KR20200002948A - Manufacturing Method of Organic EL Display - Google Patents

Abstract

The manufacturing method of the organic electroluminescent display which has an optical member formation process of forming the optical film in which liquid crystal molecules were oriented by apply | coating and drying the coating liquid for optical films containing a liquid crystal molecule and a solvent on the board | substrate with which the organic light emitting diode was previously formed.

Description

Manufacturing Method of Organic EL Display

The present invention relates to a method for producing an organic EL display.

For example, a circular polarizing plate is used for a display using an organic light emitting diode (OLED) (hereinafter also referred to as an "organic EL (Electro Luminescence) display") to suppress reflection of external light. A circularly polarizing plate is produced by laminating a linear polarizing plate and a wave plate (phase difference plate) so that their polarization axes intersect at 45 degrees.

For example, only a wavelength plate may be formed so that the polarization axis may incline 15 degrees or 75 degrees. Therefore, it is necessary to form a polarizing plate and a wave plate at arbitrary angles. Moreover, in order to cross | intersect the polarization axis of a polarizing plate or a wavelength plate at arbitrary angles, it is also necessary to separately form these polarizing plates and a wavelength plate.

Conventionally, such a polarizing plate and a wavelength plate are produced using the stretched film, for example. A stretched film is what orientates the molecule | numerator in the material in one direction by extending | stretching and bonding a film in one direction.

By the way, in recent years, with thinning of organic electroluminescent display, thinning of a polarizing plate and a wavelength plate is also calculated | required. However, in producing a polarizing plate and a wavelength plate, when using a stretched film as in the prior art, there is a limit to reducing the film thickness of the stretched film itself, and a sufficient thin plate cannot be obtained.

Therefore, thinning is aimed at by apply | coating the coating liquid which has a predetermined material on a board | substrate, and forming a polarizing plate and a wavelength plate of required film thickness. Specifically, for example, a coating liquid having liquid crystallinity as a predetermined material is applied to the substrate to be cast and aligned. The liquid crystal molecules form the supramolecular assembly in the coating liquid, and when the coating liquid flows while applying the shear stress, the major axis direction of the supramolecular assembly is oriented in the flow direction.

Thus, in order to be able to apply | coat a coating liquid with respect to a board | substrate, various apparatuses are conventionally proposed. For example, the polarizing film printing apparatus of patent document 1 has the table for holding a board | substrate, and the slot die which discharges ink liquid to a board | substrate. The ink solution is applied to the substrate by moving the slot die in the printing direction.

Japanese Patent Laid-Open No. 2005-62502

The technique which forms an optical member, such as a circularly polarizing plate, by apply | coating and drying a coating liquid on a board | substrate is developed and examined.

Conventionally, the board | substrate with which the coating liquid for optical members is apply | coated was prepared separately and joined to the board | substrate with which the organic light emitting diode was formed.

Therefore, the number of parts, such as a board | substrate and an adhesive layer, was large, the thickness of organic electroluminescent display was not enough, and the flexibility of organic electroluminescent display was not enough.

This invention is made | formed in view of the said subject, and makes it a main object to provide the organic electroluminescent display provided with the optical member which improved thinning and flexibility.

In order to solve the said subject, according to one aspect of the present invention,

The manufacturing method of the organic electroluminescent display which has the optical member formation process of forming the optical film in which liquid crystal molecules were oriented is provided by apply | coating and drying the coating liquid for optical films containing a liquid crystal molecule and a solvent on the board | substrate with which the organic light emitting diode was previously formed. do.

According to one aspect of the present invention, there is provided an organic EL display having an optical member having improved thickness and flexibility.

1 is a plan view illustrating an organic EL display according to an embodiment.
2 is a cross-sectional view showing main parts of an organic EL display according to one embodiment.
3 is a flowchart showing a method for manufacturing an organic EL display according to an embodiment.
4 is a flowchart showing a touch sensor forming process according to an embodiment.
5 is a cross-sectional view showing a first metal film formed on a substrate according to one embodiment.
6 is a cross-sectional view showing a resist film formed on a first metal film according to one embodiment.
7 is a cross-sectional view showing a resist film after exposure and development according to one embodiment.
8 is a cross-sectional view showing a first metal film after etching according to one embodiment.
9 is a cross-sectional view showing a first metal film after removal of the resist film according to one embodiment.
10 is a cross-sectional view showing an insulating film formed on a first metal film according to one embodiment.
11 is a plan view showing a state after a partial removal of the second metal film formed on the insulating film according to the embodiment.
It is a flowchart which shows the optical member formation process which concerns on 1st Embodiment.
It is a side view which shows the liquid film of the coating liquid for 1st optical films apply | coated on the board | substrate which concerns on 1st Embodiment.
It is a side view which shows the 1st optical film formed by drying the liquid film of the coating liquid for 1st optical films which concerns on 1st Embodiment.
FIG. 15 is a side view showing a partially insoluble first optical film according to the first embodiment. FIG.
It is a side view which shows the liquid film of the coating liquid for intermediate films apply | coated on the 1st optical film which concerns on 1st Embodiment.
It is a side view which shows the intermediate film formed by drying the liquid film of the coating liquid for intermediate films which concerns on 1st Embodiment.
It is a side view which shows the 1st optical film in which the part not covered with the intermediate film which concerns on 1st Embodiment was removed.
It is a side view which shows the liquid film of the coating liquid for 2nd optical films apply | coated on the intermediate film which concerns on 1st Embodiment.
It is a side view which shows the 2nd optical film formed by drying the liquid film of the coating liquid for 2nd optical films which concerns on 1st Embodiment.
21 is a side view showing a part of the second optical film insolubilized according to the first embodiment.
It is a side view which shows the liquid film of the coating liquid for protective films apply | coated on the 2nd optical film which concerns on 1st Embodiment.
It is a side view which shows the protective film formed by drying the liquid film of the coating liquid for protective films which concerns on 1st Embodiment.
It is a side view which shows the 2nd optical film in which the part not covered with the protective film by 1st Embodiment was removed.
It is a flowchart which shows the optical member formation process which concerns on 2nd Embodiment.
It is a side view which shows the 1st optical film in which the part which was not insolubilized by 2nd Embodiment was removed.
It is a side view which shows the liquid film of the coating liquid for intermediate films apply | coated on the 1st optical film which concerns on 2nd Embodiment.
It is a side view which shows the intermediate film formed by drying the liquid film of the coating liquid for intermediate films which concerns on 2nd Embodiment.
It is a side view which shows the liquid film of the coating liquid for 2nd optical films apply | coated on the intermediate film which concerns on 2nd Embodiment.
It is a side view which shows the 2nd optical film formed by drying the liquid film of the coating liquid for 2nd optical films which concerns on 2nd Embodiment.
31 is a side view showing a part of the second optical film insolubilized according to the second embodiment.
It is a side view which shows the 2nd optical film in which the part which was not insolubilized by 2nd Embodiment was removed.
It is a side view which shows the liquid film of the coating liquid for protective films apply | coated on the 2nd optical film which concerns on 2nd Embodiment.
It is a side view which shows the protective film formed by drying the liquid film of the coating liquid for protective films which concerns on 2nd Embodiment.

EMBODIMENT OF THE INVENTION Hereinafter, the form for implementing this invention is demonstrated with reference to drawings. In each figure, the same or corresponding code | symbol is attached | subjected to the same or corresponding structure, and description is abbreviate | omitted.

<Organic EL display>

1 is a plan view illustrating an organic EL display according to an embodiment. In FIG. 1, the circuit of one unit circuit 11 is expanded and shown.

The organic EL display 1 includes a substrate 10, a plurality of unit circuits 11 arranged on the substrate 10, a scan line driver circuit 14 provided on the substrate 10, and a substrate 10. Has a data line driver circuit 15 provided on the circuit board. The unit circuit 11 is provided in an area surrounded by a plurality of scan lines 16 connected to the scan line driver circuit 14 and a plurality of data lines 17 connected to the data line driver circuit 15. The unit circuit 11 includes a TFT layer 12 and an organic light emitting diode 13.

The TFT layer 12 has a plurality of TFTs (Thin Film Transistors). One TFT has a function as a switching element, and the other TFT has a function as a current control element for controlling the amount of current flowing through the organic light emitting diode 13. The TFT layer 12 is operated by the scan line driver circuit 14 and the data line driver circuit 15, and supplies current to the organic light emitting diode 13. The TFT layer 12 is provided for each unit circuit 11, and the plurality of unit circuits 11 are independently controlled. In addition, the TFT layer 12 should just be a general structure, and is not limited to the structure shown in FIG.

In addition, although the drive system of the organic EL display 1 is an active matrix system in this embodiment, a passive matrix system may be sufficient.

2 is a cross-sectional view showing main parts of an organic EL display according to one embodiment. The organic EL display 1 shown in FIG. 2 is a top emission system, and the substrate 10, the organic light emitting diode 13, the sealing layer 30, the touch sensor 40, and the optical member 50 in this order. Have The touch sensor 40 is inserted in the organic EL display 1 when the organic EL display 1 is a touch panel.

The substrate 10 may be any of a resin substrate, a glass substrate, a semiconductor substrate, a metal substrate, and the like, and is preferably a resin substrate from the viewpoint of flexibility improvement. The board | substrate 10 may be a laminated board | substrate of a resin substrate and a glass substrate from a viewpoint of a flexibility improvement and a water permeability fall. The TFT layer 12 is formed on the substrate 10. On the TFT layer 12, the planarization layer 18 which flattens the level | step difference formed by the TFT layer 12 is formed.

The planarization layer 18 has insulation. Contact plugs 19 are formed in the contact holes penetrating the planarization layer 18. The contact plug 19 electrically connects the pixel electrode 21 formed on the flat surface of the planarization layer 18 and the TFT layer 12. The contact plug 19 may be formed simultaneously with the same material as the pixel electrode 21.

The organic light emitting diode 13 is formed on the flat surface of the planarization layer 18. The organic light emitting diode 13 includes a pixel electrode 21, a counter electrode 22 provided on a side opposite to the substrate 10 based on the pixel electrode 21, a pixel electrode 21, and a counter electrode 22. ) Has an organic layer 23 formed therebetween. By operating the TFT layer 12, a voltage is applied between the pixel electrode 21 and the counter electrode 22, and the organic layer 23 emits light.

The pixel electrode 21 is, for example, a cathode, is formed of a metal material such as aluminum, and reflects light from the organic layer 23 toward the organic layer 23. Light reflected from the pixel electrode 21 passes through the organic layer 23 and the counter electrode 22 and is taken out to the outside. The pixel electrode 21 is provided for each unit circuit 11.

