KR20180003335A - Organic light emitting display device and method of manufacturing the same - Google Patents

Abstract

The present invention relates to an organic light emitting display device and a manufacturing method thereof. According to the present invention, the organic light emitting display device includes: a first bank installed in a side and the other side of an anodic electrode; a second bank installed to expose the edge of the first bank; and an organic light emitting layer installed on the upper surface of the first bank and the upper surface of the anodic electrode. The first and second banks are installed with organic substances. Moreover, the manufacturing method includes: a process of forming the first bank in a side and the other side of the anodic electrode and forming the second bank on the first bank to expose the edge of the first bank; and a process of forming an organic light emitting layer to the upper surface of the first bank. As such, the present invention is capable of preventing damage to the anodic electrode during the bank formation procedure, and securing uniform brightness by forming the organic light emitting layer flat on the upper surface of the anodic electrode.

Description

Technical Field [0001] The present invention relates to an organic light emitting diode (OLED) display device and a method of manufacturing the same,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a display device, and more particularly, to an organic light emitting display device and a method of manufacturing the same.

The flat panel display device includes a liquid crystal display device (LCD), a plasma display panel device (PDP), and an organic light emitting display device (OLED) Device (EPD: Electrophoretic Display Device) is also widely used.

Among them, the organic light emitting display device is a self-luminous display device, and has been attracting attention as a next generation flat panel display device because it has low power consumption, high response speed, high luminous efficiency, high luminance and wide viewing angle.

In particular, in recent years, an organic light emitting display device has been developed in which an organic light emitting layer is formed of a material having solubility characteristics in order to improve the convenience and efficiency of the manufacturing process of the organic light emitting display device.

1 is a schematic cross-sectional view of a conventional soluble organic light emitting display.

1, a planarization layer 1, an anode electrode 2, a first bank 3, a second bank 4, an organic light emitting layer 5, and a cathode electrode 6 are formed on a substrate (not shown) Are formed in this order.

The planarization layer 1 serves to planarize a thin film transistor layer (not shown) provided on the substrate, and the anode electrode 2 is formed on the planarization layer 1.

The first bank 3 and the second bank 4 are formed on the anode electrode 2 to define a pixel region. The first bank 3 and the second bank 4 are formed on one side and the other side of the anode electrode 2 while exposing the top surface of the anode electrode 2. At this time, the first bank 3 is formed of an inorganic material.

The organic light emitting layer 5 is formed in the pixel region defined by the first bank 3 and the second bank 4 and the cathode electrode 6 is formed on the organic light emitting layer 5 .

Specifically, in the soluble organic light emitting display, in order to improve the convenience and efficiency of the manufacturing process, an organic light emitting material having solubility characteristics by an inkjet printing method is applied to the pixels defined by the first bank 3 and the second bank 4 And then the organic light emitting layer 5 is formed by curing.

Particularly, in the conventional soluble organic light emitting display device, the bank is divided into the first bank 3 and the second bank 4 as described above so as to prevent the pileup phenomenon of the organic light emitting layer 5, .

The file up phenomenon means that the organic light emitting layer 5 is formed thicker at the edge adjacent to the bank than the center portion between the banks when the organic light emitting material is injected by the ink jet printing method. In the case where the organic light emitting layer 5 is formed unevenly, unevenness in brightness occurs in the pixel region. Thus, in order to prevent pileup phenomenon, conventionally, the banks are formed in multiple layers, The organic light emitting layer 5 is formed flat on the upper surface of the anode electrode 2 by injecting the light emitting material.

Such conventional organic light emitting display devices have the following problems.

As described above, the first bank 3 of the inorganic material must be deposited after the planarization layer 1 and the thin film transistor layer are formed. When CVD (Chemical Vapor Deposition) is performed at a high temperature, Since the performance may be deteriorated, conventionally, the first bank 3 is formed by conducting CVD at a low temperature of about 210 캜.

As described above, as the CVD process proceeds at a low temperature, the film quality and adhesive force of the first bank are lowered compared with the case of forming the first bank at a high temperature (3). As a result, the first bank 3 is peeled peeling) occurred.

Also, since the first bank 3 needs to be patterned through a dry etching or a wet etching process in the process of forming the first bank 3 by CVD, the anode electrode 2 is damaged There was a problem.

Further, by forming the banks in a multilayer structure as in the prior art, the luminance unevenness in the light emitting region can be solved to a certain extent as compared with the case where the banks are formed into a single layer, but the organic light emitting layer 5 formed in the light emitting region is still flat There was a problem that it was formed.

SUMMARY OF THE INVENTION The present invention has been made to overcome the above-described problems of the prior art, and it is an object of the present invention to provide a method of manufacturing a semiconductor device, which can prevent damage to the anode electrode during formation of a bank formed on the anode electrode, And an object of the present invention is to provide an organic light emitting display and a method of manufacturing the same.

It is another object of the present invention to provide an organic light emitting display device and a method of manufacturing the same, in which an organic light emitting layer is flatly provided on an anode electrode so as to realize a uniform luminance.

In order to achieve the above object, an OLED display according to an embodiment of the present invention includes a first bank provided on one side and the other side of an anode electrode, a second bank provided to expose an edge of the first bank, And an organic light emitting layer provided on the upper surface of the electrode and the upper surface of the first bank, wherein the first bank and the second bank are formed of an organic material.

A method of manufacturing an organic light emitting display according to an embodiment of the present invention includes forming a bank on one side and the other side of an anode electrode and forming an organic light emitting layer on an upper surface of the anode electrode, A first bank is formed on one side and the other side of the anode electrode using a halftone mask in the process and a second bank is formed on the first bank so as to expose the edge of the first bank, An organic light emitting layer is formed to the top surface of the first bank exposed to the light emitting layer.

According to another aspect of the present invention, there is provided a method of manufacturing an organic light emitting diode display, comprising: forming a first bank including an organic material on one side and the other side of an anode electrode; Forming an organic light emitting layer on the upper surface of the anode electrode and the exposed first bank.

According to the present invention as described above, the following effects can be obtained.

According to an embodiment of the present invention, the banks to be patterned on the upper surface of the anode electrode are formed of an organic material, thereby preventing the anode electrode from being damaged in the process of forming the banks and preventing the bank from being filled.

According to the embodiment of the present invention, the upper part of the bank having the stepped structure is made of a hydrophobic material and the lower part of the bank is made of hydrophilic material, so that the organic light emitting layer can be formed flat on the upper surface of the anode electrode, Can be implemented.

According to the embodiment of the present invention, the side surface of the second bank formed so as to expose the edge of the first bank is inclined with respect to the surface of the substrate, so that the organic light emitting layer is formed more flatly on the upper surface of the anode electrode, One brightness can be realized.

1 is a schematic cross-sectional view of a conventional soluble organic light emitting display.
2 is a cross-sectional view of an OLED display according to an embodiment of the present invention.
FIG. 3 is a schematic cross-sectional view of an organic light emitting display according to an embodiment of the present invention showing the region A shown in FIG.
FIG. 4 is a schematic cross-sectional view of an organic light emitting display according to another embodiment of the present invention showing the region A shown in FIG.
5 is a schematic cross-sectional view of an OLED display according to another embodiment of the present invention.
6A to 6J are cross-sectional views illustrating a method of manufacturing an OLED display according to an exemplary embodiment of the present invention.
7A to 7G are process cross-sectional views illustrating a method of forming a bank of an OLED display according to another embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention and the manner of achieving them will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims.

