WO2018203478A1 - Method for producing organic el display - Google Patents

Method for producing organic el display Download PDF

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Publication number
WO2018203478A1
WO2018203478A1 PCT/JP2018/015998 JP2018015998W WO2018203478A1 WO 2018203478 A1 WO2018203478 A1 WO 2018203478A1 JP 2018015998 W JP2018015998 W JP 2018015998W WO 2018203478 A1 WO2018203478 A1 WO 2018203478A1
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WIPO (PCT)
Prior art keywords
optical film
film
optical
forming step
organic
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PCT/JP2018/015998
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French (fr)
Japanese (ja)
Inventor
文彦 池田
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東京エレクトロン株式会社
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Application filed by 東京エレクトロン株式会社 filed Critical 東京エレクトロン株式会社
Priority to JP2019515695A priority Critical patent/JP6749485B2/en
Priority to KR1020197034306A priority patent/KR102502812B1/en
Priority to CN201880028327.6A priority patent/CN110574495B/en
Publication of WO2018203478A1 publication Critical patent/WO2018203478A1/en

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/30—Polarising elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/30—Polarising elements
    • G02B5/3025—Polarisers, i.e. arrangements capable of producing a definite output polarisation state from an unpolarised input state
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/30—Polarising elements
    • G02B5/3083—Birefringent or phase retarding elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/85—Arrangements for extracting light from the devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/50—OLEDs integrated with light modulating elements, e.g. with electrochromic elements, photochromic elements or liquid crystal elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
    • H10K71/231—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers

Definitions

  • the present invention relates to a method for manufacturing an organic EL display.
  • a circularly polarizing plate is used to suppress external light reflection.
  • OLED Organic Light Emitting Diode
  • a circularly polarizing plate is produced by laminating a linearly polarizing plate and a wave plate (retardation plate) so that the polarization axes intersect at 45 degrees.
  • the wave plate may be formed so that its polarization axis is inclined at 15 degrees or 75 degrees. Therefore, it is necessary to form a polarizing plate and a wave plate at an arbitrary angle. Furthermore, in order to cross the polarizing axes of the polarizing plate and the wave plate at an arbitrary angle, it is necessary to form these polarizing plates and the wave plate individually.
  • a stretched film is a film in which molecules in the material are oriented in one direction by stretching and pasting the film in one direction.
  • the polarizing plate and the wave plate are also required to be thinned.
  • a polarizing plate or a wavelength plate when a stretched film is used as in the prior art, there is a limit to reducing the thickness of the stretched film itself, and a sufficient thin plate cannot be obtained.
  • thinning is achieved by applying a coating liquid having a predetermined material on the substrate to form a polarizing plate and a wavelength plate having a required film thickness.
  • a coating liquid having liquid crystallinity is applied to the substrate as a predetermined material, and cast and oriented.
  • the liquid crystal molecules form supramolecular aggregates in the coating liquid, and when the coating liquid is flowed while applying a shear stress, the major axis direction of the supramolecular aggregates is aligned in the flow direction.
  • a polarizing film printing apparatus described in Patent Document 1 includes a table for holding a substrate and a slot die for discharging ink liquid onto the substrate. The slot die is moved in the printing direction to apply the ink liquid to the substrate.
  • the substrate on which the coating liquid for the optical member is applied is prepared separately from the substrate on which the organic light emitting diode is formed and bonded.
  • the number of parts such as a substrate and an adhesive layer is large, the organic EL display is not sufficiently thinned, and the flexibility of the organic EL display is not sufficient.
  • the present invention has been made in view of the above problems, and has as its main object to provide an organic EL display including an optical member that is thin and has improved flexibility.
  • an organic EL display including an optical member that is thin and has improved flexibility.
  • FIG. 1 is a plan view showing an organic EL display according to an embodiment.
  • the circuit of one unit circuit 11 is shown enlarged.
  • the organic EL display 1 includes a substrate 10, a plurality of unit circuits 11 arranged on the substrate 10, a scanning line driving circuit 14 provided on the substrate 10, and a data line driving circuit 15 provided on the substrate 10. Have.
  • the unit circuit 11 is provided in a region surrounded by a plurality of scanning lines 16 connected to the scanning line driving circuit 14 and a plurality of data lines 17 connected to the data line driving circuit 15.
  • the unit circuit 11 includes a TFT layer 12 and an organic light emitting diode 13.
  • the TFT layer 12 has a plurality of thin film transistors (TFTs). One TFT has a function as a switching element, and the other TFT has a function as a current control element for controlling the amount of current flowing through the organic light emitting diode 13.
  • the TFT layer 12 is operated by the scanning line driving circuit 14 and the data line driving circuit 15, and supplies current to the organic light emitting diode 13.
  • the TFT layer 12 is provided for each unit circuit 11, and the plurality of unit circuits 11 are controlled independently.
  • the TFT layer 12 may have a general configuration, and is not limited to the configuration shown in FIG.
  • the driving method of the organic EL display 1 is an active matrix method in the present embodiment, but may be a passive matrix method.
  • FIG. 2 is a cross-sectional view showing a main part of an organic EL display according to an embodiment.
  • the organic EL display 1 shown in FIG. 2 is a top emission type, and includes a substrate 10, an organic light emitting diode 13, a sealing layer 30, a touch sensor 40, and an optical member 50 in this order.
  • the touch sensor 40 is incorporated in the organic EL display 1 when the organic EL display 1 is a touch panel.
  • the substrate 10 may be any of a resin substrate, a glass substrate, a semiconductor substrate, a metal substrate, and the like, and is preferably a resin substrate from the viewpoint of improving flexibility.
  • the substrate 10 may be a laminated substrate of a resin substrate and a glass substrate from the viewpoint of improving flexibility and reducing moisture permeability.
  • a TFT layer 12 is formed on the substrate 10. On the TFT layer 12, a flattening layer 18 for flattening a step formed by the TFT layer 12 is formed.
  • the planarization layer 18 has an insulating property.
  • Contact plugs 19 are formed in contact holes that penetrate the planarization layer 18.
  • the contact plug 19 electrically connects the pixel electrode 21 formed on the flat surface of the flattening layer 18 and the TFT layer 12.
  • the contact plug 19 may be formed of the same material as the pixel electrode 21 at the same time.
  • the organic light emitting diode 13 is formed on the flat surface of the flattening layer 18.
  • the organic light emitting diode 13 includes a pixel electrode 21, a counter electrode 22 provided on the opposite side of the substrate 10 with respect to the pixel electrode 21, and an organic layer 23 formed between the pixel electrode 21 and the counter electrode 22. .
  • a voltage is applied between the pixel electrode 21 and the counter electrode 22, and the organic layer 23 emits light.
  • the pixel electrode 21 is, for example, a cathode and is formed of a metal material such as aluminum, and reflects light from the organic layer 23 toward the organic layer 23. The light reflected by the pixel electrode 21 passes through the organic layer 23 and the counter electrode 22 and is extracted outside.
  • the pixel electrode 21 is provided for each unit circuit 11.
  • the counter electrode 22 is, for example, an anode, is formed of a transparent material such as ITO (Indium Tin Oxide), and transmits light from the organic layer 23.
  • ITO Indium Tin Oxide
  • the light transmitted through the counter electrode 22 passes through the sealing layer 30, the touch sensor 40, and the optical member 50, and is extracted outside.
  • the counter electrode 22 is common to the plurality of unit circuits 11.
  • the organic layer 23 has, for example, an electron injection layer 24, an electron transport layer 25, a light emitting layer 26, a hole transport layer 27, and a hole injection layer 28 in this order from the cathode side to the anode side.
  • an electron injection layer 24 When a voltage is applied between the cathode and the anode, electrons are injected from the cathode into the electron injection layer 24 and holes are injected from the anode into the hole injection layer 28.
  • the electrons injected into the electron injection layer 24 are transported to the light emitting layer 26 by the electron transport layer 25.
  • the holes injected into the hole injection layer 28 are transported to the light emitting layer 26 by the hole transport layer 27.
  • the light emitting material of the light emitting layer 26 is excited, and the light emitting layer 26 emits light.
  • the light emitting layer 26 for example, a red light emitting layer that emits red light, a green light emitting layer that emits green light, and a blue light emitting layer that emits blue light are formed.
  • the organic layer 23 includes an electron injection layer 24, an electron transport layer 25, a light emitting layer 26, a hole transport layer 27, and a hole injection layer 28 in this order from the cathode side to the anode side.
  • the organic layer 23 is not limited to the configuration shown in FIG.
  • the sealing layer 30 seals the organic light emitting diode 13 between the substrate 10.
  • a silicon oxide layer, a silicon nitride layer, or the like is used as the sealing layer 30 .
  • the sealing layer 30 is formed by low-temperature CVD at a film forming temperature of 100 ° C. or less. Or it is good also as the sealing layer 30 by sticking the resin film in which the moisture-proof layer was formed.
  • the touch sensor 40 detects contact or proximity of an object such as a finger to the screen of the organic EL display 1.
  • the detection method of the touch sensor 40 is not particularly limited, but may be a capacitance method, for example.
  • Examples of the capacitance method include a surface capacitance method and a projection capacitance method.
  • Examples of the projected capacitance method include a self-capacitance method and a mutual capacitance method. Use of the mutual capacitance method is preferable because simultaneous multipoint detection is possible.
  • the touch sensor 40 is formed on the substrate 10 on which the organic light emitting diode 13 is formed in advance, as will be described in detail later. Therefore, as compared with the case where the touch sensor 40 is formed on a substrate different from the substrate 10 and bonded to the substrate 10 as in the past, the number of components such as the substrate and the adhesive layer can be reduced. The thickness can be reduced, and the flexibility of the organic EL display 1 can be improved.
  • the touch sensor 40 is formed between the organic light emitting diode 13 and the optical member 50.
  • the optical member 50 is a circularly polarizing film that suppresses reflection of external light
  • the circularly polarizing film is disposed on the light extraction side with respect to the touch sensor 40, so that the efficiency of suppressing external light reflection can be improved.
  • the optical member 50 is, for example, a circularly polarizing film that suppresses reflection of external light.
  • the optical member 50 has a 1 ⁇ 4 wavelength film ( ⁇ / 4 film) as the first optical film, and a straight line as the second optical film.
  • the quarter wavelength film and the linear polarizing film are formed so that their polarization axes intersect at 45 degrees. Note that the number of optical films constituting the optical member 50 is not particularly limited.
  • the optical member 50 is formed on the substrate 10 on which the organic light emitting diode 13 is formed in advance, as will be described in detail later. Therefore, as compared with the case where the optical member 50 is formed on a substrate different from the substrate 10 and bonded to the substrate 10 as in the past, the number of components such as the substrate and the adhesive layer can be reduced. The thickness can be reduced, and the flexibility of the organic EL display 1 can be improved.
  • the optical member 50 is manufactured without using ultraviolet irradiation in order to suppress deterioration of the organic layer 23 due to ultraviolet rays.
  • the optical member 50 is manufactured at a temperature of 100 ° C. or lower in order to suppress deterioration of the organic layer 23 due to heat.
  • the organic EL display 1 shown in FIG. 2 is a top emission system, it may be a bottom emission system.
  • the bottom emission method light from the light emitting layer 26 passes through the pixel electrode 21 and is extracted from the substrate 10, so that an anode that is a transparent electrode is used as the pixel electrode 21 and a cathode that is a reflective electrode is used as the counter electrode 22. It is done. That is, in the bottom emission method, the arrangement of the anode and the cathode is reversed.
  • the substrate 10 is a transparent substrate.
  • the touch sensor 40 and the optical member 50 are formed on the side opposite to the organic light emitting diode 13 with respect to the substrate 10.
  • FIG. 3 is a flowchart illustrating a method for manufacturing an organic EL display according to an embodiment.
  • the manufacturing method of the organic EL display 1 includes a touch sensor forming step S110 and an optical member forming step S120.
  • touch sensor formation process S110 is performed when the organic EL display 1 is a touch panel.
  • each step will be described.
  • the touch sensor 40 is formed on the substrate 10 on which the organic light emitting diodes 13 are formed in advance before the optical member forming step S120. Therefore, as compared with the case where the touch sensor 40 is formed on a substrate different from the substrate 10 and bonded to the substrate 10 as in the past, the number of components such as the substrate and the adhesive layer can be reduced. The thickness can be reduced, and the flexibility of the organic EL display 1 can be improved.
  • FIG. 4 is a flowchart illustrating a touch sensor formation process according to an embodiment.
  • FIG. 5 is a cross-sectional view illustrating a first metal film formed on a substrate according to an embodiment.
  • FIG. 6 is a cross-sectional view showing a resist film formed on the first metal film according to one embodiment.
  • FIG. 7 is a cross-sectional view showing a resist film after exposure and development according to an embodiment.
  • FIG. 8 is a cross-sectional view illustrating the first metal film after etching according to an embodiment.
  • FIG. 9 is a cross-sectional view showing the first metal film after removal of the resist film according to one embodiment.
  • FIG. 10 is a cross-sectional view illustrating an insulating film formed on a first metal film according to an embodiment.
  • FIG. 11 is a plan view showing a state after the partial removal of the second metal film formed on the insulating film according to the embodiment.
  • 5 to 10 are sectional views taken along the line AA in FIG. 5 to 11, the illustration of the organic light emitting diode 13 and the sealing layer 30 shown in FIG. 2 is omitted.
  • the touch sensor formation step S110 includes a step S111 for forming the light-shielding first metal film 41 on the substrate 10, and a step S112 for selectively removing a part of the first metal film 41 by a photolithography method and an etching method.
  • the first metal film 41 is formed on the substrate 10 (more specifically, for example, on the sealing layer 30).
  • a resist film 42 is formed on the first metal film 41 as shown in FIG.
  • the resist film 42 is patterned as shown in FIG. 7 by exposure and development.
  • the resist film 42 may be a positive type in which an exposed portion is removed by development, or a negative type in which an exposed portion remains after development.
  • the organic light emitting diode 13 Since the exposure light is shielded by the first metal film 41, the organic light emitting diode 13 is not deteriorated. Thereafter, using the patterned resist film 42 as a mask, a part of the first metal film 41 is selectively removed as shown in FIG.
  • the first metal film 41 from which a part has been selectively removed is formed in a stripe shape in plan view as shown by a broken line in FIG. Thereafter, the resist film 42 used for patterning the first metal film 41 is removed as shown in FIG.
  • the first metal film 41 having a light shielding property means that the transmittance of the first metal film 41 is 5% or less.
  • the transmittance of the first metal film 41 is preferably 3% or less.
  • the transmittance of the first metal film 41 is the ratio at which the exposure light (for example, light having a wavelength of 365 nm) of the resist film 42 formed on the first metal film 41 is transmitted through the first metal film 41. is there.
  • the first metal film 41 is made of copper, for example.
  • the touch sensor forming step S110 includes a step S113 of forming the insulating film 43 on the first metal film 41 from which part has been selectively removed.
  • the insulating film 43 insulates the first metal film 41 and the second metal film 45.
  • a silicon oxide film, a silicon nitride film, or the like is used as the insulating film 43.
  • the insulating film 43 is formed by low-temperature CVD at a film forming temperature of 100 ° C. or lower.
  • a part of the second metal film 45 is selectively removed by the step S114 of forming the light-shielding second metal film 45 on the insulating film 43 and the photolithography method and the etching method.
  • Step S115 The formation of the second metal film 45 and the partial removal of the second metal film are performed in the same manner as the formation of the first metal film 41 and the partial removal of the first metal film 41.
  • the second metal film 45 from which a part has been selectively removed is formed in a stripe shape in plan view as shown in FIG. Thereafter, the resist film used for patterning the second metal film 45 is removed.
  • the second metal film 45 having a light shielding property means that the transmittance of the second metal film 45 is 5% or less.
  • the transmittance of the second metal film 45 is preferably 3% or less.
  • the transmittance of the second metal film 45 is a ratio at which the exposure light (for example, light having a wavelength of 365 nm) of the resist film formed on the second metal film 45 passes through the second metal film 45.
  • the second metal film 45 is made of, for example, copper.
  • the touch sensor forming step S110 includes a step S116 of forming the touch sensor protective film 47 on the second metal film 45 from which part has been selectively removed.
  • the touch sensor protective film 47 is formed in the same manner as the insulating film 43.
  • a silicon oxide film, a silicon nitride film, or the like is used as the touch sensor protective film 47.
  • the touch sensor protective film 47 is formed by low-temperature CVD at a film forming temperature of 100 ° C. or less.
  • the touch sensor 40 constituted by the first metal film 41, the insulating film 43, the second metal film 45, and the touch sensor protective film 47 is obtained.
  • the wire-like first metal film 41 and the wire-like second metal film 45 are formed in a square lattice shape as shown in FIG. 11 so as not to overlap the organic layer 23 of the organic light emitting diode 13 in plan view. That is, the organic layer 23 is disposed in the opening of the square lattice in plan view. It is easy to extract light from the organic layer 23 to the outside.
  • Any one of the first metal film 41 and the second metal film 45 is used as a drive electrode, and the remaining one is used as a reception electrode.
  • the touch sensor 40 detects the contact or proximity of an object such as a finger to the screen of the organic EL display 1 by detecting a change in capacitance between the drive electrode and the reception electrode.
  • the touch sensor 40 is formed on the substrate 10 on which the organic light emitting diode 13 has been formed in advance while suppressing the deterioration of the organic layer 23 of the organic light emitting diode 13 due to exposure by a photolithography method. Can be formed. Compared to the case where the touch sensor 40 is formed on a substrate different from the substrate 10 and bonded to the substrate 10 as in the past, the number of components such as the substrate and the adhesive layer can be reduced, so the organic EL display 1 is made thinner. The flexibility of the organic EL display 1 can be improved.
  • the touch sensor formation step S110 of this embodiment is performed before the optical member formation step S120, the touch sensor 40 is formed between the organic light emitting diode 13 and the optical member 50.
  • the optical member 50 is a circularly polarizing film that suppresses reflection of external light
  • the circularly polarizing film is disposed on the light extraction side with respect to the touch sensor 40, so that the efficiency of suppressing external light reflection can be improved.
  • optical member formation process In the optical member forming step S120, an optical film in which liquid crystal molecules are aligned is formed by applying an optical film coating liquid containing liquid crystal molecules and a solvent on the substrate 10 on which the organic light emitting diodes 13 are formed in advance, and drying. Form.
  • the optical member 50 is composed of an optical film or the like.
  • the optical member 50 includes, for example, a first optical film and a second optical film.
  • One of the first optical film and the second optical film is a retardation film, and the remaining one is a polarizing film.
  • the optical member 50 is, for example, a circularly polarizing film that suppresses reflection of external light.
  • the optical member 50 has a 1 ⁇ 4 wavelength film ( ⁇ / 4 film) as the first optical film, and a straight line as the second optical film.
  • the quarter wavelength film and the linear polarizing film are formed so that their polarization axes intersect at 45 degrees. Note that the number of optical films constituting the optical member 50 is not particularly limited.
  • the optical member 50 is formed on the substrate 10 on which the organic light emitting diode 13 is previously formed. Therefore, as compared with the case where the optical member 50 is formed on a substrate different from the substrate 10 and bonded to the substrate 10 as in the past, the number of components such as the substrate and the adhesive layer can be reduced. The thickness can be reduced, and the flexibility of the organic EL display 1 can be improved.
  • the optical member 50 is manufactured without using ultraviolet irradiation in order to suppress deterioration of the organic layer 23 due to ultraviolet rays.
  • the optical member 50 is manufactured at a temperature of 100 ° C. or lower in order to suppress deterioration of the organic layer 23 due to heat.
  • FIG. 12 is a flowchart showing an optical member forming process according to the first embodiment.
  • the optical member forming step S120 includes a first optical film forming step S121, an intermediate film forming step S122, a first optical film patterning step S123, a second optical film forming step S124, and protection.
  • the film forming process S125 and the second optical film patterning process S126 are provided in this order.
  • each step will be described.
  • the first optical film patterning step S123 and the second optical film patterning step S126 are effective when a plurality of optical members 50 are formed on the substrate 10 at intervals. When only one member 50 is formed on the substrate 10, it may be omitted. The same applies to the partially insolubilizing process described later.
  • steps other than the steps shown in FIG. 12 may be performed.
