KR20210036242A - 스템 - Google Patents

스템 Download PDF

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Publication number
KR20210036242A
KR20210036242A KR1020200031803A KR20200031803A KR20210036242A KR 20210036242 A KR20210036242 A KR 20210036242A KR 1020200031803 A KR1020200031803 A KR 1020200031803A KR 20200031803 A KR20200031803 A KR 20200031803A KR 20210036242 A KR20210036242 A KR 20210036242A
Authority
KR
South Korea
Prior art keywords
hole
stem
fixing member
lead
stem body
Prior art date
Application number
KR1020200031803A
Other languages
English (en)
Korean (ko)
Inventor
마사오 가이누마
아키히로 마츠스에
히데유키 다나카
Original Assignee
신꼬오덴기 고교 가부시키가이샤
미쓰비시덴키 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 신꼬오덴기 고교 가부시키가이샤, 미쓰비시덴키 가부시키가이샤 filed Critical 신꼬오덴기 고교 가부시키가이샤
Publication of KR20210036242A publication Critical patent/KR20210036242A/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/049—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Electroplating Methods And Accessories (AREA)
KR1020200031803A 2019-09-25 2020-03-16 스템 KR20210036242A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2019-174482 2019-09-25
JP2019174482A JP7266501B2 (ja) 2019-09-25 2019-09-25 ステム

Publications (1)

Publication Number Publication Date
KR20210036242A true KR20210036242A (ko) 2021-04-02

Family

ID=75040793

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020200031803A KR20210036242A (ko) 2019-09-25 2020-03-16 스템

Country Status (3)

Country Link
JP (1) JP7266501B2 (ja)
KR (1) KR20210036242A (ja)
CN (1) CN112563211A (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112135732B (zh) 2018-05-14 2023-06-02 大金工业株式会社 层积体和管

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005191088A (ja) 2003-12-24 2005-07-14 Mitsubishi Electric Corp 半導体用パッケージ及び半導体デバイス

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS637652A (ja) * 1986-06-27 1988-01-13 Sumitomo Electric Ind Ltd 半導体用気密封止金属パツケ−ジ
JP4374300B2 (ja) * 2004-09-02 2009-12-02 新光電気工業株式会社 半導体装置用キャップ
JP2011059571A (ja) * 2009-09-14 2011-03-24 Sumitomo Electric Ind Ltd 光サブアセンブリ
JP2014146756A (ja) * 2013-01-30 2014-08-14 Kyocera Corp 電子部品搭載用パッケージおよびそれを用いた電子装置
JP6915307B2 (ja) * 2016-03-28 2021-08-04 東洋製罐グループホールディングス株式会社 フレキシブルデバイス用基板用基材及びその製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005191088A (ja) 2003-12-24 2005-07-14 Mitsubishi Electric Corp 半導体用パッケージ及び半導体デバイス

Also Published As

Publication number Publication date
CN112563211A (zh) 2021-03-26
JP7266501B2 (ja) 2023-04-28
JP2021052106A (ja) 2021-04-01

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E902 Notification of reason for refusal