KR20200102419A - 점착성 적층체, 수지막이 형성된 가공 대상물의 제조 방법, 및 경화 수지막이 형성된 경화 봉지체의 제조 방법 - Google Patents

점착성 적층체, 수지막이 형성된 가공 대상물의 제조 방법, 및 경화 수지막이 형성된 경화 봉지체의 제조 방법 Download PDF

Info

Publication number
KR20200102419A
KR20200102419A KR1020207013857A KR20207013857A KR20200102419A KR 20200102419 A KR20200102419 A KR 20200102419A KR 1020207013857 A KR1020207013857 A KR 1020207013857A KR 20207013857 A KR20207013857 A KR 20207013857A KR 20200102419 A KR20200102419 A KR 20200102419A
Authority
KR
South Korea
Prior art keywords
layer
adhesive
sheet
resin film
pressure
Prior art date
Application number
KR1020207013857A
Other languages
English (en)
Korean (ko)
Other versions
KR102689603B1 (ko
Inventor
다케히토 나카야마
나오야 오카모토
다카시 아쿠츠
Original Assignee
린텍 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 린텍 가부시키가이샤 filed Critical 린텍 가부시키가이샤
Publication of KR20200102419A publication Critical patent/KR20200102419A/ko
Application granted granted Critical
Publication of KR102689603B1 publication Critical patent/KR102689603B1/ko

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
KR1020207013857A 2017-12-26 2018-12-19 점착성 적층체, 수지막이 형성된 가공 대상물의 제조 방법, 및 경화 수지막이 형성된 경화 봉지체의 제조 방법 KR102689603B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2017-250079 2017-12-26
JP2017250079 2017-12-26
PCT/JP2018/046889 WO2019131408A1 (ja) 2017-12-26 2018-12-19 粘着性積層体、樹脂膜付き加工対象物の製造方法、及び硬化樹脂膜付き硬化封止体の製造方法

Publications (2)

Publication Number Publication Date
KR20200102419A true KR20200102419A (ko) 2020-08-31
KR102689603B1 KR102689603B1 (ko) 2024-07-29

Family

ID=67067225

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020207013857A KR102689603B1 (ko) 2017-12-26 2018-12-19 점착성 적층체, 수지막이 형성된 가공 대상물의 제조 방법, 및 경화 수지막이 형성된 경화 봉지체의 제조 방법

Country Status (5)

Country Link
JP (1) JP7340457B2 (ja)
KR (1) KR102689603B1 (ja)
CN (1) CN111448275B (ja)
TW (1) TWI791719B (ja)
WO (1) WO2019131408A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111902503A (zh) * 2018-03-30 2020-11-06 琳得科株式会社 固化密封体的防翘曲用层叠体、以及固化密封体的制造方法
CN114929825B (zh) * 2020-08-07 2024-03-19 日东电工株式会社 保护罩构件及构件供给用片
CN116631714B (zh) * 2023-07-25 2023-11-10 天蔚蓝电驱动科技(江苏)有限公司 一种复合绝缘片材及电机定子

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS594853B2 (ja) 1981-02-23 1984-02-01 株式会社日立製作所 半導体装置
JP2006291137A (ja) * 2005-04-14 2006-10-26 Nitto Denko Cs System Kk 粘着テープ類およびその使用方法
JP2009035635A (ja) * 2007-08-01 2009-02-19 Nitto Denko Corp 非汚染性熱剥離型粘着シート
KR20140133519A (ko) * 2012-02-13 2014-11-19 신에쓰 가가꾸 고교 가부시끼가이샤 반도체 웨이퍼용 보호필름 및 반도체칩의 제조방법
WO2016076131A1 (ja) * 2014-11-13 2016-05-19 Dic株式会社 両面粘着テープ、物品及び分離方法
KR20170056435A (ko) * 2015-11-13 2017-05-23 닛토덴코 가부시키가이샤 반도체 패키지의 제조 방법

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06259017A (ja) * 1993-03-05 1994-09-16 Toppan Printing Co Ltd 粘着ラベル
JP2000248240A (ja) * 1999-03-01 2000-09-12 Nitto Denko Corp 加熱剥離型粘着シート
JP4219605B2 (ja) * 2002-03-12 2009-02-04 リンテック株式会社 半導体ウエハ加工用粘着シートおよびその使用方法
JP4377144B2 (ja) * 2003-03-04 2009-12-02 電気化学工業株式会社 半導体ウエハ固定用シート
JP2004300231A (ja) * 2003-03-31 2004-10-28 Nitto Denko Corp 熱剥離性両面粘着シート、被着体の加工方法および電子部品
JP4476848B2 (ja) * 2005-03-07 2010-06-09 リンテック株式会社 レーザーダイシングシートおよびレーザーダイシング方法
JP2007246848A (ja) * 2006-03-18 2007-09-27 Nitto Denko Corp 両面粘着シート及びその使用方法
JP2017002190A (ja) * 2015-06-10 2017-01-05 リンテック株式会社 加熱剥離性粘着シート

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS594853B2 (ja) 1981-02-23 1984-02-01 株式会社日立製作所 半導体装置
JP2006291137A (ja) * 2005-04-14 2006-10-26 Nitto Denko Cs System Kk 粘着テープ類およびその使用方法
JP2009035635A (ja) * 2007-08-01 2009-02-19 Nitto Denko Corp 非汚染性熱剥離型粘着シート
KR20140133519A (ko) * 2012-02-13 2014-11-19 신에쓰 가가꾸 고교 가부시끼가이샤 반도체 웨이퍼용 보호필름 및 반도체칩의 제조방법
WO2016076131A1 (ja) * 2014-11-13 2016-05-19 Dic株式会社 両面粘着テープ、物品及び分離方法
KR20170056435A (ko) * 2015-11-13 2017-05-23 닛토덴코 가부시키가이샤 반도체 패키지의 제조 방법

Also Published As

Publication number Publication date
TW201934698A (zh) 2019-09-01
WO2019131408A1 (ja) 2019-07-04
JP7340457B2 (ja) 2023-09-07
KR102689603B1 (ko) 2024-07-29
CN111448275B (zh) 2022-04-22
JPWO2019131408A1 (ja) 2021-01-14
CN111448275A (zh) 2020-07-24
TWI791719B (zh) 2023-02-11

Similar Documents

Publication Publication Date Title
KR102576309B1 (ko) 경화 봉지체의 휨 방지용 적층체, 및 경화 봉지체의 제조 방법
KR102576310B1 (ko) 경화 봉지체의 휨 방지용 적층체, 및 경화 봉지체의 제조 방법
JP6761115B2 (ja) 半導体装置の製造方法及び両面粘着シート
CN111295738A (zh) 半导体装置的制造方法
KR102689603B1 (ko) 점착성 적층체, 수지막이 형성된 가공 대상물의 제조 방법, 및 경화 수지막이 형성된 경화 봉지체의 제조 방법
KR20200133209A (ko) 가공품의 제조 방법 및 점착성 적층체
KR102609670B1 (ko) 점착성 적층체, 점착성 적층체의 사용 방법, 및 반도체 장치의 제조 방법
JP6761116B2 (ja) 半導体装置の製造方法及び粘着シート
KR102543787B1 (ko) 적층체 및 경화 봉지체의 제조 방법
JP7267272B2 (ja) 硬化封止体の製造方法
TWI793186B (zh) 層合體及硬化密封體之製造方法

Legal Events

Date Code Title Description
E902 Notification of reason for refusal
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant