CN111463356B - Display panel, preparation method of display panel and display device - Google Patents

Display panel, preparation method of display panel and display device Download PDF

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Publication number
CN111463356B
CN111463356B CN202010313022.9A CN202010313022A CN111463356B CN 111463356 B CN111463356 B CN 111463356B CN 202010313022 A CN202010313022 A CN 202010313022A CN 111463356 B CN111463356 B CN 111463356B
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layer
light
display panel
photosensitive
area
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CN111463356A (en
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莫丹
赵欢
朱平
张义波
陈营营
贾松霖
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Kunshan Govisionox Optoelectronics Co Ltd
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Kunshan Govisionox Optoelectronics Co Ltd
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/10OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/121Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
    • H10K30/80Constructional details
    • H10K30/865Intermediate layers comprising a mixture of materials of the adjoining active layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/805Electrodes
    • H10K50/82Cathodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/122Pixel-defining structures or layers, e.g. banks
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/873Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Geometry (AREA)
  • Manufacturing & Machinery (AREA)
  • Electromagnetism (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

The embodiment of the invention discloses a display panel, a preparation method of the display panel and a display device. The display panel is provided with a display area and a non-display area, wherein the non-display area comprises a light-transmitting area; the display panel includes: the array substrate is provided with a pixel defining layer, and the pixel defining layer comprises a plurality of openings; an organic layer on the array substrate within the opening; the protective layer is positioned on one side, away from the array substrate, of the organic layer in the light-transmitting area; and the cathode layer is positioned on one side, far away from the array substrate, of the organic layer in the area except the light-transmitting area. According to the embodiment of the invention, the organic layer is protected by arranging the protective layer on the organic layer in the light-transmitting area, and the cathode layer is arranged in the area except the light-transmitting area, so that the light-transmitting area is not shielded by the cathode layer, and the light transmittance of the light-transmitting area is increased.

Description

Display panel, preparation method of display panel and display device
Technical Field
The embodiment of the invention relates to the technical field of display, in particular to a display panel, a preparation method of the display panel and a display device.
Background
With the development of display technology, the comprehensive screen has a larger screen occupation ratio and an ultra-narrow frame, and compared with a common display screen, the comprehensive screen can greatly improve the visual effect of a viewer, thereby receiving wide attention.
At present, in the display device such as cell-phone that adopts the full face screen, in order to realize the function of autodyne, video call and fingerprint identification, all can set up shape such as water droplet, bang in order to reserve leading camera locating place at display device's top usually, however the OLED rete can influence the regional transmissivity of camera, influences the sensitization effect of camera.
Disclosure of Invention
The embodiment of the invention provides a display panel, a preparation method of the display panel and a display device, which are used for improving the light transmittance of a light-transmitting area of the display panel.
In a first aspect, an embodiment of the present invention provides a display panel, which has a display area and a non-display area, where the non-display area includes a light-transmitting area;
the display panel includes:
the array substrate is provided with a pixel defining layer, and the pixel defining layer comprises a plurality of openings;
an organic layer on the array substrate within the opening;
the protective layer is positioned on one side, far away from the array substrate, of the organic layer in the light-transmitting area;
and the cathode layer is positioned on one side, far away from the array substrate, of the organic layer in the area except the light-transmitting area.
Optionally, the protective layer is a dense film layer, and the dense film layer includes at least one of lithium fluoride, aluminum oxide, or silicon oxide;
the thickness of the protective layer is 0.8-1.2 microns, and preferably, the thickness of the protective layer is 1 micron.
Alternatively, the first and second liquid crystal display panels may be,
the display panel further comprises an encapsulation layer, wherein the encapsulation layer is positioned on one side, away from the array substrate, of the cathode layer of the display area and one side, away from the array substrate, of the protection layer of the light-transmitting area;
preferably, the encapsulation layer located in the display region includes a first inorganic thin film layer, an organic thin film layer, and a second inorganic thin film layer stacked in sequence; the packaging layer located in the light-transmitting area comprises the organic thin film layer and the second inorganic thin film layer.
In a second aspect, an embodiment of the present invention further provides a method for manufacturing a display panel, where the method includes: providing an array substrate, and forming a pixel defining layer on the array substrate, wherein the pixel defining layer comprises a plurality of openings;
forming an organic layer on the array substrate positioned in the opening;
forming a protective layer on the organic layer in the light-transmitting region;
forming a photosensitive layer on the pixel defining layer in the light transmitting area, wherein the photosensitive layer fills the opening;
forming a cathode layer on the pixel defining layer, the cathode layer covering the photosensitive layer of the light transmitting region;
removing the photosensitive layer of the light-transmitting region to remove the cathode layer on the photosensitive layer.