The counter electrode 22 is, for example, an anode, formed of a transparent material such as indium tin oxide (ITO), and transmits light from the organic layer 23. Light transmitted through the counter electrode 22 passes through the sealing layer 30, the touch sensor 40, and the optical member 50, and is taken out to the outside. The counter electrode 22 is common to the plurality of unit circuits 11.

The organic layer 23 includes, for example, the electron injection layer 24, the electron transport layer 25, the light emitting layer 26, the hole transport layer 27, and the hole injection layer 28 in this order from the cathode side to the anode side. Have When a voltage is applied between the cathode and the anode, electrons are injected from the cathode to the electron injection layer 24, and holes are injected from the anode to the hole injection layer 28. Electrons injected into the electron injection layer 24 are transported to the light emitting layer 26 by the electron transport layer 25. In addition, holes injected into the hole injection layer 28 are transported to the light emitting layer 26 by the hole transport layer 27. Thus, holes and electrons recombine in the light emitting layer 26 to excite the light emitting material of the light emitting layer 26, and the light emitting layer 26 emits light. As the light emitting layer 26, for example, a red light emitting layer emitting red light, a green light emitting layer emitting green light, and a blue light emitting layer emitting blue light are formed.

In addition, in this embodiment, the organic layer 23 has the electron injection layer 24, the electron transport layer 25, the light emitting layer 26, the hole transport layer 27, and the hole injection layer 28 from the cathode side toward the anode side. ) In this order, but may have at least the light emitting layer 26. The organic layer 23 is not limited to the structure shown in FIG.

The sealing layer 30 seals the organic light emitting diode 13 with the substrate 10. As the sealing layer 30, a silicon oxide layer, a silicon nitride layer, or the like is used, and is formed by, for example, low temperature CVD with a film formation temperature of 100 ° C or lower. Or you may make the sealing layer 30 adhere | attach the resin film in which the moisture proof layer was formed.

The touch sensor 40 detects contact or proximity of an object such as a finger to the screen of the organic EL display 1. Although the detection method of the touch sensor 40 is not specifically limited, For example, the capacitance method may be sufficient. Examples of the capacitance method include a surface type capacitance method and a projection type capacitance method. Examples of the projected capacitive type include a self-capacitance type and a mutual capacitance type. The mutual capacitance method is preferable because simultaneous multi-point detection is possible.

Although the touch sensor 40 is mentioned later in detail, the touch sensor 40 is formed on the board | substrate 10 with which the organic light emitting diode 13 was previously formed. Therefore, since the touch sensor 40 is formed on a substrate separate from the substrate 10 as in the related art, compared with the case where the touch sensor 40 is bonded to the substrate 10, the number of parts such as the substrate and the adhesive layer can be reduced. The organic EL display 1 can be thinned and the flexibility of the organic EL display 1 can be improved.

The touch sensor 40 is formed between the organic light emitting diode 13 and the optical member 50. When the optical member 50 is a circularly polarizing film which suppresses reflection of external light, since the circularly polarizing film is disposed on the light extraction side rather than the touch sensor 40, the suppression efficiency of external light reflection can be improved.

The optical member 50 is a circularly polarizing film which suppresses reflection of external light, for example, and in this embodiment, has a quarter wavelength film ((lambda) / 4 film) as a 1st optical film, and uses a linear polarizing film as a 2nd optical film. Have The 1/4 wavelength film and the linear polarizing film are formed so that their polarization axes intersect at 45 degrees. In addition, the number of the optical films which comprise the optical member 50 is not specifically limited.

Although the optical member 50 is mentioned later in detail, it is formed on the board | substrate 10 with which the organic light emitting diode 13 was previously formed. Therefore, since the optical member 50 is formed in the board | substrate separate from the board | substrate 10 like conventionally, and compared with the case where it is bonded with the board | substrate 10, the number of components, such as a board | substrate and an adhesive layer, can be reduced, The organic EL display 1 can be thinned and the flexibility of the organic EL display 1 can be improved.

In order to suppress deterioration by the ultraviolet-ray of the organic layer 23, the optical member 50 is manufactured without using ultraviolet irradiation. In addition, in order to suppress deterioration by the heat of the organic layer 23, the optical member 50 is manufactured at the temperature of 100 degrees C or less.

In addition, although the organic electroluminescence display 1 shown in FIG. 2 is a top emission system, a bottom emission system may be sufficient. In the case of the bottom emission method, since the light from the light emitting layer 26 passes through the pixel electrode 21 and is extracted from the substrate 10, the anode, which is a transparent electrode, is used as the pixel electrode 21, and the cathode, which is a reflective electrode, is used. It is used as this counter electrode 22. That is, in the case of the bottom emission method, the arrangement of the anode and the cathode is reversed. In the case of a bottom emission method, the substrate 10 is a transparent substrate. In the case of the bottom emission method, the touch sensor 40 and the optical member 50 are formed on the side opposite to the organic light emitting diode 13 on the basis of the substrate 10.

<Method for Manufacturing Organic EL Display>

3 is a flowchart showing a method for manufacturing an organic EL display according to one embodiment. As shown in FIG. 3, the manufacturing method of the organic electroluminescent display 1 has touch sensor formation process S110, and optical member formation process S120. In addition, touch sensor formation process S110 is performed when the organic electroluminescent display 1 is a touch panel. Hereinafter, each process is demonstrated.

<Touch Sensor Forming Process>

In the touch sensor forming step S110, before the optical member forming step S120, the touch sensor 40 is formed on the substrate 10 on which the organic light emitting diode 13 is formed in advance. Therefore, since the touch sensor 40 is formed on a substrate separate from the substrate 10 as in the related art, compared with the case where the touch sensor 40 is bonded to the substrate 10, the number of parts such as the substrate and the adhesive layer can be reduced. The organic EL display 1 can be thinned and the flexibility of the organic EL display 1 can be improved.

4 is a flowchart showing a touch sensor forming step according to one embodiment. 5 is a cross-sectional view showing a first metal film formed on a substrate according to one embodiment. 6 is a cross-sectional view showing a resist film formed on a first metal film according to one embodiment. 7 is a cross-sectional view showing a resist film after exposure and development according to one embodiment. 8 is a cross-sectional view showing a first metal film after etching according to one embodiment. 9 is a cross-sectional view showing a first metal film after removal of the resist film according to one embodiment. 10 is a cross-sectional view showing an insulating film formed on a first metal film according to one embodiment. 11 is a plan view showing a state after a partial removal of the second metal film formed on the insulating film according to the embodiment. 5-10 is sectional drawing along the A-A line | wire of FIG. 5-11, illustration of the organic light emitting diode 13, the sealing layer 30, etc. which are shown in FIG. 2 is abbreviate | omitted.

In the touch sensor forming step S110, a step S111 of forming the light-shielding first metal film 41 on the substrate 10 and a part of the first metal film 41 are selectively performed by a photolithography method and an etching method. It has a process S112 to remove. As shown in FIG. 5, the first metal film 41 is formed on the substrate 10 (more specifically, on the sealing layer 30, for example). On the first metal film 41, a resist film 42 is formed as shown in FIG. The resist film 42 is patterned as shown in FIG. 7 by exposure and development. The resist film 42 may be a positive type in which the exposed part is removed by development, or may be a negative type in which the exposed part remains after development. Since light of exposure is shielded by the first metal film 41, the organic light emitting diode 13 is not degraded. Thereafter, using the patterned resist film 42 as a mask, a portion of the first metal film 41 is selectively removed as shown in FIG. The first metal film 41 in which a portion is selectively removed is formed into stripes in plan view, as indicated by broken lines in FIG. 11. Thereafter, the resist film 42 used for patterning the first metal film 41 is removed as shown in FIG. 9.

In this specification, the light shielding property of the first metal film 41 means that the transmittance of the first metal film 41 is 5% or less. The transmittance of the first metal film 41 is preferably 3% or less. Here, the transmittance of the first metal film 41 is that light (for example, light having a wavelength of 365 nm) of the exposure of the resist film 42 formed on the first metal film 41 causes the first metal film 41 to have a transmittance. Refers to the rate of transmission. The first metal film 41 is made of copper, for example.

In addition, touch sensor formation process S110 has the process S113 of forming the insulating film 43 on the 1st metal film 41 from which one part was selectively removed. The insulating film 43 insulates the first metal film 41 from the second metal film 45. As the insulating film 43, a silicon oxide film, a silicon nitride film, or the like is used, and is formed by, for example, low temperature CVD with a film formation temperature of 100 ° C or lower.

In the touch sensor forming step S110, a part of the second metal film 45 is formed by step S114 of forming the light-shielding second metal film 45 on the insulating film 43, and by a photolithography method and an etching method. And selectively removing step S115. The formation of the second metal film 45 and the partial removal of the second metal film are performed in the same manner as the formation of the first metal film 41 and the partial removal of the first metal film 41. As shown in FIG. 11, the second metal film 45 with a part of which is selectively removed is formed in stripes in plan view. Thereafter, the resist film used for patterning the second metal film 45 is removed.

In this specification, the light shielding property of the second metal film 45 means that the transmittance of the second metal film 45 is 5% or less. The transmittance of the second metal film 45 is preferably 3% or less. Here, the transmittance of the second metal film 45 is the ratio of the light (for example, light having a wavelength of 365 nm) of exposure of the resist film formed on the second metal film 45 to pass through the second metal film 45. Say. The second metal film 45 is made of copper, for example.

In addition, touch sensor formation process S110 has the process S116 of forming the touch sensor protective film 47 on the 2nd metal film 45 from which one part was selectively removed. The touch sensor protective film 47 is formed in the same manner as the insulating film 43. For example, a silicon oxide film, a silicon nitride film, or the like is used as the touch sensor protective film 47, and is formed by, for example, low temperature CVD with a film formation temperature of 100 ° C or lower.

In this way, a touch sensor 40 composed of the first metal film 41, the insulating film 43, the second metal film 45, and the touch sensor protective film 47 is obtained. As shown in FIG. 11, the wire-shaped first metal film 41 and the wire-shaped second metal film 45 do not overlap with the organic layer 23 of the organic light emitting diode 13 in plan view. It is formed in a lattice shape. That is, the organic layer 23 is arrange | positioned at the opening part which is a rectangular grid when viewed in plan. It is easy to take out the light from the organic layer 23 to the outside. One of the first metal film 41 and the second metal film 45 is used as a driving electrode, and the other is used as a receiving electrode. The touch sensor 40 detects contact or proximity of an object such as a finger to the screen of the organic EL display 1 by detecting a change in capacitance between the driving electrode and the receiving electrode.

According to the touch sensor formation process S110 of this embodiment, on the board | substrate 10 in which the organic light emitting diode 13 was formed previously, suppressing deterioration of the organic layer 23 of the organic light emitting diode 13 by exposure of the photolithographic method. The touch sensor 40 may be formed at the. Since the touch sensor 40 is formed on a substrate separate from the substrate 10 and bonded to the substrate 10 as in the related art, the number of parts such as the substrate and the adhesive layer can be reduced, so that the organic EL The display 1 can be thinned and the flexibility of the organic EL display 1 can be improved.