  • the surface of the substrate 10 on which the first optical film is formed (more specifically, the sealing layer 30).
  • a step of modifying the surface of the touch sensor protective film 47) may be performed.
  • an organic film such as a silane coupling agent or an inorganic film such as silicon nitride may be formed.
  • first optical film forming step S121 of FIG. 12 As shown in FIGS. 13 to 15, a first optical film coating liquid 61 containing liquid crystal molecules and a solvent is applied onto the substrate 10 and dried to thereby form the first optical film.
  • An optical film 62 is formed.
  • the first optical film 62 is, for example, a quarter wavelength film.
  • FIG. 13 is a side view showing a liquid film of the first optical film coating liquid coated on the substrate according to the first embodiment.
  • FIG. 14 is a side view showing the first optical film formed by drying the liquid film of the first optical film coating liquid according to the first embodiment.
  • FIG. 15 is a side view showing the first optical film partially insolubilized according to the first embodiment.
  • the first optical film coating liquid 61 is applied onto the substrate 10 from the coating nozzle 60.
  • the application nozzle 60 is, for example, a slit coater having a slit-like discharge port on the lower surface.
  • the first optical film coating solution 61 includes liquid crystal molecules such as lyotropic liquid crystal molecules and thermotropic liquid crystal molecules, and a solvent that dissolves the liquid crystal molecules.
  • liquid crystal molecules such as lyotropic liquid crystal molecules and thermotropic liquid crystal molecules
  • a solvent that dissolves the liquid crystal molecules for example, water is used as the solvent.
  • An organic solvent may be used as the solvent.
  • a shear stress can be applied to the first optical film coating solution 61 applied to the substrate 10.
  • the acting direction of the shear stress coincides with the relative movement direction of the coating nozzle 60 and the substrate 10.
  • the orientation direction of the liquid crystal molecules can be controlled by controlling the acting direction of the shear stress.
  • a slit coater is used to apply the first optical film coating solution 61, but a dip coater or the like may be used. It is only necessary that a shear stress can be applied to the first optical film coating solution 61 and the direction of action of the shear stress can be controlled.
  • the liquid film (see FIG. 13) of the first optical film coating liquid 61 applied on the substrate 10 is dried to form the first optical film 62.
  • the solvent is removed from the liquid film of the first optical film coating liquid 61, and the alignment of the liquid crystal molecules is appropriately maintained.
  • the first optical film 62 is, for example, a quarter wavelength film.
  • vacuum drying For drying the liquid film of the first optical film coating liquid 61, vacuum drying, natural drying, heat drying, air drying, or the like is used.
  • the drying under reduced pressure can shorten the processing time compared with the natural drying.
  • the reduced pressure drying can suppress the convection of the liquid film and can suppress the disorder of the alignment of the liquid crystal molecules, as compared with the heat drying and the air drying.
  • heat drying may be further performed.
  • the first optical film forming step S121 only a part 63 of the first optical film 62 may be insolubilized in the cleaning liquid used in the first optical film patterning step S123. This partial insolubilization is performed as necessary.
  • the cleaning liquid used in the first optical film patterning step S123 the same solvent as the solvent of the first optical film coating liquid 61 may be used, for example, water may be used. In this case, insolubilization with water is performed.
  • the fixing liquid 110 that insolubilizes a part 63 of the first optical film 62 is discharged from, for example, an ink jet type application nozzle 111.
  • the application nozzle 111 has a plurality of ejection nozzles that eject droplets of the fixing liquid 110 on the lower surface.
  • the fixing liquid 110 is selectively applied to a part 63 of the first optical film 62 by discharging droplets of the fixing liquid 110 from the application nozzle 111 while relatively moving the application nozzle 111 and the substrate 10. . Thereby, a part 63 of the first optical film 62 is insolubilized.
  • the fixing solution 110 replaces a part 63 of the first optical film 62 by, for example, substituting the functional group at the end of the first optical film 62 (for example, a water-soluble functional group such as an OH group) with another functional group. Insolubilize. Further, the fixing solution 110 may be polymerized by a condensation reaction (for example, a dehydration condensation reaction such as an OH group) to insolubilize a part 63 of the first optical film 62. In the latter case, insolubilization is likely to proceed because of higher polymerization than in the former case.
  • a condensation reaction for example, a dehydration condensation reaction such as an OH group
  • the fixing solution 110 is removed after insolubilizing a part 63 of the first optical film 62.
  • the fixing solution 110 may contain water or an organic solvent.
  • the region to which the fixing liquid 110 is applied may be, for example, a region where a plurality of pixels such as OLEDs are formed (hereinafter also referred to as “pixel area”).
  • the ink jet type application nozzle 111 is used.
  • the present invention is not limited to this.
  • only the remaining part of the first optical film 62 may be covered with a mask, and then the entire substrate 10 may be immersed in the fixing liquid 110 to apply the fixing liquid only to a part 63 of the first optical film 62.
  • FIG. 16 is a side view showing a liquid film of the coating liquid for intermediate film applied on the first optical film according to the first embodiment.
  • FIG. 17 is a side view showing the intermediate film formed by drying the liquid film of the intermediate film coating liquid according to the first embodiment.
  • the intermediate film coating liquid 71 is applied from the coating nozzle 70 onto the substrate 10 on which the first optical film 62 is formed.
  • the coating nozzle 70 may be an ink jet method, and has a plurality of ejection nozzles that eject droplets of the coating liquid 71 for the intermediate film on the lower surface.
  • the intermediate film coating solution 71 is coated on the first optical film 62. Therefore, the liquid crystal molecules forming the first optical film 62 may be insoluble in the solvent of the intermediate film coating liquid 71. It is possible to prevent the first optical film 62 from being melted by the application of the intermediate film coating liquid 71.
  • the intermediate film coating solution 71 includes an organic material that forms the intermediate film 72 and a solvent that dissolves the organic material.
  • the organic material forming the intermediate film 72 includes a polymer insoluble in the cleaning liquid used in the first optical film patterning step S123.
  • thermosetting transparent paint for example, a thermosetting transparent paint, a chemical reaction type transparent paint, a dry curing type transparent paint, or the like is used. Specifically, oil-based enamel paint, phthalate resin paint, or the like is used.
  • thermosetting transparent paint, a chemical reaction type transparent paint, a dry curing type transparent paint, and the like are polymerized by thermal curing, chemical reaction, or dry curing, and thus a dense intermediate film 72 can be formed. Therefore, the insolubility of the intermediate film 72 with respect to the cleaning liquid used in the first optical film patterning step S123 can be improved.
  • the intermediate film coating liquid 71 may have the same function as the fixing liquid 110. Partial insolubilization of the first optical film 62 can be promoted. In the case where the first optical film 62 is partially insolubilized by the intermediate film coating solution 71, the first optical film 62 may not be partially insolubilized in the first optical film forming step S121.
  • the coating liquid 71 for the intermediate film replaces a functional group at the end of the first optical film 62 (for example, a water-soluble functional group such as an OH group) with another functional group, thereby
  • the part 63 may be insolubilized.
  • the intermediate film coating liquid 71 may be insolubilized by partly insolubilizing 63 of the first optical film 62 by polymerizing by a condensation reaction (for example, a dehydration condensation reaction such as OH group). In the latter case, insolubilization is likely to proceed because of higher polymerization than in the former case.
  • the area where the intermediate film coating liquid 71 is applied may coincide with the area where the fixing liquid 110 is applied.
  • the region to which the intermediate film coating liquid 71 is applied may be a pixel area on the substrate 10.
  • the liquid film (see FIG. 16) of the intermediate film coating liquid 71 applied on the substrate 10 is dried to form the intermediate film 72.
  • the solvent is removed from the liquid film of the intermediate film coating liquid 71 to form the intermediate film 72.
  • vacuum drying For drying the liquid film of the intermediate film coating liquid 71, vacuum drying, natural drying, heat drying, wind drying, or the like is used.
  • the drying under reduced pressure can shorten the processing time compared with the natural drying.
  • heat drying may be further performed.
  • the intermediate film 72 is insoluble in the cleaning liquid used in the first optical film patterning step S123. Unlike the first optical film 62, the intermediate film 72 has isotropic optical characteristics.
  • the visible light transmittance of the intermediate film 72 is preferably 95% or more.
  • the film thickness of the intermediate film 72 is preferably 10 ⁇ m or less. Further, the residual stress of the intermediate film 72 is preferably as small as possible in order to suppress deformation of the optical member.
  • the intermediate film 72 covers the main surface of a part 63 of the first optical film 62.
  • the intermediate film 72 also serves to protect the part 63 of the first optical film 62 so that the part 63 of the first optical film 62 is not scratched or foreign.
  • the pencil hardness of the intermediate film 72 is preferably 2H or more. This is particularly effective when the production of the optical member is temporarily interrupted and it takes a long time to resume since there is a high risk of scratches and foreign matter.
  • the remainder of the 1st optical film 62 is removed by 1st optical film patterning process S123, it does not become a problem that a damage
  • FIG. 18 is a side view showing the first optical film from which a portion not covered with the intermediate film according to the first embodiment is removed.
  • the part 63 of the first optical film 62 can be protected by the intermediate film 72, and the shape collapse of the part 63 of the first optical film 62 can be suppressed. Therefore, the quality of the optical member can be improved.
  • a cleaning solution that dissolves the first optical film 62 is used.
  • the cleaning liquid is supplied to the substrate 10 while rotating the substrate 10 with, for example, a spin chuck.
  • the cleaning liquid supplied to the substrate 10 spreads over the entire substrate 10 by centrifugal force and is shaken off from the outer peripheral edge of the substrate 10.
  • the first optical film 62 Since a part 63 of the first optical film 62 is covered with the intermediate film 72, it does not come into contact with the cleaning liquid and is not deformed by the cleaning liquid. On the other hand, the remaining portion of the first optical film 62 comes into contact with the cleaning liquid and is dissolved and removed by the cleaning liquid.
  • the cleaning liquid is stored in the cleaning tank, and the substrate 10 is immersed in the cleaning liquid in the cleaning tank so that the remaining portion of the first optical film 62 can be dissolved and removed while leaving a part 63 of the first optical film 62.
  • the cleaning liquid in the cleaning tank may be stirred with a stirring blade or the like.
  • the part 63 of the first optical film 62 is insolubilized in the cleaning liquid in the first optical film forming step S121 and the intermediate film forming step S122. It is valid. Excessive removal due to the wraparound of the cleaning liquid can be prevented, and a part 63 of the first optical film 62 can be reliably left.
  • the first optical film 62 can be obtained without partially insolubilizing the first optical film 62 in the first optical film forming step S121 and the intermediate film forming step S122. Patterning is possible. In this case, the number of processes can be reduced.
  • the first optical film forming step S121 since the first optical film coating liquid 61 is applied while applying a shear stress, it is difficult to apply the first optical film coating liquid 61 only to the pixel area. Therefore, it is effective to perform the first optical film patterning step S123.
  • the remaining portion of the first optical film 62 is removed using a cleaning liquid, but the method for removing the remaining portion of the first optical film 62 is not particularly limited.
  • an etching method may be used. Etching may be either wet etching or dry etching.
  • first optical film 63 the part 63 of the first optical film 62 remaining in the first optical film patterning step S123 is also referred to as “first optical film 63”.
  • a second optical film coating liquid 81 containing liquid crystal molecules and a solvent is applied on the intermediate film 72 and dried.
  • Two optical films 82 are formed.
  • the second optical film 82 is, for example, a linearly polarizing film.
  • FIG. 19 to 21 are explanatory side views of the second optical film forming step according to the first embodiment.
  • FIG. 19 is a side view showing a liquid film of the second optical film coating liquid coated on the intermediate film according to the first embodiment.
  • FIG. 20 is a side view showing the second optical film formed by drying the liquid film of the second optical film coating liquid according to the first embodiment.
  • FIG. 21 is a side view showing the second optical film partially insolubilized according to the first embodiment.
  • a second optical film coating liquid 81 is applied onto the substrate 10 from the coating nozzle 80.
  • the application nozzle 80 is, for example, a slit coater having a slit-like discharge port on the lower surface.
  • the second optical film coating solution 81 is applied onto the intermediate film 72. Therefore, the organic material forming the intermediate film 72 may be insoluble in the solvent of the second optical film coating liquid 81. It is possible to prevent the intermediate film 72 from being melted by the application of the second optical film coating liquid 81.
  • the coating solution 81 for the second optical film contains liquid crystal molecules such as lyotropic liquid crystal molecules and thermotropic liquid crystal molecules, and a solvent that dissolves the liquid crystal molecules.
  • liquid crystal molecules such as lyotropic liquid crystal molecules and thermotropic liquid crystal molecules
  • a solvent that dissolves the liquid crystal molecules for example, water is used as the solvent.
  • An organic solvent may be used as the solvent.
  • a shear stress can be applied to the second optical film coating solution 81 applied to the substrate 10.
  • the acting direction of the shear stress coincides with the relative movement direction of the coating nozzle 80 and the substrate 10.
  • the orientation direction of the liquid crystal molecules can be controlled by controlling the acting direction of the shear stress.
  • the acting direction of the shear stress in the second optical film forming step S124 is a direction intersecting at an oblique angle of 45 ° with respect to the acting direction of the shear stress in the first optical film forming step S121.
  • the quarter wavelength film and the linearly polarizing film are formed so that their polarization axes intersect at 45 degrees.
  • a slit coater is used to apply the second optical film coating solution 81, but a dip coater or the like may be used. It is only necessary that a shear stress can be applied to the second optical film coating solution 81 and the direction of action of the shear stress can be controlled.
  • the liquid film (see FIG. 19) of the second optical film coating liquid 81 applied on the substrate 10 is dried to form the second optical film 82.
  • the solvent is removed from the liquid film of the second optical film coating liquid 81, and the alignment of the liquid crystal molecules is appropriately maintained.
  • the second optical film 82 is, for example, a linearly polarizing film.
  • the liquid film of the second optical film coating liquid 81 For drying the liquid film of the second optical film coating liquid 81, vacuum drying, natural drying, heat drying, wind drying, or the like is used.
  • the drying under reduced pressure can shorten the processing time compared with the natural drying.
  • the reduced pressure drying can suppress the convection of the liquid film and can suppress the disorder of the alignment of the liquid crystal molecules, as compared with the heat drying and the air drying.
  • heat drying may be further performed.
  • the second optical film forming step S124 only a part 83 of the second optical film 82 may be insolubilized in the cleaning liquid used in the second optical film patterning step S126. This partial insolubilization is performed as necessary.
  • the same solvent as the solvent of the second optical film coating liquid 81 may be used, for example, water may be used. In this case, insolubilization with water is performed.
  • the fixing liquid 120 that insolubilizes the part 83 of the second optical film 82 is discharged from, for example, an ink jet type application nozzle 121.
  • the coating nozzle 121 has a plurality of ejection nozzles that eject droplets of the fixing liquid 120 on the lower surface.
  • the fixing liquid 120 is selectively applied to a part 83 of the second optical film 82 by discharging droplets of the fixing liquid 120 from the application nozzle 121 while relatively moving the application nozzle 121 and the substrate 10. . Thereby, a part 83 of the second optical film 82 is insolubilized.
  • the fixing solution 120 replaces the functional group at the end of the second optical film 82 (for example, a water-soluble functional group such as an OH group) with another functional group, so that a part 83 of the second optical film 82 is replaced. Insolubilize. Further, the fixing solution 120 may be polymerized by a condensation reaction (for example, a dehydration condensation reaction such as an OH group) to insolubilize a part 83 of the second optical film 82. In the latter case, insolubilization is likely to proceed because of higher polymerization than in the former case.
  • a condensation reaction for example, a dehydration condensation reaction such as an OH group
  • the fixing solution 120 is removed after insolubilizing the part 83 of the second optical film 82.
  • the fixing solution 120 may contain water or an organic solvent.
  • the area where the fixing liquid 120 is applied may be, for example, a pixel area.
  • the ink jet type application nozzle 121 is used, but the present invention is not limited to this.
  • only the remaining part of the second optical film 82 may be covered with a mask, and then the entire substrate 10 may be immersed in the fixing liquid 120 to apply the fixing liquid only to a part 83 of the second optical film 82.
  • a protective film coating liquid 91 different from the second optical film coating liquid 81 is applied onto the second optical film 82 and dried. Thereby, the protective film 92 is formed.
  • FIG. 22 is a side view showing a liquid film of the coating liquid for the protective film applied on the second optical film according to the first embodiment.
  • FIG. 23 is a side view showing the protective film formed by drying the liquid film of the protective film coating liquid according to the first embodiment.
  • the protective film coating liquid 91 is applied from the coating nozzle 90 onto the substrate 10 on which the second optical film 82 is formed.
  • the coating nozzle 90 may be an ink jet system, and has a plurality of ejection nozzles that eject droplets of the protective film coating liquid 91 on the lower surface.
  • the protective film coating liquid 91 is applied onto the second optical film 82. Therefore, the liquid crystal molecules forming the second optical film 82 may be insoluble in the solvent of the protective film coating liquid 91. It is possible to prevent the second optical film 82 from being melted by the application of the protective film coating liquid 91.
  • the protective film coating solution 91 includes an organic material that forms the protective film 92 and a solvent that dissolves the organic material.
  • the organic material forming the protective film 92 includes a polymer that is insoluble in the cleaning liquid used in the second optical film patterning step S126.
  • the protective film coating liquid 91 for example, a thermosetting transparent paint, a chemical reaction type transparent paint, a dry curing type transparent paint, or the like is used. Specifically, oil-based enamel paint, phthalate resin paint, or the like is used.
  • thermosetting transparent coating, a chemical reaction type transparent coating, a dry curing type transparent coating, and the like are polymerized by thermal curing, chemical reaction, or drying curing, so that a dense protective film 92 can be formed. Therefore, the insolubility of the protective film 92 in the cleaning liquid used in the second optical film patterning step S126 can be improved.
  • the protective film coating liquid 91 may have the same function as the fixing liquid 120. Partial insolubilization of the second optical film 82 can be promoted. When the second optical film 82 is partially insolubilized by the protective film coating solution 91, the second optical film 82 may not be partially insolubilized in the second optical film forming step S124.
  • the coating liquid 91 for the protective film replaces the functional group at the end of the second optical film 82 (for example, a water-soluble functional group such as an OH group) with another functional group, thereby
  • the part 83 may be insolubilized.
  • the protective film coating solution 91 may be polymerized by a condensation reaction (for example, a dehydration condensation reaction such as an OH group) to insolubilize a part 83 of the second optical film 82. In the latter case, insolubilization is likely to proceed because of higher polymerization than in the former case.
  • the area where the protective film coating liquid 91 is applied may coincide with the area where the fixing liquid 120 is applied.
  • the region where the protective film coating liquid 91 is applied may be a pixel area on the substrate 10.
  • the liquid film (see FIG. 22) of the protective film coating liquid 91 applied on the substrate 10 is dried to form the protective film 92.
  • the solvent is removed from the liquid film of the protective film coating liquid 91 to form a protective film 92.
  • vacuum drying For drying the liquid film of the protective film coating liquid 91, vacuum drying, natural drying, heat drying, wind drying, or the like is used.
  • the drying under reduced pressure can shorten the processing time compared with the natural drying.
  • heat drying may be further performed.
  • the protective film 92 is insoluble in the cleaning liquid used in the second optical film patterning step S126. Unlike the second optical film 82, the protective film 92 has isotropic optical characteristics.
  • the visible light transmittance of the protective film 92 is preferably 95% or more.
  • the film thickness of the protective film 92 is preferably 10 ⁇ m or less. Further, the residual stress of the protective film 92 is preferably as small as possible in order to suppress deformation of the optical member.
  • the protective film 92 covers the main surface of a part 83 of the second optical film 82.
  • the protective film 92 also serves to protect the part 83 of the second optical film 82 so that the part 83 of the second optical film 82 is not damaged or foreign matter.
  • the pencil hardness of the intermediate film 72 is preferably 2H or more.
  • the remainder of the second optical film 82 is removed in the second optical film patterning step S126, it is not a problem that scratches or foreign matters are attached.
  • the foreign matter attached to the protective film 92 can be removed by cleaning, and the cleaning does not damage the portion 83 of the second optical film 82.