Optionally, the material of the photosensitive layer includes a photosensitive resin; preferably, the material of the photosensitive resin includes dichromic acid photoresist or polyvinyl alcohol cinnamate photoresist.
Optionally, the forming a photosensitive layer on the pixel defining layer located in the light transmitting region includes:
and coating the photosensitive resin on the pixel defining layer positioned in the light transmitting area to form the photosensitive layer.
Optionally, after the photosensitive layer is formed, a highest point of the photosensitive layer is higher than a highest point of the pixel defining layer of the display region.
Optionally, the removing the photosensitive layer of the light-transmitting region to remove the cathode layer on the photosensitive layer comprises:
and irradiating the side surface of the photosensitive layer, and etching to remove the photosensitive layer higher than the pixel defining layer in the light transmitting area and the cathode layer on the photosensitive layer.
Optionally, after the removing, by the irradiating light to the side of the photosensitive layer, the photosensitive layer higher than the pixel defining layer located in the light transmitting area and the cathode layer located on the photosensitive layer by etching, the method further includes:
and etching and removing the residual photosensitive layer by illuminating the front surface of the residual photosensitive layer positioned in the light transmitting area.
In a third aspect, an embodiment of the present invention further provides a display device, including the display panel provided in any embodiment of the present invention or a display panel manufactured by the manufacturing method of the display panel provided in any embodiment of the present invention.
The embodiment of the invention provides a display panel, a preparation method of the display panel and a display device, wherein the display panel is provided with a display area and a non-display area, and the non-display area comprises a light-transmitting area; the display panel comprises an array substrate, wherein a pixel defining layer is arranged on the array substrate, and the pixel defining layer comprises a plurality of openings; and the organic layer is positioned on the array substrate and is arranged in the opening. According to the embodiment of the invention, the organic layer is protected by arranging the protective layer on the organic layer in the light-transmitting area, and the cathode layer is arranged in the area except the light-transmitting area, so that the light-transmitting area is not shielded by the cathode layer, and the light transmittance of the light-transmitting area is increased.
Drawings
Fig. 1 is a schematic structural diagram of a display panel according to an embodiment of the present invention;
FIG. 2 is a cross-sectional view of the display panel of FIG. 1 along section line AA;
fig. 3 is a schematic structural diagram of another display panel according to an embodiment of the present invention;
fig. 4 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present invention;
fig. 5 to 9 are schematic structural diagrams of a display panel corresponding to a main flow of a method for manufacturing a display panel according to an embodiment of the present invention;
FIG. 10 is a flowchart of another method for fabricating a display panel according to an embodiment of the present invention;
fig. 11 is a schematic structural diagram of a display panel with a photosensitive layer removed according to an embodiment of the present invention;
fig. 12 is a schematic structural diagram of another display panel with a photosensitive layer removed according to an embodiment of the disclosure;
fig. 13 is a schematic structural diagram of a display device according to an embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
Example embodiments may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their repetitive description will be omitted. The words expressing the position and direction described in the present invention are illustrated in the accompanying drawings, but may be changed as required and still be within the scope of the present invention. The drawings of the present invention are only for illustrating the relative positional relationship, the layer thicknesses of some parts are exaggerated in a drawing manner for easy understanding, and the layer thicknesses in the drawings do not represent the proportional relationship of the actual layer thicknesses.
The embodiment of the invention provides a display panel, which is provided with a display area and a non-display area, wherein the non-display area comprises a light-transmitting area; the display panel comprises an array substrate, wherein a pixel defining layer is arranged on the array substrate and comprises a plurality of openings; an organic layer on the array substrate within the opening; and the organic layer of the light-transmitting area is positioned on the protective layer at one side far away from the array substrate, and a cathode layer is arranged at one side far away from the substrate of the organic layer, wherein the cathode layer is positioned in an area except the light-transmitting area. Generally, the transparent area can be used for placing a camera, but the anode layer, the pixel defining layer and the cathode layer in the transparent area have poor light transmittance, so that the photosensitive effect of the transparent area is poor. In order to improve the light sensitivity of the light-transmitting area in the prior art, the light transmittance is improved by removing the anode in the light-transmitting area, but the light transmittance of the residual cathode layer is still low, so that the light transmittance of the light-transmitting area is greatly reduced. According to the embodiment of the invention, the light transmittance of the light transmitting area is improved by removing the cathode layer in the light transmitting area, and other film layers in the display area and the non-display area are not damaged in the process of removing the cathode layer, so that the completeness of the film layers in the display area and the non-display area is favorably maintained.
