KR20200019593A - 도전성 수지 조성물 및 그것을 사용한 차폐 패키지의 제조 방법 - Google Patents

도전성 수지 조성물 및 그것을 사용한 차폐 패키지의 제조 방법 Download PDF

Info

Publication number
KR20200019593A
KR20200019593A KR1020197025414A KR20197025414A KR20200019593A KR 20200019593 A KR20200019593 A KR 20200019593A KR 1020197025414 A KR1020197025414 A KR 1020197025414A KR 20197025414 A KR20197025414 A KR 20197025414A KR 20200019593 A KR20200019593 A KR 20200019593A
Authority
KR
South Korea
Prior art keywords
resin composition
compound
package
conductive resin
shielding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020197025414A
Other languages
English (en)
Korean (ko)
Inventor
히로아키 우메다
가즈히로 마쓰다
하지메 나카조노
Original Assignee
타츠타 전선 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 타츠타 전선 주식회사 filed Critical 타츠타 전선 주식회사
Publication of KR20200019593A publication Critical patent/KR20200019593A/ko
Ceased legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4042—Imines; Imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/56—Amines together with other curing agents
    • C08G59/58—Amines together with other curing agents with polycarboxylic acids or with anhydrides, halides, or low-molecular-weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
    • C08K5/3445—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/12—Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/10—Homopolymers or copolymers of methacrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L35/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1020197025414A 2017-06-15 2018-04-03 도전성 수지 조성물 및 그것을 사용한 차폐 패키지의 제조 방법 Ceased KR20200019593A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017117814A JP2019001912A (ja) 2017-06-15 2017-06-15 導電性樹脂組成物及びそれを用いたシールドパッケージの製造方法
JPJP-P-2017-117814 2017-06-15
PCT/JP2018/014287 WO2018230109A1 (ja) 2017-06-15 2018-04-03 導電性樹脂組成物及びそれを用いたシールドパッケージの製造方法

Publications (1)

Publication Number Publication Date
KR20200019593A true KR20200019593A (ko) 2020-02-24

Family

ID=64660003

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020197025414A Ceased KR20200019593A (ko) 2017-06-15 2018-04-03 도전성 수지 조성물 및 그것을 사용한 차폐 패키지의 제조 방법

Country Status (5)

Country Link
JP (1) JP2019001912A (enExample)
KR (1) KR20200019593A (enExample)
CN (1) CN110382620A (enExample)
TW (1) TW201904764A (enExample)
WO (1) WO2018230109A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7272284B2 (ja) * 2020-01-15 2023-05-12 信越化学工業株式会社 低誘電樹脂組成物
CN111508911B (zh) * 2020-04-30 2022-03-25 青岛歌尔微电子研究院有限公司 分腔电磁屏蔽封装方法及封装结构
TW202444786A (zh) * 2023-03-09 2024-11-16 日商拓自達電線股份有限公司 導電性組成物

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003258137A (ja) 2002-02-28 2003-09-12 Mitsubishi Electric Corp 半導体装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4996182B2 (ja) * 2006-09-07 2012-08-08 株式会社日立製作所 ポリマーナノコンポジット材料、その製造方法電子部品装置およびその製造方法
JP5266774B2 (ja) * 2008-01-31 2013-08-21 住友ベークライト株式会社 樹脂組成物およびそれを用いて作製した半導体装置または回路基板
JP5266719B2 (ja) * 2007-10-29 2013-08-21 住友ベークライト株式会社 樹脂組成物及び樹脂組成物を使用して作製した半導体装置
EP3202866B1 (en) * 2014-09-30 2018-12-05 Tatsuta Electric Wire & Cable Co., Ltd. Conductive coating material and method for producing shield package using same
JP2017008160A (ja) * 2015-06-18 2017-01-12 京セラ株式会社 ダイボンディングペーストの製造方法およびダイボンディングペースト

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003258137A (ja) 2002-02-28 2003-09-12 Mitsubishi Electric Corp 半導体装置

Also Published As

Publication number Publication date
TW201904764A (zh) 2019-02-01
WO2018230109A1 (ja) 2018-12-20
CN110382620A (zh) 2019-10-25
JP2019001912A (ja) 2019-01-10

Similar Documents

Publication Publication Date Title
US9236169B2 (en) Electromagnetic wave shielding structure and method for fabricating the same
KR101725748B1 (ko) 전자 부품의 패키지의 쉴드용 도전성 도료 및 이것을 이용한 쉴드 패키지의 제조 방법
CN106538086B (zh) 电磁干扰屏蔽组合物及其应用方法
KR102355385B1 (ko) 도전성 도료 및 이것을 사용한 차폐 패키지의 제조 방법
US20180222152A1 (en) Resin-clad copper foil, and printed wiring board
KR102355386B1 (ko) 도전성 도료 및 이것을 사용한 차폐 패키지의 제조 방법
KR20180125942A (ko) 도전성 도료 및 그것을 사용한 차폐 패키지의 제조 방법
KR20200019593A (ko) 도전성 수지 조성물 및 그것을 사용한 차폐 패키지의 제조 방법
US11834586B2 (en) Conductive paint, method for producing shield package using the same, and method for producing resin molded article having shield layer
WO2019198336A1 (ja) 導電性塗料及び該導電性塗料を用いたシールドパッケージの製造方法
WO2018012017A1 (ja) 導電性塗料及びそれを用いたシールドパッケージの製造方法
JP2024122282A (ja) シールドパッケージとその製造方法
WO2024048627A1 (ja) 導電性塗料、及びシールド層を有する樹脂成形品の製造方法
HK1229833A1 (en) Conductive coating material and method for producing shield package using same

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20190829

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20210219

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20220718

Patent event code: PE09021S01D

E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 20230102

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 20220718

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I