JP2019001912A - 導電性樹脂組成物及びそれを用いたシールドパッケージの製造方法 - Google Patents

導電性樹脂組成物及びそれを用いたシールドパッケージの製造方法 Download PDF

Info

Publication number
JP2019001912A
JP2019001912A JP2017117814A JP2017117814A JP2019001912A JP 2019001912 A JP2019001912 A JP 2019001912A JP 2017117814 A JP2017117814 A JP 2017117814A JP 2017117814 A JP2017117814 A JP 2017117814A JP 2019001912 A JP2019001912 A JP 2019001912A
Authority
JP
Japan
Prior art keywords
resin composition
package
compound
conductive resin
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2017117814A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019001912A5 (enExample
Inventor
梅田　裕明
Hiroaki Umeda
裕明 梅田
和大 松田
Kazuhiro Matsuda
和大 松田
元 中園
Hajime Nakazono
元 中園
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tatsuta Electric Wire and Cable Co Ltd
Original Assignee
Tatsuta Electric Wire and Cable Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tatsuta Electric Wire and Cable Co Ltd filed Critical Tatsuta Electric Wire and Cable Co Ltd
Priority to JP2017117814A priority Critical patent/JP2019001912A/ja
Priority to PCT/JP2018/014287 priority patent/WO2018230109A1/ja
Priority to CN201880017919.8A priority patent/CN110382620A/zh
Priority to KR1020197025414A priority patent/KR20200019593A/ko
Priority to TW107113043A priority patent/TW201904764A/zh
Publication of JP2019001912A publication Critical patent/JP2019001912A/ja
Publication of JP2019001912A5 publication Critical patent/JP2019001912A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4042—Imines; Imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/56—Amines together with other curing agents
    • C08G59/58—Amines together with other curing agents with polycarboxylic acids or with anhydrides, halides, or low-molecular-weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
    • C08K5/3445—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/12—Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/10—Homopolymers or copolymers of methacrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L35/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2017117814A 2017-06-15 2017-06-15 導電性樹脂組成物及びそれを用いたシールドパッケージの製造方法 Pending JP2019001912A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2017117814A JP2019001912A (ja) 2017-06-15 2017-06-15 導電性樹脂組成物及びそれを用いたシールドパッケージの製造方法
PCT/JP2018/014287 WO2018230109A1 (ja) 2017-06-15 2018-04-03 導電性樹脂組成物及びそれを用いたシールドパッケージの製造方法
CN201880017919.8A CN110382620A (zh) 2017-06-15 2018-04-03 导电性树脂组合物及使用该导电性树脂组合物的屏蔽封装体的制造方法
KR1020197025414A KR20200019593A (ko) 2017-06-15 2018-04-03 도전성 수지 조성물 및 그것을 사용한 차폐 패키지의 제조 방법
TW107113043A TW201904764A (zh) 2017-06-15 2018-04-17 導電性樹脂組成物及使用其之屏蔽封裝體之製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017117814A JP2019001912A (ja) 2017-06-15 2017-06-15 導電性樹脂組成物及びそれを用いたシールドパッケージの製造方法

Publications (2)

Publication Number Publication Date
JP2019001912A true JP2019001912A (ja) 2019-01-10
JP2019001912A5 JP2019001912A5 (enExample) 2020-05-28

Family

ID=64660003

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017117814A Pending JP2019001912A (ja) 2017-06-15 2017-06-15 導電性樹脂組成物及びそれを用いたシールドパッケージの製造方法

Country Status (5)

Country Link
JP (1) JP2019001912A (enExample)
KR (1) KR20200019593A (enExample)
CN (1) CN110382620A (enExample)
TW (1) TW201904764A (enExample)
WO (1) WO2018230109A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021109941A (ja) * 2020-01-15 2021-08-02 信越化学工業株式会社 低誘電樹脂組成物
WO2024185839A1 (ja) * 2023-03-09 2024-09-12 タツタ電線株式会社 導電性組成物

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111508911B (zh) * 2020-04-30 2022-03-25 青岛歌尔微电子研究院有限公司 分腔电磁屏蔽封装方法及封装结构

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009179725A (ja) * 2008-01-31 2009-08-13 Sumitomo Bakelite Co Ltd 樹脂組成物およびそれを用いて作製した半導体装置または回路基板
WO2016051700A1 (ja) * 2014-09-30 2016-04-07 タツタ電線株式会社 導電性塗料及びそれを用いたシールドパッケージの製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003258137A (ja) * 2002-02-28 2003-09-12 Mitsubishi Electric Corp 半導体装置
JP4996182B2 (ja) * 2006-09-07 2012-08-08 株式会社日立製作所 ポリマーナノコンポジット材料、その製造方法電子部品装置およびその製造方法
JP5266719B2 (ja) * 2007-10-29 2013-08-21 住友ベークライト株式会社 樹脂組成物及び樹脂組成物を使用して作製した半導体装置
JP2017008160A (ja) * 2015-06-18 2017-01-12 京セラ株式会社 ダイボンディングペーストの製造方法およびダイボンディングペースト

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009179725A (ja) * 2008-01-31 2009-08-13 Sumitomo Bakelite Co Ltd 樹脂組成物およびそれを用いて作製した半導体装置または回路基板
WO2016051700A1 (ja) * 2014-09-30 2016-04-07 タツタ電線株式会社 導電性塗料及びそれを用いたシールドパッケージの製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021109941A (ja) * 2020-01-15 2021-08-02 信越化学工業株式会社 低誘電樹脂組成物
JP7272284B2 (ja) 2020-01-15 2023-05-12 信越化学工業株式会社 低誘電樹脂組成物
WO2024185839A1 (ja) * 2023-03-09 2024-09-12 タツタ電線株式会社 導電性組成物

Also Published As

Publication number Publication date
TW201904764A (zh) 2019-02-01
WO2018230109A1 (ja) 2018-12-20
CN110382620A (zh) 2019-10-25
KR20200019593A (ko) 2020-02-24

Similar Documents

Publication Publication Date Title
US9236169B2 (en) Electromagnetic wave shielding structure and method for fabricating the same
US10259952B2 (en) Conductive coating material for shielding electronic component package and method for producing shielded package
TWI722136B (zh) 導電性塗料及使用其之屏蔽封裝體之製造方法
JP6992083B2 (ja) シールドパッケージ
CN106538086A (zh) 电磁干扰屏蔽组合物及其应用方法
US20180222152A1 (en) Resin-clad copper foil, and printed wiring board
JP6831731B2 (ja) 導電性塗料及びそれを用いたシールドパッケージの製造方法
JP2011219674A (ja) 回路基板用熱硬化樹脂性組成物
WO2018230109A1 (ja) 導電性樹脂組成物及びそれを用いたシールドパッケージの製造方法
TW202102602A (zh) 包含磁性粉體之樹脂組成物
WO2018012017A1 (ja) 導電性塗料及びそれを用いたシールドパッケージの製造方法
JP2012255147A (ja) 半導体モジュール部品及び液状封止用樹脂組成物
JP2020055977A (ja) 導電性塗料
JP2023119440A (ja) 絶縁性組成物、熱硬化型絶縁性接着シート、絶縁接着層および複合部材
JP2017120879A (ja) 保護素子、保護素子の製造方法、実装基板および電子機器
HK1229833A1 (en) Conductive coating material and method for producing shield package using same
HK40002728A (en) Conductive adhesive composition

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20200420

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20200421

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20210518

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20211116