The shapes, sizes, ratios, angles, numbers, and the like disclosed in the drawings for describing the embodiments of the present invention are illustrative, and thus the present invention is not limited thereto. Like reference numerals refer to like elements throughout the specification. In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail. In the case where the word 'includes', 'having', 'done', etc. are used in this specification, other parts can be added unless '~ only' is used. Unless the context clearly dictates otherwise, including the plural unless the context clearly dictates otherwise.

In interpreting the constituent elements, it is construed to include the error range even if there is no separate description.

In the case of a description of the positional relationship, for example, if the positional relationship between two parts is described as 'on', 'on top', 'under', and 'next to' Or " direct " is not used, one or more other portions may be located between the two portions.

In the case of a description of a temporal relationship, for example, if the temporal relationship is described by 'after', 'after', 'after', 'before', etc., May not be continuous unless they are not used.

The first, second, etc. are used to describe various components, but these components are not limited by these terms. These terms are used only to distinguish one component from another. Therefore, the first component mentioned below may be the second component within the technical spirit of the present invention.

It is to be understood that each of the features of the various embodiments of the present invention may be combined or combined with each other, partially or wholly, technically various interlocking and driving, and that the embodiments may be practiced independently of each other, It is possible.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.

2 is a cross-sectional view of an OLED display according to an embodiment of the present invention.

2, an organic light emitting display according to an exemplary embodiment of the present invention includes a substrate 100, a thin film transistor T, a passivation layer 165, a planarization layer 170, A second anode 190, a bank 200, an organic light emitting layer 210, and a cathode 220 are formed on a substrate 180. The first electrode 180, the second anode 190,

The thin film transistor layer T includes an active layer 110, a gate insulating layer 120, a gate electrode 130, an interlayer insulating layer 140, a source electrode 150, and a drain electrode 160.

The active layer 110 is formed on the substrate 100 so as to overlap with the gate electrode 130. The active layer 110 may be formed of a silicon-based semiconductor material or an oxide-based semiconductor material. Although not shown, a light shielding film may be additionally formed between the substrate 100 and the active layer 110. In this case, external light incident through the lower surface of the substrate 100 is shielded by the light shielding film, The problem that the active layer 110 is damaged by external light can be prevented.

The gate insulating layer 120 is formed on the active layer 110. The gate insulating layer 120 functions to isolate the active layer 110 from the gate electrode 130. The gate insulating layer 120 may be formed of an inorganic insulating material, for example, a silicon oxide layer (SiOx), a silicon nitride layer (SiNX), or a multilayer thereof. However, the gate insulating layer 120 is not limited thereto.

The gate electrode 130 is formed on the gate insulating layer 120. The gate electrode 130 is formed to overlap the active layer 110 with the gate insulating layer 120 therebetween. The gate electrode 130 may be formed of any one selected from the group consisting of Mo, Al, Cr, Au, Ti, Ni, Ne, And may be a single layer or multiple layers made of these alloys, but it is not necessarily limited thereto.

The interlayer insulating layer 140 is formed on the gate electrode 130. The interlayer insulating layer 140 may be formed of the same inorganic insulating material as the gate insulating layer 120, for example, a silicon oxide layer (SiOX), a silicon nitride layer (SiNX), or a multilayer thereof. However, no.

The source electrode 150 and the drain electrode 160 are formed to face each other on the interlayer insulating layer 140. The first contact hole CH1 exposing the one end region of the active layer 110 and the second contact hole CH1 exposing the other end region of the active layer 110 are formed in the gate insulating layer 120 and the interlayer insulating layer 140, The source electrode 150 is connected to the other end region of the active layer 110 through the second contact hole CH2 and the drain electrode 160 is connected to the first contact hole CH2, (CH1) to the one end region of the active layer (110).

The source electrode 150 may have a multi-layer structure including a lower source electrode 151 and an upper source electrode 152.

The lower source electrode 151 may be formed between the interlayer insulating layer 140 and the upper source electrode 152 to enhance adhesion between the interlayer insulating layer 140 and the upper source electrode 152. [ have. In addition, the lower source electrode 151 may protect the lower surface of the upper source electrode 152, thereby preventing the lower surface of the upper source electrode 152 from being corroded. Therefore, the degree of oxidation of the lower source electrode 151 may be lower than the degree of oxidation of the upper source electrode 152. That is, the material of the lower source electrode 151 may be made of a material having higher corrosion resistance than the material of the upper source electrode 152. As described above, the lower source electrode 151 serves as an adhesion promoting layer or an anti-corrosion layer, and may be made of an alloy of molybdenum and titanium (MoTi), but is not limited thereto.

The upper source electrode 152 is formed on the upper surface of the lower source electrode 151. The upper source electrode 152 may be made of copper (Cu), which is a metal having a low resistance, but is not limited thereto. The upper source electrode 152 may be formed of a metal having a relatively lower resistance than the lower source electrode 151. In order to reduce the total resistance of the source electrode 150, the thickness of the upper source electrode 152 may be greater than the thickness of the lower source electrode 151.

The drain electrode 160 may have a multilayer structure including a lower drain electrode 161 and an upper drain electrode 162, similar to the source electrode 150 described above.

The lower drain electrode 161 is formed between the interlayer insulating layer 140 and the upper drain electrode 162 to improve adhesion between the interlayer insulating layer 140 and the upper drain electrode 162 Also, it is possible to prevent the lower surface of the upper drain electrode 162 from being corroded. Therefore, the degree of oxidation of the lower drain electrode 161 may be lower than the degree of oxidation of the upper drain electrode 162. That is, the material of the lower drain electrode 161 may be made of a material having higher corrosion resistance than the material of the upper drain electrode 162. As described above, the lower drain electrode 161 may be made of the same molybdenum and titanium alloy (MoTi) as the lower source electrode 151, but is not limited thereto.

The upper drain electrode 162 is formed on the upper surface of the lower drain electrode 161 and may be made of the same copper as the upper source electrode 152 described above but is not limited thereto. The thickness of the upper drain electrode 162 may be greater than the thickness of the lower drain electrode 161 to reduce the overall resistance of the drain electrode 160.

The upper drain electrode 162 may be formed of the same material and the same thickness as the upper source electrode 152 and the lower drain electrode 161 may be formed of the same material and the same thickness as the lower source electrode 151 In this case, the drain electrode 160 and the source electrode 150 can be simultaneously formed through the same process.

The structure of the thin film transistor layer T as described above is not limited to the structure shown in the drawings, but may be variously modified in a structure known to those skilled in the art. For example, although the top gate structure in which the gate electrode 130 is formed on the active layer 110 is shown in the drawing, the gate electrode 130 may be formed on the bottom layer of the active layer 110, Or a bottom gate structure.

The passivation layer 165 is formed on the thin film transistor layer T and more specifically on the upper surfaces of the source electrode 150 and the drain electrode 160. The passivation layer 165 functions to protect the thin film transistor layer T. The passivation layer 165 may be formed of an inorganic insulating material such as a silicon oxide film (SiOX) or a silicon nitride film (SiNX). However, the present invention is not limited thereto.

