KR20200065074A - 발광 디바이스 패키지 - Google Patents

발광 디바이스 패키지 Download PDF

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Publication number
KR20200065074A
KR20200065074A KR1020207014163A KR20207014163A KR20200065074A KR 20200065074 A KR20200065074 A KR 20200065074A KR 1020207014163 A KR1020207014163 A KR 1020207014163A KR 20207014163 A KR20207014163 A KR 20207014163A KR 20200065074 A KR20200065074 A KR 20200065074A
Authority
KR
South Korea
Prior art keywords
coating layer
base
layer
reflective layer
light emitting
Prior art date
Application number
KR1020207014163A
Other languages
English (en)
Korean (ko)
Inventor
수 리
Original Assignee
루미레즈 엘엘씨
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US15/788,347 external-priority patent/US10672960B2/en
Application filed by 루미레즈 엘엘씨 filed Critical 루미레즈 엘엘씨
Publication of KR20200065074A publication Critical patent/KR20200065074A/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
KR1020207014163A 2017-10-19 2018-10-01 발광 디바이스 패키지 KR20200065074A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US15/788,347 US10672960B2 (en) 2017-10-19 2017-10-19 Light emitting device package with a coating layer
US15/788,347 2017-10-19
EP18153901.6 2018-01-29
EP18153901 2018-01-29
PCT/US2018/053694 WO2019079021A1 (en) 2017-10-19 2018-10-01 LIGHT EMITTING DEVICE HOUSING

Publications (1)

Publication Number Publication Date
KR20200065074A true KR20200065074A (ko) 2020-06-08

Family

ID=63862209

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020207014163A KR20200065074A (ko) 2017-10-19 2018-10-01 발광 디바이스 패키지

Country Status (6)

Country Link
EP (1) EP3698415A1 (ja)
JP (1) JP7193532B2 (ja)
KR (1) KR20200065074A (ja)
CN (1) CN111837245A (ja)
TW (1) TW201924094A (ja)
WO (1) WO2019079021A1 (ja)

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2003034508A1 (ja) * 2001-10-12 2005-02-03 日亜化学工業株式会社 発光装置及びその製造方法
JP2007109915A (ja) * 2005-10-14 2007-04-26 Stanley Electric Co Ltd 発光ダイオード
JP4973011B2 (ja) 2006-05-31 2012-07-11 豊田合成株式会社 Ｌｅｄ装置
JP5245594B2 (ja) 2007-07-27 2013-07-24 日亜化学工業株式会社 発光装置及びその製造方法
JP4962270B2 (ja) * 2007-10-31 2012-06-27 日亜化学工業株式会社 発光装置及びこれの製造方法
KR20100079970A (ko) * 2008-12-31 2010-07-08 서울반도체 주식회사 광원 패키지
KR101293649B1 (ko) * 2009-03-31 2013-08-13 도시바 라이텍쿠 가부시키가이샤 발광장치 및 조명장치
TWI411143B (en) * 2009-06-26 2013-10-01 Led package structure with a plurality of standby pads for increasing wire-bonding yield and method for manufacturing the same
JP5413137B2 (ja) 2009-11-09 2014-02-12 日亜化学工業株式会社 発光装置および発光装置の製造方法
JP2012019062A (ja) * 2010-07-08 2012-01-26 Shin Etsu Chem Co Ltd 発光半導体装置、実装基板及びそれらの製造方法
JP5864089B2 (ja) 2010-08-25 2016-02-17 日亜化学工業株式会社 発光装置の製造方法
CN103403892A (zh) * 2011-03-31 2013-11-20 松下电器产业株式会社 半导体发光装置
US10490712B2 (en) * 2011-07-21 2019-11-26 Cree, Inc. Light emitter device packages, components, and methods for improved chemical resistance and related methods
JP2013033890A (ja) 2011-08-03 2013-02-14 Toyoda Gosei Co Ltd 発光装置
JP6164215B2 (ja) * 2012-06-06 2017-07-19 日立化成株式会社 光半導体装置
JP2014041955A (ja) 2012-08-23 2014-03-06 Konica Minolta Inc Ｌｅｄ装置、及びその製造方法
KR102008315B1 (ko) 2013-01-23 2019-10-21 삼성전자주식회사 발광 소자 패키지
DE102013215650B4 (de) 2013-08-08 2021-10-28 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Bauelement und Verfahren zu seiner Herstellung
KR102188500B1 (ko) * 2014-07-28 2020-12-09 삼성전자주식회사 발광다이오드 패키지 및 이를 이용한 조명장치

Also Published As

Publication number Publication date
JP2021500749A (ja) 2021-01-07
EP3698415A1 (en) 2020-08-26
WO2019079021A1 (en) 2019-04-25
JP7193532B2 (ja) 2022-12-20
TW201924094A (zh) 2019-06-16
CN111837245A (zh) 2020-10-27

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Date Code Title Description
AMND Amendment
E902 Notification of reason for refusal
AMND Amendment
E601 Decision to refuse application
X091 Application refused [patent]
AMND Amendment
X601 Decision of rejection after re-examination