The above is the core idea of the present invention, and the technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the drawings in the embodiment of the present invention. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present invention without any creative work belong to the protection scope of the present invention.
Fig. 1 is a schematic structural diagram of a display panel according to an embodiment of the invention, and fig. 2 is a cross-sectional view of the display panel in fig. 1 along a sectional line AA. Referring to fig. 1 and 2, the display panel according to the embodiment of the present invention has a display area 100 and a non-display area (not shown) including a light-transmitting area 210; the display panel includes:
the array substrate 10, a pixel defining layer 103 is arranged on the array substrate 10, and the pixel defining layer 103 comprises a plurality of openings;
an organic layer 20 on the array substrate 10 within the opening;
the protective layer 30 is positioned on one side of the organic layer 20 of the light-transmitting region 210, which is far away from the array substrate 10;
and a cathode layer 40 on a side of the organic layer 20 away from the array substrate 10 in a region other than the light-transmitting region 210.
Specifically, the display panel includes a display area 100 and a non-display area, and the array substrate 10 includes a substrate 101, an anode layer 102, and a pixel defining layer 103. Further, a gate insulating layer 104, a passivation layer 105, and thin film transistors 106 are provided on the substrate 101, and the thin film transistors 106 are arranged in an array in the display region 100, and constitute a driving circuit of the light emitting device, driving the light emitting device to emit light. A planarization layer 107 is disposed on the passivation layer 105, and the anode layer 102, the pixel defining layer 103, the organic layer 20, and the cathode layer 40 are sequentially disposed on the planarization layer 107, the pixel defining layer 103 including a plurality of openings exposing the anode layer 102, the anode layer 102 being positioned at the bottom of the openings. The anode layer 102, the organic layer 20, and the cathode layer 40 in the display area 100 form an OLED light emitting device, wherein the organic layer 20 may be one or more layers, for example, the organic layer 20 may include an electron injection layer, an electron transport layer, a light emitting layer, a hole transport layer, and a hole injection layer, electrons of the cathode layer 40 and holes of the anode layer 102 are respectively injected into the electron injection layer and the hole injection layer under the driving action of an electric field, and then migrate to the light emitting layer through the electron transport layer and the hole transport layer, the electrons and holes combine in the light emitting layer to generate excitons, and the excitons generate photon light emission through migration and radiation attenuation. The cathode layer 40 is positioned in an area other than the light-transmitting area 210, such as the display area 100. The display panel further includes a light-transmitting region 210 located in the non-display region, in order to improve the light transmittance of the light-transmitting region 210, in the embodiment of the present invention, the cathode layer 40 in the light-transmitting region 210 is removed, only the organic layer 20 and the protective layer 30 are remained, and the protective layer 30 is used to protect the organic layer 20 from being oxidized by external moisture and oxygen when the cathode layer 40 on the organic layer 20 is removed, so as to avoid affecting the organic layer 20 in the display region 100. Of course, the protective layer 30 may also be disposed between the cathode layer 40 and the organic layer 20 of the display area 100. Meanwhile, the organic layer 20 located in the light-transmitting region 210 does not include a light-emitting layer, so as to prevent the light-emitting layer from affecting the light-sensing capability of the light-transmitting region 210, for example, a Fine Metal Mask (FMM) may be used to manufacture the light-emitting layer in the light-transmitting region 210 during the manufacturing process of the organic layer 20, and only the electron injection layer, the electron transport layer, the hole transport layer, and the hole injection layer remain. The substrate 101 may be flexible and may be formed of any suitable insulating material having flexibility; the substrate 101 may also be rigid, such as a glass substrate. The position of the light-transmitting region 210 of the display panel may correspond to the installation of a camera or a sensor.
The non-display area generally refers to an area without a display function in the use process of the display panel, the non-display area includes a light-transmitting area 210, in order to improve the screen ratio, the design scheme of the display panel shown in fig. 1 may be generally adopted, but the display panel adopting the design scheme shown in fig. 1 needs to improve the light-sensing capability of the light-transmitting area 210, so that the light transmittance of the light-transmitting area 210 may be greatly improved by removing the cathode layer 40 located in the light-transmitting area 210 in the embodiment of the present invention, so as to improve the light-sensing capability of the light-transmitting area 210, and when a camera is built in the light-transmitting area 210, the light-sensing effect of the camera may be enhanced.