The planarization layer 170 is formed on the passivation layer 165. The planarization layer 170 functions to flatten the upper surface of the substrate 100 on which the thin film transistor T is formed. The planarization layer 170 may be formed of an organic insulating material such as an acryl resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin. But is not necessarily limited thereto

The first anode electrode 180 is formed on the planarization layer 170. The third contact hole CH3 exposing the source electrode 150 is formed in the passivation layer 165 and the planarization layer 170. The third contact hole CH3 is formed in the passivation layer 165 and the planarization layer 170, And the first anode electrode 180 are connected to each other.

The first anode electrode 180 may include a first lower anode electrode 181 and a first upper anode electrode 182.

The first lower anode electrode 181 is formed between the planarization layer 170 and the first upper anode electrode 182 to reduce the adhesive force between the planarization layer 170 and the first upper anode electrode 182 It can play a role of promoting. In addition, the first lower anode electrode 181 may protect the lower surface of the first upper anode electrode 182, thereby preventing the lower surface of the first upper anode electrode 182 from being corroded. Accordingly, the degree of oxidation of the first lower anode electrode 181 may be lower than that of the first upper anode electrode 182. That is, the material of the first lower anode 181 may be made of a material having higher corrosion resistance than the material of the first upper anode 182.

In addition, the first lower anode electrode 181 may protect the upper surface of the upper source electrode 152, thereby preventing the upper surface of the upper source electrode 152 from being corroded. Therefore, the degree of oxidation of the first lower anode electrode 181 may be lower than that of the upper source electrode 152. That is, the material of the first lower anode electrode 181 may be made of a material having higher corrosion resistance than the material of the upper source electrode 152.

Since the first lower anode electrode 181 can prevent the upper surface of the upper source electrode 152 from being corroded, the source electrode 150 can be formed in the two-layer structure described above. The first lower anode 181 may be made of an alloy of molybdenum and titanium (MoTi), but it is not limited thereto.

The first upper anode electrode 182 is formed on the upper surface of the first lower anode electrode 181. The first upper anode electrode 182 may be made of copper (Cu) having a low resistance, but is not limited thereto. The first upper anode electrode 182 may be made of a metal having a lower resistance than the first lower anode electrode 181. The thickness of the first upper anode electrode 182 may be greater than the thickness of the first lower anode electrode 181 to reduce the overall resistance of the first anode electrode 180.

The second anode 190 is formed on the upper surface of the first anode 180. The second anode 190 is formed to be in contact with the upper surface and the entire side surface of the first anode 180. That is, an additional insulating layer is not formed between the second anode 190 and the first anode 180, thereby omitting the insulating layer and the contact hole forming process. The second anode 190 reflects light emitted from the organic light emitting layer 210 in an upward direction, and thus includes a material having high reflectivity. The second anode 190 is formed to cover the top and side surfaces of the first anode 180, thereby preventing the top and sides of the first anode 180 from being corroded. do.

The second anode electrode 190 may include a second lower anode electrode 191, a second central anode electrode 192, and a second upper anode electrode 193.

The second lower anode electrode 191 is formed between the first anode electrode 180 and the second central anode electrode 192. The second lower anode electrode 191 is formed to cover the upper surface and side surfaces of the first anode electrode 180, thereby preventing the first anode electrode 180 from being corroded. The degree of oxidation of the second lower anode electrode 191 may be lower than the degree of oxidation of the first lower anode electrode 181 and the first upper anode electrode 182 constituting the first anode electrode 180 . That is, the material of the second lower anode electrode 191 may be made of a material having higher corrosion resistance than the material of the first lower anode electrode 181 and the first upper anode electrode 182.

Also, the second lower anode electrode 191 protects the lower surface of the second central anode electrode 192, thereby preventing the lower surface of the second central anode electrode 192 from being corroded. Therefore, the degree of oxidation of the second lower anode electrode 191 may be lower than the degree of oxidation of the second central anode electrode 192. That is, the material of the second lower anode electrode 191 may be made of a material having a higher corrosion resistance than the material of the second central anode electrode 192. The second lower anode electrode 191 may be made of a transparent conductive material such as ITO, but is not limited thereto.

The second central anode electrode 192 is formed between the second lower anode electrode 191 and the second upper anode electrode 193. The second central anode electrode 192 is made of a material having a lower resistance and a higher reflectivity than the second lower anode electrode 191 and the second upper anode electrode 193, However, the present invention is not limited thereto. The thickness of the second central anode electrode 192 having a relatively low resistance is greater than the thickness of each of the second lower anode electrode 191 and the second upper anode electrode 193 having a relatively high resistance, The total resistance of the electrode 190 can be reduced.

The second upper anode electrode 193 is formed on the upper surface of the second central anode electrode 192 to prevent the upper surface of the second central anode electrode 192 from being corroded. Therefore, the degree of oxidation of the second upper anode electrode 193 may be lower than that of the second central anode electrode 192. That is, the material of the second upper anode electrode 193 may be made of a material having higher corrosion resistance than the material of the second central anode electrode 192. The second upper anode electrode 193 may be made of a transparent conductive material such as ITO, however, the present invention is not limited thereto.

In the above description, the anode electrode is formed as a plurality of layers such as the first anode electrode 180 and the second anode electrode 190, and each of the anode electrode 180 and the second anode electrode 190 is formed as a double layer or a triple layer. However, It is also possible to form a single layer.

The bank 200 is formed on the second anode 190.

The bank 200 is formed on one side and the other side of the second anode 190 while exposing an upper surface of the second anode 190. The bank 200 is formed to expose the upper surface of the second anode 190, thereby securing an area for displaying an image. In addition, since the bank 200 is formed on one side and the other side of the second anode 190, the side of the second anode 190, which is vulnerable to corrosion, is prevented from being exposed to the outside, It is possible to prevent the side surface of the electrode 190 from being corroded. The organic light emitting layer 210 and the cathode electrode 220 are formed on the upper surface of the second anode 190. The organic light emitting layer 210 and the cathode electrode 220 The exposed region of the electrode 190 corresponds to the light emitting region EA.

The bank 200 may be formed of an organic insulating material such as a polyimide resin, an acryl resin, a benzocyclobutene (BCB) or the like, but is not limited thereto.

2, the bank 200 according to an exemplary embodiment of the present invention includes a first anode electrode 180 and a second anode electrode 190. The first anode electrode 180 and the second anode electrode 190 are formed to expose the upper surface of the second anode 190, A first bank 201 provided on one side and the other side of the first bank 201 and a second bank 202 provided on the first bank 201 to expose an upper surface of the first bank 201 do. Particularly, the second bank 202 is provided to expose the upper surface of the edge of the first bank 201.

As described above, in the embodiment of the present invention, the second bank 202 is provided on the first bank 201 while exposing the edges of the first bank 201, The first anode electrode 180 and the second anode electrode 190 are formed in a shape having a step on the first anode electrode 180 and the second anode electrode 190 as shown in FIG.

In the exemplary embodiment of the present invention, the second bank 202 is provided on the first bank 201 while exposing the edges of the first bank 201, up phenomenon.