  • the protective film 92 of the present embodiment is formed by applying the protective film coating liquid 91 on the second optical film 82 and drying it.
  • the protective film 92 is attached to the second optical film 82 in the form of a film. Also good.
  • FIG. 24 is a side view showing the second optical film from which a portion not covered with the protective film according to the first embodiment is removed.
  • the part 83 of the second optical film 82 can be protected by the protective film 92, and the shape collapse of the part 83 of the second optical film 82 can be suppressed. Therefore, the quality of the optical member can be improved.
  • a cleaning solution that dissolves the second optical film 82 is used.
  • the cleaning liquid is supplied to the substrate 10 while rotating the substrate 10 with, for example, a spin chuck.
  • the cleaning liquid supplied to the substrate 10 spreads over the entire substrate 10 by centrifugal force and is shaken off from the outer peripheral edge of the substrate 10.
  • part 83 of the second optical film 82 Since part 83 of the second optical film 82 is covered with the protective film 92, it does not come into contact with the cleaning liquid and does not lose its shape due to the cleaning liquid. On the other hand, since the remaining part of the second optical film 82 is in contact with the cleaning liquid, it is dissolved and removed by the cleaning liquid.
  • the cleaning liquid is stored in the cleaning tank, and the substrate 10 is immersed in the cleaning liquid in the cleaning tank so that the remaining portion of the second optical film 82 can be dissolved and removed while leaving the portion 83 of the second optical film 82.
  • the cleaning liquid in the cleaning tank may be stirred with a stirring blade or the like.
  • the part 83 of the second optical film 82 is insolubilized in the cleaning liquid in the second optical film forming step S124 and the protective film forming step S125. It is valid. Excessive removal due to the wraparound of the cleaning liquid can be prevented, and the part 83 of the second optical film 82 can be reliably left.
  • the second optical film 82 can be obtained without partially insolubilizing the second optical film 82 in the second optical film forming step S124 or the protective film forming step S125. Patterning is possible. In this case, the number of processes can be reduced.
  • the second optical film forming step S124 since the second optical film coating liquid 81 is applied while applying a shear stress, it is difficult to apply the second optical film coating liquid 81 only to the pixel area. Therefore, it is effective to perform the second optical film patterning step S126.
  • the remaining portion of the second optical film 82 is removed using a cleaning liquid, but the method for removing the remaining portion of the second optical film 82 is not particularly limited.
  • an etching method may be used. Etching may be either wet etching or dry etching.
  • the part 83 of the second optical film 82 remaining in the second optical film patterning step S126 is also referred to as “second optical film 83”.
  • the optical member 50 composed of the first optical film 63, the intermediate film 72, the second optical film 83, and the protective film 92 is spaced on the substrate 10. A plurality are formed. Therefore, the optical member 50 can be multi-surfaced, and the organic EL display 1 can be multi-surfaced. In addition, since the optical member 50 is selectively formed in the pixel area, terminals provided around the pixel area can function appropriately.
  • the first optical film forming step S121, the intermediate film forming step S122, and the second optical film forming step S124 are performed in this order.
  • An intermediate film 72 is formed between the first optical film 63 and the second optical film 83.
  • the intermediate film 72 can protect the first optical film 63 so that the first optical film 63 is not damaged or foreign matter. Therefore, the quality of the optical member 50 can be improved. This is particularly effective when the production of the optical member 50 is temporarily interrupted and it takes a long time to resume, since there is a high risk of scratches and foreign matter.
  • the intermediate film 72 that covers only a part 63 of the first optical film 62 is used as a mask.
  • a first optical film patterning step S123 for removing the remaining part of the first optical film 62 is performed.
  • the part 63 of the first optical film 62 can be protected by the intermediate film 72, and the shape collapse of the part 63 of the first optical film 62 can be suppressed. Therefore, the quality of the optical member 50 can be improved.
  • a cleaning liquid that dissolves the first optical film 62 is used in the first optical film patterning step S123. Since a part 63 of the first optical film 62 is covered with the intermediate film 72, it does not come into contact with the cleaning liquid and is not deformed by the cleaning liquid. On the other hand, the remaining portion of the first optical film 62 comes into contact with the cleaning liquid and is dissolved and removed by the cleaning liquid.
  • the first optical film forming step S121 in the first optical film forming step S121, only a part 63 of the first optical film 62 is insolubilized in the cleaning liquid used in the first optical film patterning step S123. Therefore, in the first optical film patterning step S123, excessive removal due to the wrapping of the cleaning liquid can be prevented, and a part 63 of the first optical film 62 can be reliably left.
  • the intermediate film forming step S122 only the part 63 of the first optical film 62 is applied to the first optical film 62 by applying the intermediate film coating liquid 71 only to the part 63 of the first optical film 62. It is insolubilized in the cleaning liquid used in the optical film patterning step S123. Therefore, in the first optical film patterning step S123, excessive removal due to the wrapping of the cleaning liquid can be prevented, and a part 63 of the first optical film 62 can be reliably left.
  • the protective film forming step S125 for forming the protective film 92 that protects the second optical film 83 is performed.
  • the protective film 92 can protect the second optical film 83 so that the second optical film 83 is not damaged or foreign matter after the optical member 50 is manufactured. Therefore, the quality of the optical member 50 can be improved.
  • the remaining part of the second optical film 82 is removed using the protective film 92 that covers only a part 83 of the second optical film 82 as a mask.
  • An optical film patterning step S126 is performed. During the second optical film patterning step S126, the part 83 of the second optical film 82 can be protected by the protective film 92, and the shape collapse of the part 83 of the second optical film 82 can be suppressed. Therefore, the quality of the optical member 50 can be improved.
  • a cleaning liquid that dissolves the second optical film 82 is used in the second optical film patterning step S126. Since a part 83 of the second optical film 82 is covered with the protective film 92, it does not come into contact with the cleaning liquid and does not lose its shape due to the cleaning liquid. On the other hand, since the remaining part of the second optical film 82 is in contact with the cleaning liquid, it is dissolved and removed by the cleaning liquid.
  • the second optical film forming step S124 in the second optical film forming step S124, only a part 83 of the second optical film 82 is insolubilized in the cleaning liquid used in the second optical film patterning step S126. Therefore, in the second optical film patterning step S126, it is possible to prevent excessive removal due to wraparound of the cleaning liquid, and it is possible to reliably leave a part 83 of the second optical film 82.
  • the protective film forming step S125 only the part 83 of the second optical film 82 is applied to the second optical film 82 by applying the coating liquid 91 for protective film only to the part 83 of the second optical film 82. It is insolubilized in the cleaning liquid used in the optical film patterning step S126. Therefore, in the second optical film patterning step S126, it is possible to prevent excessive removal due to wraparound of the cleaning liquid, and it is possible to reliably leave a part 83 of the second optical film 82.
  • the first optical film patterning process S123 is performed after the intermediate film formation process S122, whereas in the present embodiment, the intermediate film formation process S122 is performed after the first optical film patterning process S123. Is different.
  • the intermediate film 72 of the present embodiment does not serve as a mask for removing a part of the first optical film 62 while leaving a part 63 of the first optical film 62.
  • the intermediate film 72 of the present embodiment plays a role of protecting the part 63 of the first optical film 62 so that the part 63 of the first optical film 62 is not damaged or foreign matter.
  • the second optical film patterning step S126 is performed after the protective film forming step S125, whereas in the present embodiment, the protective film forming step S125 is performed after the second optical film patterning step S126. It differs in that it is done.
  • the protective film 92 according to the present embodiment does not serve as a mask for removing the remaining portion of the second optical film 82 while leaving a part 83 of the second optical film 82.
  • the protective film 92 of the present embodiment plays a role of protecting the part 83 of the second optical film 82 so that the part 83 of the second optical film 82 is not damaged or foreign matter.
  • FIG. 25 is a flowchart showing an optical member forming process according to the second embodiment.
  • the optical member forming step S120 includes a first optical film forming step S121, a first optical film patterning step S123, an intermediate film forming step S122, a second optical film forming step S124, It has 2 optical film patterning process S126 and protective film formation process S125 in this order.
  • the first optical film patterning step S123 and the second optical film patterning step S126 are effective when a plurality of optical members 50 are formed on the substrate 10 at intervals. When only one member 50 is formed on the substrate 10, it may be omitted. The same applies to the partially insolubilizing process described later.
  • steps other than the steps shown in FIG. 25 may be performed.
  • a step of modifying the surface of the substrate on which the first optical film is formed may be performed in order to improve the adhesion of the first optical film to the substrate.
  • an organic film such as a silane coupling agent or an inorganic film such as silicon nitride may be formed.
  • the optical film patterning step S126 may be performed in this order.
  • first optical film forming step S121, the intermediate film forming step S122 and the first optical film patterning step S123 shown in FIG. 12, and the second optical film forming step S124 and the second optical film patterning step shown in FIG. S126 and protective film formation step S125 may be performed in this order.
  • the first optical film coating liquid 61 containing liquid crystal molecules and a solvent is applied onto the substrate 10 and dried to thereby form the first optical film.
  • An optical film 62 is formed.
  • the first optical film 62 is, for example, a quarter wavelength film.
  • the process for insolubilizing the part 63 of the first optical film 62 shown in FIG. 15 is not performed. This process is performed in the first optical film patterning step S123.
  • FIG. 26 is a side view showing the first optical film from which a portion not insolubilized is removed according to the second embodiment.
  • the cleaning liquid is supplied to the substrate 10 while rotating the substrate 10 with, for example, a spin chuck.
  • the cleaning liquid supplied to the substrate 10 spreads over the entire substrate 10 by centrifugal force and is shaken off from the outer peripheral edge of the substrate 10.
  • the first optical film 62 Since a part 63 of the first optical film 62 is insolubilized in the cleaning liquid, it does not lose its shape due to the cleaning liquid. On the other hand, the remaining portion of the first optical film 62 is not insolubilized in the cleaning liquid, and is dissolved and removed by the cleaning liquid.
  • the cleaning liquid is stored in the cleaning tank, and the substrate 10 is immersed in the cleaning liquid in the cleaning tank so that the remaining portion of the first optical film 62 can be dissolved and removed while leaving a part 63 of the first optical film 62.
  • the cleaning liquid in the cleaning tank may be stirred with a stirring blade or the like.
  • the first optical film forming step S121 since the first optical film coating liquid 61 is applied while applying a shear stress, it is difficult to apply the first optical film coating liquid 61 only to the pixel area. Therefore, it is effective to perform the first optical film patterning step S123.
  • first optical film 63 the part 63 of the first optical film 62 remaining in the first optical film patterning step S123 is also referred to as “first optical film 63”.
  • FIG. 27 is a view showing a liquid film of the coating liquid for intermediate film applied on the first optical film according to the second embodiment.
  • FIG. 28 is a view showing an intermediate film formed by drying a liquid film of the intermediate film coating liquid according to the second embodiment.
  • the intermediate film coating liquid 71 is applied from the coating nozzle 70 onto the substrate 10 on which the first optical film 63 is formed.
  • the coating nozzle 70 may be an ink jet method, and has a plurality of ejection nozzles that eject droplets of the coating liquid 71 for the intermediate film on the lower surface.
  • the intermediate film coating solution 71 is applied onto the first optical film 63. Therefore, the liquid crystal molecules forming the first optical film 63 may be insoluble in the solvent of the intermediate film coating liquid 71. It is possible to prevent the first optical film 63 from being melted by the application of the intermediate film coating liquid 71.
  • the intermediate film coating solution 71 includes an organic material that forms the intermediate film 72 and a solvent that dissolves the organic material.
  • the organic material forming the intermediate film 72 includes a polymer that is insoluble in the solvent of the second optical film coating solution 81 (see FIG. 29) applied on the intermediate film 72.
  • thermosetting transparent paint for example, a thermosetting transparent paint, a chemical reaction type transparent paint, a dry curing type transparent paint, or the like is used. Specifically, oil-based enamel paint, phthalate resin paint, or the like is used.
  • thermosetting transparent paint, a chemical reaction type transparent paint, a dry curing type transparent paint, and the like are polymerized by thermal curing, chemical reaction, or dry curing, and thus a dense intermediate film 72 can be formed.
  • the intermediate film coating solution 71 may be applied so as to cover not only the main surface of the first optical film 63 but also the end surface of the first optical film 63 as shown in FIG.
  • the first optical film 63 can be protected by the intermediate film 72 so that not only the main surface of the first optical film 63 but also the end surface of the first optical film 63 is not damaged or foreign matter.
  • the region where the intermediate film coating liquid 71 is applied may be limited to the pixel area on the substrate 10 and the vicinity thereof.
  • a mask such as a film may be affixed on the substrate 10 in order to limit the region to which the intermediate film coating solution 71 is applied. This mask may form a gap between the first optical film 63 and the first optical film 63 so as not to damage the first optical film 63 when it is peeled later.
  • the liquid film (see FIG. 27) of the intermediate film coating liquid 71 applied on the substrate 10 is dried to form the intermediate film 72.
  • the solvent is removed from the liquid film of the intermediate film coating liquid 71 to form the intermediate film 72.
  • the intermediate film 72 has isotropic optical characteristics.
  • the visible light transmittance of the intermediate film 72 is preferably 95% or more.
  • the film thickness of the intermediate film 72 is preferably 10 ⁇ m or less. Further, the residual stress of the intermediate film 72 is preferably as small as possible in order to suppress deformation of the optical member.
  • the intermediate film 72 covers not only the main surface of the first optical film 63 but also the end surface of the first optical film 63.
  • the intermediate film 72 serves to protect the first optical film 63 so that the first optical film 63 is not damaged or foreign matter.
  • the pencil hardness of the intermediate film 72 is preferably 2H or more. This is particularly effective when the production of the optical member is temporarily interrupted and it takes a long time to resume since there is a high risk of scratches and foreign matter.
  • the intermediate film 72 is formed only in the pixel area on the substrate 10 and in the vicinity thereof, and a plurality of intermediate films 72 are formed on the substrate 10 at intervals. Note that, when it is not necessary to take out terminals provided around the pixel area, the intermediate film 72 may be formed on substantially the entire substrate 10.
  • the second optical film coating liquid 81 is applied onto the intermediate film 72, the alignment controllability of the liquid crystal molecules of the second optical film coating liquid 81 is good.
  • a second optical film coating solution 81 containing liquid crystal molecules and a solvent is applied onto the intermediate film 72 and dried to thereby form the first optical film.
  • Two optical films 82 are formed.
  • the second optical film 82 is, for example, a linearly polarizing film.
  • FIG. 29 is a side view showing a liquid film of the second optical film coating liquid applied on the intermediate film according to the second embodiment.
  • FIG. 30 is a side view showing a second optical film formed by drying the liquid film of the second optical film coating liquid according to the second embodiment.
  • the second optical film coating liquid 81 is applied onto the substrate 10 from the coating nozzle 80.
  • the application nozzle 80 is, for example, a slit coater having a slit-like discharge port on the lower surface.
  • the second optical film coating solution 81 is applied onto the intermediate film 72. Therefore, the organic material forming the intermediate film 72 may be insoluble in the solvent of the second optical film coating liquid 81. It is possible to prevent the intermediate film 72 from being melted by the application of the second optical film coating liquid 81.
  • a slit coater is used to apply the second optical film coating solution 81, but a dip coater or the like may be used. It is only necessary that a shear stress can be applied to the second optical film coating solution 81 and the direction of action of the shear stress can be controlled.
  • the liquid film (see FIG. 29) of the second optical film coating liquid 81 applied on the substrate 10 is dried to form the second optical film 82.
  • the solvent is removed from the liquid film of the second optical film coating liquid 81, and the alignment of the liquid crystal molecules is appropriately maintained.
  • the second optical film 82 is, for example, a linearly polarizing film.
  • the second optical film patterning step S126 only a part 83 of the second optical film 82 is insolubilized in the cleaning liquid as shown in FIG. 31, and then the remaining part of the second optical film 82 is shown in FIG. Dissolve with cleaning solution.
  • FIG. 31 is a side view showing the second optical film partially insolubilized according to the second embodiment.
  • FIG. 32 is a side view showing the second optical film from which the insoluble portion has been removed according to the second embodiment.
  • the cleaning liquid the same solvent as the solvent of the second optical film coating liquid 81 may be used.
  • water may be used. In this case, insolubilization with water is performed.
  • the fixing liquid 120 that insolubilizes the part 83 of the second optical film 82 is discharged from, for example, an ink jet type application nozzle 121.
  • the coating nozzle 121 has a plurality of ejection nozzles that eject droplets of the fixing liquid 120 on the lower surface.
  • the fixing liquid 120 is selectively applied to a part 83 of the second optical film 82 by discharging droplets of the fixing liquid 120 from the application nozzle 121 while relatively moving the application nozzle 121 and the substrate 10. . Thereby, a part 83 of the second optical film 82 is insolubilized.
  • the area where the fixing liquid 120 is applied may be, for example, a pixel area.
  • the second optical film patterning step S126 only a part 83 of the second optical film 82 is left and the remaining part of the second optical film 82 is removed.
  • a cleaning liquid is used to remove the remaining portion of the second optical film 82.
  • the cleaning liquid is supplied to the substrate 10 while rotating the substrate 10 with, for example, a spin chuck.
  • the cleaning liquid supplied to the substrate 10 spreads over the entire substrate 10 by centrifugal force and is shaken off from the outer peripheral edge of the substrate 10.
  • the part 83 of the second optical film 82 is insolubilized in the cleaning liquid, so that it does not lose its shape due to the cleaning liquid. On the other hand, since the remaining portion of the second optical film 82 is not insolubilized in the cleaning liquid, it is dissolved and removed by the cleaning liquid.
  • the cleaning liquid is stored in the cleaning tank, and the substrate 10 is immersed in the cleaning liquid in the cleaning tank so that the remaining portion of the second optical film 82 can be dissolved and removed while leaving the portion 83 of the second optical film 82.
  • the cleaning liquid in the cleaning tank may be stirred with a stirring blade or the like.
  • the second optical film forming step S124 since the second optical film coating liquid 81 is applied while applying a shear stress, it is difficult to apply the second optical film coating liquid 81 only to the pixel area. Therefore, it is effective to perform the second optical film patterning step S126.
  • the part 83 of the second optical film 82 remaining in the second optical film patterning step S126 is also referred to as “second optical film 83”.
  • a protective film coating liquid 91 different from the second optical film coating liquid 81 is applied onto the second optical film 83 and dried. Thereby, the protective film 92 is formed.
  • FIG. 33 is a side view showing a liquid film of a coating liquid for a protective film applied on the second optical film according to the second embodiment.
  • FIG. 34 is a side view showing the protective film formed by drying the liquid film of the protective film coating liquid according to the second embodiment.
  • the protective film coating liquid 91 is applied from the coating nozzle 90 onto the substrate 10 on which the second optical film 83 is formed.
  • the coating nozzle 90 may be an ink jet system, and has a plurality of ejection nozzles that eject droplets of the protective film coating liquid 91 on the lower surface.
  • the protective film coating solution 91 is applied onto the second optical film 83. Therefore, the liquid crystal molecules forming the second optical film 83 may be insoluble in the solvent of the protective film coating solution 91. It is possible to prevent the second optical film 83 from being melted by the application of the protective film coating liquid 91.
  • the protective film coating solution 91 includes an organic material that forms the protective film 92 and a solvent that dissolves the organic material.
  • the protective film coating liquid 91 for example, a thermosetting transparent paint, a chemical reaction type transparent paint, a dry curing type transparent paint, or the like is used. Specifically, oil-based enamel paint, phthalate resin paint, or the like is used.
  • thermosetting transparent coating, a chemical reaction type transparent coating, a dry curing type transparent coating, and the like are polymerized by thermal curing, chemical reaction, or drying curing, so that a dense protective film 92 can be formed.
  • the protective film coating liquid 91 may be applied so as to cover not only the main surface of the second optical film 83 but also the end surface of the second optical film 83.
  • the second optical film 83 can be protected by the protective film 92 so that not only the main surface of the second optical film 83 but also the end surface of the second optical film 83 is not damaged or foreign matter.
  • the protective film coating solution 91 does not cover the end face of the intermediate film 72 in FIG. 33, but may be applied so as to cover the end face of the intermediate film 72.
  • the region where the protective film coating liquid 91 is applied may be limited to the pixel area on the substrate 10 and the vicinity thereof.