Compared with the prior art, the technical solution provided by the embodiment of the present invention protects the organic layer 20 by disposing the protective layer 30 on the organic layer 20 of the light-transmitting region 210, and disposing the cathode layer 40 in the region except the light-transmitting region 210. In the actual manufacturing process of the display panel, the cathode layer 40 in the display area 100 and the light-transmitting area 210 are manufactured together, in a normal case, the cathode layer 40 in the light-transmitting area 210 can be removed by photolithography, and the protection layer 30 is disposed on the organic layer 20 to prevent the organic layer 20 from being oxidized by external moisture and oxygen in the process of removing the cathode layer 20 in the light-transmitting area 210, because the organic layer 20 in the display area 100 and the organic layer 20 in the light-transmitting area 210 are in common, the integrity of the organic layer 20 in the display area 100 can be indirectly protected by protecting the organic layer 20 in the light-transmitting area 210, and the phenomena of missing or falling off of the organic layer 20 and the like caused by the influence of the oxidation of the organic layer 20 in the display area 100 by the organic layer 20 in the light-transmitting area 210 can be effectively avoided. And the light-transmitting region 210 is not shielded by the cathode layer 40, thereby increasing the light transmittance of the light-transmitting region 210.
Optionally, the protective layer 30 is a dense film layer comprising at least one of lithium fluoride, aluminum oxide, or silicon oxide. Specifically, the protective layer 30 is mainly used to prevent external moisture and oxygen from entering the organic layer 20, so as to ensure that the organic layer 20 is not damaged. The organic layer 20 in the light-transmitting region 210 is a common film layer with the organic layer 40 in the display region 100, and is different only in that the organic layer 20 in the light-transmitting region 210 does not include a light-emitting layer. In general, the cathode layer 40 in the display area 100 and the cathode layer 40 in the light-transmitting area 210 are manufactured together, the cathode layer 40 in the light-transmitting area 210 can be removed by photolithography, the organic layer 20 can be prevented from being oxidized by external moisture and oxygen during the process of removing the cathode layer 40 in the light-transmitting area 210 by disposing the protective layer 30 on the organic layer 20, and since the organic layer 20 in the display area 100 and the organic layer 20 in the light-transmitting area 210 are in common, the integrity of the organic layer 20 in the display area 100 can be indirectly protected by protecting the organic layer 20 in the light-transmitting area 210. The material of the protective layer 30 may be lithium fluoride, aluminum oxide, or silicon oxide, preferably lithium fluoride. Lithium fluoride through forming a certain thickness of one deck on being located the organic layer 20 in light transmission area 210 opening can be on the basis that the cathode layer 40 in-process that realizes organic layer 20 can not get rid of in light transmission area 210 is oxidized by external steam and oxygen, has better light transmissivity simultaneously, can not influence the holistic luminousness in light transmission area 210, and preferably, the thickness of protective layer 30 is 1 micron.
Optionally, fig. 3 is a schematic structural diagram of another display panel provided in the embodiment of the present invention. On the basis of the above embodiment, referring to fig. 3, the display panel further includes an encapsulation layer 60, the cathode layer 40 of the display area 100 is located on a side away from the array substrate 10, and the protection layer 30 of the light-transmitting area 210 is located on a side away from the array substrate 10;
preferably, the encapsulation layer 60 positioned at the display area 100 includes a first inorganic thin film layer, an organic thin film layer, and a second inorganic thin film layer, which are sequentially stacked; the encapsulation layer positioned in the light-transmitting region 210 includes an organic thin film layer and a second inorganic thin film layer. The encapsulation layer 60 is used to isolate the external water and oxygen and impurities from entering the display panel, and the protection layer 30 can isolate the external water vapor and oxygen from entering the organic layer 20, so that the protection layer 30 can be reused as the first inorganic thin film layer in the light-transmitting region 210 to reduce the manufacturing process flow of the light-transmitting region 210. The embodiment of the invention also provides a preparation method of the display panel. Optionally, fig. 4 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present invention; fig. 5 to 9 are schematic structural diagrams of a display panel corresponding to a main flow of a method for manufacturing a display panel according to an embodiment of the present invention. On the basis of the above embodiment, referring to fig. 4, a method for manufacturing a display panel according to an embodiment of the present invention includes:
step 410, providing an array substrate, and forming a pixel defining layer on the array substrate, wherein the pixel defining layer includes a plurality of openings.