In the case of forming the organic light emitting layer 210 by the inkjet printing method, the filing-up phenomenon is a phenomenon in which the organic light emitting material constituting the organic light emitting layer 210 is sprayed or dropped onto the second anode electrode 190, The organic light emitting layer 210 is formed on an upper surface of the second anode 190 in contact with the bank 200 after the organic light emitting material is dried and cured, 210 are formed to have a large thickness, thereby causing a thickness variation.

As a result, the organic light emitting layer 210 is formed flat at the central portion of the light emitting region EA and has a cross-sectional shape gradually increasing in thickness toward a portion adjacent to the bank 200. [ If the organic light emitting layer 210 is formed on the second anode 190 in a non-planar manner, there is a problem that luminance unevenness occurs.

Therefore, in the embodiment of the present invention, the first bank 201 may be formed so that the banks 200 provided at one side and the other side of the first anode electrode 180 and the second anode electrode 190 have a step- And the second bank 202, thereby preventing the above-mentioned file-up phenomenon.

The upper surface of the second anode electrode 190 exposed by the first bank 201 and the upper surface of the second anode electrode 190 exposed by the first bank 201 and the second bank 202, The organic light emitting layer 210 is formed on the second anode 190 corresponding to the light emitting region EA as the organic light emitting material is injected onto the top surface of the first bank 201 exposed by the second bank 202, Can be formed flat. That is, in the embodiment of the present invention, the organic light emitting layer 210 may be formed on the upper edge of the first bank 201, thereby forming the organic light emitting layer 210 in the light emitting region EA.

For this, the first bank 201 is formed to have a hydrophilic characteristic as a whole, and the second bank 202 may have a hydrophobic characteristic as a whole or a hydrophobic characteristic only as a top. That is, as described above, in the embodiment of the present invention, in order to prevent the file up phenomenon from occurring in the region where the second anode electrode 190 corresponding to the light emitting region EA is exposed, The organic light emitting layer 210 must be formed on the upper surface.

Accordingly, the first bank 201 may be formed of a hydrophilic material and the organic light emitting layer 210 may be formed on the upper surface of the first bank 201. The second bank 202 may include the organic light emitting layer 210 Is formed of a hydrophobic material so as to restrict the region in which the film is formed. However, since the pixel region can be defined only when the organic light emitting layer 210 is not formed on the second bank 202, the second bank 202 may be formed of a hydrophobic material only at the top, But it is not limited thereto, and it is possible to be formed entirely of a hydrophobic material.

In addition, the first bank 201 and the second bank 202 are formed of an organic material. That is, conventionally, the first bank 201 formed on the second anode 190 is formed of an inorganic material. In this case, the performance of the planarization layer 170 and the thin film transistor T formed on the lower layer There is a problem that the first bank 201 is peeled from the finished product because the CVD process can not be performed at a low temperature. Further, in the process of patterning the first bank 201 through the etching process, there is a problem that the second anode electrode 190 is damaged by the etching solution.

Therefore, in the embodiment of the present invention, both the first bank 201 and the second bank 202 are formed of an organic material in order to prevent the deterioration of the quality and the damage of the second anode electrode 190, thereby simplifying the process The productivity can be improved. More specifically, the manufacturing process of the first bank 201 and the second bank 202 will be described later.

The organic light emitting layer 210 is formed on the second anode 190. The organic light emitting layer 210 includes a hole injecting layer, a hole transporting layer, an emitting layer, an electron transporting layer, and an electron injecting layer. Lt; / RTI > The structure of the organic light emitting layer 210 may be changed into various forms known in the art.

In particular, at least one layer of the hole injection layer, the hole transport layer, the light emitting layer, the electron transport layer, and the electron injection layer constituting the organic light emitting layer 210 may be formed through a solubilization process have. For example, the hole injecting layer, the hole transporting layer, and the light emitting layer may be formed through a soluble process, and the electron transporting layer and the electron injecting layer may be formed by a vapor deposition method or the like, but the present invention is not limited thereto.

The soluble process is a process of forming the organic light emitting layer 210 by spraying a soluble organic light emitting material onto the second anode 190 by ink jet printing and curing the soluble organic light emitting material as described above, And is used to increase convenience and efficiency.

In particular, the organic light emitting layer 210 may extend to the top surface of the first bank 201 exposed by the second bank 202. However, the organic light emitting layer 210 does not extend to the upper surface of the second bank 202 while covering the upper surface of the second bank 202.

For this, the first bank 201 may be formed entirely of a hydrophilic material, and the second bank 202 may be formed entirely of a hydrophobic material or may be formed of a hydrophobic material only.

The cathode electrode 220 is formed on the organic light emitting layer 210. The cathode electrode 220 is formed of a transparent conductive material because it is formed on a surface on which light is emitted.

Although not shown in the drawing, an encapsulation layer may be additionally formed on the cathode electrode 220 to prevent moisture from penetrating. As the sealing layer, various materials known in the art can be used. Although not shown, a color filter may be additionally formed on the cathode electrode 220 for each pixel. In this case, white light may be emitted from the organic light emitting layer 210.

In the embodiment of the present invention, a structure of a top emission type in which light generated in the organic emission layer 210 is emitted to the outside through the cathode 220 is exemplified. However, the present invention is not limited thereto, The first anode electrode 180 and the second anode electrode 190 may emit light to the outside through the first anode electrode 180 and the second anode electrode 190, respectively.

FIG. 3 is a schematic cross-sectional view of an organic light emitting display according to an embodiment of the present invention showing the region A shown in FIG.

3, a second anode 190, a bank 200, an organic light emitting layer 210, and a cathode 220 are formed on a substrate of the OLED display according to an exemplary embodiment of the present invention. Referring to FIG. .

Since the second anode 190, the bank 200, the organic light emitting layer 210, and the cathode 220 are laminated in the same manner as the organic light emitting display according to FIG. 2, And only the structures laminated in different structures will be described below.

The bank 200 includes a first bank 201 provided on one side and the other side of the second anode 190 so as to expose an upper surface of the second anode 190, And a second bank 202 provided on the first bank 201 so as to expose an edge of the first bank 201. The first bank 201 may be formed to have a thickness of 1.5 탆 or less and the second bank 202 may have a thickness of 2.0 탆 or less so that the second bank 202 is connected to the first bank 201 As shown in Fig. That is, as shown in FIG. 3, the organic light emitting layer 190 is formed on the upper surface of the first bank 201 so that the organic light emitting layer 190 may be formed on the second anode 190 The second bank 202 needs to be able to define a pixel region while restricting a region where the organic light emitting layer 210 is formed. Therefore, the second bank 202 is relatively thinner than the first bank 201, As shown in Fig.

3, the second bank 202 is provided to expose the upper surface of the edge of the first bank 201, so that the organic light emitting layer 210, as shown in FIG. 3, May be formed not only on the upper surface of the second anode electrode 190 but also on the upper surface of the first bank 201.

Therefore, even if the organic luminescent material is injected by the inkjet printing method, the organic luminescent layer 210 is formed on the upper surface of the second anode electrode 190 because the organic luminescent material is further formed on the upper edge of the first bank 201 And can be formed flat. Therefore, in the embodiment of the present invention, uniform light emission is possible in all areas of the pixel.