  • a mask such as a film may be affixed on the substrate 10 in order to limit the region to which the protective film coating solution 91 is applied.
  • a gap may be formed between the mask and the second optical film 83 so as not to damage the second optical film 83 when it is later peeled off.
  • the liquid film (see FIG. 33) of the protective film coating liquid 91 applied on the substrate 10 is dried to form the protective film 92.
  • the solvent is removed from the liquid film of the protective film coating liquid 91 to form a protective film 92.
  • the protective film 92 has isotropic optical characteristics.
  • the visible light transmittance of the protective film 92 is preferably 95% or more.
  • the film thickness of the protective film 92 is preferably 10 ⁇ m or less. Further, the residual stress of the protective film 92 is preferably as small as possible in order to suppress deformation of the optical member.
  • the protective film 92 covers not only the main surface of the second optical film 83 but also the end surface of the second optical film 83.
  • the protective film 92 serves to protect the second optical film 83 so that the second optical film 83 is not scratched or foreign.
  • the pencil hardness of the protective film 92 is preferably 2H or higher.
  • the protective film 92 is formed only in the pixel area on the substrate 10 and in the vicinity thereof, and a plurality of protective films 92 are formed on the substrate 10 at intervals. Note that when it is not necessary to take out terminals provided around the pixel area, the protective film 92 may be formed on substantially the entire substrate 10.
  • the protective film 92 of the present embodiment is formed by applying the protective film coating liquid 91 on the second optical film 83 and drying it.
  • the protective film 92 is attached to the second optical film 83 in the form of a film. Also good.
  • the optical member 50 including the first optical film 63, the intermediate film 72, the second optical film 83, and the protective film 92 is spaced apart on the substrate 10. A plurality are formed. Therefore, the optical member 50 can be multi-surfaced, and the organic EL display 1 can be multi-surfaced. Moreover, since the optical member 50 is selectively formed in the pixel area and its vicinity, the terminals provided around the pixel area can function appropriately.
  • the first optical film forming step S121, the intermediate film forming step S122, and the second optical film forming step S124 are performed in this order.
  • An intermediate film 72 is formed between the first optical film 63 and the second optical film 83.
  • the intermediate film 72 can protect the first optical film 63 so that the first optical film 63 is not damaged or foreign matter. Therefore, the quality of the optical member 50 can be improved. This is particularly effective when the production of the optical member 50 is temporarily interrupted and it takes a long time to resume, since there is a high risk of scratches and foreign matter.
  • the part 63 of the first optical film 62 is left and the remaining part of the first optical film 62 is removed.
  • One optical film patterning step S123 is performed. Therefore, it is possible to cover not only the main surface of the first optical film 63 remaining after the first optical film patterning step S123 but also the end surface of the first optical film 63 with the intermediate film 72.
  • the first optical film patterning step S123 only a part 63 of the first optical film 62 is insolubilized in the cleaning liquid that dissolves the first optical film 62, and then the remaining part of the first optical film 62 is obtained. Dissolve with cleaning solution. Since a part 63 of the first optical film 62 is insolubilized in the cleaning liquid, the mold is not lost by the cleaning liquid. On the other hand, the remaining portion of the first optical film 62 is not insolubilized in the cleaning liquid, and is dissolved and removed by the cleaning liquid.
  • the intermediate film 72 is formed so as to cover the main surface of the first optical film 63 and the end surface of the first optical film 63.
  • the intermediate film 72 can protect the first optical film 63 so that not only the main surface of the first optical film 63 but also the end surface of the first optical film 63 is not damaged or foreign matter. Therefore, the quality of the optical member 50 can be improved. This is particularly effective when the production of the optical member 50 is temporarily interrupted and it takes a long time to resume, since there is a high risk of scratches and foreign matter.
  • the protective film forming step S125 for forming the protective film 92 that protects the second optical film 83 is performed.
  • the protective film 92 can protect the second optical film 83 so that the second optical film 83 is not damaged or foreign matter after the optical member 50 is manufactured. Therefore, the quality of the optical member 50 can be improved.
  • the second optical film 82 is left as a part 83 and the remaining portion of the second optical film 82 is removed.
  • Two optical film patterning process S126 is performed. Therefore, it is possible to cover not only the main surface of the second optical film 83 remaining after the second optical film patterning step S126 but also the end surface of the second optical film 83 with the protective film 92.
  • the second optical film patterning step S126 only a part 83 of the second optical film 82 is insolubilized in the cleaning liquid that dissolves the second optical film 82, and then the remaining part of the second optical film 82 is obtained. Dissolve with cleaning solution. Since a part 83 of the second optical film 82 is insolubilized in the cleaning liquid, the mold is not lost by the cleaning liquid. On the other hand, since the remaining portion of the second optical film 82 is not insolubilized in the cleaning liquid, it is dissolved and removed by the cleaning liquid.
  • the protective film 92 is formed so as to cover the main surface of the second optical film 83 and the end surface of the second optical film 83.
  • the protective film 92 can protect the second optical film 83 so that not only the main surface of the second optical film 83 but also the end surface of the second optical film 83 is not damaged or foreign matter. Therefore, the quality of the optical member 50 can be improved. This is particularly effective when the production of the optical member 50 is temporarily interrupted and it takes a long time to resume, since there is a high risk of scratches and foreign matter.
  • the optical member 50 includes the first optical film 63, the intermediate film 72, the second optical film 83, and the protective film 92 in the above embodiment, but the present invention is not limited to this.
  • the optical member 50 only needs to include an optical film in which liquid crystal molecules are aligned, and the number of optical films is not limited.

Abstract

This method for producing organic EL display contains an optical member formation step in which an optical film having liquid crystal molecules aligned therein is formed by applying a coating solution for an optical film, the coating solution containing liquid crystal molecules and a solvent, onto a substrate having organic light-emitting diodes formed thereupon, and subsequently drying the solution.

Description

有機ＥＬディスプレイの製造方法Manufacturing method of organic EL display
　本発明は、有機ＥＬディスプレイの製造方法に関する。 The present invention relates to a method for manufacturing an organic EL display.
　例えば有機発光ダイオード（ＯＬＥＤ：Organic　Light　Emitting　Diode）を用いたディスプレイ（以下、「有機ＥＬ（Electro Luminescence）ディスプレイ」とも呼ぶ。）には、外光反射の抑制のために円偏光板が用いられている。円偏光板は、直線偏光板と波長板（位相差板）を、その偏光軸が４５度で交差するように積層して作製される。 For example, in a display using an organic light emitting diode (OLED: Organic Light Emitting Diode) (hereinafter also referred to as an “organic EL (Electro Luminescence) display”), a circularly polarizing plate is used to suppress external light reflection. Yes. The circularly polarizing plate is produced by laminating a linearly polarizing plate and a wave plate (retardation plate) so that the polarization axes intersect at 45 degrees.
　また、例えば波長板のみを、その偏光軸が１５度や７５度に傾くように形成する場合がある。したがって、偏光板や波長板を任意の角度で形成する必要がある。さらに、偏光板や波長板の偏光軸を任意の角度で交差させるため、これら偏光板や波長板を個別に形成する必要もある。 Also, for example, only the wave plate may be formed so that its polarization axis is inclined at 15 degrees or 75 degrees. Therefore, it is necessary to form a polarizing plate and a wave plate at an arbitrary angle. Furthermore, in order to cross the polarizing axes of the polarizing plate and the wave plate at an arbitrary angle, it is necessary to form these polarizing plates and the wave plate individually.
　従来、このような偏光板や波長板は、例えば延伸フィルムを用いて作製されている。延伸フィルムは、フィルムを一方向に延伸させて貼り付けることで、その材料中の分子を一方向に配向させたものである。 Conventionally, such polarizing plates and wave plates have been produced using, for example, stretched films. A stretched film is a film in which molecules in the material are oriented in one direction by stretching and pasting the film in one direction.
　ところで、近年、有機ＥＬディスプレイの薄型化に伴い、偏光板や波長板の薄板化も求められている。しかしながら、偏光板や波長板を作製するにあたり、従来のように延伸フィルムを用いた場合、当該延伸フィルム自体の膜厚を小さくするのに限界があり、十分な薄板を得ることができない。 By the way, in recent years, with the thinning of the organic EL display, the polarizing plate and the wave plate are also required to be thinned. However, when producing a polarizing plate or a wavelength plate, when a stretched film is used as in the prior art, there is a limit to reducing the thickness of the stretched film itself, and a sufficient thin plate cannot be obtained.
　そこで、基板上に所定材料を有する塗布液を塗布し、必要な膜厚の偏光板や波長板を形成することで、薄板化が図られている。具体的には、例えば所定材料として液晶性を有する塗布液を基板に塗布し、流延・配向させる。液晶分子は塗布液中で超分子会合体を形成しており、せん断応力を加えながら塗布液を流動させると超分子会合体の長軸方向が流動方向に配向する。 Therefore, thinning is achieved by applying a coating liquid having a predetermined material on the substrate to form a polarizing plate and a wavelength plate having a required film thickness. Specifically, for example, a coating liquid having liquid crystallinity is applied to the substrate as a predetermined material, and cast and oriented. The liquid crystal molecules form supramolecular aggregates in the coating liquid, and when the coating liquid is flowed while applying a shear stress, the major axis direction of the supramolecular aggregates is aligned in the flow direction.
　このように基板に対して塗布液を塗布できるようにするため、従来、種々の装置が提案されている。例えば特許文献１に記載された偏光膜印刷装置は、基板を保持するためのテーブルと、基板にインク液を吐出するスロットダイとを有する。スロットダイを印刷方向に移動させて基板にインク液を塗布する。 In order to be able to apply the coating liquid to the substrate in this way, various apparatuses have been proposed conventionally. For example, a polarizing film printing apparatus described in Patent Document 1 includes a table for holding a substrate and a slot die for discharging ink liquid onto the substrate. The slot die is moved in the printing direction to apply the ink liquid to the substrate.
日本国特開２００５－６２５０２号公報Japanese Unexamined Patent Publication No. 2005-62502
　基板上に塗布液を塗布して乾燥することにより、円偏光板などの光学部材を形成する技術が開発、検討されている。 A technique for forming an optical member such as a circularly polarizing plate by applying a coating solution on a substrate and drying it has been developed and studied.
　従来、光学部材用の塗布液が塗布される基板は、有機発光ダイオードが形成された基板とは別に用意され、貼り合わされていた。 Conventionally, the substrate on which the coating liquid for the optical member is applied is prepared separately from the substrate on which the organic light emitting diode is formed and bonded.
　そのため、基板や接着層などの部品点数が多く、有機ＥＬディスプレイの薄型化が十分ではなく、有機ＥＬディスプレイのフレキシブル性が十分ではなかった。 Therefore, the number of parts such as a substrate and an adhesive layer is large, the organic EL display is not sufficiently thinned, and the flexibility of the organic EL display is not sufficient.
　本発明は、上記課題に鑑みてなされたものであり、薄型化およびフレキシブル性を向上した、光学部材を備える有機ＥＬディスプレイの提供を主な目的とする。 The present invention has been made in view of the above problems, and has as its main object to provide an organic EL display including an optical member that is thin and has improved flexibility.
　上記課題を解決するため、本発明の一態様によれば、
　有機発光ダイオードが予め形成された基板上に、液晶分子と溶媒を含む光学膜用塗布液を塗布して乾燥することにより、液晶分子が配向された光学膜を形成する光学部材形成工程を有する、有機ＥＬディスプレイの製造方法が提供される。 In order to solve the above problems, according to one aspect of the present invention,
An optical member forming step of forming an optical film in which liquid crystal molecules are aligned by applying and drying an optical film coating liquid containing liquid crystal molecules and a solvent on a substrate on which an organic light emitting diode is formed in advance; A method for producing an organic EL display is provided.
　本発明の一態様によれば、薄型化およびフレキシブル性を向上した、光学部材を備える有機ＥＬディスプレイが提供される。 According to one aspect of the present invention, there is provided an organic EL display including an optical member that is thin and has improved flexibility.
一実施形態による有機ＥＬディスプレイを示す平面図である。It is a top view which shows the organic electroluminescent display by one Embodiment. 一実施形態による有機ＥＬディスプレイの要部を示す断面図である。It is sectional drawing which shows the principal part of the organic electroluminescent display by one Embodiment. 一実施形態による有機ＥＬディスプレイの製造方法を示すフローチャートである。It is a flowchart which shows the manufacturing method of the organic electroluminescent display by one Embodiment. 一実施形態によるタッチセンサ形成工程を示すフローチャートである。It is a flowchart which shows the touch sensor formation process by one Embodiment. 一実施形態による基板上に形成された第１金属膜を示す断面図である。It is sectional drawing which shows the 1st metal film formed on the board | substrate by one Embodiment. 一実施形態による第１金属膜上に形成されたレジスト膜を示す断面図である。It is sectional drawing which shows the resist film formed on the 1st metal film by one Embodiment. 一実施形態による露光および現像後のレジスト膜を示す断面図である。It is sectional drawing which shows the resist film after exposure and image development by one Embodiment. 一実施形態によるエッチング後の第１金属膜を示す断面図である。It is sectional drawing which shows the 1st metal film after the etching by one Embodiment. 一実施形態によるレジスト膜の除去後の第１金属膜を示す断面図である。It is sectional drawing which shows the 1st metal film after the removal of the resist film by one Embodiment. 一実施形態による第１金属膜上に形成された絶縁膜を示す断面図である。It is sectional drawing which shows the insulating film formed on the 1st metal film by one Embodiment. 一実施形態による絶縁膜上に形成された第２金属膜の一部除去後の状態を示す平面図である。It is a top view which shows the state after partial removal of the 2nd metal film formed on the insulating film by one Embodiment. 第１実施形態による光学部材形成工程を示すフローチャートである。It is a flowchart which shows the optical member formation process by 1st Embodiment. 第１実施形態による基板上に塗布された第１光学膜用塗布液の液膜を示す側面図である。It is a side view which shows the liquid film of the coating liquid for 1st optical films apply | coated on the board | substrate by 1st Embodiment. 第１実施形態による第１光学膜用塗布液の液膜の乾燥により形成された第１光学膜を示す側面図である。It is a side view which shows the 1st optical film formed by drying the liquid film of the coating liquid for 1st optical films by 1st Embodiment. 第１実施形態による一部不溶化された第１光学膜を示す側面図である。It is a side view which shows the 1st optical film partially insolubilized by 1st Embodiment. 第１実施形態による第１光学膜上に塗布された中間膜用塗布液の液膜を示す側面図である。It is a side view which shows the liquid film of the coating liquid for intermediate films apply | coated on the 1st optical film by 1st Embodiment. 第１実施形態による中間膜用塗布液の液膜の乾燥により形成された中間膜を示す側面図である。It is a side view which shows the intermediate film formed by drying the liquid film of the coating liquid for intermediate films by 1st Embodiment. 第１実施形態による中間膜で覆われていない部分が除去された第１光学膜を示す側面図である。It is a side view which shows the 1st optical film from which the part which is not covered with the intermediate film by 1st Embodiment was removed. 第１実施形態による中間膜上に塗布された第２光学膜用塗布液の液膜を示す側面図である。It is a side view which shows the liquid film of the coating liquid for 2nd optical films apply | coated on the intermediate film by 1st Embodiment. 第１実施形態による第２光学膜用塗布液の液膜の乾燥により形成された第２光学膜を示す側面図である。It is a side view which shows the 2nd optical film formed by drying the liquid film of the coating liquid for 2nd optical films by 1st Embodiment. 第１実施形態による一部不溶化された第２光学膜を示す側面図である。It is a side view which shows the 2nd optical film partially insolubilized by 1st Embodiment. 第１実施形態による第２光学膜上に塗布された保護膜用塗布液の液膜を示す側面図である。It is a side view which shows the liquid film of the coating liquid for protective films apply | coated on the 2nd optical film by 1st Embodiment. 第１実施形態による保護膜用塗布液の液膜の乾燥により形成された保護膜を示す側面図である。It is a side view which shows the protective film formed by drying the liquid film of the coating liquid for protective films by 1st Embodiment. 第１実施形態による保護膜で覆われていない部分が除去された第２光学膜を示す側面図である。It is a side view which shows the 2nd optical film from which the part which is not covered with the protective film by 1st Embodiment was removed. 第２実施形態による光学部材形成工程を示すフローチャートである。It is a flowchart which shows the optical member formation process by 2nd Embodiment. 第２実施形態による不溶化されていない部分が除去された第１光学膜を示す側面図である。It is a side view which shows the 1st optical film by which the part which has not been insolubilized by 2nd Embodiment was removed. 第２実施形態による第１光学膜上に塗布された中間膜用塗布液の液膜を示す側面図である。It is a side view which shows the liquid film of the coating liquid for intermediate films apply | coated on the 1st optical film by 2nd Embodiment. 第２実施形態による中間膜用塗布液の液膜の乾燥により形成された中間膜を示す側面図である。It is a side view which shows the intermediate film formed by drying the liquid film of the coating liquid for intermediate films by 2nd Embodiment. 第２実施形態による中間膜上に塗布された第２光学膜用塗布液の液膜を示す側面図である。It is a side view which shows the liquid film of the coating liquid for 2nd optical films apply | coated on the intermediate film by 2nd Embodiment. 第２実施形態による第２光学膜用塗布液の液膜の乾燥により形成された第２光学膜を示す側面図である。It is a side view which shows the 2nd optical film formed by drying the liquid film of the coating liquid for 2nd optical films by 2nd Embodiment. 第２実施形態による一部不溶化された第２光学膜を示す側面図である。It is a side view which shows the 2nd optical film partially insolubilized by 2nd Embodiment. 第２実施形態による不溶化されていない部分が除去された第２光学膜を示す側面図である。It is a side view which shows the 2nd optical film by which the part which is not insolubilized by 2nd Embodiment was removed. 第２実施形態による第２光学膜上に塗布された保護膜用塗布液の液膜を示す側面図である。It is a side view which shows the liquid film of the coating liquid for protective films apply | coated on the 2nd optical film by 2nd Embodiment. 第２実施形態による保護膜用塗布液の液膜の乾燥により形成された保護膜を示す側面図である。It is a side view which shows the protective film formed by drying the liquid film of the coating liquid for protective films by 2nd Embodiment.
　以下、本発明を実施するための形態について図面を参照して説明する。各図面において、同一の又は対応する構成には、同一の又は対応する符号を付して説明を省略する。 Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. In the drawings, the same or corresponding components are denoted by the same or corresponding reference numerals, and description thereof is omitted.
　＜有機ＥＬディスプレイ＞
　図１は、一実施形態による有機ＥＬディスプレイを示す平面図である。図１において、一の単位回路１１の回路を拡大して示す。 <Organic EL display>
FIG. 1 is a plan view showing an organic EL display according to an embodiment. In FIG. 1, the circuit of one unit circuit 11 is shown enlarged.
　有機ＥＬディスプレイ１は、基板１０と、基板１０上に配列される複数の単位回路１１と、基板１０上に設けられる走査線駆動回路１４と、基板１０上に設けられるデータ線駆動回路１５とを有する。走査線駆動回路１４に接続される複数の走査線１６と、データ線駆動回路１５に接続される複数のデータ線１７とで囲まれる領域に、単位回路１１が設けられる。単位回路１１は、ＴＦＴ層１２と、有機発光ダイオード１３とを含む。 The organic EL display 1 includes a substrate 10, a plurality of unit circuits 11 arranged on the substrate 10, a scanning line driving circuit 14 provided on the substrate 10, and a data line driving circuit 15 provided on the substrate 10. Have. The unit circuit 11 is provided in a region surrounded by a plurality of scanning lines 16 connected to the scanning line driving circuit 14 and a plurality of data lines 17 connected to the data line driving circuit 15. The unit circuit 11 includes a TFT layer 12 and an organic light emitting diode 13.