Since the touch sensor forming step S110 of the present embodiment is performed before the optical member forming step S120, the touch sensor 40 is formed between the organic light emitting diode 13 and the optical member 50. When the optical member 50 is a circularly polarizing film which suppresses reflection of external light, since the circularly polarizing film is disposed on the light extraction side rather than the touch sensor 40, the suppression efficiency of external light reflection can be improved.

<Optical member forming process>

Optical member formation process S120 forms the optical film in which liquid crystal molecules were oriented by apply | coating and drying the coating liquid for optical films containing a liquid crystal molecule and a solvent on the board | substrate 10 with which the organic light emitting diode 13 was previously formed. The optical member 50 is comprised with an optical film.

The optical member 50 has a 1st optical film and a 2nd optical film, for example. One of a 1st optical film and a 2nd optical film is a retardation film, and the other is a polarizing film.

The optical member 50 is a circularly polarizing film which suppresses reflection of external light, for example, and in this embodiment, has a quarter wavelength film ((lambda) / 4 film) as a 1st optical film, and uses a linear polarizing film as a 2nd optical film. Have The 1/4 wavelength film and the linear polarizing film are formed so that their polarization axes intersect at 45 degrees. In addition, the number of the optical films which comprise the optical member 50 is not specifically limited.

According to the optical member formation process S120 of this embodiment, the optical member 50 is formed on the board | substrate 10 with which the organic light emitting diode 13 was previously formed. Therefore, since the optical member 50 is formed in the board | substrate separate from the board | substrate 10 like conventionally, and compared with the case where it is bonded with the board | substrate 10, the number of components, such as a board | substrate and an adhesive layer, can be reduced, The organic EL display 1 can be thinned and the flexibility of the organic EL display 1 can be improved.

According to optical member formation process S120 of this embodiment, the optical member 50 is manufactured without using ultraviolet irradiation in order to suppress deterioration by the ultraviolet-ray of the organic layer 23. FIG. In addition, in order to suppress deterioration by the heat of the organic layer 23, the optical member 50 is manufactured at the temperature of 100 degrees C or less.

<Optical member forming step of the first embodiment>

12 is a flowchart showing an optical member forming process according to the first embodiment. As shown in FIG. 12, the optical member forming step S120 includes the first optical film forming step S121, the intermediate film forming step S122, the first optical film patterning step S123, the second optical film forming step S124, and the protective film forming step. S125 and 2nd optical film patterning process S126 are provided in this order. Hereinafter, each process is demonstrated.

In addition, all the processes shown in FIG. 12 may not be performed. For example, although described later in detail, the first optical film patterning step S123 and the second optical film patterning step S126 are effective when a plurality of optical members 50 are formed on the substrate 10 at intervals. When only one 50 is formed on the substrate 10, it may be omitted. The same applies to the processing of some insolubilization described later.

In addition, processes other than the process shown in FIG. 12 may be performed. For example, in order to improve the adhesion of the first optical film to the substrate 10 before the first optical film forming step S121, the surface on which the first optical film of the substrate 10 is formed (more specifically, the sealing layer 30) Alternatively, the step of surface modification of the touch sensor protective film 47 may be performed. As the surface modification film, an organic film such as a silane coupling agent or an inorganic film such as silicon nitride may be formed.

<1st optical film formation process of 1st embodiment>

In the first optical film forming step S121 of FIG. 12, as shown in FIGS. 13 to 15, the coating liquid 61 for coating the first optical film containing liquid crystal molecules and a solvent is applied onto the substrate 10 and dried. 1 The optical film 62 is formed. The first optical film 62 is, for example, a quarter wavelength film.

It is a side view which shows the liquid film of the coating liquid for 1st optical films apply | coated on the board | substrate which concerns on 1st Embodiment. FIG. 14: is a side view which shows the 1st optical film formed by drying of the liquid film of the coating liquid for 1st optical films which concerns on 1st Embodiment. FIG. FIG. 15 is a side view showing a partially insoluble first optical film according to the first embodiment. FIG.

In FIGS. 13-15, illustration of the organic light emitting diode 13, the sealing layer 30, etc. which are shown in FIG. 2 is abbreviate | omitted. 16-24, illustration of the organic light emitting diode 13, the sealing layer 30, etc. which are shown similarly to FIG. 2 is abbreviate | omitted.

As shown in FIG. 13, in 1st optical film formation process S121, the coating liquid 61 for 1st optical films is apply | coated from the application | coating nozzle 60 on the board | substrate 10. FIG. The application nozzle 60 is, for example, a slit coater having a slit discharge port on its lower surface.

The coating liquid 61 for 1st optical film contains liquid crystal molecules, such as a lyotropic liquid crystal molecule and a thermotropic liquid crystal molecule, and the solvent which melt | dissolves a liquid crystal molecule. As a solvent, water etc. are used, for example. In addition, an organic solvent may be used as the solvent.

By moving the coating nozzle 60 and the substrate 10 in one direction, shear stress can be applied to the coating liquid 61 for the first optical film applied to the substrate 10. The direction of action of the shear stress coincides with the relative moving direction of the coating nozzle 60 and the substrate 10. By controlling the direction of action of the shear stress, the alignment direction of the liquid crystal molecules can be controlled.

In addition, in this embodiment, although the slit coater is used for application | coating of the coating liquid 61 for 1st optical films, a dip coater etc. may be used. Shear stress can be applied to the coating liquid 61 for 1st optical film, and the direction of action of the shear stress should just be controllable.

As shown in FIG. 14, in 1st optical film formation process S121, the liquid film (refer FIG. 13) of the coating liquid 61 for 1st optical films apply | coated on the board | substrate 10 is dried, and the 1st optical film 62 ). A solvent is removed from the liquid film of the coating liquid 61 for 1st optical films, and the orientation of a liquid crystal molecule is maintained suitably. The first optical film 62 is, for example, a quarter wavelength film.

Decompression drying, natural drying, heat drying, wind drying, etc. are used for drying the liquid film of the coating liquid 61 for 1st optical films. Decompression drying can shorten processing time rather than natural drying. In addition, compared with heat drying and wind drying, reduced-pressure drying can suppress convection of a liquid film, and can suppress the confusion of the orientation of a liquid crystal molecule. When the solvent remains in the reduced pressure drying, heat drying may be further performed.

As shown in FIG. 15, in the first optical film forming step S121, only a part 63 of the first optical film 62 may be insolubilized with respect to the cleaning liquid used in the first optical film patterning step S123. This partial insolubilization is performed as needed.

As the cleaning liquid used in the first optical film patterning step S123, the same solvent as that of the coating liquid 61 for the first optical film may be used, for example, water may be used. In this case, insolubilization of water is performed.

The fixing liquid 110 which insolubilizes a portion 63 of the first optical film 62 is discharged from, for example, the inkjet coating nozzle 111. The application nozzle 111 has a plurality of discharge nozzles for discharging droplets of the fixing liquid 110 on the lower surface.

By discharging the droplets of the fixing liquid 110 from the coating nozzle 111 while relatively moving the coating nozzle 111 and the substrate 10, the fixing liquid 110 is applied to a part 63 of the first optical film 62. Apply selectively. As a result, part 63 of the first optical film 62 is insolubilized.

The fixer 110 replaces a portion 63 of the first optical film 62 by, for example, replacing a functional group (eg, a water-soluble functional group such as an OH group) at the end of the first optical film 62 with another functional group. Insolubilize In addition, the fixing solution 110 may be insolubilized by part of the first optical film 62 by polymerizing by a condensation reaction (dehydration condensation reaction such as an OH group). In the latter case, insolubilization tends to proceed because of the progress of polymerization as compared with the former case.

The fixer 110 is removed after insolubilizing a portion 63 of the first optical film 62. The fixer 110 may contain water or may contain an organic solvent.

The area | region to which the fixer 110 is apply | coated may be the area | region (henceforth a "pixel area" hereafter) in which two or more pixels, such as OLED, are formed.

In addition, in this embodiment, although the application nozzle 111 of the inkjet system is used in order to apply | coat the fixer 110 only to the one part 63 of the 1st optical film 62, this invention is not limited to this. For example, even if only the remainder of the first optical film 62 is covered with a mask, and then the entire substrate 10 is immersed in the fixer 110, the fixer may be applied only to a portion 63 of the first optical film 62. good.

<Intermediate film formation process of 1st Embodiment>

In the intermediate film forming step S122 of FIG. 12, as shown in FIGS. 16 to 17, an intermediate film coating liquid 71 different from the first optical film coating liquid 61 is applied onto the first optical film 62. The intermediate film 72 is formed by drying.

It is a side view which shows the liquid film of the coating liquid for intermediate films apply | coated on the 1st optical film which concerns on 1st Embodiment. It is a side view which shows the intermediate film formed by drying the liquid film of the coating liquid for intermediate films which concerns on 1st Embodiment.

As shown in FIG. 16, in intermediate film formation process S122, the coating liquid 71 for intermediate films is apply | coated from the application | coating nozzle 70 on the board | substrate 10 with which the 1st optical film 62 was formed. The coating nozzle 70 may be an inkjet method and has a plurality of discharge nozzles for discharging droplets of the coating liquid 71 for interlayer film on the lower surface.

By discharging droplets of the coating liquid 71 for intermediate film from the coating nozzle 70 while relatively moving the coating nozzle 70 and the board | substrate 10, it is used for the intermediate film in a part 63 of the 1st optical film 62. The coating liquid 71 is selectively applied.

The coating liquid 71 for intermediate film is apply | coated on the 1st optical film 62. As shown in FIG. Therefore, the liquid crystal molecule which forms the 1st optical film 62 may have insoluble with respect to the solvent of the coating liquid 71 for intermediate films. The application of the intermediate liquid coating liquid 71 can prevent the first optical film 62 from melting.

The coating liquid 71 for an interlayer film contains the organic material which forms the interlayer film 72, and the solvent which melt | dissolves this organic material. The organic material which forms the intermediate film 72 contains insoluble polymer etc. with respect to the washing | cleaning liquid used at 1st optical film patterning process S123.

As the intermediate liquid coating liquid 71, for example, a thermosetting transparent coating, a chemical reaction transparent coating, a dry curing transparent coating, or the like is used. Specifically, an oil-based enamel paint, a phthalic resin paint, etc. are used.

Since the thermosetting transparent coating, the chemical reaction transparent coating, the dry curing transparent coating, and the like are polymerized by thermosetting, chemical reaction, or dry curing, a dense interlayer film 72 can be formed. Therefore, insolubility to the cleaning liquid used in the 1st optical film patterning process S123 of the intermediate film 72 can be improved.