Specifically, referring to fig. 5, the array substrate 10 includes a substrate 101, an anode layer 102, and a pixel defining layer 103, and the pixel defining layer 103 includes a plurality of openings exposing the anode layer 102. The substrate 101 may be flexible and may be formed of any suitable insulating material having flexibility; the substrate 101 may also be rigid, such as a glass substrate. A gate insulating layer 104, a passivation layer 105, and thin film transistors 106 are formed over a substrate 101, and the thin film transistors 106 are arranged in an array in the display region 100 to constitute a driving circuit of the light emitting device, thereby driving the light emitting device to emit light. The planarization layer 107 is formed on the passivation layer 105, which is beneficial to smooth the surface step difference caused by different film patterns on the substrate 101, and is convenient for the preparation of the subsequent film. A pixel array is formed on the substrate 101 of the display area 100, and the pixel array includes a pixel circuit, which may be formed of a thin film transistor 106.
Step 420, forming an organic layer on the array substrate located in the opening.
Specifically, with continued reference to fig. 5, a display area 100 including an anode layer 102, a pixel defining layer 103, an organic layer 20, and a cathode layer 40 is formed on a side of the planarization layer 107 away from the substrate 101, the pixel defining layer 103 including a plurality of openings exposing the anode layer 102, the anode layer 102 being located at the bottom of the openings. The anode layer 102, the organic layer 20, and the cathode layer 40 within the display area 100 form an OLED light emitting device, wherein the organic layer 20 may include an electron injection layer, an electron transport layer, a light emitting layer, a hole transport layer, and a hole injection layer. In order to avoid the influence of the light emitting layer on the photosensitive effect of the light transmitting region 210, the light emitting layer is not formed in the organic layer 20 in the light transmitting region 210. The display panel further includes a pixel array on the substrate 101, where the pixel array includes a plurality of pixel units arranged in an array, and the pixel units include thin film transistor circuits to form a driving circuit of the OLED light emitting device, so as to drive the OLED light emitting device to emit light. The pixel unit is located in the light emitting layer in the display area 100, and typically includes a red sub-pixel, a green sub-pixel, and a blue sub-pixel to realize color display. The pixel defining layer 103 may be a pixel defining layer for defining the position of each sub-pixel, or may be an integral body including the pixel defining layer and a space defining layer located on the pixel defining layer for ensuring the distance between the substrate and the fixture in the evaporation process of the OLED light emitting device.
Step 430, a protective layer is formed on the organic layer in the light-transmitting region.
Specifically, on the basis of the above embodiment, referring to fig. 6, a gate insulating layer 104, a passivation layer 105, and thin film transistors 106 are provided on a substrate 101, and the thin film transistors 106 are arranged in an array in the display region 100, and constitute a driving circuit of the light emitting device, driving the light emitting device to emit light. A planarization layer 107 is formed on the passivation layer 105, and a display area 100 including the anode layer 102, the pixel defining layer 103, the organic layer 20, and the cathode layer 40 is formed on a side of the planarization layer 107 away from the substrate 101, the pixel defining layer 103 including a plurality of openings exposing the anode layer 102, the anode layer 102 being located at the bottom of the openings. After the organic layer 20 is formed at the opening of the light-transmitting region 210, a protective layer 30 having a certain thickness is evaporated on the organic layer 20 through a mask. Since the organic layer 20 in the transparent region 210 is a common layer with the organic layer 20 in the display region 100, the organic layer 20 in the display region 100 is also affected when the organic layer 20 in the transparent region 210 is damaged. Therefore, before the photosensitive layer 50 is coated on the light-transmitting region 210, a protective layer 30 is deposited on the organic layer 20 in the light-transmitting region 210 to prevent the organic layer 20 from being oxidized during the process of removing the cathode layer 40 in the light-transmitting region 210.