　ＴＦＴ層１２は、複数のＴＦＴ（Thin Film Transistor）を有する。一のＴＦＴはスイッチング素子としての機能を有し、他の一のＴＦＴは有機発光ダイオード１３に流す電流量を制御する電流制御用素子としての機能を有する。ＴＦＴ層１２は、走査線駆動回路１４およびデータ線駆動回路１５によって作動され、有機発光ダイオード１３に電流を供給する。ＴＦＴ層１２は単位回路１１毎に設けられており、複数の単位回路１１は独立に制御される。尚、ＴＦＴ層１２は、一般的な構成であればよく、図１に示す構成には限定されない。 The TFT layer 12 has a plurality of thin film transistors (TFTs). One TFT has a function as a switching element, and the other TFT has a function as a current control element for controlling the amount of current flowing through the organic light emitting diode 13. The TFT layer 12 is operated by the scanning line driving circuit 14 and the data line driving circuit 15, and supplies current to the organic light emitting diode 13. The TFT layer 12 is provided for each unit circuit 11, and the plurality of unit circuits 11 are controlled independently. The TFT layer 12 may have a general configuration, and is not limited to the configuration shown in FIG.
　尚、有機ＥＬディスプレイ１の駆動方式は、本実施形態ではアクティブマトリックス方式であるが、パッシブマトリックス方式であってもよい。 The driving method of the organic EL display 1 is an active matrix method in the present embodiment, but may be a passive matrix method.
　図２は、一実施形態による有機ＥＬディスプレイの要部を示す断面図である。図２に示す有機ＥＬディスプレイ１は、トップエミッション方式であり、基板１０、有機発光ダイオード１３、封止層３０、タッチセンサ４０、および光学部材５０をこの順で有する。タッチセンサ４０は、有機ＥＬディスプレイ１がタッチパネルである場合に、有機ＥＬディスプレイ１に組み込まれる。 FIG. 2 is a cross-sectional view showing a main part of an organic EL display according to an embodiment. The organic EL display 1 shown in FIG. 2 is a top emission type, and includes a substrate 10, an organic light emitting diode 13, a sealing layer 30, a touch sensor 40, and an optical member 50 in this order. The touch sensor 40 is incorporated in the organic EL display 1 when the organic EL display 1 is a touch panel.
　基板１０は、樹脂基板、ガラス基板、半導体基板、金属基板などのいずれでもよく、フレキシブル性向上の観点から樹脂基板であることが好ましい。基板１０は、フレキシブル性向上と水分透過性低下の観点から、樹脂基板とガラス基板の積層基板でもよい。基板１０上には、ＴＦＴ層１２が形成されている。ＴＦＴ層１２上には、ＴＦＴ層１２によって形成される段差を平坦化する平坦化層１８が形成されている。 The substrate 10 may be any of a resin substrate, a glass substrate, a semiconductor substrate, a metal substrate, and the like, and is preferably a resin substrate from the viewpoint of improving flexibility. The substrate 10 may be a laminated substrate of a resin substrate and a glass substrate from the viewpoint of improving flexibility and reducing moisture permeability. A TFT layer 12 is formed on the substrate 10. On the TFT layer 12, a flattening layer 18 for flattening a step formed by the TFT layer 12 is formed.
　平坦化層１８は、絶縁性を有している。平坦化層１８を貫通するコンタクトホールには、コンタクトプラグ１９が形成されている。コンタクトプラグ１９は、平坦化層１８の平坦面に形成される画素電極２１と、ＴＦＴ層１２とを電気的に接続する。コンタクトプラグ１９は、画素電極２１と同じ材料で、同時に形成されてよい。 The planarization layer 18 has an insulating property. Contact plugs 19 are formed in contact holes that penetrate the planarization layer 18. The contact plug 19 electrically connects the pixel electrode 21 formed on the flat surface of the flattening layer 18 and the TFT layer 12. The contact plug 19 may be formed of the same material as the pixel electrode 21 at the same time.
　有機発光ダイオード１３は、平坦化層１８の平坦面上に形成される。有機発光ダイオード１３は、画素電極２１と、画素電極２１を基準として基板１０とは反対側に設けられる対向電極２２と、画素電極２１と対向電極２２の間に形成される有機層２３とを有する。ＴＦＴ層１２を作動させることで、画素電極２１と対向電極２２との間に電圧が印加され、有機層２３が発光する。 The organic light emitting diode 13 is formed on the flat surface of the flattening layer 18. The organic light emitting diode 13 includes a pixel electrode 21, a counter electrode 22 provided on the opposite side of the substrate 10 with respect to the pixel electrode 21, and an organic layer 23 formed between the pixel electrode 21 and the counter electrode 22. . By operating the TFT layer 12, a voltage is applied between the pixel electrode 21 and the counter electrode 22, and the organic layer 23 emits light.
　画素電極２１は、例えば陰極であり、アルミニウムなどの金属材料で形成され、有機層２３からの光を有機層２３に向けて反射する。画素電極２１で反射した光は、有機層２３や対向電極２２を透過し、外部に取り出される。画素電極２１は、単位回路１１毎に設けられる。 The pixel electrode 21 is, for example, a cathode and is formed of a metal material such as aluminum, and reflects light from the organic layer 23 toward the organic layer 23. The light reflected by the pixel electrode 21 passes through the organic layer 23 and the counter electrode 22 and is extracted outside. The pixel electrode 21 is provided for each unit circuit 11.
　対向電極２２は、例えば陽極であって、ＩＴＯ（Indium Tin Oxide）などの透明材料で形成され、有機層２３からの光を透過する。対向電極２２を透過した光は、封止層３０やタッチセンサ４０、光学部材５０を通過し、外部に取り出される。対向電極２２は、複数の単位回路１１に共通のものである。 The counter electrode 22 is, for example, an anode, is formed of a transparent material such as ITO (Indium Tin Oxide), and transmits light from the organic layer 23. The light transmitted through the counter electrode 22 passes through the sealing layer 30, the touch sensor 40, and the optical member 50, and is extracted outside. The counter electrode 22 is common to the plurality of unit circuits 11.
　有機層２３は、例えば、陰極側から陽極側に向けて、電子注入層２４、電子輸送層２５、発光層２６、正孔輸送層２７、正孔注入層２８をこの順で有する。陰極と陽極との間に電圧がかかると、陰極から電子注入層２４に電子が注入されると共に、陽極から正孔注入層２８に正孔が注入される。電子注入層２４に注入された電子は、電子輸送層２５によって発光層２６へ輸送される。また、正孔注入層２８に注入された正孔は、正孔輸送層２７によって発光層２６へ輸送される。そうして、発光層２６内で正孔と電子が再結合して、発光層２６の発光材料が励起され、発光層２６が発光する。発光層２６としては、例えば、赤色に発光する赤色発光層、緑色に発光する緑色発光層、および青色に発光する青色発光層が形成される。 The organic layer 23 has, for example, an electron injection layer 24, an electron transport layer 25, a light emitting layer 26, a hole transport layer 27, and a hole injection layer 28 in this order from the cathode side to the anode side. When a voltage is applied between the cathode and the anode, electrons are injected from the cathode into the electron injection layer 24 and holes are injected from the anode into the hole injection layer 28. The electrons injected into the electron injection layer 24 are transported to the light emitting layer 26 by the electron transport layer 25. The holes injected into the hole injection layer 28 are transported to the light emitting layer 26 by the hole transport layer 27. Then, holes and electrons are recombined in the light emitting layer 26, the light emitting material of the light emitting layer 26 is excited, and the light emitting layer 26 emits light. As the light emitting layer 26, for example, a red light emitting layer that emits red light, a green light emitting layer that emits green light, and a blue light emitting layer that emits blue light are formed.
　尚、有機層２３は、本実施形態では、陰極側から陽極側に向けて、電子注入層２４、電子輸送層２５、発光層２６、正孔輸送層２７、正孔注入層２８をこの順で有するが、少なくとも発光層２６を有していればよい。有機層２３は、図２に示す構成には限定されない。 In the present embodiment, the organic layer 23 includes an electron injection layer 24, an electron transport layer 25, a light emitting layer 26, a hole transport layer 27, and a hole injection layer 28 in this order from the cathode side to the anode side. However, it is sufficient that at least the light emitting layer 26 is provided. The organic layer 23 is not limited to the configuration shown in FIG.
　封止層３０は、基板１０との間に、有機発光ダイオード１３を封止する。封止層３０としては、酸化珪素層や窒化珪素層などが用いられ、例えば成膜温度が１００℃以下の低温ＣＶＤにより形成される。あるいは、防湿層が形成された樹脂フィルムを貼着して封止層３０としてもよい。 The sealing layer 30 seals the organic light emitting diode 13 between the substrate 10. As the sealing layer 30, a silicon oxide layer, a silicon nitride layer, or the like is used. For example, the sealing layer 30 is formed by low-temperature CVD at a film forming temperature of 100 ° C. or less. Or it is good also as the sealing layer 30 by sticking the resin film in which the moisture-proof layer was formed.
　タッチセンサ４０は、有機ＥＬディスプレイ１の画面に対する指などの物体の接触または近接を検出する。タッチセンサ４０の検出方式は、特に限定されないが、例えば静電容量方式であってよい。静電容量方式としては、表面型静電容量方式、投影型静電容量方式などがある。投影型静電容量方式としては、自己容量方式、相互容量方式等がある。相互容量方式を用いると、同時多点検出が可能となるため好ましい。 The touch sensor 40 detects contact or proximity of an object such as a finger to the screen of the organic EL display 1. The detection method of the touch sensor 40 is not particularly limited, but may be a capacitance method, for example. Examples of the capacitance method include a surface capacitance method and a projection capacitance method. Examples of the projected capacitance method include a self-capacitance method and a mutual capacitance method. Use of the mutual capacitance method is preferable because simultaneous multipoint detection is possible.
　タッチセンサ４０は、詳しくは後述するが、有機発光ダイオード１３が予め形成された基板１０上に形成される。よって、従来のようにタッチセンサ４０が基板１０とは別の基板に形成され、基板１０と貼り合わされる場合に比べて、基板や接着層などの部品点数を削減できるので、有機ＥＬディスプレイ１を薄型化でき、有機ＥＬディスプレイ１のフレキシブル性を向上できる。 The touch sensor 40 is formed on the substrate 10 on which the organic light emitting diode 13 is formed in advance, as will be described in detail later. Therefore, as compared with the case where the touch sensor 40 is formed on a substrate different from the substrate 10 and bonded to the substrate 10 as in the past, the number of components such as the substrate and the adhesive layer can be reduced. The thickness can be reduced, and the flexibility of the organic EL display 1 can be improved.
　タッチセンサ４０は、有機発光ダイオード１３と光学部材５０との間に形成される。光学部材５０が外光反射を抑制する円偏光膜である場合に、円偏光膜がタッチセンサ４０よりも光取出側に配設されるため、外光反射の抑制効率を向上できる。 The touch sensor 40 is formed between the organic light emitting diode 13 and the optical member 50. When the optical member 50 is a circularly polarizing film that suppresses reflection of external light, the circularly polarizing film is disposed on the light extraction side with respect to the touch sensor 40, so that the efficiency of suppressing external light reflection can be improved.
　光学部材５０は、例えば外光反射を抑制する円偏光膜であって、本実施形態では、第１光学膜として１／４波長膜（λ／４膜）を有し、第２光学膜として直線偏光膜とを有する。１／４波長膜と直線偏光膜は、その偏光軸が４５度で交差するように形成される。尚、光学部材５０を構成する光学膜の数は特に限定されない。 The optical member 50 is, for example, a circularly polarizing film that suppresses reflection of external light. In the present embodiment, the optical member 50 has a ¼ wavelength film (λ / 4 film) as the first optical film, and a straight line as the second optical film. A polarizing film. The quarter wavelength film and the linear polarizing film are formed so that their polarization axes intersect at 45 degrees. Note that the number of optical films constituting the optical member 50 is not particularly limited.
　光学部材５０は、詳しくは後述するが、有機発光ダイオード１３が予め形成された基板１０上に形成される。よって、従来のように光学部材５０が基板１０とは別の基板に形成され、基板１０と貼り合わされる場合に比べて、基板や接着層などの部品点数を削減できるので、有機ＥＬディスプレイ１を薄型化でき、有機ＥＬディスプレイ１のフレキシブル性を向上できる。 The optical member 50 is formed on the substrate 10 on which the organic light emitting diode 13 is formed in advance, as will be described in detail later. Therefore, as compared with the case where the optical member 50 is formed on a substrate different from the substrate 10 and bonded to the substrate 10 as in the past, the number of components such as the substrate and the adhesive layer can be reduced. The thickness can be reduced, and the flexibility of the organic EL display 1 can be improved.
　光学部材５０は、有機層２３の紫外線による劣化を抑制するため、紫外線照射を用いることなく製造される。また、光学部材５０は、有機層２３の熱による劣化を抑制するため、１００℃以下の温度で製造される。 The optical member 50 is manufactured without using ultraviolet irradiation in order to suppress deterioration of the organic layer 23 due to ultraviolet rays. The optical member 50 is manufactured at a temperature of 100 ° C. or lower in order to suppress deterioration of the organic layer 23 due to heat.
　尚、図２に示す有機ＥＬディスプレイ１は、トップエミッション方式であるが、ボトムエミッション方式であってもよい。ボトムエミッション方式の場合、発光層２６からの光は画素電極２１を透過し基板１０から取り出されるため、透明電極である陽極が画素電極２１として用いられ、反射電極である陰極が対向電極２２として用いられる。つまり、ボトムエミッション方式の場合、陽極と陰極の配置が逆になる。また、ボトムエミッション方式の場合、基板１０は透明基板である。さらに、ボトムエミッション方式の場合、タッチセンサ４０や光学部材５０は、基板１０を基準として、有機発光ダイオード１３とは反対側に形成される。 In addition, although the organic EL display 1 shown in FIG. 2 is a top emission system, it may be a bottom emission system. In the case of the bottom emission method, light from the light emitting layer 26 passes through the pixel electrode 21 and is extracted from the substrate 10, so that an anode that is a transparent electrode is used as the pixel electrode 21 and a cathode that is a reflective electrode is used as the counter electrode 22. It is done. That is, in the bottom emission method, the arrangement of the anode and the cathode is reversed. In the case of the bottom emission method, the substrate 10 is a transparent substrate. Further, in the case of the bottom emission method, the touch sensor 40 and the optical member 50 are formed on the side opposite to the organic light emitting diode 13 with respect to the substrate 10.
　＜有機ＥＬディスプレイの製造方法＞
　図３は、一実施形態による有機ＥＬディスプレイの製造方法を示すフローチャートである。図３に示すように、有機ＥＬディスプレイ１の製造方法は、タッチセンサ形成工程Ｓ１１０と、光学部材形成工程Ｓ１２０とを有する。尚、タッチセンサ形成工程Ｓ１１０は、有機ＥＬディスプレイ１がタッチパネルである場合に行われる。以下、各工程について説明する。 <Method for manufacturing organic EL display>
FIG. 3 is a flowchart illustrating a method for manufacturing an organic EL display according to an embodiment. As shown in FIG. 3, the manufacturing method of the organic EL display 1 includes a touch sensor forming step S110 and an optical member forming step S120. In addition, touch sensor formation process S110 is performed when the organic EL display 1 is a touch panel. Hereinafter, each step will be described.
　＜タッチセンサ形成工程＞
　タッチセンサ形成工程Ｓ１１０は、光学部材形成工程Ｓ１２０の前に、有機発光ダイオード１３が予め形成された基板１０上に、タッチセンサ４０を形成する。よって、従来のようにタッチセンサ４０が基板１０とは別の基板に形成され、基板１０と貼り合わされる場合に比べて、基板や接着層などの部品点数を削減できるので、有機ＥＬディスプレイ１を薄型化でき、有機ＥＬディスプレイ１のフレキシブル性を向上できる。 <Touch sensor formation process>
In the touch sensor forming step S110, the touch sensor 40 is formed on the substrate 10 on which the organic light emitting diodes 13 are formed in advance before the optical member forming step S120. Therefore, as compared with the case where the touch sensor 40 is formed on a substrate different from the substrate 10 and bonded to the substrate 10 as in the past, the number of components such as the substrate and the adhesive layer can be reduced. The thickness can be reduced, and the flexibility of the organic EL display 1 can be improved.
　図４は、一実施形態によるタッチセンサ形成工程を示すフローチャートである。図５は、一実施形態による基板上に形成された第１金属膜を示す断面図である。図６は、一実施形態による第１金属膜上に形成されたレジスト膜を示す断面図である。図７は、一実施形態による露光および現像後のレジスト膜を示す断面図である。図８は、一実施形態によるエッチング後の第１金属膜を示す断面図である。図９は、一実施形態によるレジスト膜の除去後の第１金属膜を示す断面図である。図１０は、一実施形態による第１金属膜上に形成された絶縁膜を示す断面図である。図１１は、一実施形態による絶縁膜上に形成された第２金属膜の一部除去後の状態を示す平面図である。図５～図１０は、図１１のＡ－Ａ線に沿った断面図である。図５～図１１において、図２に示す有機発光ダイオード１３や封止層３０などの図示を省略する。 FIG. 4 is a flowchart illustrating a touch sensor formation process according to an embodiment. FIG. 5 is a cross-sectional view illustrating a first metal film formed on a substrate according to an embodiment. FIG. 6 is a cross-sectional view showing a resist film formed on the first metal film according to one embodiment. FIG. 7 is a cross-sectional view showing a resist film after exposure and development according to an embodiment. FIG. 8 is a cross-sectional view illustrating the first metal film after etching according to an embodiment. FIG. 9 is a cross-sectional view showing the first metal film after removal of the resist film according to one embodiment. FIG. 10 is a cross-sectional view illustrating an insulating film formed on a first metal film according to an embodiment. FIG. 11 is a plan view showing a state after the partial removal of the second metal film formed on the insulating film according to the embodiment. 5 to 10 are sectional views taken along the line AA in FIG. 5 to 11, the illustration of the organic light emitting diode 13 and the sealing layer 30 shown in FIG. 2 is omitted.
　タッチセンサ形成工程Ｓ１１０は、基板１０上に遮光性の第１金属膜４１を形成する工程Ｓ１１１と、フォトリソグラフィ法およびエッチング法によって第１金属膜４１の一部を選択的に除去する工程Ｓ１１２とを有する。第１金属膜４１は、図５に示すように基板１０上（より詳細には例えば封止層３０上）に形成される。第１金属膜４１上には、図６に示すようにレジスト膜４２が形成される。レジスト膜４２は、露光および現像によって図７に示すようにパターンニングされる。レジスト膜４２は、露光された部分が現像で除去されるポジ型でもよいし、露光された部分が現像後に残るネガ型でもよい。露光の光は、第１金属膜４１で遮光されるため、有機発光ダイオード１３を劣化させることがない。その後、パターンニングされたレジスト膜４２をマスクとして用いて、図８に示すように第１金属膜４１の一部が選択的に除去される。一部が選択的に除去された第１金属膜４１は、図１１に破線で示すように平面視で、縞状に形成される。その後、第１金属膜４１のパターンニングに用いたレジスト膜４２は、図９に示すように除去される。 The touch sensor formation step S110 includes a step S111 for forming the light-shielding first metal film 41 on the substrate 10, and a step S112 for selectively removing a part of the first metal film 41 by a photolithography method and an etching method. Have As shown in FIG. 5, the first metal film 41 is formed on the substrate 10 (more specifically, for example, on the sealing layer 30). A resist film 42 is formed on the first metal film 41 as shown in FIG. The resist film 42 is patterned as shown in FIG. 7 by exposure and development. The resist film 42 may be a positive type in which an exposed portion is removed by development, or a negative type in which an exposed portion remains after development. Since the exposure light is shielded by the first metal film 41, the organic light emitting diode 13 is not deteriorated. Thereafter, using the patterned resist film 42 as a mask, a part of the first metal film 41 is selectively removed as shown in FIG. The first metal film 41 from which a part has been selectively removed is formed in a stripe shape in plan view as shown by a broken line in FIG. Thereafter, the resist film 42 used for patterning the first metal film 41 is removed as shown in FIG.
　尚、本明細書において、第１金属膜４１が遮光性を有するとは、第１金属膜４１の透過率が５％以下であることを意味する。第１金属膜４１の透過率は、好ましくは３％以下である。ここで、第１金属膜４１の透過率は、第１金属膜４１上に形成されるレジスト膜４２の露光の光（例えば波長３６５ｎｍの光）が第１金属膜４１を透過する割合のことである。第１金属膜４１は、例えば銅で形成される。 In the present specification, the first metal film 41 having a light shielding property means that the transmittance of the first metal film 41 is 5% or less. The transmittance of the first metal film 41 is preferably 3% or less. Here, the transmittance of the first metal film 41 is the ratio at which the exposure light (for example, light having a wavelength of 365 nm) of the resist film 42 formed on the first metal film 41 is transmitted through the first metal film 41. is there. The first metal film 41 is made of copper, for example.