The coating liquid 71 for an interlayer film may have the same function as the fixer 110. Partial insolubilization of the first optical film 62 can be promoted. In addition, when partial insolubilization of the 1st optical film 62 is performed by the coating liquid 71 for intermediate films, it is not necessary to partially insolubilize the 1st optical film 62 in the said 1st optical film formation process S121. .

For example, the coating liquid 71 for intermediate film replaces the functional group (for example, water-soluble functional group, such as an OH group) of the terminal of the 1st optical film 62, and replaces a part of 1st optical film 62 ( 63) may be insolubilized. In addition, the coating liquid 71 for intermediate films may insolubilize a part 63 of the first optical film 62 by polymerizing by a condensation reaction (dehydration condensation reaction such as OH group). In the latter case, insolubilization tends to proceed because of the progress of polymerization as compared with the former case.

The area | region to which the coating liquid 71 for intermediate films is apply | coated may correspond with the area | region to which the fixer 110 is apply | coated. For example, the area | region to which the coating liquid 71 for intermediate films is apply | coated may be the pixel area | region on the board | substrate 10. FIG.

As shown in FIG. 17, in intermediate film formation process S122, the liquid film (refer FIG. 16) of the coating liquid 71 for intermediate films apply | coated on the board | substrate 10 is dried, and the intermediate film 72 is formed. The solvent is removed from the liquid film of the coating liquid 71 for interlayer film, and the interlayer film 72 is formed.

Pressure drying, natural drying, heat drying, wind drying and the like are used for drying the liquid film of the coating liquid 71 for interlayer film. Decompression drying can shorten processing time rather than natural drying. When the solvent remains in the reduced pressure drying, heat drying may be further performed.

The interlayer film 72 is insoluble in the cleaning liquid used in the first optical film patterning step S123. The intermediate film 72 has an isotropic optical characteristic, unlike the first optical film 62. It is preferable that the visible light transmittance of the interlayer film 72 is 95% or more. Moreover, it is preferable that the film thickness of the intermediate film 72 is 10 micrometers or less. In addition, the smaller the residual stress of the intermediate film 72 is, in order to suppress deformation of the optical member.

The intermediate film 72 covers the main surface of a portion 63 of the first optical film 62. The intermediate film 72 also serves to protect a portion 63 of the first optical film 62 so that damage, foreign matter, and the like do not occur in the portion 63 of the first optical film 62. It is preferable that the pencil hardness of the interlayer film 72 is 2H or more. It is particularly effective when the manufacturing of the optical member is temporarily stopped in the middle and it takes time to resume, since the risk of damage or foreign matter is high.

In addition, since the remainder of the first optical film 62 is removed in the first optical film patterning step S123, damage or foreign matter does not become a problem. In addition, the foreign matter generated in the intermediate film 72 can be removed by washing, and the cleaning does not damage part of the first optical film 62.

<1st optical film patterning process of 1st Embodiment>

In the first optical film patterning step S123 of FIG. 12, the intermediate film 72 covering only a portion 63 (see FIG. 17) of the first optical film 62 after the intermediate film forming step S122 and before the second optical film forming step S124. ) Is used as a mask to remove the remainder of the first optical film 62 as shown in FIG. 18.

FIG. 18: is a side view which shows the 1st optical film in which the part not covered with the intermediate film which concerns on 1st Embodiment was removed. FIG. During the first optical film patterning step S123, a part 63 of the first optical film 62 can be protected by the intermediate film 72, and the shape collapse of the part 63 of the first optical film 62 is suppressed. can do. Therefore, the quality of an optical member can be improved.

For example, in 1st optical film patterning process S123, the washing | cleaning liquid which melt | dissolves the 1st optical film 62 is used. The cleaning liquid is supplied to the substrate 10 while, for example, rotating the substrate 10 with a spin chuck. The cleaning liquid supplied to the substrate 10 is spread over the entire substrate 10 by centrifugal force, and shaken off from the outer peripheral edge of the substrate 10.

Since a part 63 of the first optical film 62 is covered with the intermediate film 72, the first optical film 62 is not in contact with the cleaning liquid, and no shape collapse occurs by the cleaning liquid. On the other hand, since the remainder of the first optical film 62 is in contact with the cleaning liquid, it is melted and removed by the cleaning liquid.

In addition, the cleaning liquid is stored in the cleaning tank, and by immersing the substrate 10 in the cleaning liquid of the cleaning tank, the remainder of the first optical film 62 may be dissolved and removed while leaving a part 63 of the first optical film 62. good. The washing liquid of the washing tank may be stirred with a stirring blade or the like.

In the first optical film forming step S121 or the intermediate film forming step S122, a part 63 of the first optical film 62 is insoluble with respect to the cleaning liquid so that a part 63 of the first optical film 62 remains reliably. It is available to make money. Excessive removal can be prevented by entering the cleaning liquid, and part of the first optical film 62 can be reliably left.

In addition, since the interlayer film 72 has an insolubility in the cleaning liquid, even in the first optical film forming step S121 or the interlayer film forming step S122, even if the first optical film 62 is not partially insolubilized, the first optical film is not insoluble. Patterning of 62 is possible. In this case, the number of steps can be reduced.

In the first optical film forming step S121, since the first optical film coating liquid 61 is applied while applying a shear stress, it is difficult to apply the first optical film coating liquid 61 only to the pixel region. Therefore, it is effective to perform 1st optical film patterning process S123.

In addition, in this embodiment, although the remainder of the 1st optical film 62 is removed using a washing | cleaning liquid, the removal method of the remainder of the 1st optical film 62 is not specifically limited. For example, an etching method may be used. Etching may be either wet etching or dry etching.

Hereinafter, the part 63 of the 1st optical film 62 which remains in 1st optical film patterning process S123 is also called "the 1st optical film 63."

<2nd optical film formation process of 1st embodiment>

In the second optical film forming step S124 of FIG. 12, as shown in FIGS. 19 to 21, the coating liquid 81 for the second optical film containing the liquid crystal molecules and the solvent is applied onto the intermediate film 72 and dried. Two optical films 82 are formed. The second optical film 82 is, for example, a linear polarizing film.

19-21 is explanatory side view of the 2nd optical film formation process which concerns on 1st Embodiment. It is a side view which shows the liquid film of the coating liquid for 2nd optical films apply | coated on the intermediate film which concerns on 1st Embodiment. It is a side view which shows the 2nd optical film formed by drying of the liquid film of the coating liquid for 2nd optical films which concerns on 1st Embodiment. FIG. 21: is a side view which shows the partially insolubilized 2nd optical film which concerns on 1st Embodiment. FIG.

As shown in FIG. 19, in 2nd optical film formation process S124, the coating liquid 81 for 2nd optical films is apply | coated from the application | coating nozzle 80 on the board | substrate 10. FIG. The application nozzle 80 is, for example, a slit coater having a slit discharge port on its lower surface.

The coating liquid 81 for the second optical film is applied onto the intermediate film 72. Therefore, the organic material which forms the intermediate film 72 may have insolubility with respect to the solvent of the coating liquid 81 for 2nd optical films. The application of the coating liquid 81 for the second optical film can prevent the intermediate film 72 from melting.

The coating liquid 81 for 2nd optical film contains liquid crystal molecules, such as a lyotropic liquid crystal molecule and a thermotropic liquid crystal molecule, and the solvent which melt | dissolves a liquid crystal molecule. As a solvent, water etc. are used, for example. In addition, an organic solvent may be used as the solvent.

By moving the application | coating nozzle 80 and the board | substrate 10 relatively in one direction, a shear stress can be applied to the coating liquid 81 for 2nd optical films apply | coated to the board | substrate 10. FIG. The direction of action of the shear stress coincides with the relative moving direction of the coating nozzle 80 and the substrate 10. By controlling the direction of action of the shear stress, the alignment direction of the liquid crystal molecules can be controlled.

The direction of action of the shear stress in the second optical film forming step S124 becomes a direction intersecting at an inclination of 45 ° with respect to the direction of action of the shear stress in the first optical film forming step S121. As a result, the 1/4 wavelength film and the linear polarizing film are formed so that their polarization axes intersect at 45 degrees.

In addition, in this embodiment, although the slit coater is used for application | coating of the coating liquid 81 for 2nd optical films, a dip coater etc. may be used. Shear stress can be applied to the coating liquid 81 for 2nd optical film, and the direction of action of the shear stress should just be controllable.

As shown in FIG. 20, in 2nd optical film formation process S124, the liquid film (refer FIG. 19) of the coating liquid 81 for 2nd optical films apply | coated on the board | substrate 10 is dried, and the 2nd optical film 82 is carried out. ). A solvent is removed from the liquid film of the coating liquid 81 for 2nd optical films, and the orientation of a liquid crystal molecule is maintained suitably. The second optical film 82 is, for example, a linear polarizing film.

Pressure drying, natural drying, heat drying, wind drying, or the like is used for drying the liquid film of the coating liquid 81 for the second optical film. Decompression drying can shorten processing time rather than natural drying. In addition, compared with heat drying and wind drying, reduced-pressure drying can suppress the convection of a liquid film, and can suppress the confusion of the orientation of a liquid crystal molecule. When the solvent remains in the reduced pressure drying, heat drying may be further performed.

As shown in FIG. 21, in the second optical film forming step S124, only a part 83 of the second optical film 82 may be insolubilized with respect to the cleaning liquid used in the second optical film patterning step S126. This partial insolubilization is performed as needed.

As the cleaning liquid used in the second optical film patterning step S126, the same solvent as the solvent of the coating liquid 81 for the second optical film may be used, for example, water may be used. In this case, insolubilization of water is performed.

The fixing liquid 120 which insolubilizes a part 83 of the second optical film 82 is discharged from, for example, an inkjet coating nozzle 121. The application nozzle 121 has a plurality of discharge nozzles for discharging droplets of the fixer 120 on the lower surface.

While the application nozzle 121 and the substrate 10 are relatively moved, the droplet of the fixing solution 120 is discharged from the application nozzle 121, thereby fixing the fixing solution 120 to a part 83 of the second optical film 82. Apply selectively. As a result, a part 83 of the second optical film 82 is insolubilized.

For example, the fixer 120 replaces a portion 83 of the second optical film 82 by replacing a functional group (eg, a water-soluble functional group such as an OH group) at the end of the second optical film 82 with another functional group. Insolubilize In addition, the fixing solution 120 may be insolubilized by a part of the second optical film 82 by polymerizing by a condensation reaction (dehydration condensation reaction such as OH group). In the latter case, insolubilization tends to proceed because of the progress of polymerization as compared with the former case.

The fixer 120 is removed after insolubilizing a part 83 of the second optical film 82. The fixer 120 may contain water or may contain an organic solvent.

The area | region to which the fixer 120 is apply | coated may be a pixel area, for example.