Alternatively, the material of the protective layer 30 may be lithium fluoride or aluminum oxide. The protective layer 30 is mainly used to ensure that the organic layer 20 is not oxidized when the cathode layer 40 on the organic layer 20 is removed. The organic layer 20 in the light-transmitting region 210 is a common film layer with the organic layer 20 in the display region 100, and is different only in that the organic layer 20 in the light-transmitting region 210 does not include a light-emitting layer. In general, the cathode layer 40 in the display area 100 and the cathode layer 40 in the light-transmitting area 210 are fabricated together, the cathode layer 40 in the light-transmitting area 210 can be removed by photolithography, the organic layer 20 can be prevented from being oxidized during the process of removing the cathode layer 40 in the light-transmitting area 210 by disposing the protective layer 30 on the organic layer 20, and the integrity of the organic layer 20 in the display area 100 can be indirectly protected by protecting the organic layer 20 in the light-transmitting area 210 because the organic layer 20 in the display area 100 and the organic layer 20 in the light-transmitting area 210 are common. The material of the protective layer 30 includes lithium fluoride or alumina, preferably lithium fluoride. Through form the lithium fluoride that one deck thickness is 1 micron at least on being located the organic layer 20 in light-transmitting zone 210 opening, can realize organic layer 20 can not get rid of the basis that the cathode layer 40 in the light-transmitting zone 210 in-process was oxidized, have better light transmissivity simultaneously, can not influence the holistic luminousness of light-transmitting zone 210.
Step 440, forming a photosensitive layer on the pixel defining layer in the transparent region, wherein the opening is filled with the photosensitive layer.
Specifically, referring to fig. 7, the photosensitive layer 50 may be formed on the pixel defining layer 103 located in the light transmitting region 210 in a coating manner. Illustratively, the material of the photosensitive layer 50 includes a photosensitive resin; preferably, the material of the photosensitive resin includes dichromic acid photoresist or polyvinyl alcohol cinnamate photoresist. Meanwhile, the highest point of the photosensitive layer 50 is higher than the highest point of the pixel defining layer 103 of the display area, in other words, after the photosensitive layer 50 is formed in the light transmitting area 210, the height of the photosensitive layer 50 in the light transmitting area 210 is higher than the height of the pixel defining layer 103 of the display area 100, and a step with a height difference is formed between the display area 100 and the light transmitting area 210, so that when a cathode layer is deposited subsequently, the cathode layer between the display area 100 and a non-display area is broken and separated, and the subsequent removal of the cathode layer of the light transmitting area 210 does not affect the cathode layer of the display area.
Step 450, a cathode layer is formed on the pixel defining layer, wherein the cathode layer covers the photosensitive layer of the light-transmitting region.
Specifically, referring to fig. 8, a cathode layer 40 is deposited on the pixel defining layer 103 in the display area 100 and the non-display area, and the material of the cathode layer 40 may be indium tin oxide. Since the height of the photosensitive layer 50 in the light-transmitting region 210 is higher than the height of the pixel defining layer 103 in the display region 100, a step with a height difference is formed between the display region 100 and the light-transmitting region 210, and due to the height difference, when the cathode layer 40 is deposited, the cathode layer 40 between the display region 100 and the non-display region is broken, the cathode 402 of the light-transmitting region 210 is separated from the cathode 401 in the display region 100, so that the cathode 402 in the light-transmitting region 210 is completely located on the photosensitive layer 50 and covers the photosensitive layer 50.
Step 460, remove the photosensitive layer in the transparent region to remove the cathode layer on the photosensitive layer.
Specifically, referring to fig. 9, since the photosensitive layer 50 includes a photosensitive material and is sensitive to light, the photosensitive layer 50 can perform a photochemical reaction under the action of light. The photosensitive layer 50 may be made of a photosensitive resin such as dichromic acid photoresist or polyvinyl alcohol cinnamate photoresist, or the photosensitive resin such as dichromic acid photoresist or polyvinyl alcohol cinnamate photoresist is colloidal, and the photosensitive layer 50 may be formed by coating. Illustratively, the photosensitive layer 50 in the light-transmitting region 210 undergoes a decomposition reaction under the action of light, and then the photosensitive layer 50 is etched to remove the photosensitive layer 50. Since the cathode 402 on the photosensitive layer 50 is separated from the cathode 401 in the display area 100, when the photosensitive layer 50 is removed, the cathode 402 covering the photosensitive layer 50 is also removed, so that the cathode layer 40 in the light-transmitting area 210 is removed, thereby greatly increasing the light transmittance of the light-transmitting area 210. The operation is simple and convenient, the cathode layer and other film layers in the display area can not be influenced, and the normal display effect is ensured.
Optionally, fig. 10 is a flowchart of another method for manufacturing a display panel according to an embodiment of the present invention. On the basis of the above embodiment, referring to fig. 10, a method for manufacturing a display panel according to an embodiment of the present invention includes:
step 510, providing an array substrate, and forming a pixel defining layer on the array substrate, wherein the pixel defining layer includes a plurality of openings.