　また、タッチセンサ形成工程Ｓ１１０は、一部が選択的に除去された第１金属膜４１上に絶縁膜４３を形成する工程Ｓ１１３を有する。絶縁膜４３は、第１金属膜４１と第２金属膜４５とを絶縁する。絶縁膜４３としては、酸化珪素膜や窒化珪素膜などが用いられ、例えば成膜温度が１００℃以下の低温ＣＶＤにより形成される。 Further, the touch sensor forming step S110 includes a step S113 of forming the insulating film 43 on the first metal film 41 from which part has been selectively removed. The insulating film 43 insulates the first metal film 41 and the second metal film 45. As the insulating film 43, a silicon oxide film, a silicon nitride film, or the like is used. For example, the insulating film 43 is formed by low-temperature CVD at a film forming temperature of 100 ° C. or lower.
　さらに、タッチセンサ形成工程Ｓ１１０は、絶縁膜４３上に遮光性の第２金属膜４５を形成する工程Ｓ１１４と、フォトリソグラフィ法およびエッチング法によって第２金属膜４５の一部を選択的に除去する工程Ｓ１１５とを有する。第２金属膜４５の形成および第２金属膜の一部除去は、第１金属膜４１の形成および第１金属膜４１の一部除去と同様に行われる。一部が選択的に除去された第２金属膜４５は、図１１に示すように平面視で、縞状に形成される。その後、第２金属膜４５のパターンニングに用いたレジスト膜は、除去される。 Further, in the touch sensor formation step S110, a part of the second metal film 45 is selectively removed by the step S114 of forming the light-shielding second metal film 45 on the insulating film 43 and the photolithography method and the etching method. Step S115. The formation of the second metal film 45 and the partial removal of the second metal film are performed in the same manner as the formation of the first metal film 41 and the partial removal of the first metal film 41. The second metal film 45 from which a part has been selectively removed is formed in a stripe shape in plan view as shown in FIG. Thereafter, the resist film used for patterning the second metal film 45 is removed.
　尚、本明細書において、第２金属膜４５が遮光性を有するとは、第２金属膜４５の透過率が５％以下であることを意味する。第２金属膜４５の透過率は、好ましくは３％以下である。ここで、第２金属膜４５の透過率は、第２金属膜４５上に形成されるレジスト膜の露光の光（例えば波長３６５ｎｍの光）が第２金属膜４５を透過する割合のことである。第２金属膜４５は、例えば銅で形成される。 In the present specification, the second metal film 45 having a light shielding property means that the transmittance of the second metal film 45 is 5% or less. The transmittance of the second metal film 45 is preferably 3% or less. Here, the transmittance of the second metal film 45 is a ratio at which the exposure light (for example, light having a wavelength of 365 nm) of the resist film formed on the second metal film 45 passes through the second metal film 45. . The second metal film 45 is made of, for example, copper.
　さらに、タッチセンサ形成工程Ｓ１１０は、一部が選択的に除去された第２金属膜４５上にタッチセンサ保護膜４７を形成する工程Ｓ１１６を有する。タッチセンサ保護膜４７は、絶縁膜４３と同様に形成される。例えば、タッチセンサ保護膜４７としては、酸化珪素膜や窒化珪素膜などが用いられ、例えば成膜温度が１００℃以下の低温ＣＶＤにより形成される。 Furthermore, the touch sensor forming step S110 includes a step S116 of forming the touch sensor protective film 47 on the second metal film 45 from which part has been selectively removed. The touch sensor protective film 47 is formed in the same manner as the insulating film 43. For example, as the touch sensor protective film 47, a silicon oxide film, a silicon nitride film, or the like is used. For example, the touch sensor protective film 47 is formed by low-temperature CVD at a film forming temperature of 100 ° C. or less.
　このようにして、第１金属膜４１、絶縁膜４３、第２金属膜４５、およびタッチセンサ保護膜４７とで構成されるタッチセンサ４０が得られる。ワイヤー状の第１金属膜４１やワイヤー状の第２金属膜４５は、平面視で有機発光ダイオード１３の有機層２３と重ならないように、図１１に示すように四角格子状に形成される。つまり、平面視で、四角格子の開口部に有機層２３が配設される。有機層２３からの光を外部に取り出しやすい。第１金属膜４１および第２金属膜４５は、いずれか１つが駆動電極として用いられ、残りの１つが受信電極として用いられる。タッチセンサ４０は、駆動電極と受信電極の間の容量変化を検出することで、有機ＥＬディスプレイ１の画面に対する指などの物体の接触または近接を検出する。 Thus, the touch sensor 40 constituted by the first metal film 41, the insulating film 43, the second metal film 45, and the touch sensor protective film 47 is obtained. The wire-like first metal film 41 and the wire-like second metal film 45 are formed in a square lattice shape as shown in FIG. 11 so as not to overlap the organic layer 23 of the organic light emitting diode 13 in plan view. That is, the organic layer 23 is disposed in the opening of the square lattice in plan view. It is easy to extract light from the organic layer 23 to the outside. Any one of the first metal film 41 and the second metal film 45 is used as a drive electrode, and the remaining one is used as a reception electrode. The touch sensor 40 detects the contact or proximity of an object such as a finger to the screen of the organic EL display 1 by detecting a change in capacitance between the drive electrode and the reception electrode.
　本実施形態のタッチセンサ形成工程Ｓ１１０によれば、フォトリソグラフィ法の露光による有機発光ダイオード１３の有機層２３の劣化を抑制しながら、予め有機発光ダイオード１３が形成された基板１０上にタッチセンサ４０を形成できる。従来のようにタッチセンサ４０が基板１０とは別の基板に形成され、基板１０と貼り合わされる場合に比べて、基板や接着層などの部品点数を削減できるので、有機ＥＬディスプレイ１を薄型化でき、有機ＥＬディスプレイ１のフレキシブル性を向上できる。 According to the touch sensor formation step S110 of the present embodiment, the touch sensor 40 is formed on the substrate 10 on which the organic light emitting diode 13 has been formed in advance while suppressing the deterioration of the organic layer 23 of the organic light emitting diode 13 due to exposure by a photolithography method. Can be formed. Compared to the case where the touch sensor 40 is formed on a substrate different from the substrate 10 and bonded to the substrate 10 as in the past, the number of components such as the substrate and the adhesive layer can be reduced, so the organic EL display 1 is made thinner. The flexibility of the organic EL display 1 can be improved.
　本実施形態のタッチセンサ形成工程Ｓ１１０は、光学部材形成工程Ｓ１２０の前に行われるので、タッチセンサ４０は有機発光ダイオード１３と光学部材５０との間に形成される。光学部材５０が外光反射を抑制する円偏光膜である場合に、円偏光膜がタッチセンサ４０よりも光取出側に配設されるため、外光反射の抑制効率を向上できる。 Since the touch sensor formation step S110 of this embodiment is performed before the optical member formation step S120, the touch sensor 40 is formed between the organic light emitting diode 13 and the optical member 50. When the optical member 50 is a circularly polarizing film that suppresses reflection of external light, the circularly polarizing film is disposed on the light extraction side with respect to the touch sensor 40, so that the efficiency of suppressing external light reflection can be improved.
　＜光学部材形成工程＞
　光学部材形成工程Ｓ１２０は、有機発光ダイオード１３が予め形成された基板１０上に、液晶分子と溶媒を含む光学膜用塗布液を塗布して乾燥することにより、液晶分子が配向された光学膜を形成する。光学膜などで光学部材５０が構成される。 <Optical member formation process>
In the optical member forming step S120, an optical film in which liquid crystal molecules are aligned is formed by applying an optical film coating liquid containing liquid crystal molecules and a solvent on the substrate 10 on which the organic light emitting diodes 13 are formed in advance, and drying. Form. The optical member 50 is composed of an optical film or the like.
　光学部材５０は、例えば第１光学膜と第２光学膜を有する。第１光学膜および第２光学膜は、いずれか１つが位相差膜であり、残りの１つが偏光膜である。 The optical member 50 includes, for example, a first optical film and a second optical film. One of the first optical film and the second optical film is a retardation film, and the remaining one is a polarizing film.
　光学部材５０は、例えば外光反射を抑制する円偏光膜であって、本実施形態では、第１光学膜として１／４波長膜（λ／４膜）を有し、第２光学膜として直線偏光膜とを有する。１／４波長膜と直線偏光膜は、その偏光軸が４５度で交差するように形成される。尚、光学部材５０を構成する光学膜の数は特に限定されない。 The optical member 50 is, for example, a circularly polarizing film that suppresses reflection of external light. In the present embodiment, the optical member 50 has a ¼ wavelength film (λ / 4 film) as the first optical film, and a straight line as the second optical film. A polarizing film. The quarter wavelength film and the linear polarizing film are formed so that their polarization axes intersect at 45 degrees. Note that the number of optical films constituting the optical member 50 is not particularly limited.
　本実施形態の光学部材形成工程Ｓ１２０によれば、光学部材５０は、有機発光ダイオード１３が予め形成された基板１０上に形成される。よって、従来のように光学部材５０が基板１０とは別の基板に形成され、基板１０と貼り合わされる場合に比べて、基板や接着層などの部品点数を削減できるので、有機ＥＬディスプレイ１を薄型化でき、有機ＥＬディスプレイ１のフレキシブル性を向上できる。 According to the optical member forming step S120 of the present embodiment, the optical member 50 is formed on the substrate 10 on which the organic light emitting diode 13 is previously formed. Therefore, as compared with the case where the optical member 50 is formed on a substrate different from the substrate 10 and bonded to the substrate 10 as in the past, the number of components such as the substrate and the adhesive layer can be reduced. The thickness can be reduced, and the flexibility of the organic EL display 1 can be improved.
　本実施形態の光学部材形成工程Ｓ１２０によれば、光学部材５０は、有機層２３の紫外線による劣化を抑制するため、紫外線照射を用いることなく製造される。また、光学部材５０は、有機層２３の熱による劣化を抑制するため、１００℃以下の温度で製造される。 According to the optical member forming step S120 of this embodiment, the optical member 50 is manufactured without using ultraviolet irradiation in order to suppress deterioration of the organic layer 23 due to ultraviolet rays. The optical member 50 is manufactured at a temperature of 100 ° C. or lower in order to suppress deterioration of the organic layer 23 due to heat.
　＜第１実施形態の光学部材形成工程＞
　図１２は、第１実施形態による光学部材形成工程を示すフローチャートである。光学部材形成工程Ｓ１２０は、図１２に示すように、第１光学膜形成工程Ｓ１２１と、中間膜形成工程Ｓ１２２と、第１光学膜パターンニング工程Ｓ１２３と、第２光学膜形成工程Ｓ１２４と、保護膜形成工程Ｓ１２５と、第２光学膜パターンニング工程Ｓ１２６とをこの順で有する。以下、各工程について説明する。 <Optical member formation process of 1st Embodiment>
FIG. 12 is a flowchart showing an optical member forming process according to the first embodiment. As shown in FIG. 12, the optical member forming step S120 includes a first optical film forming step S121, an intermediate film forming step S122, a first optical film patterning step S123, a second optical film forming step S124, and protection. The film forming process S125 and the second optical film patterning process S126 are provided in this order. Hereinafter, each step will be described.
　尚、図１２に示す全ての工程が行われなくてもよい。例えば詳しくは後述するが、第１光学膜パターンニング工程Ｓ１２３や第２光学膜パターンニング工程Ｓ１２６は、光学部材５０を基板１０上に間隔をおいて複数形成する場合には有効であるが、光学部材５０を基板１０上に１つのみ形成する場合には省略してもよい。後述の一部不溶化の処理について同様である。 Note that all the steps shown in FIG. 12 need not be performed. For example, as will be described in detail later, the first optical film patterning step S123 and the second optical film patterning step S126 are effective when a plurality of optical members 50 are formed on the substrate 10 at intervals. When only one member 50 is formed on the substrate 10, it may be omitted. The same applies to the partially insolubilizing process described later.
　また、図１２に示す工程以外の工程が行われてもよい。例えば、第１光学膜形成工程Ｓ１２１の前に、基板１０に対する第１光学膜の密着性を改善するため、基板１０の第１光学膜が形成される面（より具体的には封止層３０またはタッチセンサ保護膜４７）を表面改質する工程が行われてもよい。表面改質膜として、シランカップリング剤などの有機膜、または窒化珪素などの無機膜が形成されてよい。 Further, steps other than the steps shown in FIG. 12 may be performed. For example, before the first optical film forming step S121, in order to improve the adhesion of the first optical film to the substrate 10, the surface of the substrate 10 on which the first optical film is formed (more specifically, the sealing layer 30). Alternatively, a step of modifying the surface of the touch sensor protective film 47) may be performed. As the surface modification film, an organic film such as a silane coupling agent or an inorganic film such as silicon nitride may be formed.
　＜第１実施形態の第１光学膜形成工程＞
　図１２の第１光学膜形成工程Ｓ１２１では、図１３～図１５に示すように、液晶分子と溶媒を含む第１光学膜用塗布液６１を基板１０上に塗布して乾燥することにより第１光学膜６２を形成する。第１光学膜６２は、例えば１／４波長膜である。 <First Optical Film Formation Step of First Embodiment>
In the first optical film forming step S121 of FIG. 12, as shown in FIGS. 13 to 15, a first optical film coating liquid 61 containing liquid crystal molecules and a solvent is applied onto the substrate 10 and dried to thereby form the first optical film. An optical film 62 is formed. The first optical film 62 is, for example, a quarter wavelength film.
　図１３は、第１実施形態による基板上に塗布された第１光学膜用塗布液の液膜を示す側面図である。図１４は、第１実施形態による第１光学膜用塗布液の液膜の乾燥により形成された第１光学膜を示す側面図である。図１５は、第１実施形態による一部不溶化された第１光学膜を示す側面図である。 FIG. 13 is a side view showing a liquid film of the first optical film coating liquid coated on the substrate according to the first embodiment. FIG. 14 is a side view showing the first optical film formed by drying the liquid film of the first optical film coating liquid according to the first embodiment. FIG. 15 is a side view showing the first optical film partially insolubilized according to the first embodiment.
　図１３～図１５において、図２に示す有機発光ダイオード１３や封止層３０などの図示を省略する。尚、図１６～図２４において、同様に、図２に示す有機発光ダイオード１３や封止層３０などの図示を省略する。 13 to 15, the illustration of the organic light emitting diode 13 and the sealing layer 30 shown in FIG. 2 is omitted. 16 to 24, similarly, the illustration of the organic light emitting diode 13 and the sealing layer 30 shown in FIG. 2 is omitted.
　図１３に示すように、第１光学膜形成工程Ｓ１２１では、基板１０上に塗布ノズル６０から第１光学膜用塗布液６１を塗布する。塗布ノズル６０は、例えば下面にスリット状の吐出口を有するスリットコータである。 As shown in FIG. 13, in the first optical film forming step S <b> 121, the first optical film coating liquid 61 is applied onto the substrate 10 from the coating nozzle 60. The application nozzle 60 is, for example, a slit coater having a slit-like discharge port on the lower surface.
　第１光学膜用塗布液６１は、リオトロピック液晶分子やサーモトロピック液晶分子などの液晶分子と、液晶分子を溶かす溶媒とを含む。溶媒としては、例えば水などが用いられる。尚、溶媒として、有機溶媒が用いられてもよい。 The first optical film coating solution 61 includes liquid crystal molecules such as lyotropic liquid crystal molecules and thermotropic liquid crystal molecules, and a solvent that dissolves the liquid crystal molecules. For example, water is used as the solvent. An organic solvent may be used as the solvent.
　塗布ノズル６０と基板１０とを相対的に一方向に移動させることにより、基板１０に塗布される第１光学膜用塗布液６１にせん断応力を加えることができる。せん断応力の作用方向は、塗布ノズル６０と基板１０の相対的な移動方向と一致する。せん断応力の作用方向を制御することで、液晶分子の配向方向を制御できる。 By moving the coating nozzle 60 and the substrate 10 relatively in one direction, a shear stress can be applied to the first optical film coating solution 61 applied to the substrate 10. The acting direction of the shear stress coincides with the relative movement direction of the coating nozzle 60 and the substrate 10. The orientation direction of the liquid crystal molecules can be controlled by controlling the acting direction of the shear stress.
　尚、本実施形態では第１光学膜用塗布液６１の塗布にスリットコータが用いられるが、ディップコータなどが用いられてもよい。第１光学膜用塗布液６１にせん断応力を加えることができ、そのせん断応力の作用方向を制御できればよい。 In this embodiment, a slit coater is used to apply the first optical film coating solution 61, but a dip coater or the like may be used. It is only necessary that a shear stress can be applied to the first optical film coating solution 61 and the direction of action of the shear stress can be controlled.
　図１４に示すように、第１光学膜形成工程Ｓ１２１では、基板１０上に塗布された第１光学膜用塗布液６１の液膜（図１３参照）を乾燥して、第１光学膜６２を形成する。第１光学膜用塗布液６１の液膜から溶媒が除去され、液晶分子の配向が適切に維持される。第１光学膜６２は、例えば１／４波長膜である。 As shown in FIG. 14, in the first optical film forming step S121, the liquid film (see FIG. 13) of the first optical film coating liquid 61 applied on the substrate 10 is dried to form the first optical film 62. Form. The solvent is removed from the liquid film of the first optical film coating liquid 61, and the alignment of the liquid crystal molecules is appropriately maintained. The first optical film 62 is, for example, a quarter wavelength film.
　第１光学膜用塗布液６１の液膜の乾燥には、減圧乾燥、自然乾燥、加熱乾燥、風乾燥などが用いられる。減圧乾燥は、自然乾燥よりも、処理時間を短縮できる。また、減圧乾燥は、加熱乾燥や風乾燥に比べて、液膜の対流を抑制でき、液晶分子の配向の乱れを抑制できる。減圧乾燥で溶媒が残留している場合、さらに加熱乾燥が行われてもよい。 For drying the liquid film of the first optical film coating liquid 61, vacuum drying, natural drying, heat drying, air drying, or the like is used. The drying under reduced pressure can shorten the processing time compared with the natural drying. Moreover, the reduced pressure drying can suppress the convection of the liquid film and can suppress the disorder of the alignment of the liquid crystal molecules, as compared with the heat drying and the air drying. When the solvent remains by vacuum drying, heat drying may be further performed.
　図１５に示すように、第１光学膜形成工程Ｓ１２１では、第１光学膜６２の一部６３のみを第１光学膜パターンニング工程Ｓ１２３で用いられる洗浄液に対し不溶化してもよい。この一部不溶化は、必要に応じて行われる。 As shown in FIG. 15, in the first optical film forming step S121, only a part 63 of the first optical film 62 may be insolubilized in the cleaning liquid used in the first optical film patterning step S123. This partial insolubilization is performed as necessary.
　尚、第１光学膜パターンニング工程Ｓ１２３で用いられる洗浄液としては、第１光学膜用塗布液６１の溶媒と同じものが用いられてよく、例えば水が用いられてよい。この場合、水に対する不溶化が行われる。 In addition, as the cleaning liquid used in the first optical film patterning step S123, the same solvent as the solvent of the first optical film coating liquid 61 may be used, for example, water may be used. In this case, insolubilization with water is performed.
　第１光学膜６２の一部６３を不溶化する定着液１１０は、例えばインクジェット方式の塗布ノズル１１１から吐出される。塗布ノズル１１１は、下面に定着液１１０の液滴を吐出する吐出ノズルを複数有する。 The fixing liquid 110 that insolubilizes a part 63 of the first optical film 62 is discharged from, for example, an ink jet type application nozzle 111. The application nozzle 111 has a plurality of ejection nozzles that eject droplets of the fixing liquid 110 on the lower surface.