In addition, the second bank 202 may have a side surface 202a inclined at a predetermined angle with respect to the surface of the substrate. 3, the angle? Between the side surface 202a of the second bank 202 and the surface of the substrate may be less than 45 degrees.

That is, when the organic light emitting layer 210 is formed on the side surface 202a of the second bank 202 having a gentle inclination, the thickness variation of the organic light emitting layer 210 is reduced, The side walls 202a of the second bank 202 may be formed in the same direction as the side walls 202a of the second bank 202. In this case, The organic light emitting layer 210 provided on the second anode 190 may be formed to be flat. At this time, the angle? Is not limited to the above-described angle, but may vary depending on the viscosity of the organic light emitting material, the area of the upper surface of the first bank 201 exposed by the second bank 202, . Since the organic light emitting layer 210 is formed on the upper edge of the first bank 201, the angle between the side surface 201a of the first bank 201 and the surface of the substrate is limited to a specific value Do not.

In addition, according to an embodiment of the present invention, the first bank 201 is formed to have a hydrophilic characteristic as a whole, and the second bank 202 is formed to have a hydrophobic characteristic as a whole. That is, in the exemplary embodiment of the present invention, the organic light emitting layer 210 may be formed on the upper surface of the first bank 201 exposed by the second bank 202 so that the thickness of the organic light emitting layer 210 may be uniformly formed in the light emitting region. Should be formed.

Accordingly, the first bank 201 may be formed of a hydrophilic material and the organic light emitting layer 210 may be formed on the upper surface of the first bank 201. The second bank 202 may include the organic light emitting layer 210 Is formed of a hydrophobic material in order to restrict the region in which it is formed.

In addition, the first bank 201 and the second bank 202 are formed of an organic material. That is, conventionally, the first bank 201 formed on the second anode 190 is formed of an inorganic material. In this case, the performance of the planarization layer 170 and the thin film transistor T formed on the lower layer There is a problem that the first bank 201 is peeled from the finished product because the CVD process can not be performed at a low temperature. Further, in the process of patterning the first bank 201 through the etching process, there is a problem that the second anode electrode 190 is damaged by the etching solution.

Accordingly, in the embodiment of the present invention, the first bank 201 formed of an organic material is patterned through a first mask process in order to prevent the deterioration of the quality and the damage of the second anode 190, It is possible to simplify the process and improve the productivity as compared with the process of depositing the inorganic material by patterning the second bank 202 formed of the organic material through the process. More specifically, the manufacturing process of the first bank 201 and the second bank 202 will be described later.

As described above, in one embodiment of the present invention, the first bank 201 formed of a hydrophilic material and the bank 200 including the second bank 202 formed of a hydrophobic material may have a stepped step as a whole Uniform luminance can be realized by forming a flat organic emission layer 210 on the second anode electrode 190. By forming the first bank 201 and the second bank 202 from an organic material, It is possible to prevent the damage and quality deterioration of the second anode electrode 190 due to the CVD process.

FIG. 4 is a schematic cross-sectional view of an organic light emitting display according to another embodiment of the present invention showing the region A shown in FIG. 2. The organic light emitting display shown in FIG. 3, except that the structure of the bank 200 is changed, Device. Therefore, the same reference numerals are assigned to the same components, and only the different components will be described below.

In particular, in the organic light emitting display according to another embodiment of the present invention, the first bank 201 is formed to have a hydrophilic property as a whole, and the second bank 202 is formed to have a hydrophobic property only at the top.

That is, as described above, in the exemplary embodiment of the present invention, the upper surface of the first bank 201 exposed by the second bank 202 may be formed to have a uniform thickness of the organic light emitting layer 210 in the light- The organic light emitting layer 210 must be formed.

Accordingly, the first bank 201 should be formed entirely of a hydrophilic material because the organic light emitting layer 210 should be formed on the upper surface. However, since the second bank 202 is for defining a pixel region, The organic emission layer 210 may be formed. Therefore, according to another embodiment of the present invention, the second bank 202 may be formed of a hydrophobic material only at the upper portion, not the whole. Specifically, in another embodiment of the present invention, in the process of patterning the first bank 201 and the second bank 202, only the upper portion of the second bank 202 may be formed to be hydrophobic. Will be described later.

In addition, according to another embodiment of the present invention, the first bank 201 and the second bank 202 may be pattern-formed through the same mask process using the same organic material. That is, in the embodiment of FIG. 3, the first bank 201 is formed through a first mask process, and the second bank 202 is formed through a second mask process. The first bank 201 and the second bank 202 may be formed through a single mask process in another embodiment of the present invention. It is possible to reduce the number of mask processes.

As described above, in another embodiment of the present invention, the first bank 201 formed of a hydrophilic material and the bank 200 including the second bank 202 formed of a hydrophobic material may have a stepped step as a whole Uniform luminance can be realized by forming a flat organic emission layer 210 on the second anode electrode 190. By forming the first bank 201 and the second bank 202 from an organic material, It is possible to prevent the damage and quality deterioration of the second anode electrode 190 caused by the CVD process in the state of the first bank 201 and the second bank 202 having the above- The number of times of the mask process can be reduced.

5 is a schematic cross-sectional view of an OLED display according to another embodiment of the present invention, and is the same as the OLED display of FIG. 4 except that the structure of the bank 200 is changed. Therefore, the same reference numerals are assigned to the same components, and only the different components will be described below.

In the OLED display according to another embodiment of the present invention, the bank 200 may include a first bank 201, a second bank 202, and a third bank 203. That is, as shown in FIG. 4, the bank 200 may be formed so as to have two stepped steps, as well as three stepped steps as shown in FIG. 5 have. In addition, the step structure of the bank 200 is not limited to that shown in the drawings, and therefore, it may be formed to have stepped steps of four or more steps.

For example, when the bank 200 includes the first bank 201, the second bank 202, and the third bank 203, the third bank 203 is connected to the second bank 202, And the organic light emitting layer 210 may be formed on the upper surface of the first bank 201 exposed by the second bank 202 as well as on the second bank 202, And may extend to an upper surface of the second bank 202 exposed by the third bank 203. That is, when the organic light emitting layer 210 is formed to the upper surface of the exposed second bank 202, the organic light emitting layer 210 gently moves along the upper surfaces of the first bank 201 and the second bank 202 As a result, the thickness of the organic light emitting layer 210 in the light emitting region is more uniform.

In the case where the bank 200 includes the first bank 201, the second bank 202 and the third bank 203, the first bank 201 and the second bank 202 And the third bank 203 is formed to have a hydrophobic characteristic as a whole or a hydrophobic characteristic as a whole. That is, as described above, the organic light emitting layer 210 is formed on the upper surface of the second bank 202 exposed by the third bank 203 so that the thickness of the organic light emitting layer 210 can be uniformly formed in the light emitting region. The second bank 202 is formed of a hydrophilic material and the third bank 203 is formed to have a hydrophobic property so as to define a pixel region by limiting a region where the organic light emitting layer 210 is formed, Material.

When the bank 200 is provided with stepped steps of three or more steps, only the bank provided at the uppermost portion is provided with a hydrophobic material to define a pixel region, and the remaining banks provided at the lower portion are made of a hydrophilic material And the thickness of the organic light emitting layer 210 in the light emitting region can be reduced by gently forming the organic light emitting layer 210.