In addition, in this embodiment, although the application nozzle 121 of the inkjet system is used in order to apply | coat the fixer 120 only to the one part 83 of the 2nd optical film 82, this invention is not limited to this. For example, even if only the remainder of the second optical film 82 is covered with a mask, and then the entire substrate 10 is immersed in the fixer 120, the fixer may be applied only to a part 83 of the second optical film 82. good.

<Protective Film Formation Step of First Embodiment>

In the protective film formation process S125 of FIG. 12, as shown to FIGS. 22-23, the coating liquid 91 for protective films different from the coating liquid 81 for 2nd optical films is apply | coated on the 2nd optical film 82, The protective film 92 is formed by drying.

It is a side view which shows the liquid film of the coating liquid for protective films apply | coated on the 2nd optical film which concerns on 1st Embodiment. It is a side view which shows the protective film formed by drying the liquid film of the coating liquid for protective films which concerns on 1st Embodiment.

As shown in FIG. 22, in protective film formation process S125, the coating liquid 91 for protective films is apply | coated from the coating nozzle 90 on the board | substrate 10 with which the 2nd optical film 82 was formed. The coating nozzle 90 may be an inkjet method, and has a plurality of discharge nozzles for discharging droplets of the coating liquid 91 for protective film on the lower surface.

By discharging droplets of the coating liquid 91 for the protective film from the coating nozzle 90 while moving the coating nozzle 90 and the substrate 10 relatively, the portion of the second optical film 82 is used for the protective film 83. The coating liquid 91 is selectively applied.

The protective film coating liquid 91 is applied onto the second optical film 82. Therefore, the liquid crystal molecule which forms the 2nd optical film 82 may have insoluble with respect to the solvent of the coating liquid 91 for protective films. The application of the protective film coating liquid 91 can prevent the second optical film 82 from melting.

The coating liquid 91 for protective films contains the organic material which forms the protective film 92, and the solvent which melt | dissolves this organic material. The organic material which forms the protective film 92 contains insoluble polymer etc. with respect to the washing | cleaning liquid used at 2nd optical film patterning process S126.

As the protective film coating liquid 91, for example, a thermosetting transparent coating, a chemical reaction transparent coating, a dry curing transparent coating, or the like is used. Specifically, an oil-based enamel paint, a phthalic resin paint, etc. are used.

Since the thermosetting transparent coating, the chemical reaction transparent coating, the dry curing transparent coating, and the like are polymerized by thermosetting, chemical reaction, or dry curing, a dense protective film 92 can be formed. Therefore, the insolubility with respect to the washing | cleaning liquid used at the 2nd optical film patterning process S126 of the protective film 92 can be improved.

The coating liquid 91 for protective films may have the same function as the fixing liquid 120. Partial insolubilization of the second optical film 82 can be promoted. In addition, when partial insolubilization of the 2nd optical film 82 is performed by the coating liquid 91 for protective films, it is not necessary to partially insolubilize the 2nd optical film 82 in the said 2nd optical film formation process S124. .

For example, the coating liquid 91 for a protective film replaces the functional group (for example, water-soluble functional groups, such as an OH group) of the terminal of the 2nd optical film 82, and replaces a part of 2nd optical film 82 ( 83) may be insolubilized. In addition, the coating liquid 91 for protective films may insolubilize a part 83 of the 2nd optical film 82 by polymerizing by condensation reaction (dehydration condensation reaction, such as OH group). In the latter case, insolubilization tends to proceed because of the progress of polymerization as compared with the former case.

The area | region to which the coating liquid 91 for protective films is apply | coated may correspond with the area | region to which the fixer 120 is apply | coated. For example, the area | region to which the coating liquid 91 for protective films is apply | coated may be the pixel area | region on the board | substrate 10. FIG.

As shown in FIG. 23, in the protective film formation process S125, the liquid film (refer FIG. 22) of the protective film coating liquid 91 apply | coated on the board | substrate 10 is dried, and the protective film 92 is formed. A solvent is removed from the liquid film of the coating liquid 91 for protective films, and the protective film 92 is formed.

Pressure drying, natural drying, heat drying, wind drying and the like are used for drying the liquid film of the protective film coating liquid 91. Decompression drying can shorten processing time rather than natural drying. When the solvent remains in the reduced pressure drying, heat drying may be further performed.

The protective film 92 is insoluble in the cleaning liquid used in the second optical film patterning step S126. The protective film 92 has an isotropic optical characteristic, unlike the second optical film 82. It is preferable that the visible light transmittance of the protective film 92 is 95% or more. Moreover, it is preferable that the film thickness of the protective film 92 is 10 micrometers or less. The smaller the residual stress of the protective film 92 is, the smaller it is, in order to suppress deformation of the optical member.

The protective film 92 covers the main surface of a part 83 of the second optical film 82. The protective film 92 also serves to protect a portion 83 of the second optical film 82 so that no damage, foreign matter, or the like occurs on the portion 83 of the second optical film 82. It is preferable that the pencil hardness of the interlayer film 72 is 2H or more.

In addition, since the remainder of the second optical film 82 is removed in the second optical film patterning step S126, damage or foreign matter does not become a problem. In addition, the foreign matter generated in the protective film 92 can be removed by cleaning, and the cleaning does not damage a part 83 of the second optical film 82.

In addition, although the protective film 92 of this embodiment is formed by apply | coating the protective film coating liquid 91 on the 2nd optical film 82, and drying, although it adheres to the 2nd optical film 82 in the form of a film, good.

<2nd optical film patterning process of 1st embodiment>

In the second optical film patterning step S126 of FIG. 12, after the protective film forming step S125, a protective film 92 (see FIG. 23) covering only a portion 83 of the second optical film 82 is used as a mask. As shown in the drawing, the remainder of the second optical film 82 is removed.

It is a side view which shows the 2nd optical film in which the part not covered with the protective film which concerns on 1st Embodiment was removed. During the second optical film patterning step S126, the portion 83 of the second optical film 82 can be protected by the protective film 92, and the shape collapse of the portion 83 of the second optical film 82 is suppressed. can do. Therefore, the quality of an optical member can be improved.

For example, in 2nd optical film patterning process S126, the washing | cleaning liquid which melt | dissolves the 2nd optical film 82 is used. The cleaning liquid is supplied to the substrate 10 while, for example, rotating the substrate 10 with a spin chuck. The cleaning liquid supplied to the substrate 10 is spread over the entire substrate 10 by centrifugal force, and shaken off from the outer peripheral edge of the substrate 10.

Since the portion 83 of the second optical film 82 is covered with the protective film 92, the second optical film 82 does not come into contact with the cleaning liquid, and no shape collapse occurs by the cleaning liquid. On the other hand, since the remainder of the second optical film 82 is in contact with the cleaning liquid, it is melted and removed by the cleaning liquid.

In addition, the cleaning liquid is stored in the cleaning tank, and by immersing the substrate 10 in the cleaning liquid of the cleaning tank, the remainder of the second optical film 82 may be dissolved and removed while leaving a portion 83 of the second optical film 82. good. The washing liquid of the washing tank may be stirred with a stirring blade or the like.

In the second optical film forming step S124 or the protective film forming step S125, a part 83 of the second optical film 82 is insoluble to the cleaning liquid so that a part 83 of the second optical film 82 remains reliably. It is available to make money. Excessive removal of the cleaning liquid can be prevented, and a part 83 of the second optical film 82 can be reliably left.

In addition, since the protective film 92 is insoluble in the cleaning liquid, the second optical film is not insoluble in the second optical film 82 in the second optical film forming step S124 or the protective film forming step S125 even if the second optical film 82 is not partially insolubilized. Patterning of 82 is possible. In this case, the number of steps can be reduced.

In the second optical film forming step S124, the second optical film coating liquid 81 is applied while applying a shear stress, so that it is difficult to apply the second optical film coating liquid 81 only to the pixel region. Therefore, it is effective to perform 2nd optical film patterning process S126.

In addition, in this embodiment, although the remainder of the 2nd optical film 82 is removed using a washing | cleaning liquid, the removal method of the remainder of the 2nd optical film 82 is not specifically limited. For example, an etching method may be used. Etching may be either wet etching or dry etching.

Hereinafter, the part 83 of the 2nd optical film 82 which remains in 2nd optical film patterning process S126 is also called "the 2nd optical film 83."

According to this embodiment, as shown in FIG. 24, the optical member 50 comprised from the 1st optical film 63, the intermediate film 72, the 2nd optical film 83, and the protective film 92 is a board | substrate ( 10) A plurality is formed at intervals on the. Therefore, the multifaceted odor of the optical member 50 is possible, and the multifaceted odor of the organic EL display 1 is possible. In addition, since the optical member 50 is selectively formed in the pixel region, a terminal provided around the pixel region can function properly.

<Arrangement of the optical member formation process of 1st Embodiment>

As described above, according to the present embodiment, the first optical film forming step S121, the intermediate film forming step S122, and the second optical film forming step S124 are performed in this order. An intermediate film 72 is formed between the first optical film 63 and the second optical film 83. The intermediate film 72 can protect the first optical film 63 so that the first optical film 63 is not damaged or foreign matters are generated. Therefore, the quality of the optical member 50 can be improved. When the manufacture of the optical member 50 is temporarily stopped in the middle and it takes time to resume, it is particularly effective because the risk of damage or foreign matter is high.

According to this embodiment, a 1st optical film is used using the intermediate film 72 which covers only a part 63 of the 1st optical film 62 after intermediate film formation process S122 and before 2nd optical film formation process S124 as a mask. First optical film patterning step S123 for removing the remainder of 62 is performed. During the first optical film patterning step S123, a part 63 of the first optical film 62 can be protected by the intermediate film 72, and the shape collapse of the part 63 of the first optical film 62 is suppressed. can do. Therefore, the quality of the optical member 50 can be improved.

According to this embodiment, in 1st optical film patterning process S123, the washing | cleaning liquid which melt | dissolves the 1st optical film 62 is used. Since a part 63 of the first optical film 62 is covered with the intermediate film 72, the first optical film 62 is not in contact with the cleaning liquid, and no shape collapse occurs by the cleaning liquid. On the other hand, since the remainder of the first optical film 62 is in contact with the cleaning liquid, it is melted and removed by the cleaning liquid.

According to this embodiment, in 1st optical film formation process S121, only a part 63 of the 1st optical film 62 is insolubilized with respect to the washing | cleaning liquid used at 1st optical film patterning process S123. Therefore, in 1st optical film patterning process S123, excess removal by washing liquid enters can be prevented, and the part 63 of the 1st optical film 62 can be reliably left.