　塗布ノズル１１１と基板１０とを相対的に移動させながら、塗布ノズル１１１から定着液１１０の液滴を吐出することで、第１光学膜６２の一部６３に定着液１１０を選択的に塗布する。これにより、第１光学膜６２の一部６３が不溶化される。 The fixing liquid 110 is selectively applied to a part 63 of the first optical film 62 by discharging droplets of the fixing liquid 110 from the application nozzle 111 while relatively moving the application nozzle 111 and the substrate 10. . Thereby, a part 63 of the first optical film 62 is insolubilized.
　定着液１１０は、例えば、第１光学膜６２の末端の官能基（例えばＯＨ基などの水溶性の官能基）を別の官能基に置換することで、第１光学膜６２の一部６３を不溶化する。また、定着液１１０は、縮合反応（例えばＯＨ基などの脱水縮合反応）によって高分子化させることで、第１光学膜６２の一部６３を不溶化してもよい。後者の場合、前者の場合に比べて、高分子化が進むため、不溶化が進みやすい。 The fixing solution 110 replaces a part 63 of the first optical film 62 by, for example, substituting the functional group at the end of the first optical film 62 (for example, a water-soluble functional group such as an OH group) with another functional group. Insolubilize. Further, the fixing solution 110 may be polymerized by a condensation reaction (for example, a dehydration condensation reaction such as an OH group) to insolubilize a part 63 of the first optical film 62. In the latter case, insolubilization is likely to proceed because of higher polymerization than in the former case.
　定着液１１０は、第１光学膜６２の一部６３を不溶化した後、除去される。定着液１１０は、水を含んでもよいし、有機溶媒を含んでもよい。 The fixing solution 110 is removed after insolubilizing a part 63 of the first optical film 62. The fixing solution 110 may contain water or an organic solvent.
　定着液１１０が塗布される領域は、例えば、ＯＬＥＤなどの画素が複数形成される領域（以下、「画素エリア」とも呼ぶ。）であってよい。 The region to which the fixing liquid 110 is applied may be, for example, a region where a plurality of pixels such as OLEDs are formed (hereinafter also referred to as “pixel area”).
　尚、本実施形態では、第１光学膜６２の一部６３のみに定着液１１０を塗布するため、インクジェット方式の塗布ノズル１１１を用いるが、本発明はこれに限定されない。例えば、第１光学膜６２の残部のみをマスクで覆い、その後、基板１０全体を定着液１１０に浸漬することで、第１光学膜６２の一部６３のみに定着液を塗布してもよい。 In this embodiment, since the fixing liquid 110 is applied only to a part 63 of the first optical film 62, the ink jet type application nozzle 111 is used. However, the present invention is not limited to this. For example, only the remaining part of the first optical film 62 may be covered with a mask, and then the entire substrate 10 may be immersed in the fixing liquid 110 to apply the fixing liquid only to a part 63 of the first optical film 62.
　＜第１実施形態の中間膜形成工程＞
　図１２の中間膜形成工程Ｓ１２２では、図１６～図１７に示すように、第１光学膜用塗布液６１とは異なる中間膜用塗布液７１を第１光学膜６２上に塗布して乾燥することにより中間膜７２を形成する。 <Intermediate Film Forming Process of First Embodiment>
In the intermediate film forming step S122 of FIG. 12, as shown in FIGS. 16 to 17, an intermediate film coating liquid 71 different from the first optical film coating liquid 61 is applied on the first optical film 62 and dried. Thus, the intermediate film 72 is formed.
　図１６は、第１実施形態による第１光学膜上に塗布された中間膜用塗布液の液膜を示す側面図である。図１７は、第１実施形態による中間膜用塗布液の液膜の乾燥により形成された中間膜を示す側面図である。 FIG. 16 is a side view showing a liquid film of the coating liquid for intermediate film applied on the first optical film according to the first embodiment. FIG. 17 is a side view showing the intermediate film formed by drying the liquid film of the intermediate film coating liquid according to the first embodiment.
　図１６に示すように、中間膜形成工程Ｓ１２２では、第１光学膜６２が形成された基板１０上に塗布ノズル７０から中間膜用塗布液７１を塗布する。塗布ノズル７０は、インクジェット方式であってよく、下面に中間膜用塗布液７１の液滴を吐出する吐出ノズルを複数有する。 As shown in FIG. 16, in the intermediate film forming step S <b> 122, the intermediate film coating liquid 71 is applied from the coating nozzle 70 onto the substrate 10 on which the first optical film 62 is formed. The coating nozzle 70 may be an ink jet method, and has a plurality of ejection nozzles that eject droplets of the coating liquid 71 for the intermediate film on the lower surface.
　塗布ノズル７０と基板１０とを相対的に移動させながら、塗布ノズル７０から中間膜用塗布液７１の液滴を吐出することで、第１光学膜６２の一部６３に中間膜用塗布液７１を選択的に塗布する。 While the coating nozzle 70 and the substrate 10 are moved relatively, droplets of the coating liquid 71 for the intermediate film are ejected from the coating nozzle 70, so that the coating liquid 71 for the intermediate film is applied to a part 63 of the first optical film 62. Is applied selectively.
　中間膜用塗布液７１は、第１光学膜６２上に塗布される。そのため、第１光学膜６２を形成する液晶分子は、中間膜用塗布液７１の溶媒に対し不溶性を有してよい。中間膜用塗布液７１の塗布によって第１光学膜６２が溶けることを防止できる。 The intermediate film coating solution 71 is coated on the first optical film 62. Therefore, the liquid crystal molecules forming the first optical film 62 may be insoluble in the solvent of the intermediate film coating liquid 71. It is possible to prevent the first optical film 62 from being melted by the application of the intermediate film coating liquid 71.
　中間膜用塗布液７１は、中間膜７２を形成する有機材料と、その有機材料を溶かす溶媒とを含む。中間膜７２を形成する有機材料は、第１光学膜パターンニング工程Ｓ１２３で用いられる洗浄液に対し不溶性の高分子などを含む。 The intermediate film coating solution 71 includes an organic material that forms the intermediate film 72 and a solvent that dissolves the organic material. The organic material forming the intermediate film 72 includes a polymer insoluble in the cleaning liquid used in the first optical film patterning step S123.
　中間膜用塗布液７１としては、例えば、熱硬化型の透明塗料、化学反応型の透明塗料、乾燥硬化型の透明塗料などが用いられる。具体的には、油性エナメル塗料、フタル酸樹脂塗料などが用いられる。 As the intermediate film coating liquid 71, for example, a thermosetting transparent paint, a chemical reaction type transparent paint, a dry curing type transparent paint, or the like is used. Specifically, oil-based enamel paint, phthalate resin paint, or the like is used.
　熱硬化型の透明塗料、化学反応型の透明塗料、乾燥硬化型の透明塗料などは、熱硬化や化学反応または乾燥硬化によって高分子化されるため、緻密な中間膜７２を形成できる。よって、中間膜７２の第１光学膜パターンニング工程Ｓ１２３で用いられる洗浄液に対する不溶性を向上できる。 A thermosetting transparent paint, a chemical reaction type transparent paint, a dry curing type transparent paint, and the like are polymerized by thermal curing, chemical reaction, or dry curing, and thus a dense intermediate film 72 can be formed. Therefore, the insolubility of the intermediate film 72 with respect to the cleaning liquid used in the first optical film patterning step S123 can be improved.
　中間膜用塗布液７１は、定着液１１０と同様の機能を有してもよい。第１光学膜６２の一部不溶化を促進できる。尚、中間膜用塗布液７１によって第１光学膜６２の一部不溶化を行う場合、上記第１光学膜形成工程Ｓ１２１で第１光学膜６２の一部不溶化を行わなくてもよい。 The intermediate film coating liquid 71 may have the same function as the fixing liquid 110. Partial insolubilization of the first optical film 62 can be promoted. In the case where the first optical film 62 is partially insolubilized by the intermediate film coating solution 71, the first optical film 62 may not be partially insolubilized in the first optical film forming step S121.
　例えば、中間膜用塗布液７１は、第１光学膜６２の末端の官能基（例えばＯＨ基などの水溶性の官能基）を別の官能基に置換することで、第１光学膜６２の一部６３を不溶化してもよい。また、中間膜用塗布液７１は、縮合反応（例えばＯＨ基などの脱水縮合反応）によって高分子化させることで、第１光学膜６２の一部６３を不溶化してもよい。後者の場合、前者の場合に比べて、高分子化が進むため、不溶化が進みやすい。 For example, the coating liquid 71 for the intermediate film replaces a functional group at the end of the first optical film 62 (for example, a water-soluble functional group such as an OH group) with another functional group, thereby The part 63 may be insolubilized. In addition, the intermediate film coating liquid 71 may be insolubilized by partly insolubilizing 63 of the first optical film 62 by polymerizing by a condensation reaction (for example, a dehydration condensation reaction such as OH group). In the latter case, insolubilization is likely to proceed because of higher polymerization than in the former case.
　中間膜用塗布液７１が塗布される領域は、定着液１１０が塗布される領域と一致してよい。例えば、中間膜用塗布液７１が塗布される領域は、基板１０上の画素エリアであってよい。 The area where the intermediate film coating liquid 71 is applied may coincide with the area where the fixing liquid 110 is applied. For example, the region to which the intermediate film coating liquid 71 is applied may be a pixel area on the substrate 10.
　図１７に示すように、中間膜形成工程Ｓ１２２では、基板１０上に塗布された中間膜用塗布液７１の液膜（図１６参照）を乾燥して、中間膜７２を形成する。中間膜用塗布液７１の液膜から溶媒が除去され、中間膜７２が形成される。 17, in the intermediate film forming step S122, the liquid film (see FIG. 16) of the intermediate film coating liquid 71 applied on the substrate 10 is dried to form the intermediate film 72. The solvent is removed from the liquid film of the intermediate film coating liquid 71 to form the intermediate film 72.
　中間膜用塗布液７１の液膜の乾燥には、減圧乾燥、自然乾燥、加熱乾燥、風乾燥などが用いられる。減圧乾燥は、自然乾燥よりも、処理時間を短縮できる。減圧乾燥で溶媒が残留している場合、さらに加熱乾燥が行われてもよい。 For drying the liquid film of the intermediate film coating liquid 71, vacuum drying, natural drying, heat drying, wind drying, or the like is used. The drying under reduced pressure can shorten the processing time compared with the natural drying. When the solvent remains by vacuum drying, heat drying may be further performed.
　中間膜７２は、第１光学膜パターンニング工程Ｓ１２３で用いられる洗浄液に対し不溶性を有する。中間膜７２は、第１光学膜６２とは異なり、等方的な光学特性を有する。中間膜７２の可視光透過率は９５％以上であることが好ましい。また、中間膜７２の膜厚は、１０μｍ以下であることが好ましい。また、中間膜７２の残留応力は、光学部材の変形を抑制するため、小さいほど好ましい。 The intermediate film 72 is insoluble in the cleaning liquid used in the first optical film patterning step S123. Unlike the first optical film 62, the intermediate film 72 has isotropic optical characteristics. The visible light transmittance of the intermediate film 72 is preferably 95% or more. The film thickness of the intermediate film 72 is preferably 10 μm or less. Further, the residual stress of the intermediate film 72 is preferably as small as possible in order to suppress deformation of the optical member.
　中間膜７２は、第１光学膜６２の一部６３の主表面を覆う。中間膜７２は、第１光学膜６２の一部６３に傷や異物などが付かないように、第１光学膜６２の一部６３を保護する役割も果たす。中間膜７２の鉛筆硬度は、２Ｈ以上であることが好ましい。光学部材の製造が途中で一時的に中断され、再開までに時間がかかる場合、傷や異物が付くリスクが高いため、特に有効である。 The intermediate film 72 covers the main surface of a part 63 of the first optical film 62. The intermediate film 72 also serves to protect the part 63 of the first optical film 62 so that the part 63 of the first optical film 62 is not scratched or foreign. The pencil hardness of the intermediate film 72 is preferably 2H or more. This is particularly effective when the production of the optical member is temporarily interrupted and it takes a long time to resume since there is a high risk of scratches and foreign matter.
　尚、第１光学膜６２の残部は、第１光学膜パターンニング工程Ｓ１２３で除去されるため、傷や異物が付くことは問題にならない。また、中間膜７２に付いた異物は洗浄で除去でき、その洗浄によって第１光学膜６２の一部６３が傷つくことは無い。 In addition, since the remainder of the 1st optical film 62 is removed by 1st optical film patterning process S123, it does not become a problem that a damage | wound and a foreign material attach. Further, the foreign matter attached to the intermediate film 72 can be removed by cleaning, and the cleaning does not damage the part 63 of the first optical film 62.
　＜第１実施形態の第１光学膜パターンニング工程＞
　図１２の第１光学膜パターンニング工程Ｓ１２３では、中間膜形成工程Ｓ１２２の後、第２光学膜形成工程Ｓ１２４の前に、第１光学膜６２の一部６３（図１７参照）のみを覆う中間膜７２をマスクとして用いて、図１８に示すように第１光学膜６２の残部を除去する。 <First Optical Film Patterning Step of First Embodiment>
In the first optical film patterning step S123 of FIG. 12, after the intermediate film forming step S122 and before the second optical film forming step S124, an intermediate covering only a part 63 (see FIG. 17) of the first optical film 62. Using the film 72 as a mask, the remaining portion of the first optical film 62 is removed as shown in FIG.
　図１８は、第１実施形態による中間膜で覆われていない部分が除去された第１光学膜を示す側面図である。第１光学膜パターンニング工程Ｓ１２３の間、第１光学膜６２の一部６３を中間膜７２で保護でき、第１光学膜６２の一部６３の形状崩れを抑制できる。よって、光学部材の品質を向上できる。 FIG. 18 is a side view showing the first optical film from which a portion not covered with the intermediate film according to the first embodiment is removed. During the first optical film patterning step S123, the part 63 of the first optical film 62 can be protected by the intermediate film 72, and the shape collapse of the part 63 of the first optical film 62 can be suppressed. Therefore, the quality of the optical member can be improved.
　例えば、第１光学膜パターンニング工程Ｓ１２３では、第１光学膜６２を溶かす洗浄液を用いる。洗浄液は、例えばスピンチャックで基板１０を回転させながら、基板１０に供給される。基板１０に供給された洗浄液は、遠心力によって基板１０の全体に広がり、基板１０の外周縁から振り切られる。 For example, in the first optical film patterning step S123, a cleaning solution that dissolves the first optical film 62 is used. The cleaning liquid is supplied to the substrate 10 while rotating the substrate 10 with, for example, a spin chuck. The cleaning liquid supplied to the substrate 10 spreads over the entire substrate 10 by centrifugal force and is shaken off from the outer peripheral edge of the substrate 10.
　第１光学膜６２の一部６３は、中間膜７２で覆われているため、洗浄液と接触することがなく、洗浄液によって型崩れしない。一方、第１光学膜６２の残部は、洗浄液と接触するため、洗浄液で溶かされ、除去される。 Since a part 63 of the first optical film 62 is covered with the intermediate film 72, it does not come into contact with the cleaning liquid and is not deformed by the cleaning liquid. On the other hand, the remaining portion of the first optical film 62 comes into contact with the cleaning liquid and is dissolved and removed by the cleaning liquid.
　尚、洗浄液は洗浄槽に貯えられ、洗浄槽の洗浄液に基板１０を浸漬することで、第１光学膜６２の一部６３を残しつつ、第１光学膜６２の残部を溶かして除去してもよい。洗浄槽の洗浄液は、撹拌翼などで撹拌されてもよい。 The cleaning liquid is stored in the cleaning tank, and the substrate 10 is immersed in the cleaning liquid in the cleaning tank so that the remaining portion of the first optical film 62 can be dissolved and removed while leaving a part 63 of the first optical film 62. Good. The cleaning liquid in the cleaning tank may be stirred with a stirring blade or the like.
　第１光学膜６２の一部６３が確実に残るように、上記第１光学膜形成工程Ｓ１２１や上記中間膜形成工程Ｓ１２２において、第１光学膜６２の一部６３を洗浄液に対し不溶化することは有効である。洗浄液の回り込みによる過剰な除去を防止でき、第１光学膜６２の一部６３を確実に残すことができる。 In order to ensure that the part 63 of the first optical film 62 remains, the part 63 of the first optical film 62 is insolubilized in the cleaning liquid in the first optical film forming step S121 and the intermediate film forming step S122. It is valid. Excessive removal due to the wraparound of the cleaning liquid can be prevented, and a part 63 of the first optical film 62 can be reliably left.
　尚、中間膜７２は洗浄液に対する不溶性を有するため、上記第１光学膜形成工程Ｓ１２１や上記中間膜形成工程Ｓ１２２において、第１光学膜６２の一部不溶化を行わなくても、第１光学膜６２のパターンニングは可能である。この場合、工程数を削減できる。 Since the intermediate film 72 is insoluble in the cleaning liquid, the first optical film 62 can be obtained without partially insolubilizing the first optical film 62 in the first optical film forming step S121 and the intermediate film forming step S122. Patterning is possible. In this case, the number of processes can be reduced.
　上記第１光学膜形成工程Ｓ１２１では、せん断応力を加えながら第１光学膜用塗布液６１を塗布するため、画素エリアのみに第１光学膜用塗布液６１を塗布するのは困難である。従って、第１光学膜パターンニング工程Ｓ１２３を行うことは有効である。 In the first optical film forming step S121, since the first optical film coating liquid 61 is applied while applying a shear stress, it is difficult to apply the first optical film coating liquid 61 only to the pixel area. Therefore, it is effective to perform the first optical film patterning step S123.
　尚、本実施形態では洗浄液を用いて第１光学膜６２の残部を除去するが、第１光学膜６２の残部の除去方法は特に限定されない。例えば、エッチング法が用いられてもよい。エッチングは、ウェットエッチング、ドライエッチングのいずれでもよい。 In the present embodiment, the remaining portion of the first optical film 62 is removed using a cleaning liquid, but the method for removing the remaining portion of the first optical film 62 is not particularly limited. For example, an etching method may be used. Etching may be either wet etching or dry etching.
　以下、第１光学膜パターンニング工程Ｓ１２３で残る第１光学膜６２の一部６３を、「第１光学膜６３」とも称する。 Hereinafter, the part 63 of the first optical film 62 remaining in the first optical film patterning step S123 is also referred to as “first optical film 63”.
　＜第１実施形態の第２光学膜形成工程＞
　図１２の第２光学膜形成工程Ｓ１２４では、図１９～図２１に示すように、液晶分子と溶媒を含む第２光学膜用塗布液８１を中間膜７２上に塗布して乾燥することにより第２光学膜８２を形成する。第２光学膜８２は、例えば直線偏光膜である。 <Second Optical Film Forming Process of First Embodiment>
In the second optical film forming step S124 of FIG. 12, as shown in FIGS. 19 to 21, a second optical film coating liquid 81 containing liquid crystal molecules and a solvent is applied on the intermediate film 72 and dried. Two optical films 82 are formed. The second optical film 82 is, for example, a linearly polarizing film.
　図１９～図２１は、第１実施形態による第２光学膜形成工程の説明側面図である。図１９は、第１実施形態による中間膜上に塗布された第２光学膜用塗布液の液膜を示す側面図である。図２０は、第１実施形態による第２光学膜用塗布液の液膜の乾燥により形成された第２光学膜を示す側面図である。図２１は、第１実施形態による一部不溶化された第２光学膜を示す側面図である。 19 to 21 are explanatory side views of the second optical film forming step according to the first embodiment. FIG. 19 is a side view showing a liquid film of the second optical film coating liquid coated on the intermediate film according to the first embodiment. FIG. 20 is a side view showing the second optical film formed by drying the liquid film of the second optical film coating liquid according to the first embodiment. FIG. 21 is a side view showing the second optical film partially insolubilized according to the first embodiment.
　図１９に示すように、第２光学膜形成工程Ｓ１２４では、基板１０上に塗布ノズル８０から第２光学膜用塗布液８１を塗布する。塗布ノズル８０は、例えば下面にスリット状の吐出口を有するスリットコータである。 As shown in FIG. 19, in the second optical film forming step S <b> 124, a second optical film coating liquid 81 is applied onto the substrate 10 from the coating nozzle 80. The application nozzle 80 is, for example, a slit coater having a slit-like discharge port on the lower surface.