As described above, the angle formed by the side surface 202a of the second bank 202 and the side surface 203a of the third bank 203 with the surface of the substrate is set at a gentle angle of 45 degrees or less And the organic light emitting layer 210 may be formed flat in the light emitting region.

6A to 6J are cross-sectional views illustrating a method of manufacturing an organic light emitting diode display according to an embodiment of the present invention, which relates to a method of manufacturing the organic light emitting display according to the aforementioned FIG.

6A, an active layer 110, a gate insulating film 120, a gate electrode 130, an interlayer insulating film 140, a source electrode 150, and a drain electrode 160 are formed on a substrate 100, Respectively.

More specifically, the active layer 110 is formed on the substrate 100, the gate insulating layer 120 is formed on the active layer 110, the gate insulating layer 120 is formed on the gate insulating layer 120, A gate electrode 130 is formed on the gate insulating layer 140 and the interlayer insulating layer 140 is formed on the gate electrode 130. The gate insulating layer 140 and the gate insulating layer 140 are formed with first contact holes CH1, 2 contact hole CH2 and then the drain electrode 160 and the second contact hole CH2 connected to one end region of the active layer 110 through the first contact hole CH1, The source electrode 150 connected to the other end region of the active layer 110 is formed.

The source electrode 150 includes a lower source electrode 151 and an upper source electrode 152 and the drain electrode 160 includes a lower drain electrode 161 and an upper drain electrode 162. The source electrode 150 and the drain electrode 160 may be formed at the same time by the same patterning process using the same material.

6B, a passivation layer 165 is formed on the source electrode 150 and the drain electrode 160, and a planarization layer 170 is formed on the passivation layer 165. Next, as shown in FIG.

The passivation layer 165 and the planarization layer 170 are formed to have a third contact hole CH3 so that the source electrode 150 is exposed to the outside through the third contact hole CH3.

6C, a first anode electrode 180 and a second anode electrode 190 are sequentially formed on the planarization layer 170. Next, as shown in FIG.

The first anode 180 is formed to be connected to the source electrode 150 through the third contact hole CH3.

The first anode electrode 180 includes a first lower anode electrode 181 and a first upper anode electrode 182. The second anode electrode 190 includes a second lower anode electrode 191, A central anode electrode 192, and a second upper anode electrode 193.

Next, as shown in FIG. 6D, a first bank layer BK1 made of a hydrophilic organic material is formed on the second anode 190. More specifically, the first bank layer BK1 is formed on the entire surface of the active region including the second anode 190. In particular, the first bank layer BK1 according to the embodiment of the present invention may be made of a photosensitive material of a negative type.

That is, since the first bank layer BK1 is made of a photosensitive material of a negative type, the region irradiated with ultraviolet rays during exposure remains after the developing process, Respectively.

Next, as shown in FIG. 6E, a first photoresist pattern M1 is formed on the first bank layer BK1 and aligned. In particular, the first photoresist pattern M1 may include a first transmissive pattern M1-1 through which light is entirely transmitted during exposure and a second light-shielding pattern M1-2 that blocks light during exposure.

After the first photoresist pattern M1 is aligned, the first bank layer BK1 is exposed and developed using the first photoresist pattern M1 as a mask.

Since the first photoresist pattern M1 includes the first transmissive pattern M1-1 and the second light shielding pattern M1-2, the first photoresist pattern M1 is located under the first transmissive pattern M1-1 Ultraviolet rays are all irradiated to the first bank layer BK1 and ultraviolet light is not applied to the first bank layer BK1 located below the second light blocking pattern M1-2.

6F, the first photoresist pattern M1 is removed through a strip process so that the first bank 201 and the second anode 190 are exposed to the outside, (100). More specifically, the first bank 201 is patterned on one side and the other side of the second anode electrode 190, and the second anode electrode 190 is exposed to the outside in a region where the first bank 201 is not formed Exposed.

That is, as described above, since the first bank layer BK1 is made of a photosensitive material of a negative type, the first bank layer BK1 corresponding to the first transmission pattern M1-1, Are all left to form the first bank 201 and all of the first bank layers BK1 corresponding to the second light blocking pattern M1-2 and not irradiated with ultraviolet rays are removed.

6G, a second bank layer BK2 made of a hydrophobic organic material is formed on the first bank 201. Next, as shown in FIG. More specifically, the second bank layer BK2 is formed on the entire surface of the active region including the second anode 190 and the first bank 201. In particular, the second bank layer BK2 according to the embodiment of the present invention may be formed of a photosensitive material of a negative type.

That is, since the second bank layer BK2 is formed of a photosensitive material of a negative type, the region irradiated with ultraviolet rays during exposure remains after the developing process, Respectively.

6H, a second photoresist pattern M2 is formed and aligned on the second bank layer BK2. In particular, the second photoresist pattern M2 may include a second transmissive pattern M2-1 through which light is entirely transmitted during exposure and a second light-shielding pattern M2-2 that blocks all light during exposure.

After the second photoresist pattern M2 is aligned, the second bank layer BK2 is exposed and developed using the second photoresist pattern M2 as a mask.

Since the second photoresist pattern M2 includes the second transmissive pattern M2-1 and the second light shielding pattern M2-2, the second photoresist pattern M2 is located under the second transmissive pattern M2-1 Ultraviolet rays are all irradiated to the second bank layer BK2 and ultraviolet light is not applied to the second bank layer BK2 corresponding to the second light blocking pattern M2-2.

6I, the second photoresist pattern M2 is removed through a strip process so that the first bank 201, the second bank 202, and the second anode electrode 190 are exposed to the outside. More specifically, the first bank 201 and the second bank 202 are patterned on one side and the other side of the second anode electrode 190, and the first bank 201 and the second bank 202 are patterned by the second bank 202, And the second anode electrode 190 are exposed to the outside.

That is, as described above, since the second bank layer BK2 is made of a photosensitive material of a negative type, the second bank layer BK2 corresponding to the second transmissive pattern M2-1, Are all left to form the second bank 202. All of the second bank layers BK2 corresponding to the second light blocking pattern M2-2 and not irradiated with ultraviolet light are all removed.

Particularly, in the embodiment of the present invention, since the second bank 202 is formed to expose the edge of the first bank 201, the second light blocking pattern 202 included in the second photoresist pattern M2 Shielding pattern M2-2 is larger than the first light-shielding pattern M1-2 included in the first photoresist pattern M1.

6J, an organic light emitting layer 210 and a cathode electrode 220 are sequentially formed on the second anode electrode 190. Next, as shown in FIG. As described above, the first bank 201 is made of a hydrophilic material, and the second bank 202 is made of a hydrophilic material. The second bank 202 is formed by injecting a solubilized organic luminescent material through an ink- The organic light emitting layer 210 may be deposited on the upper surface of the second anode 190 and on the upper surface of the edge of the first bank 201 exposed by the second bank 202. [ But is not deposited on the upper surface of the second bank 202.