Step 520, forming an organic layer on the array substrate located in the opening.
Step 530, a protective layer is formed on the organic layer in the light-transmitting region.
Step 540, forming a photosensitive layer on the pixel defining layer in the transparent region, wherein the opening is filled with the photosensitive layer.
Step 550 is to form a cathode layer on the pixel defining layer, the cathode layer covering the photosensitive layer of the light-transmitting region.
And 560, by illuminating the side surface of the photosensitive layer, etching to remove the photosensitive layer higher than the pixel defining layer in the light-transmitting area and the cathode layer on the photosensitive layer.
Specifically, since the highest point of the photosensitive layer 50 is higher than the highest point of the pixel defining layer 103 of the display area 100, after the cathode layer 40 is deposited on the photosensitive layer 50 of the non-display area and the pixel defining layer 103 of the display area 100, a step with a height difference is formed between the cathode 402 located on the photosensitive layer 50 and the cathode 401 in the display area 100. Fig. 11 is a schematic structural diagram of a display panel with a photosensitive layer removed according to an embodiment of the present invention, and fig. 12 is a schematic structural diagram of another display panel with a photosensitive layer removed according to an embodiment of the present invention. On the basis of the above embodiment, referring to fig. 11 and 12, due to the height difference, when depositing the cathode layer 40, the cathode layer 40 between the display area 100 and the non-display area is broken, the cathode 402 of the light-transmitting area 210 is separated from the cathode 401 in the display area 100, and by performing light irradiation, such as infrared or UV light irradiation, on both sides of the photosensitive layer 50, the photosensitive resin 501 in the photosensitive layer 50 in the light-transmitting area 210, which is higher than the film layer of the display area 100, is etched, and at the same time, the cathode layer 40 on the photosensitive layer 50 is removed together with the photosensitive resin 501, so as to achieve the purpose of removing the cathode layer 40 in the light-transmitting area 210.
Step 570, the remaining photosensitive layer is removed by etching by illuminating the front surface of the remaining photosensitive layer located in the light-transmitting area.
Specifically, after the photosensitive layer 50 higher than the pixel defining layer 103 in the light transmissive region 210 and the cathode layer 40 on the photosensitive layer 50 are removed, the photosensitive layer 50 is irradiated and etched from the front side of the photosensitive layer 50 to remove the residual photosensitive resin 502 in the photosensitive layer 50 in the light transmissive region 210, that is, the light transmissive region 210 after the photosensitive layer 50 is removed by the irradiation and etching no longer has the cathode layer 40, so that the light transmittance of the light transmissive region 210 is greatly increased, the light intensity passing through the light transmissive region 210 is enhanced, and the improvement of the light sensitivity of the camera or the sensor in the light transmissive region 210 is facilitated.
In other embodiments, after removing the photosensitive layer 50 in the light-transmitting region 210, the display panel is moved into the packaging chamber for thin film packaging to block external moisture from entering the pixel array layer, thereby affecting the service life of the light emitting device.
The embodiment of the invention provides a preparation method of a display panel, the display panel is provided with a display area 100 and a non-display area, the non-display area comprises a light-transmitting area 210; by forming an anode layer 102, an organic layer 20, and a pixel defining layer 103 on a substrate 101, the pixel defining layer 103 including a plurality of openings exposing the anode layer 102, the organic layer 20 being located within the openings; the protection layer 30 is deposited on the organic layer 20 in the light-transmitting region 210 by evaporation to protect the organic layer 20 from being oxidized by external moisture and oxygen during the process of removing the cathode layer 40 in the light-transmitting region 210. And by coating the photosensitive layer 50 made of photosensitive resin on the light-transmitting area 210, the height of the film layer of the light-transmitting area 210 is higher than the height of the pixel defining layer 103 of the display area 100, when the cathode layer 40 is formed on the interface with the height difference, the cathode layer 40 is easily broken at the position where the height difference is formed, so under the action of light, the photosensitive layer 50 and the cathode layer 40 on the photosensitive layer 50 are conveniently removed by etching, and the cathode layer 40 is located in the area except the light-transmitting area 210. Compared with the prior art, the embodiment of the invention improves the light transmittance of the light-transmitting area by removing the cathode layer 40 in the light-transmitting area 210, and prevents the organic layer 20 from being oxidized by external water vapor and oxygen in the process of removing the cathode layer 40 in the light-transmitting area 210 by arranging the protective layer 30, because the organic layer 20 in the display area 100 and the organic layer 20 in the light-transmitting area 210 are in common, the organic layer 20 in the display area 100 is protected by protecting the organic layer 20 in the light-transmitting area 210, and meanwhile, the light transmittance of the protective layer 30 is higher, so that the whole light transmittance of the light-transmitting area 210 is not influenced.