According to the present embodiment, in the interlayer film forming step S122, only a portion 63 of the first optical film 62 is removed by applying the coating liquid 71 for the interlayer film to only a portion 63 of the first optical film 62. 1 Insolubilize with respect to the washing | cleaning liquid used at the optical film patterning process S123. Therefore, in 1st optical film patterning process S123, excess removal by washing liquid enters can be prevented, and the part 63 of the 1st optical film 62 can be reliably left.

According to this embodiment, the protective film formation process S125 which forms the protective film 92 which protects the 2nd optical film 83 is performed. The protective film 92 can protect the second optical film 83 after the optical member 50 is manufactured so that no damage, foreign matter, or the like occurs in the second optical film 83. Therefore, the quality of the optical member 50 can be improved.

According to this embodiment, the agent which removes the remainder of the 2nd optical film 82 using the protective film 92 after protective film formation process S125 and which covers only a part 83 of the 2nd optical film 82 as a mask is used. 2 optical film patterning process S126 is performed. During the second optical film patterning step S126, the portion 83 of the second optical film 82 can be protected by the protective film 92, and the shape collapse of the portion 83 of the second optical film 82 is suppressed. can do. Therefore, the quality of the optical member 50 can be improved.

According to this embodiment, in 2nd optical film patterning process S126, the washing | cleaning liquid which melt | dissolves the 2nd optical film 82 is used. Since the portion 83 of the second optical film 82 is covered with the protective film 92, the second optical film 82 does not come into contact with the cleaning liquid, and no shape collapse occurs by the cleaning liquid. On the other hand, since the remainder of the second optical film 82 is in contact with the cleaning liquid, it is melted and removed by the cleaning liquid.

According to the present embodiment, in the second optical film forming step S124, only a part 83 of the second optical film 82 is insolubilized with respect to the cleaning liquid used in the second optical film patterning step S126. Therefore, in 2nd optical film patterning process S126, excess removal by washing liquid enters can be prevented, and the part 83 of the 2nd optical film 82 can be reliably left.

According to this embodiment, in the protective film formation process S125, only the part 83 of the 2nd optical film 82 is removed by apply | coating the protective film coating liquid 91 only to the part 83 of the 2nd optical film 82. 2 Insolubilize with respect to the washing | cleaning liquid used at the optical film patterning process S126. Therefore, in 2nd optical film patterning process S126, excess removal by washing liquid enters can be prevented, and the part 83 of the 2nd optical film 82 can be reliably left.

<Optical member formation process of 2nd Embodiment>

In the first embodiment, the first optical film patterning step S123 is performed after the intermediate film forming step S122, whereas the first embodiment is different in that the intermediate film forming step S122 is performed after the first optical film patterning step S123.

Therefore, unlike the said 1st Embodiment, the intermediate film 72 of this embodiment is a mask for removing the remainder of the 1st optical film 62, leaving a part 63 of the 1st optical film 62. FIG. Does not play a role. The interlayer film 72 of the present embodiment serves to protect a portion 63 of the first optical film 62 so that damage, foreign matter, and the like do not occur in the portion 63 of the first optical film 62.

In addition, in the said 1st Embodiment, although the 2nd optical film patterning process S126 is performed after the protective film formation process S125, in this embodiment, it differs in that a passivation film formation process S125 is performed after the 2nd optical film patterning process S126. Do.

Therefore, unlike the said 1st Embodiment, the protective film 92 of this embodiment is a mask for removing the remainder of the 2nd optical film 82, leaving a part 83 of the 2nd optical film 82. FIG. Does not play a role. The protective film 92 of this embodiment serves to protect a part 83 of the second optical film 82 so as not to cause damage or foreign matter to the part 83 of the second optical film 82.

Hereinafter, the difference will mainly be described with reference to FIG. 25 and the like. 25 is a flowchart showing an optical member forming step according to the second embodiment. As shown in FIG. 25, optical member formation process S120 is 1st optical film formation process S121, 1st optical film patterning process S123, intermediate film formation process S122, 2nd optical film formation process S124, and 2nd optical The film patterning step S126 and the protective film forming step S125 are in this order.

In addition, all the processes shown in FIG. 25 may not be performed. For example, although described later in detail, the first optical film patterning step S123 and the second optical film patterning step S126 are effective when a plurality of optical members 50 are formed on the substrate 10 at intervals. When only one 50 is formed on the substrate 10, it may be omitted. The same applies to the processing of some insolubilization described later.

In addition, processes other than the process shown in FIG. 25 may be performed. For example, in order to improve the adhesiveness of a 1st optical film with respect to a board | substrate before 1st optical film formation process S121, the process of surface-modifying the surface in which the 1st optical film of a board | substrate is formed may be performed. As the surface modification film, an organic film such as a silane coupling agent or an inorganic film such as silicon nitride may be formed.

In addition, 1st optical film formation process S121 shown in FIG. 25, 1st optical film patterning process S123, and intermediate film formation process S122, and 2nd optical film formation process S124 shown in FIG. 12, protective film formation process S125, and 2nd optical film patterning are shown. Step S126 may be performed in this order.

Moreover, 1st optical film formation process S121 shown in FIG. 12, intermediate film formation process S122, and 1st optical film patterning process S123, and 2nd optical film formation process S124 shown in FIG. 25, 2nd optical film patterning process S126, and protective film formation Step S125 may be performed in this order.

<1st optical film formation process of 2nd Embodiment>

In the first optical film forming step S121 of FIG. 25, as shown in FIGS. 13 to 14, the coating liquid 61 for coating the first optical film containing liquid crystal molecules and a solvent is applied onto the substrate 10 and dried. 1 The optical film 62 is formed. The first optical film 62 is, for example, a quarter wavelength film.

In 1st optical film formation process S121 of this embodiment, the process of insolubilizing a part 63 of the 1st optical film 62 shown in FIG. 15 is not performed. This processing is performed in the first optical film patterning step S123.

<1st optical film patterning process of 2nd Embodiment>

In the first optical film patterning step S123 of FIG. 25, after the first optical film forming step S121 and before the intermediate film forming step S122, the first optical film 62 is left with a portion 63 of the first optical film 62 remaining. Remove the remainder.

For example, in the first optical film patterning step S123, only a part 63 of the first optical film 62 is insolubilized with the cleaning liquid, as shown in FIG. 15, and thereafter, the first optical film as shown in FIG. 26. The remainder of 62 is dissolved in a cleaning liquid. It is a side view which shows the 1st optical film in which the part which has not been insolubilized by 2nd Embodiment was removed.

The cleaning liquid is supplied to the substrate 10 while, for example, rotating the substrate 10 with a spin chuck. The cleaning liquid supplied to the substrate 10 is spread over the entire substrate 10 by centrifugal force, and shaken off from the outer peripheral edge of the substrate 10.

Since a part 63 of the first optical film 62 is insolubilized with the cleaning liquid, shape collapse does not occur with the cleaning liquid. On the other hand, since the remainder of the first optical film 62 is not insolubilized with the cleaning liquid, it is melted and removed by the cleaning liquid.

In addition, the cleaning liquid is stored in the cleaning tank, and by immersing the substrate 10 in the cleaning liquid of the cleaning tank, the remainder of the first optical film 62 may be dissolved and removed while leaving a part 63 of the first optical film 62. good. The washing liquid of the washing tank may be stirred with a stirring blade or the like.

As shown in FIG. 26, in this embodiment, before the intermediate film 72 (see FIG. 28) is formed, the remainder of the first optical film 62 is left while leaving a portion 63 of the first optical film 62. It is removed, and the first optical film 62 is patterned.

In the first optical film forming step S121, since the first optical film coating liquid 61 is applied while applying a shear stress, it is difficult to apply the first optical film coating liquid 61 only to the pixel region. Therefore, it is effective to perform 1st optical film patterning process S123.

Hereinafter, the part 63 of the 1st optical film 62 which remains in 1st optical film patterning process S123 is also called "the 1st optical film 63."

<Intermediate film formation process of 2nd Embodiment>

In the intermediate film formation step S122 of FIG. 25, as shown in FIGS. 27 to 28, an intermediate film coating liquid 71 different from the first optical film coating liquid 61 is applied onto the first optical film 63. The intermediate film 72 is formed by drying.

It is a figure which shows the liquid film of the coating liquid for intermediate films apply | coated on the 1st optical film which concerns on 2nd Embodiment. It is a figure which shows the intermediate film formed by drying the liquid film of the coating liquid for intermediate films which concerns on 2nd Embodiment.

As shown in FIG. 27, in the intermediate film formation process S122, the coating liquid 71 for intermediate films is apply | coated from the application | coating nozzle 70 on the board | substrate 10 with which the 1st optical film 63 was formed. The coating nozzle 70 may be an inkjet method and has a plurality of discharge nozzles for discharging droplets of the coating liquid 71 for interlayer film on the lower surface.

By discharging droplets of the coating liquid 71 for the intermediate film from the coating nozzle 70 while moving the coating nozzle 70 and the substrate 10 relatively, only the first optical film 63 and its vicinity (for example, the pixel region). And only in the vicinity thereof. The coating liquid 71 for intermediate film is selectively applied.

The coating liquid 71 for intermediate film is apply | coated on the 1st optical film 63. FIG. Therefore, the liquid crystal molecule which forms the 1st optical film 63 may have insoluble with respect to the solvent of the coating liquid 71 for intermediate films. The coating of the intermediate liquid coating liquid 71 can prevent the first optical film 63 from melting.

The coating liquid 71 for an interlayer film contains the organic material which forms the interlayer film 72, and the solvent which melt | dissolves this organic material. The organic material which forms the intermediate film 72 contains insoluble polymer etc. with respect to the solvent of the coating liquid 81 (refer FIG. 29) for the 2nd optical film apply | coated on the intermediate film 72. FIG.

As the intermediate liquid coating liquid 71, for example, a thermosetting transparent coating, a chemical reaction transparent coating, a dry curing transparent coating, or the like is used. Specifically, an oil-based enamel paint, a phthalic resin paint, etc. are used.

Since the thermosetting transparent coating, the chemical reaction transparent coating, the dry curing transparent coating, and the like are polymerized by thermosetting, chemical reaction, or dry curing, a dense interlayer film 72 can be formed.

As shown in FIG. 27, the coating liquid 71 for intermediate films may be apply | coated so that not only the main surface of the 1st optical film 63 but the end surface of the 1st optical film 63 may be covered. Not only the main surface of the first optical film 63 but also the end surface of the first optical film 63, the first optical film 63 can be protected by the intermediate film 72 so as not to cause damage or foreign matter.

The area | region to which the coating liquid 71 for intermediate films is apply | coated may be limited to the pixel area on the board | substrate 10, and its vicinity.

In addition, in order to limit the area | region where the coating liquid 71 for intermediate films is apply | coated, you may adhere | attach the mask, such as a film, on the board | substrate 10. This mask may form a gap between the first optical film 63 so as not to damage the first optical film 63 when the mask is later peeled off.