That is, in the embodiment of the present invention, the first bank layer BK1 made of a hydrophilic material and the second bank layer BK2 made of a hydrophobic material are used as the first bank 201 and the second bank BK2, 202 are formed not only on the upper surface of the second anode 190 exposed by the first bank 201 but also on the upper surface of the first bank 201 exposed by the second bank 202 The organic emission layer 210 may be formed. Accordingly, the organic light emitting layer 210 may be formed to be flat in a region where the second anode 190 corresponding to the light emitting region is exposed.

In the embodiment of the present invention, the first bank 201 and the second bank 202 are formed by using the first bank layer BK1 and the second bank layer BK2 made of an organic material as described above It is possible to simplify the process and improve the productivity as compared with the case of forming the bank with the inorganic material and to prevent the second anode electrode 190 from being damaged by the etchant in the process of patterning the bank.

Although the first bank 201 and the second bank 202 are formed through the first bank layer BK1 and the second bank layer BK2 made of the photosensitive material of the negative type in the above description, The first bank 201 and the second bank 202 may be formed by using a bank layer made of a positive type photosensitive material.

Although not shown, a step of forming the third bank to expose the edge of the second bank 202 is added after the step of forming the second bank 202 (Fig. 6I) . In this case, the organic light emitting layer 210 is formed to the upper surface of the second bank 202 exposed by the third bank in the process of forming the organic light emitting layer 210 (FIG. 6J). Accordingly, since the organic light emitting layer 210 can be gently formed along the upper surfaces of the first bank 201 and the second bank 202, the thickness of the organic light emitting layer 210 in the light emitting region is more uniform Respectively. When the third bank is additionally formed on the second bank 202, the first bank 201 and the second bank 202 are formed using a material having hydrophilic property, Is formed using a material having hydrophobicity.

7A to 7G are process cross-sectional views illustrating a method of forming a bank of an OLED display according to another embodiment of the present invention. This relates to the method of manufacturing the organic light emitting diode display of FIG. Therefore, the same reference numerals are assigned to the same components, and redundant description of the repetitive portions in the materials, structures, etc. of the respective components is omitted.

7A, an active layer 110, a gate insulating film 120, a gate electrode 130, an interlayer insulating film 140, a source electrode 150 and a drain electrode 160 are formed on a substrate 100, Respectively.

More specifically, the active layer 110 is formed on the substrate 100, the gate insulating layer 120 is formed on the active layer 110, the gate insulating layer 120 is formed on the gate insulating layer 120, A gate electrode 130 is formed on the gate insulating layer 140 and the interlayer insulating layer 140 is formed on the gate electrode 130. The gate insulating layer 140 and the gate insulating layer 140 are formed with first contact holes CH1, 2 contact hole CH2 and then the drain electrode 160 and the second contact hole CH2 connected to one end region of the active layer 110 through the first contact hole CH1, The source electrode 150 connected to the other end region of the active layer 110 is formed.

The source electrode 150 includes a lower source electrode 151 and an upper source electrode 152 and the drain electrode 160 includes a lower drain electrode 161 and an upper drain electrode 162. The source electrode 150 and the drain electrode 160 may be formed at the same time by the same patterning process using the same material.

7B, a passivation layer 165 is formed on the source electrode 150 and the drain electrode 160, and a planarization layer 170 is formed on the passivation layer 165. Next, as shown in FIG.

The passivation layer 165 and the planarization layer 170 are formed to have a third contact hole CH3 so that the source electrode 150 is exposed to the outside through the third contact hole CH3.

7C, a first anode electrode 180 and a second anode electrode 190 are sequentially formed on the planarization layer 170. Next, as shown in FIG.

The first anode 180 is formed to be connected to the source electrode 150 through the third contact hole CH3.

The first anode electrode 180 includes a first lower anode electrode 181 and a first upper anode electrode 182. The second anode electrode 190 includes a second lower anode electrode 191, A central anode electrode 192, and a second upper anode electrode 193.

Next, as shown in FIG. 7D, a bank layer BK made of an organic material is formed on the second anode 190. More specifically, the bank layer BK is formed on the entire surface of the active region including the second anode 190. In particular, the bank layer BK according to the embodiment of the present invention may be made of a photosensitive material of a negative type.

That is, since the bank layer BK is made of a photosensitive material of a negative type, the region irradiated with ultraviolet rays during exposure remains after the developing process, and the region where light is blocked during exposure has a characteristic of being removed after the developing process .

In addition, the bank layer BK according to the embodiment of the present invention may include a material to which a hydrophobic agent can be bound by cross linking in a region irradiated with ultraviolet rays (UV) . For example, the bank layer BK may be an organic material such as an acryl resin, an epoxy resin, a phenolic resin, a polyamide resin, a polyimide resin, But is not limited to, a material in which fluorine corresponding to a hydrophobic agent is mixed. Hereinafter, the case where the bank layer BK is an organic material containing fluorine will be described as an example.

Next, as shown in FIG. 7E, a photoresist pattern M is formed on the bank layer BK and aligned. Then, the solvent of the photoresist pattern M is removed through a soft-baking process. In this process, the fluorine contained in the bank layer BK moves to the surface.

In particular, the photoresist pattern M includes a transmissive pattern M1 through which light is entirely transmitted during exposure, a light-shielding pattern M2 that blocks all light during exposure, and a semi-transmissive pattern M3 through which only half of light is transmitted during exposure. . ≪ / RTI > After the photoresist pattern M is aligned, the exposure and development processes are performed on the bank layer BK using the photoresist pattern M as a mask.

Since the photoresist pattern M includes the transmissive pattern M1, the light shielding pattern M2 and the semi-transmissive pattern M3, the photoresist pattern M is formed in the bank layer BK located below the transmissive pattern M1 The ultraviolet rays are all irradiated and ultraviolet rays are not irradiated to the bank layer BK located below the light shielding pattern M2 and the bank layer BK located below the transflective pattern M3, The ultraviolet rays are only partially irradiated. The bank layer BK forms cross linking during exposure, and the fluorine moved to the surface in the above-described soft baking process is fixed to the surface by cross-linking.

Therefore, in the bank layer BK located below the transmissive pattern M1, crosslinking is formed and the hydrophobic agent is fixed, so that the upper portion becomes hydrophobic, and the lower portion of the light shielding pattern M2 The bank layer (BK) is hydrophilic because it does not have a hydrophobic agent. Since the ultraviolet rays are partially irradiated to the bank layer BK located below the transflective pattern M3 and the hydrophobic agent can not be fixed due to insufficient cross-linking, the bank layer BK of the corresponding region And becomes hydrophilic. Therefore, when the exposure and development processes are performed, the upper portion of the bank layer BK located under the transmissive pattern M1 is made of a hydrophobic material, and the lower portion of the transmissive pattern M3 The bank layer BK disposed on the bank layer BK is made of a hydrophilic material. As described above, in the embodiment of the present invention, a bank having a step difference can be formed through a single mask process by using a bank layer containing a hydrophobic agent, and at the same time, only the upper portion can be made hydrophobic.

7F, the photoresist pattern M is removed through a strip process so that the edges of the first bank 201, the second bank 202, and the second anode electrode 190 are exposed to the outside. More specifically, the first bank 201 is patterned on one side and the other side of the second anode electrode 190, and the second anode electrode 190 is exposed to the outside in a region where the first bank 201 is not formed And the second bank 202 is formed on the first bank 201 so as to expose the upper surface of the edge of the first bank 201.

