- resin
- conductive adhesive
- adhesive composition
- modified polyester
- polyester resin
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 39
- 239000000853 adhesive Substances 0.000 title claims abstract description 38
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 38
- 229920001225 polyester resin Polymers 0.000 claims abstract description 37
- 239000004645 polyester resin Substances 0.000 claims abstract description 37
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 28
- 229920005989 resin Polymers 0.000 claims abstract description 23
- 239000011347 resin Substances 0.000 claims abstract description 23
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims abstract description 16
- 238000002844 melting Methods 0.000 claims abstract description 11
- 230000008018 melting Effects 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims description 11
- 230000009477 glass transition Effects 0.000 claims description 10
- 239000000945 filler Substances 0.000 claims description 7
- 229920000728 polyester Polymers 0.000 claims description 7
- 210000001787 dendrite Anatomy 0.000 claims description 6
- 239000011231 conductive filler Substances 0.000 abstract description 8
- 239000002245 particle Substances 0.000 description 37
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 23
- 229910052709 silver Inorganic materials 0.000 description 23
- 239000004332 silver Substances 0.000 description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 20
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 18
- 229910052782 aluminium Inorganic materials 0.000 description 18
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 17
- 238000007740 vapor deposition Methods 0.000 description 13
- 239000002313 adhesive film Substances 0.000 description 12
- 229910052802 copper Inorganic materials 0.000 description 11
- 239000010949 copper Substances 0.000 description 11
- 239000011889 copper foil Substances 0.000 description 10
- 229910052759 nickel Inorganic materials 0.000 description 9
- 229910052799 carbon Inorganic materials 0.000 description 8
- 229910000881 Cu alloy Inorganic materials 0.000 description 7
- 229920006038 crystalline resin Polymers 0.000 description 7
- 229910052748 manganese Inorganic materials 0.000 description 7
- 229920006127 amorphous resin Polymers 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- -1 polyethylene Polymers 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 238000000576 coating method Methods 0.000 description 5
- 230000008021 deposition Effects 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 238000007719 peel strength test Methods 0.000 description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 description 5
- 239000005020 polyethylene terephthalate Substances 0.000 description 5
- 229920002799 BoPET Polymers 0.000 description 4
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000011324 bead Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000002253 acid Substances 0.000 description 3
- 238000000113 differential scanning calorimetry Methods 0.000 description 3
- 238000001938 differential scanning calorimetry curve Methods 0.000 description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 3
- 239000011342 resin composition Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920006324 polyoxymethylene Polymers 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000009864 tensile test Methods 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000005227 gel permeation chromatography Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000004128 high performance liquid chromatography Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 150000002815 nickel Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000011164 primary particle Substances 0.000 description 1
- 239000007870 radical polymerization initiator Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000000790 scattering method Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 239000003643 water by type Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2019-038664 | 2019-03-04 | ||