As shown in FIG. 28, in intermediate film formation process S122, the liquid film (refer FIG. 27) of the coating liquid 71 for intermediate films apply | coated on the board | substrate 10 is dried, and the intermediate film 72 is formed. The solvent is removed from the liquid film of the coating liquid 71 for interlayer film, and the interlayer film 72 is formed.

The intermediate film 72 has an isotropic optical characteristic, unlike the first optical film 63. It is preferable that the visible light transmittance of the interlayer film 72 is 95% or more. Moreover, it is preferable that the film thickness of the intermediate film 72 is 10 micrometers or less. In addition, the smaller the residual stress of the intermediate film 72 is, in order to suppress deformation of the optical member.

The intermediate film 72 covers not only the main surface of the first optical film 63 but also the end surface of the first optical film 63. The intermediate film 72 serves to protect the first optical film 63 so that the first optical film 63 is not damaged or foreign matters are generated. It is preferable that the pencil hardness of the interlayer film 72 is 2H or more. It is particularly effective when the manufacturing of the optical member is temporarily stopped in the middle and it takes time to resume, since the risk of damage or foreign matter is high.

The intermediate film 72 is formed only in and around the pixel region on the substrate 10, and a plurality of intermediate films 72 are formed on the substrate 10 at intervals. In addition, when taking out the terminal provided in the periphery of a pixel area is unnecessary, the intermediate film 72 may be formed in the substantially whole of the board | substrate 10. FIG. When apply | coating the 2nd optical film coating liquid 81 on the intermediate film 72, the orientation controllability of the liquid crystal molecule of the 2nd optical film coating liquid 81 is good.

<2nd optical film formation process of 2nd Embodiment>

In the second optical film forming step S124 of FIG. 25, as shown in FIGS. 29 to 30, the coating liquid 81 for the second optical film containing the liquid crystal molecules and the solvent is applied onto the intermediate film 72 and dried. Two optical films 82 are formed. The second optical film 82 is, for example, a linear polarizing film.

It is a side view which shows the liquid film of the coating liquid for 2nd optical films apply | coated on the intermediate film which concerns on 2nd Embodiment. It is a side view which shows the 2nd optical film formed by drying of the liquid film of the coating liquid for 2nd optical films which concerns on 2nd Embodiment.

As shown in FIG. 29, in 2nd optical film formation process S124, the coating liquid 81 for 2nd optical films is apply | coated from the application | coating nozzle 80 on the board | substrate 10. FIG. The application nozzle 80 is, for example, a slit coater having a slit discharge port on its lower surface.

The coating liquid 81 for the second optical film is applied onto the intermediate film 72. Therefore, the organic material which forms the intermediate film 72 may have insolubility with respect to the solvent of the coating liquid 81 for 2nd optical films. The application of the coating liquid 81 for the second optical film can prevent the intermediate film 72 from melting.

In addition, in this embodiment, although the slit coater is used for application | coating of the coating liquid 81 for 2nd optical films, a dip coater etc. may be used. Shear stress can be applied to the coating liquid 81 for 2nd optical film, and the direction of action of the shear stress should just be controllable.

As shown in FIG. 30, in 2nd optical film formation process S124, the liquid film (refer FIG. 29) of the coating liquid 81 for 2nd optical films apply | coated on the board | substrate 10 is dried, and 2nd optical film 82 is carried out. ). A solvent is removed from the liquid film of the coating liquid 81 for 2nd optical films, and the orientation of a liquid crystal molecule is maintained suitably. The second optical film 82 is, for example, a linear polarizing film.

<2nd optical film patterning process of 2nd Embodiment>

In the second optical film patterning step S126 of FIG. 25, after the second optical film forming step S124 and before the protective film forming step S125, a portion 83 of the second optical film 82 is left while the second optical film 82 is left. Remove the remainder.

For example, in the second optical film patterning step S126, only a portion 83 of the second optical film 82 is insolubilized with the cleaning liquid, as shown in FIG. 31, and then the second optical film as shown in FIG. 32. The remainder of 82 is dissolved in a cleaning liquid.

FIG. 31: is a side view which shows the partially insolubilized 2nd optical film which concerns on 2nd Embodiment. It is a side view which shows the 2nd optical film in which the part which has not been insolubilized by 2nd Embodiment was removed.

As shown in FIG. 31, only a part 83 of the second optical film 82 is insolubilized with the cleaning liquid in the second optical film patterning step S126. As the cleaning liquid, the same solvent as the solvent of the coating liquid 81 for the second optical film may be used, for example, water may be used. In this case, insolubilization of water is performed.

The fixing liquid 120 which insolubilizes a part 83 of the second optical film 82 is discharged from, for example, an inkjet coating nozzle 121. The application nozzle 121 has a plurality of discharge nozzles for discharging droplets of the fixer 120 on the lower surface.

While the application nozzle 121 and the substrate 10 are relatively moved, the droplet of the fixing solution 120 is discharged from the application nozzle 121, thereby fixing the fixing solution 120 to a part 83 of the second optical film 82. Apply selectively. As a result, a part 83 of the second optical film 82 is insolubilized.

The area | region to which the fixer 120 is apply | coated may be a pixel area, for example.

As shown in FIG. 32, in the second optical film patterning step S126, the remainder of the second optical film 82 is removed while leaving only a part 83 of the second optical film 82. For example, a cleaning liquid is used to remove the remainder of the second optical film 82.

The cleaning liquid is supplied to the substrate 10 while, for example, rotating the substrate 10 with a spin chuck. The cleaning liquid supplied to the substrate 10 is spread over the entire substrate 10 by centrifugal force, and shaken off from the outer peripheral edge of the substrate 10.

Since a part 83 of the second optical film 82 is insolubilized with the cleaning liquid, shape collapse does not occur with the cleaning liquid. On the other hand, since the remainder of the second optical film 82 is not insolubilized with the cleaning liquid, it is melted and removed by the cleaning liquid.

In addition, the cleaning liquid is stored in the cleaning tank, and by immersing the substrate 10 in the cleaning liquid of the cleaning tank, the remainder of the second optical film 82 may be dissolved and removed while leaving a portion 83 of the second optical film 82. good. The washing liquid of the washing tank may be stirred with a stirring blade or the like.

As shown in FIG. 32, in this embodiment, before the protective film 92 (refer FIG. 34) is formed, the remainder of the 2nd optical film 82 is removed leaving a part 83 of the 2nd optical film 82. FIG. Thus, the second optical film 82 is patterned.

In the second optical film forming step S124, the second optical film coating liquid 81 is applied while applying a shear stress, so that it is difficult to apply the second optical film coating liquid 81 only to the pixel region. Therefore, it is effective to perform 2nd optical film patterning process S126.

Hereinafter, the part 83 of the 2nd optical film 82 which remains in 2nd optical film patterning process S126 is also called "the 2nd optical film 83."

<Protective Film Formation Step of Second Embodiment>

In the protective film formation process S125 of FIG. 25, as shown to FIGS. 33-34, the coating liquid 91 for protective films different from the coating liquid 81 for 2nd optical films is apply | coated on the 2nd optical film 83, The protective film 92 is formed by drying.

It is a side view which shows the liquid film of the coating liquid for protective films apply | coated on the 2nd optical film which concerns on 2nd Embodiment. It is a side view which shows the protective film formed by drying the liquid film of the coating liquid for protective films which concerns on 2nd Embodiment.

As shown in FIG. 33, in protective film formation process S125, the coating liquid 91 for protective films is apply | coated from the coating nozzle 90 on the board | substrate 10 with which the 2nd optical film 83 was formed. The coating nozzle 90 may be an inkjet method, and has a plurality of discharge nozzles for discharging droplets of the coating liquid 91 for protective film on the lower surface.

By discharging droplets of the coating liquid 91 for the protective film from the coating nozzle 90 while moving the coating nozzle 90 and the substrate 10 relatively, only the second optical film 83 and its vicinity (for example, the pixel region). And only in the vicinity thereof. The coating liquid 91 for a protective film is selectively apply | coated.

The protective film coating liquid 91 is applied onto the second optical film 83. Therefore, the liquid crystal molecule which forms the 2nd optical film 83 may have insoluble with respect to the solvent of the coating liquid 91 for protective films. The coating of the protective film coating liquid 91 can prevent the second optical film 83 from melting.

The coating liquid 91 for protective films contains the organic material which forms the protective film 92, and the solvent which melt | dissolves this organic material.

As the protective film coating liquid 91, for example, a thermosetting transparent coating, a chemical reaction transparent coating, a dry curing transparent coating, or the like is used. Specifically, an oil-based enamel paint, a phthalic resin paint, etc. are used.

Since the thermosetting transparent coating, the chemical reaction transparent coating, the dry curing transparent coating, and the like are polymerized by thermosetting, chemical reaction, or dry curing, a dense protective film 92 can be formed.

As shown in FIG. 33, the coating liquid 91 for protective films may be apply | coated so that not only the main surface of the 2nd optical film 83 but the end surface of the 2nd optical film 83 may be covered. Not only the main surface of the second optical film 83 but also the end surface of the second optical film 83 can protect the second optical film 83 with the protective film 92 so as not to cause damage or foreign matter.

In addition, although the coating liquid 91 for protective films does not cover the end surface of the intermediate film 72 in FIG. 33, you may apply | coat so that the end surface of the intermediate film 72 may be covered.

The area | region to which the coating liquid 91 for protective films is apply | coated may be limited to the pixel area | region on the board | substrate 10, and its vicinity.

In addition, in order to limit the area | region to which the coating liquid 91 for protective films is apply | coated, you may adhere | attach the mask, such as a film, on the board | substrate 10. FIG. This mask may form a gap between the second optical film 83 so as not to damage the second optical film 83 when the mask is later peeled off.

As shown in FIG. 34, in the protective film formation process S125, the liquid film (refer FIG. 33) of the protective film coating liquid 91 apply | coated on the board | substrate 10 is dried, and the protective film 92 is formed. A solvent is removed from the liquid film of the coating liquid 91 for protective films, and the protective film 92 is formed.

The protective film 92 has an isotropic optical characteristic, unlike the second optical film 83. It is preferable that the visible light transmittance of the protective film 92 is 95% or more. Moreover, it is preferable that the film thickness of the protective film 92 is 10 micrometers or less. The smaller the residual stress of the protective film 92 is, the smaller it is, in order to suppress deformation of the optical member.

The protective film 92 covers not only the main surface of the second optical film 83 but the end surface of the second optical film 83. The protective film 92 serves to protect the second optical film 83 so that the second optical film 83 is not damaged or foreign matters are generated. It is preferable that the pencil hardness of the protective film 92 is 2H or more.