That is, as described above, since the bank layer BK is made of a photosensitive material of a negative type, all of the bank layers BK irradiated with ultraviolet rays corresponding to the transmissive pattern M1 remain, All of the bank layers BK corresponding to the light shielding pattern M2 and not irradiated with ultraviolet rays are all removed and only half of the bank layer BK corresponding to the transflective pattern M3 and partially irradiated with ultraviolet light is left do. Thus, finally, as shown in FIG. 7F, the first bank 201 and the second bank 202 having a stepped step structure are formed. As described above, in another embodiment of the present invention, the number of mask processes can be reduced by forming the first bank 201 and the second bank 202 through a single slit mask or a half-tone mask.

7G, an organic light emitting layer 210 and a cathode electrode 220 are sequentially formed on the second anode electrode 190. Next, as shown in FIG. The organic light emitting layer 210 is formed by injecting a solubilized organic light emitting material through an inkjet printing method. The organic light emitting layer 210 is formed by exposing a process of forming the first and second banks 201 and 202 The first bank 201 is made of a hydrophilic material and the second bank 202 is made of only a hydrophobic material so that the organic light emitting layer 210 is formed on the upper surface of the second anode 190, May be deposited on the upper surface of the edge of the first bank 201 exposed by the second bank 202 but not deposited on the upper surface of the second bank 202.

Particularly, in the embodiment of the present invention, the first bank 201 is made of a hydrophilic material by using a bank layer BK made of a photosensitive material of a negative type as described above, and the second bank 202 has only an upper portion It may be provided with a hydrophobic substance. This will be described in more detail as follows.

If the bank layer BK made of a positive type photosensitive material is subjected to the above-described process, the region of the bank layer BK where ultraviolet rays are irradiated during the exposure is removed after the developing process, The blocked area remains after the development process. That is, since the region irradiated with the ultraviolet rays is changed to a state capable of being removed by the developer through the photochemical action and the region not irradiated with the ultraviolet ray remains, the exposure process using the negative type photosensitive material Likewise, the hydrophobic agent can not be bound to the surface by cross-linking. As described above, since only the upper portion of a specific bank can not be formed with hydrophobicity by using the bank layer BK made of a photosensitive type photosensitive material, in the embodiment of the present invention, the bank layer BK made of a photosensitive material of a negative type, The first bank 201 and the second bank 202 having the above-described characteristics can be formed.

Although not shown in the figure, in the step of forming the first bank 201 and the second bank 202 described above (Fig. 7F), the third bank 201 is formed so as to expose the edge of the second bank 202, Can be formed together. In this case, the organic light emitting layer 210 is formed to the upper surface of the second bank 202 exposed by the third bank in the process of forming the organic light emitting layer 210 (FIG. 7G). Accordingly, since the organic light emitting layer 210 can be gently formed along the upper surfaces of the first bank 201 and the second bank 202, the thickness of the organic light emitting layer 210 in the light emitting region is more uniform Respectively. Particularly, as described above, the first to third banks 201 to 3 are formed using the bank layer BK including a material to which the hydrophobic agent can be bound by cross-linking in a region irradiated with ultraviolet rays at the time of exposure Therefore, the first bank 201 and the second bank 202 may be formed of a hydrophilic material, and the third bank may be formed only of a hydrophobic material.

Although the embodiments of the present invention have been described in detail with reference to the accompanying drawings, it is to be understood that the present invention is not limited to those embodiments and various changes and modifications may be made without departing from the scope of the present invention. . Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the scope of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. Therefore, it should be understood that the above-described embodiments are illustrative in all aspects and not restrictive. The scope of protection of the present invention should be construed according to the claims, and all technical ideas within the scope of equivalents should be interpreted as being included in the scope of the present invention.

100: substrate T: thin film transistor layer
165: passivation layer 170: planarization layer
180: First anode electrode 190: Second anode electrode
201: first bank 202: second bank
210: organic light emitting layer 220: cathode electrode

Claims (12)

An anode electrode provided on the substrate;
A first bank provided on one side and the other side of the anode electrode;
A second bank provided on the first bank to expose an edge of the first bank;
An organic light emitting layer provided on an upper surface of the anode electrode exposed by the first bank and on an upper surface of the exposed first bank; And
And a cathode electrode provided on the organic light emitting layer,
Wherein the first bank and the second bank are formed of an organic material. The method according to claim 1,
Wherein the first bank is made of a material having hydrophilicity, and the second bank is made of a material having hydrophobicity. The method according to claim 1,
And a third bank provided on the second bank so as to expose an edge of the second bank, wherein the organic light emitting layer is provided up to an upper surface of the exposed second bank. The method of claim 3,
Wherein the first bank and the second bank are made of a material having hydrophilicity, and the third bank is made of a material having hydrophobicity. The method of claim 3,
And the sides of the second bank and the third bank are inclined at a predetermined angle with respect to the surface of the substrate. Forming an anode electrode on the substrate;
Forming a bank comprising an organic material on one side and the other side of the anode electrode;
Forming an organic light emitting layer on an upper surface of the anode electrode exposed by the bank; And
And forming a cathode electrode on the organic light emitting layer,
A first bank is formed on one side and the other side of the anode electrode using a halftone mask in the step of forming the bank and a second bank is formed on the first bank so as to expose an edge of the first bank and,
Wherein the organic light emitting layer is formed to a top surface of the exposed first bank in the step of forming the organic light emitting layer. The method according to claim 6,
Wherein the step of forming the bank comprises:
Forming a bank layer made of a photosensitive material of a negative type on the anode electrode;
Forming a photoresist pattern on the bank layer;
Exposing and developing the bank layer using the photoresist pattern as a mask, and forming the first bank and the second bank by the remaining bank layer; And
And removing the photoresist pattern. The method of manufacturing an organic light emitting display according to claim 1, 8. The method of claim 7,
Wherein the bank layer is made of an organic material including a hydrophobic agent,
Wherein the hydrophobic material is fixed by cross linking by the exposure in a process of forming the first bank and the second bank so that a predetermined region of the second bank is formed to have hydrophobicity, ≪ / RTI > The method according to claim 6,
A third bank is further formed on the second bank so as to expose an edge of the second bank using the halftone mask in the step of forming the bank,
Wherein the organic light emitting layer is formed to a top surface of the exposed second bank in the step of forming the organic light emitting layer. Forming an anode electrode on the substrate;
Forming a first bank comprising an organic material on one side and the other side of the anode electrode;
Forming a second bank made of an organic material on the first bank so as to expose an edge of the first bank;
Forming an organic light emitting layer on a top surface of the anode electrode exposed by the first bank and on an exposed top surface of the first bank; And
And forming a cathode electrode on the organic light emitting layer. 11. The method of claim 10,
Wherein the first bank is formed using a material having hydrophilicity, and the second bank is formed using a material having hydrophobicity. 11. The method of claim 10,
Further comprising the step of forming a third bank on the second bank so as to expose an edge of the second bank after the step of forming the second bank,
Wherein the organic light emitting layer is formed to a top surface of the exposed second bank in the step of forming the organic light emitting layer,
Wherein the first bank and the second bank are formed using a material having hydrophilicity, and the third bank is formed using a material having hydrophobicity.

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