Optionally, fig. 13 is a schematic structural diagram of a display device according to an embodiment of the present invention. The display device comprises the display panel obtained by the preparation method of the display panel provided by any embodiment. The display device provided by the embodiment of the invention can be an electronic device such as a mobile phone, a flat panel, a smart television and the like, and the display device provided by the embodiment of the invention comprises the display panel provided by any embodiment, so that the display device also has the beneficial effects described in the embodiments.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims (13)

1. A display panel is characterized by comprising a display area and a non-display area, wherein the non-display area comprises a light-transmitting area;
the display panel includes:
the array substrate is provided with a pixel defining layer, and the pixel defining layer comprises a plurality of openings;
an organic layer on the array substrate within the opening;
the protective layer is positioned on one side, away from the array substrate, of the organic layer in the light-transmitting area and used for preventing water vapor and oxygen from damaging the organic layer, and the protective layer has light-transmitting property;
and the cathode layer is positioned on one side, far away from the array substrate, of the organic layer in the area except the light-transmitting area.
2. The display panel of claim 1, wherein the protective layer is a dense film layer comprising at least one of lithium fluoride, aluminum oxide, or silicon oxide; the thickness of the protective layer is 0.8-1.2 microns.
3. The display panel according to claim 2, wherein the protective layer has a thickness of 1 μm.
4. The display panel according to claim 1, further comprising an encapsulation layer, wherein the cathode layer of the display region is located on a side of the array substrate away from the cathode layer of the display region, and the protection layer of the light-transmissive region is located on a side of the array substrate away from the protection layer of the light-transmissive region.
5. The display panel according to claim 4, wherein the encapsulation layer in the display region includes a first inorganic thin film layer, an organic thin film layer, and a second inorganic thin film layer stacked in this order; the packaging layer located in the light-transmitting area comprises the organic thin film layer and the second inorganic thin film layer.
6. A method for manufacturing a display panel, comprising:
providing an array substrate, wherein a pixel defining layer is formed on the array substrate and comprises a plurality of openings;
forming an organic layer on the array substrate positioned in the opening;
forming a protective layer on the organic layer in the light-transmitting region;
forming a photosensitive layer on the pixel defining layer in the light transmitting area, wherein the photosensitive layer fills the opening;
forming a cathode layer on the pixel defining layer, the cathode layer covering the photosensitive layer of the light transmitting region;
removing the photosensitive layer of the light-transmitting region to remove the cathode layer on the photosensitive layer.
7. The method for manufacturing a display panel according to claim 6, wherein a material of the photosensitive layer includes a photosensitive resin.
8. The method of manufacturing a display panel according to claim 7, wherein the material of the photosensitive resin includes dichromic acid photoresist and/or polyvinyl alcohol cinnamate photoresist.
9. The method according to claim 7, wherein the forming a photosensitive layer on the pixel defining layer in the light transmitting region comprises:
and coating the photosensitive resin on the pixel defining layer positioned in the light transmitting area to form the photosensitive layer.
10. The method according to claim 6, wherein after the photosensitive layer is formed, a highest point of the photosensitive layer is higher than a highest point of the pixel defining layer of the display region.
11. The method of claim 6, wherein the removing the photosensitive layer of the light-transmitting region to remove the cathode layer on the photosensitive layer comprises:
and irradiating the side surface of the photosensitive layer, and etching to remove the photosensitive layer higher than the pixel defining layer in the light transmitting area and the cathode layer on the photosensitive layer.
12. The method for manufacturing a display panel according to claim 11, further comprising, after the removing, by etching, the photosensitive layer higher than the pixel defining layer in the light transmitting region and the cathode layer on the photosensitive layer by irradiating light to a side of the photosensitive layer:
and etching and removing the residual photosensitive layer by illuminating the front surface of the residual photosensitive layer positioned in the light transmitting area.
13. A display device comprising the display panel according to any one of claims 1 to 5 or the display panel produced by the production method for a display panel according to any one of claims 6 to 12.
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