KR20200029353A - 제트 디스펜서용 땜납 조성물 및 전자 기판의 제조 방법 - Google Patents
제트 디스펜서용 땜납 조성물 및 전자 기판의 제조 방법 Download PDFInfo
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- KR20200029353A KR20200029353A KR1020190107043A KR20190107043A KR20200029353A KR 20200029353 A KR20200029353 A KR 20200029353A KR 1020190107043 A KR1020190107043 A KR 1020190107043A KR 20190107043 A KR20190107043 A KR 20190107043A KR 20200029353 A KR20200029353 A KR 20200029353A
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Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3618—Carboxylic acids or salts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/082—Flux dispensers; Apparatus for applying flux
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2018-168993 | 2018-09-10 | ||
| JP2018168993 | 2018-09-10 | ||
| JP2019147420A JP6864046B2 (ja) | 2018-09-10 | 2019-08-09 | ジェットディスペンサー用はんだ組成物、および電子基板の製造方法 |
| JPJP-P-2019-147420 | 2019-08-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20200029353A true KR20200029353A (ko) | 2020-03-18 |
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| KR1020190107043A KR20200029353A (ko) | 2018-09-10 | 2019-08-30 | 제트 디스펜서용 땜납 조성물 및 전자 기판의 제조 방법 |
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| Country | Link |
|---|---|
| JP (1) | JP6864046B2 (ja) |
| KR (1) | KR20200029353A (ja) |
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| JP7194141B2 (ja) * | 2020-03-25 | 2022-12-21 | 株式会社タムラ製作所 | レーザーはんだ付け用はんだ組成物、および電子基板の製造方法 |
| JP7169390B2 (ja) * | 2020-03-26 | 2022-11-10 | 株式会社タムラ製作所 | はんだ組成物および電子基板 |
| JP6836090B1 (ja) * | 2020-04-02 | 2021-02-24 | 千住金属工業株式会社 | フラックス組成物、及びそれを用いたはんだペースト |
| JP7450318B2 (ja) | 2021-09-16 | 2024-03-15 | 株式会社タムラ製作所 | はんだ組成物およびフレキシブル回路基板の製造方法 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6184817B2 (ja) * | 2013-09-24 | 2017-08-23 | 株式会社タムラ製作所 | フラックス組成物、はんだ組成物、および、プリント配線基板の製造方法 |
| JP6383768B2 (ja) * | 2015-09-30 | 2018-08-29 | 株式会社タムラ製作所 | はんだ組成物および電子基板の製造方法 |
| JP6370324B2 (ja) * | 2016-03-04 | 2018-08-08 | 株式会社タムラ製作所 | はんだ組成物および電子基板の製造方法 |
| JP6402213B2 (ja) * | 2016-03-31 | 2018-10-10 | 株式会社タムラ製作所 | はんだ組成物および電子基板 |
| KR102242412B1 (ko) * | 2016-06-29 | 2021-04-20 | 가부시키가이샤 다무라 세이사쿠쇼 | 플럭스 조성물, 솔더 페이스트 조성물 및 전자 회로 기판 |
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2019
- 2019-08-09 JP JP2019147420A patent/JP6864046B2/ja active Active
- 2019-08-30 KR KR1020190107043A patent/KR20200029353A/ko not_active Application Discontinuation
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| Publication number | Publication date |
|---|---|
| JP6864046B2 (ja) | 2021-04-21 |
| JP2020040120A (ja) | 2020-03-19 |
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