| JP2019038664 | 2019-03-04 | ||
| PCT/JP2019/048767 WO2020179179A1 (ja) | 2019-03-04 | 2019-12-12 | 導電性接着剤組成物 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20210133949A true KR20210133949A (ko) | 2021-11-08 |
Family
ID=72338552
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020217018539A KR20210133949A (ko) | 2019-03-04 | 2019-12-12 | 도전성 접착제 조성물 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7459048B2 (zh) |
| KR (1) | KR20210133949A (zh) |
| CN (1) | CN113330082B (zh) |
| TW (1) | TW202043407A (zh) |
| WO (1) | WO2020179179A1 (zh) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003096317A (ja) | 2001-07-18 | 2003-04-03 | Mitsubishi Engineering Plastics Corp | 熱可塑性樹脂組成物 |
| WO2009038190A1 (ja) | 2007-09-19 | 2009-03-26 | Hitachi Chemical Company, Ltd. | 接着剤組成物及び接合体 |
| JP2014060025A (ja) | 2012-09-18 | 2014-04-03 | Dexerials Corp | 異方性導電フィルム、接続方法、及び接合体 |
| JP2014102943A (ja) | 2012-11-19 | 2014-06-05 | Dexerials Corp | 異方性導電フィルム、接続方法、及び接合体 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5769390A (en) * | 1980-10-13 | 1982-04-28 | Fuji Electric Co Ltd | Coffee vending machine |
| JP2007242397A (ja) | 2006-03-08 | 2007-09-20 | Toyobo Co Ltd | 導電性ペースト及びこれを用いた印刷回路、面状発熱体 |
| JP4858144B2 (ja) | 2006-12-13 | 2012-01-18 | パナソニック株式会社 | 発熱体 |
| WO2014195400A1 (en) | 2013-06-06 | 2014-12-11 | Chiesi Farmaceutici S.P.A. | Kinase inhibitors |
| JP6327243B2 (ja) * | 2015-12-24 | 2018-05-23 | 住友電気工業株式会社 | 絶縁シート及びフラットケーブル |
| JP6719550B2 (ja) * | 2016-05-12 | 2020-07-08 | 日本メクトロン株式会社 | 導電性接着剤およびシールドフィルム |
| US10577524B2 (en) | 2016-05-23 | 2020-03-03 | Tatsuta Electric Wire & Cable Co., Ltd. | Conductive adhesive composition |
| JP6329314B1 (ja) | 2017-09-28 | 2018-05-23 | タツタ電線株式会社 | 導電性接着剤シート |
| WO2019151188A1 (ja) | 2018-01-30 | 2019-08-08 | タツタ電線株式会社 | 導電性接着剤組成物 |
-
2019
- 2019-10-29 TW TW108139066A patent/TW202043407A/zh unknown
- 2019-12-12 JP JP2021503413A patent/JP7459048B2/ja active Active
- 2019-12-12 WO PCT/JP2019/048767 patent/WO2020179179A1/ja active Application Filing
- 2019-12-12 CN CN201980090818.8A patent/CN113330082B/zh active Active
- 2019-12-12 KR KR1020217018539A patent/KR20210133949A/ko not_active Application Discontinuation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003096317A (ja) | 2001-07-18 | 2003-04-03 | Mitsubishi Engineering Plastics Corp | 熱可塑性樹脂組成物 |
| WO2009038190A1 (ja) | 2007-09-19 | 2009-03-26 | Hitachi Chemical Company, Ltd. | 接着剤組成物及び接合体 |
| JP2014060025A (ja) | 2012-09-18 | 2014-04-03 | Dexerials Corp | 異方性導電フィルム、接続方法、及び接合体 |
| JP2014102943A (ja) | 2012-11-19 | 2014-06-05 | Dexerials Corp | 異方性導電フィルム、接続方法、及び接合体 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020179179A1 (ja) | 2020-09-10 |
| CN113330082B (zh) | 2023-04-28 |
| TW202043407A (zh) | 2020-12-01 |
| JPWO2020179179A1 (zh) | 2020-09-10 |
| CN113330082A (zh) | 2021-08-31 |
| JP7459048B2 (ja) | 2024-04-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI570215B (zh) | 導電性接著劑 | |
| CN1950912B (zh) | 电路连接粘合剂 | |
| US4731282A (en) | Anisotropic-electroconductive adhesive film | |
| CN101946371B (zh) | 连接膜、以及接合体及其制造方法 | |
| CN100365090C (zh) | 具有ptc特性的各向异性导电粘合剂 | |
| CN107112658B (zh) | 各向异性导电膜和连接方法 | |
| KR20140068956A (ko) | 전기 전도성의 열 활성화되는 접착제 컴파운드 | |
| CN101836515B (zh) | 各向异性导电粘接剂 | |
| KR20140068950A (ko) | 전기 전도성 접착제 화합물 및 접착 테이프 | |
| JP5232130B2 (ja) | プリント配線板の接続構造、その製造方法、および異方導電性接着剤 | |
| KR102580259B1 (ko) | 도전성 접착제 조성물 | |
| JP4572562B2 (ja) | フィルム状接着剤 | |
| KR20210133949A (ko) | 도전성 접착제 조성물 | |
| WO2012164836A1 (ja) | 接着剤組成物及び接着フィルム | |
| JP4867805B2 (ja) | 電極接続用接着剤 | |
| JP6805190B2 (ja) | 導電性接着剤組成物 | |
| KR101862734B1 (ko) | 전자 부품 접착 재료 및 전자 부품의 접착 방법 | |
| CN104882189A (zh) | 导电性组合物及导体 | |
| JP2005294086A (ja) | フィルム状接着剤 | |
| KR102545861B1 (ko) | 도전 재료 | |
| WO2024116988A1 (ja) | 異方性導電フィルム、接続構造体および接続構造体の製造方法 | |
| JP2010135576A (ja) | プリント配線板およびプリント配線板の製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| E902 | Notification of reason for refusal |