The passivation film 92 is formed only in and around the pixel region on the substrate 10, and a plurality of protective films 92 are formed on the substrate 10 at intervals. In addition, when taking out the terminal provided in the periphery of a pixel area is unnecessary, the protective film 92 may be formed in the substantially whole of the board | substrate 10. FIG.

In addition, although the protective film 92 of this embodiment is formed by apply | coating and drying the protective film coating liquid 91 on the 2nd optical film 83, even if it adheres to the 2nd optical film 83 in the form of a film, good.

According to this embodiment, as shown in FIG. 34, the optical member 50 comprised from the 1st optical film 63, the intermediate film 72, the 2nd optical film 83, and the protective film 92 is a board | substrate ( 10) A plurality is formed at intervals on the. Therefore, the multifaceted odor of the optical member 50 is possible, and the multifaceted odor of the organic EL display 1 is possible. In addition, since the optical member 50 is selectively formed in the pixel region and its vicinity, terminals provided around the pixel region can function properly.

<Arrangement of the optical member formation process of 2nd Embodiment>

As described above, according to the present embodiment, the first optical film forming step S121, the intermediate film forming step S122, and the second optical film forming step S124 are performed in this order. An intermediate film 72 is formed between the first optical film 63 and the second optical film 83. The intermediate film 72 can protect the first optical film 63 so that the first optical film 63 is not damaged or foreign matters are generated. Therefore, the quality of the optical member 50 can be improved. When the manufacture of the optical member 50 is temporarily stopped in the middle and it takes time to resume, it is particularly effective because the risk of damage or foreign matter is high.

According to this embodiment, 1st which removes the remainder of the 1st optical film 62 leaving a part 63 of the 1st optical film 62 after 1st optical film formation process S121 and before intermediate film formation process S122. Optical film patterning process S123 is performed. Therefore, it is possible to cover not only the main surface of the first optical film 63 remaining after the first optical film patterning step S123, but also the end surface of the first optical film 63 with the intermediate film 72.

According to this embodiment, in 1st optical film patterning process S123, only a part 63 of the 1st optical film 62 is insolubilized with respect to the washing | cleaning liquid which melt | dissolves the 1st optical film 62, and after that, 1st optical The remainder of the film 62 is dissolved in a cleaning liquid. Since a part 63 of the first optical film 62 is insolubilized with the cleaning liquid, shape collapse does not occur with the cleaning liquid. On the other hand, since the remainder of the first optical film 62 is not insolubilized with the cleaning liquid, it is melted and removed by the cleaning liquid.

According to this embodiment, in intermediate film formation process S122, the intermediate film 72 is formed so that the main surface of the 1st optical film 63 and the end surface of the 1st optical film 63 may be covered. The intermediate film 72 can protect the first optical film 63 so that not only the main surface of the first optical film 63 but also the end surface of the first optical film 63 does not cause damage or foreign matter. Therefore, the quality of the optical member 50 can be improved. When the manufacture of the optical member 50 is temporarily stopped in the middle and it takes time to resume, it is particularly effective because the risk of damage or foreign matter is high.

According to this embodiment, the protective film formation process S125 which forms the protective film 92 which protects the 2nd optical film 83 is performed. The protective film 92 can protect the second optical film 83 after the optical member 50 is manufactured so that no damage, foreign matter, or the like occurs in the second optical film 83. Therefore, the quality of the optical member 50 can be improved.

According to this embodiment, 2nd which removes the remainder of the 2nd optical film 82, leaving a part 83 of the 2nd optical film 82 after 2nd optical film formation process S124 and before protective film formation process S125. Optical film patterning process S126 is performed. Therefore, it is possible to cover not only the main surface of the second optical film 83 remaining after the second optical film patterning step S126 but also the end surface of the second optical film 83 with the protective film 92.

According to this embodiment, in the 2nd optical film patterning process S126, only a part 83 of the 2nd optical film 82 is insolubilized with respect to the washing | cleaning liquid which melt | dissolves the 2nd optical film 82, and after that, 2nd optical The remainder of the film 82 is dissolved in a cleaning liquid. Since a part 83 of the second optical film 82 is insolubilized with the cleaning liquid, shape collapse does not occur with the cleaning liquid. On the other hand, since the remainder of the second optical film 82 is not insolubilized with the cleaning liquid, it is melted and removed by the cleaning liquid.

According to this embodiment, in protective film formation process S125, the protective film 92 is formed so that the main surface of the 2nd optical film 83 and the end surface of the 2nd optical film 83 may be covered. The protective film 92 can protect the second optical film 83 so that not only the main surface of the second optical film 83 but also the end surface of the second optical film 83 does not cause damage or foreign matter. Therefore, the quality of the optical member 50 can be improved. When the manufacture of the optical member 50 is temporarily stopped in the middle and it takes time to resume, it is particularly effective because the risk of damage or foreign matter is high.

<Deformation, improvement>

As mentioned above, although embodiment of the manufacturing method of an organic electroluminescent display was described, this invention is not limited to the said embodiment etc., Various deformation | transformation and improvement are possible within the scope of the summary of this invention described in a claim.

For example, the optical member 50 includes the first optical film 63, the intermediate film 72, the second optical film 83, and the protective film 92 in the above embodiment, but the present invention is not limited thereto. . The optical member 50 should just contain the optical film with which the liquid crystal molecule was orientated, and the number of optical films is not limited, either.

This application claims the priority based on Japanese Patent Application No. 2017-091471 for which it applied to Japan Patent Office on May 1, 2017, and uses all the content of Japanese Patent Application 2017-091471 for this application.

10: substrate
13: organic light emitting diode
30: sealing layer
40: touch sensor
41: first metal film
43: insulating film
45: second metal film
47: touch sensor protective film
50: optical member
61: coating liquid for first optical film
62: first optical film
63: first optical film
71: coating liquid for interlayer film
72: interlayer
81: coating liquid for second optical film
82: second optical film
83: second optical film
91: coating liquid for protective film
92: protective film

Claims (19)

The manufacturing method of the organic electroluminescent display which has an optical member formation process of forming the optical film in which liquid crystal molecules were oriented by apply | coating and drying the coating liquid for optical films containing a liquid crystal molecule and a solvent on the board | substrate with which the organic light emitting diode was previously formed. The method of claim 1, wherein the optical member forming step,
The 1st optical film which forms the 1st optical film as any one of retardation film and a polarizing film by apply | coating and drying the coating liquid for 1st optical film containing a liquid crystal molecule and a solvent on the said board | substrate with which the said organic light emitting diode was previously formed. Forming process,
After the first optical film forming step, a coating liquid for a second optical film containing liquid crystal molecules and a solvent is applied onto the first optical film and dried, whereby second optical as the other of the retardation film and the polarizing film. The manufacturing method of organic electroluminescent display which has a 2nd optical film formation process which forms a film. The method of claim 2, wherein the optical member forming step,
The intermediate film which forms an intermediate film by apply | coating and drying the coating liquid for intermediate films different from the said coating liquid for 1st optical films on the said 1st optical film after the said 1st optical film formation process and before the said 2nd optical film formation process. The manufacturing method of organic electroluminescent display which has a formation process. The method of claim 3, wherein the optical member forming step,
And a first optical film patterning step of removing the remainder of the first optical film by using the intermediate film covering only a part of the first optical film as a mask after the intermediate film forming step and before the second optical film forming step, Method for producing an organic EL display. The manufacturing method of the organic electroluminescent display of Claim 4 using the cleaning liquid which melt | dissolves the said 1st optical film in the said 1st optical film patterning process. The method for producing an organic EL display according to claim 5, wherein in the first optical film forming step, only the part of the first optical film is insolubilized with respect to the cleaning liquid used in the first optical film patterning step. The said intermediate film formation process WHEREIN: The said intermediate film formation process WHEREIN: Only the said part of said 1st optical film is used by a said 1st optical film patterning process by apply | coating the said coating film for said intermediate films only to the said part of said 1st optical film. The manufacturing method of the organic electroluminescent display insoluble about the said washing | cleaning liquid used. The method of claim 3, wherein the optical member forming step,
And a first optical film patterning step of removing the remainder of the first optical film while leaving a part of the first optical film after the first optical film forming step and before the intermediate film forming step. The method according to claim 8, wherein in the first optical film patterning step, only a part of the first optical film is insolubilized with respect to the cleaning liquid for melting the first optical film, and then the remainder of the first optical film is converted into the cleaning liquid. The manufacturing method of the organic electroluminescent display to melt | dissolve. The manufacturing method of an organic EL display according to claim 8 or 9, wherein in the intermediate film forming step, the intermediate film is formed so as to cover the main surface of the first optical film and the end surface of the first optical film. The said optical member formation process of any one of Claims 3-10,
After the second optical film forming step, a protective film forming step of forming a protective film for protecting the second optical film by applying and drying a protective film coating liquid different from the coating liquid for the second optical film on the second optical film. The manufacturing method of organic electroluminescent display which has. The method of claim 11, wherein the optical member forming step,
And a second optical film patterning step of removing the remainder of the second optical film by using the protective film covering only a part of the second optical film as a mask after the protective film forming step. The manufacturing method of the organic electroluminescence display of Claim 12 using the cleaning liquid which melt | dissolves the said 2nd optical film in a said 2nd optical film patterning process. The method for producing an organic EL display according to claim 13, wherein in the second optical film forming step, only the part of the second optical film is insolubilized with respect to the cleaning liquid used in the second optical film patterning step. The said protective film formation process WHEREIN: The said liquid film coating process is apply | coated only to the said part of the said 2nd optical film, Only the said part of the said 2nd optical film is used in a said 2nd optical film patterning process. The manufacturing method of the organic electroluminescent display insoluble about the said washing | cleaning liquid used. The method of claim 11, wherein the optical member forming step,
And a second optical film patterning step of removing the remainder of the second optical film while leaving a part of the second optical film after the second optical film forming step and before the protective film forming step. The method according to claim 16, wherein in the second optical film patterning step, only the part of the second optical film is insolubilized with respect to the cleaning liquid that melts the second optical film, and then the remainder of the second optical film is turned into the cleaning liquid. The manufacturing method of the organic electroluminescent display to melt | dissolve. 18. The manufacturing method of the organic EL display according to claim 16 or 17, wherein in the protective film forming step, the protective film is formed so as to cover the main surface of the second optical film and the end surface of the second optical film. 19. The method according to any one of claims 1 to 18, further comprising a touch sensor forming step of forming a touch sensor on the substrate on which the organic light emitting diode is formed before the optical member forming step.
The touch sensor forming process,
Forming a light blocking first metal film on the substrate on which the organic light emitting diode is formed in advance;
Selectively removing a part of the first metal film by photolithography and etching;
Forming an insulating film on the first metal film, a portion of which is selectively removed;
Forming a light shielding second metal film on the insulating film;
A method of producing an organic EL display, comprising the step of selectively removing a part of the second metal film by a photolithography method and an etching method.

Images