　第２光学膜用塗布液８１は、中間膜７２上に塗布される。そのため、中間膜７２を形成する有機材料は、第２光学膜用塗布液８１の溶媒に対し不溶性を有してよい。第２光学膜用塗布液８１の塗布によって中間膜７２が溶けることを防止できる。 The second optical film coating solution 81 is applied onto the intermediate film 72. Therefore, the organic material forming the intermediate film 72 may be insoluble in the solvent of the second optical film coating liquid 81. It is possible to prevent the intermediate film 72 from being melted by the application of the second optical film coating liquid 81.
　第２光学膜用塗布液８１は、リオトロピック液晶分子やサーモトロピック液晶分子などの液晶分子と、液晶分子を溶かす溶媒とを含む。溶媒としては、例えば水などが用いられる。尚、溶媒として、有機溶媒が用いられてもよい。 The coating solution 81 for the second optical film contains liquid crystal molecules such as lyotropic liquid crystal molecules and thermotropic liquid crystal molecules, and a solvent that dissolves the liquid crystal molecules. For example, water is used as the solvent. An organic solvent may be used as the solvent.
　塗布ノズル８０と基板１０とを相対的に一方向に移動させることにより、基板１０に塗布される第２光学膜用塗布液８１にせん断応力を加えることができる。せん断応力の作用方向は、塗布ノズル８０と基板１０の相対的な移動方向と一致する。せん断応力の作用方向を制御することで、液晶分子の配向方向を制御できる。 By moving the coating nozzle 80 and the substrate 10 relatively in one direction, a shear stress can be applied to the second optical film coating solution 81 applied to the substrate 10. The acting direction of the shear stress coincides with the relative movement direction of the coating nozzle 80 and the substrate 10. The orientation direction of the liquid crystal molecules can be controlled by controlling the acting direction of the shear stress.
　第２光学膜形成工程Ｓ１２４でのせん断応力の作用方向は、第１光学膜形成工程Ｓ１２１でのせん断応力の作用方向に対し斜め４５°で交わる方向とされる。これにより、１／４波長膜と直線偏光膜は、その偏光軸が４５度で交差するように形成される。 The acting direction of the shear stress in the second optical film forming step S124 is a direction intersecting at an oblique angle of 45 ° with respect to the acting direction of the shear stress in the first optical film forming step S121. Thereby, the quarter wavelength film and the linearly polarizing film are formed so that their polarization axes intersect at 45 degrees.
　尚、本実施形態では第２光学膜用塗布液８１の塗布にスリットコータが用いられるが、ディップコータなどが用いられてもよい。第２光学膜用塗布液８１にせん断応力を加えることができ、そのせん断応力の作用方向を制御できればよい。 In this embodiment, a slit coater is used to apply the second optical film coating solution 81, but a dip coater or the like may be used. It is only necessary that a shear stress can be applied to the second optical film coating solution 81 and the direction of action of the shear stress can be controlled.
　図２０に示すように、第２光学膜形成工程Ｓ１２４では、基板１０上に塗布された第２光学膜用塗布液８１の液膜（図１９参照）を乾燥して、第２光学膜８２を形成する。第２光学膜用塗布液８１の液膜から溶媒が除去され、液晶分子の配向が適切に維持される。第２光学膜８２は、例えば直線偏光膜である。 As shown in FIG. 20, in the second optical film forming step S124, the liquid film (see FIG. 19) of the second optical film coating liquid 81 applied on the substrate 10 is dried to form the second optical film 82. Form. The solvent is removed from the liquid film of the second optical film coating liquid 81, and the alignment of the liquid crystal molecules is appropriately maintained. The second optical film 82 is, for example, a linearly polarizing film.
　第２光学膜用塗布液８１の液膜の乾燥には、減圧乾燥、自然乾燥、加熱乾燥、風乾燥などが用いられる。減圧乾燥は、自然乾燥よりも、処理時間を短縮できる。また、減圧乾燥は、加熱乾燥や風乾燥に比べて、液膜の対流を抑制でき、液晶分子の配向の乱れを抑制できる。減圧乾燥で溶媒が残留している場合、さらに加熱乾燥が行われてもよい。 For drying the liquid film of the second optical film coating liquid 81, vacuum drying, natural drying, heat drying, wind drying, or the like is used. The drying under reduced pressure can shorten the processing time compared with the natural drying. Moreover, the reduced pressure drying can suppress the convection of the liquid film and can suppress the disorder of the alignment of the liquid crystal molecules, as compared with the heat drying and the air drying. When the solvent remains by vacuum drying, heat drying may be further performed.
　図２１に示すように、第２光学膜形成工程Ｓ１２４では、第２光学膜８２の一部８３のみを第２光学膜パターンニング工程Ｓ１２６で用いられる洗浄液に対し不溶化してもよい。この一部不溶化は、必要に応じて行われる。 As shown in FIG. 21, in the second optical film forming step S124, only a part 83 of the second optical film 82 may be insolubilized in the cleaning liquid used in the second optical film patterning step S126. This partial insolubilization is performed as necessary.
　尚、第２光学膜パターンニング工程Ｓ１２６で用いられる洗浄液としては、第２光学膜用塗布液８１の溶媒と同じものが用いられてよく、例えば水が用いられてよい。この場合、水に対する不溶化が行われる。 As the cleaning liquid used in the second optical film patterning step S126, the same solvent as the solvent of the second optical film coating liquid 81 may be used, for example, water may be used. In this case, insolubilization with water is performed.
　第２光学膜８２の一部８３を不溶化する定着液１２０は、例えばインクジェット方式の塗布ノズル１２１から吐出される。塗布ノズル１２１は、下面に定着液１２０の液滴を吐出する吐出ノズルを複数有する。 The fixing liquid 120 that insolubilizes the part 83 of the second optical film 82 is discharged from, for example, an ink jet type application nozzle 121. The coating nozzle 121 has a plurality of ejection nozzles that eject droplets of the fixing liquid 120 on the lower surface.
　塗布ノズル１２１と基板１０とを相対的に移動させながら、塗布ノズル１２１から定着液１２０の液滴を吐出することで、第２光学膜８２の一部８３に定着液１２０を選択的に塗布する。これにより、第２光学膜８２の一部８３が不溶化される。 The fixing liquid 120 is selectively applied to a part 83 of the second optical film 82 by discharging droplets of the fixing liquid 120 from the application nozzle 121 while relatively moving the application nozzle 121 and the substrate 10. . Thereby, a part 83 of the second optical film 82 is insolubilized.
　定着液１２０は、例えば、第２光学膜８２の末端の官能基（例えばＯＨ基などの水溶性の官能基）を別の官能基に置換することで、第２光学膜８２の一部８３を不溶化する。また、定着液１２０は、縮合反応（例えばＯＨ基などの脱水縮合反応）によって高分子化させることで、第２光学膜８２の一部８３を不溶化してもよい。後者の場合、前者の場合に比べて、高分子化が進むため、不溶化が進みやすい。 For example, the fixing solution 120 replaces the functional group at the end of the second optical film 82 (for example, a water-soluble functional group such as an OH group) with another functional group, so that a part 83 of the second optical film 82 is replaced. Insolubilize. Further, the fixing solution 120 may be polymerized by a condensation reaction (for example, a dehydration condensation reaction such as an OH group) to insolubilize a part 83 of the second optical film 82. In the latter case, insolubilization is likely to proceed because of higher polymerization than in the former case.
　定着液１２０は、第２光学膜８２の一部８３を不溶化した後、除去される。定着液１２０は、水を含んでもよいし、有機溶媒を含んでもよい。 The fixing solution 120 is removed after insolubilizing the part 83 of the second optical film 82. The fixing solution 120 may contain water or an organic solvent.
　定着液１２０が塗布される領域は、例えば画素エリアであってよい。 The area where the fixing liquid 120 is applied may be, for example, a pixel area.
　尚、本実施形態では、第２光学膜８２の一部８３のみに定着液１２０を塗布するため、インクジェット方式の塗布ノズル１２１を用いるが、本発明はこれに限定されない。例えば、第２光学膜８２の残部のみをマスクで覆い、その後、基板１０全体を定着液１２０に浸漬することで、第２光学膜８２の一部８３のみに定着液を塗布してもよい。 In this embodiment, since the fixing liquid 120 is applied only to a part 83 of the second optical film 82, the ink jet type application nozzle 121 is used, but the present invention is not limited to this. For example, only the remaining part of the second optical film 82 may be covered with a mask, and then the entire substrate 10 may be immersed in the fixing liquid 120 to apply the fixing liquid only to a part 83 of the second optical film 82.
　＜第１実施形態の保護膜形成工程＞
　図１２の保護膜形成工程Ｓ１２５では、図２２～図２３に示すように、第２光学膜用塗布液８１とは異なる保護膜用塗布液９１を第２光学膜８２上に塗布して乾燥することにより保護膜９２を形成する。 <Protective film formation process of 1st Embodiment>
In the protective film forming step S125 of FIG. 12, as shown in FIGS. 22 to 23, a protective film coating liquid 91 different from the second optical film coating liquid 81 is applied onto the second optical film 82 and dried. Thereby, the protective film 92 is formed.
　図２２は、第１実施形態による第２光学膜上に塗布された保護膜用塗布液の液膜を示す側面図である。図２３は、第１実施形態による保護膜用塗布液の液膜の乾燥により形成された保護膜を示す側面図である。 FIG. 22 is a side view showing a liquid film of the coating liquid for the protective film applied on the second optical film according to the first embodiment. FIG. 23 is a side view showing the protective film formed by drying the liquid film of the protective film coating liquid according to the first embodiment.
　図２２に示すように、保護膜形成工程Ｓ１２５では、第２光学膜８２が形成された基板１０上に塗布ノズル９０から保護膜用塗布液９１を塗布する。塗布ノズル９０は、インクジェット方式であってよく、下面に保護膜用塗布液９１の液滴を吐出する吐出ノズルを複数有する。 As shown in FIG. 22, in the protective film forming step S125, the protective film coating liquid 91 is applied from the coating nozzle 90 onto the substrate 10 on which the second optical film 82 is formed. The coating nozzle 90 may be an ink jet system, and has a plurality of ejection nozzles that eject droplets of the protective film coating liquid 91 on the lower surface.
　塗布ノズル９０と基板１０とを相対的に移動させながら、塗布ノズル９０から保護膜用塗布液９１の液滴を吐出することで、第２光学膜８２の一部８３に保護膜用塗布液９１を選択的に塗布する。 While the coating nozzle 90 and the substrate 10 are moved relatively, droplets of the coating liquid 91 for the protective film are ejected from the coating nozzle 90, so that the coating liquid 91 for the protective film is applied to a part 83 of the second optical film 82. Is applied selectively.
　保護膜用塗布液９１は、第２光学膜８２上に塗布される。そのため、第２光学膜８２を形成する液晶分子は、保護膜用塗布液９１の溶媒に対し不溶性を有してよい。保護膜用塗布液９１の塗布によって第２光学膜８２が溶けることを防止できる。 The protective film coating liquid 91 is applied onto the second optical film 82. Therefore, the liquid crystal molecules forming the second optical film 82 may be insoluble in the solvent of the protective film coating liquid 91. It is possible to prevent the second optical film 82 from being melted by the application of the protective film coating liquid 91.
　保護膜用塗布液９１は、保護膜９２を形成する有機材料と、その有機材料を溶かす溶媒とを含む。保護膜９２を形成する有機材料は、第２光学膜パターンニング工程Ｓ１２６で用いられる洗浄液に対し不溶性の高分子などを含む。 The protective film coating solution 91 includes an organic material that forms the protective film 92 and a solvent that dissolves the organic material. The organic material forming the protective film 92 includes a polymer that is insoluble in the cleaning liquid used in the second optical film patterning step S126.
　保護膜用塗布液９１としては、例えば、熱硬化型の透明塗料、化学反応型の透明塗料、乾燥硬化型の透明塗料などが用いられる。具体的には、油性エナメル塗料、フタル酸樹脂塗料などが用いられる。 As the protective film coating liquid 91, for example, a thermosetting transparent paint, a chemical reaction type transparent paint, a dry curing type transparent paint, or the like is used. Specifically, oil-based enamel paint, phthalate resin paint, or the like is used.
　熱硬化型の透明塗料、化学反応型の透明塗料、乾燥硬化型の透明塗料などは、熱硬化や化学反応または乾燥硬化によって高分子化されるため、緻密な保護膜９２を形成できる。よって、保護膜９２の第２光学膜パターンニング工程Ｓ１２６で用いられる洗浄液に対する不溶性を向上できる。 A thermosetting transparent coating, a chemical reaction type transparent coating, a dry curing type transparent coating, and the like are polymerized by thermal curing, chemical reaction, or drying curing, so that a dense protective film 92 can be formed. Therefore, the insolubility of the protective film 92 in the cleaning liquid used in the second optical film patterning step S126 can be improved.
　保護膜用塗布液９１は、定着液１２０と同様の機能を有してもよい。第２光学膜８２の一部不溶化を促進できる。尚、保護膜用塗布液９１によって第２光学膜８２の一部不溶化を行う場合、上記第２光学膜形成工程Ｓ１２４で第２光学膜８２の一部不溶化を行わなくてもよい。 The protective film coating liquid 91 may have the same function as the fixing liquid 120. Partial insolubilization of the second optical film 82 can be promoted. When the second optical film 82 is partially insolubilized by the protective film coating solution 91, the second optical film 82 may not be partially insolubilized in the second optical film forming step S124.
　例えば、保護膜用塗布液９１は、第２光学膜８２の末端の官能基（例えばＯＨ基などの水溶性の官能基）を別の官能基に置換することで、第２光学膜８２の一部８３を不溶化してもよい。また、保護膜用塗布液９１は、縮合反応（例えばＯＨ基などの脱水縮合反応）によって高分子化させることで、第２光学膜８２の一部８３を不溶化してもよい。後者の場合、前者の場合に比べて、高分子化が進むため、不溶化が進みやすい。 For example, the coating liquid 91 for the protective film replaces the functional group at the end of the second optical film 82 (for example, a water-soluble functional group such as an OH group) with another functional group, thereby The part 83 may be insolubilized. The protective film coating solution 91 may be polymerized by a condensation reaction (for example, a dehydration condensation reaction such as an OH group) to insolubilize a part 83 of the second optical film 82. In the latter case, insolubilization is likely to proceed because of higher polymerization than in the former case.
　保護膜用塗布液９１が塗布される領域は、定着液１２０が塗布される領域と一致してよい。例えば、保護膜用塗布液９１が塗布される領域は、基板１０上の画素エリアであってよい。 The area where the protective film coating liquid 91 is applied may coincide with the area where the fixing liquid 120 is applied. For example, the region where the protective film coating liquid 91 is applied may be a pixel area on the substrate 10.
　図２３に示すように、保護膜形成工程Ｓ１２５では、基板１０上に塗布された保護膜用塗布液９１の液膜（図２２参照）を乾燥して、保護膜９２を形成する。保護膜用塗布液９１の液膜から溶媒が除去され、保護膜９２が形成される。 As shown in FIG. 23, in the protective film forming step S125, the liquid film (see FIG. 22) of the protective film coating liquid 91 applied on the substrate 10 is dried to form the protective film 92. The solvent is removed from the liquid film of the protective film coating liquid 91 to form a protective film 92.
　保護膜用塗布液９１の液膜の乾燥には、減圧乾燥、自然乾燥、加熱乾燥、風乾燥などが用いられる。減圧乾燥は、自然乾燥よりも、処理時間を短縮できる。減圧乾燥で溶媒が残留している場合、さらに加熱乾燥が行われてもよい。 For drying the liquid film of the protective film coating liquid 91, vacuum drying, natural drying, heat drying, wind drying, or the like is used. The drying under reduced pressure can shorten the processing time compared with the natural drying. When the solvent remains by vacuum drying, heat drying may be further performed.
　保護膜９２は、第２光学膜パターンニング工程Ｓ１２６で用いられる洗浄液に対し不溶性を有する。保護膜９２は、第２光学膜８２とは異なり、等方的な光学特性を有する。保護膜９２の可視光透過率は９５％以上であることが好ましい。また、保護膜９２の膜厚は、１０μｍ以下であることが好ましい。また、保護膜９２の残留応力は、光学部材の変形を抑制するため、小さいほど好ましい。 The protective film 92 is insoluble in the cleaning liquid used in the second optical film patterning step S126. Unlike the second optical film 82, the protective film 92 has isotropic optical characteristics. The visible light transmittance of the protective film 92 is preferably 95% or more. The film thickness of the protective film 92 is preferably 10 μm or less. Further, the residual stress of the protective film 92 is preferably as small as possible in order to suppress deformation of the optical member.
　保護膜９２は、第２光学膜８２の一部８３の主表面を覆う。保護膜９２は、第２光学膜８２の一部８３に傷や異物などが付かないように、第２光学膜８２の一部８３を保護する役割も果たす。中間膜７２の鉛筆硬度は、２Ｈ以上であることが好ましい。 The protective film 92 covers the main surface of a part 83 of the second optical film 82. The protective film 92 also serves to protect the part 83 of the second optical film 82 so that the part 83 of the second optical film 82 is not damaged or foreign matter. The pencil hardness of the intermediate film 72 is preferably 2H or more.
　尚、第２光学膜８２の残部は、第２光学膜パターンニング工程Ｓ１２６で除去されるため、傷や異物が付くことは問題にならない。また、保護膜９２に付いた異物は洗浄で除去でき、その洗浄によって第２光学膜８２の一部８３が傷つくことは無い。 In addition, since the remainder of the second optical film 82 is removed in the second optical film patterning step S126, it is not a problem that scratches or foreign matters are attached. In addition, the foreign matter attached to the protective film 92 can be removed by cleaning, and the cleaning does not damage the portion 83 of the second optical film 82.
　尚、本実施形態の保護膜９２は、保護膜用塗布液９１を第２光学膜８２上に塗布して乾燥することにより形成するが、フィルムの形態で第２光学膜８２に貼り付けられてもよい。 The protective film 92 of the present embodiment is formed by applying the protective film coating liquid 91 on the second optical film 82 and drying it. The protective film 92 is attached to the second optical film 82 in the form of a film. Also good.
　＜第１実施形態の第２光学膜パターンニング工程＞
　図１２の第２光学膜パターンニング工程Ｓ１２６では、保護膜形成工程Ｓ１２５の後に、第２光学膜８２の一部８３のみを覆う保護膜９２（図２３参照）をマスクとして用いて、図２４に示すように第２光学膜８２の残部を除去する。 <Second Optical Film Patterning Step of First Embodiment>
In the second optical film patterning step S126 of FIG. 12, after the protective film forming step S125, the protective film 92 (see FIG. 23) covering only a part 83 of the second optical film 82 is used as a mask in FIG. As shown, the remaining portion of the second optical film 82 is removed.
　図２４は、第１実施形態による保護膜で覆われていない部分が除去された第２光学膜を示す側面図である。第２光学膜パターンニング工程Ｓ１２６の間、第２光学膜８２の一部８３を保護膜９２で保護でき、第２光学膜８２の一部８３の形状崩れを抑制できる。よって、光学部材の品質を向上できる。 FIG. 24 is a side view showing the second optical film from which a portion not covered with the protective film according to the first embodiment is removed. During the second optical film patterning step S126, the part 83 of the second optical film 82 can be protected by the protective film 92, and the shape collapse of the part 83 of the second optical film 82 can be suppressed. Therefore, the quality of the optical member can be improved.
　例えば、第２光学膜パターンニング工程Ｓ１２６では、第２光学膜８２を溶かす洗浄液を用いる。洗浄液は、例えばスピンチャックで基板１０を回転させながら、基板１０に供給される。基板１０に供給された洗浄液は、遠心力によって基板１０の全体に広がり、基板１０の外周縁から振り切られる。 For example, in the second optical film patterning step S126, a cleaning solution that dissolves the second optical film 82 is used. The cleaning liquid is supplied to the substrate 10 while rotating the substrate 10 with, for example, a spin chuck. The cleaning liquid supplied to the substrate 10 spreads over the entire substrate 10 by centrifugal force and is shaken off from the outer peripheral edge of the substrate 10.
　第２光学膜８２の一部８３は、保護膜９２で覆われているため、洗浄液と接触することがなく、洗浄液によって型崩れしない。一方、第２光学膜８２の残部は、洗浄液と接触するため、洗浄液で溶かされ、除去される。 Since part 83 of the second optical film 82 is covered with the protective film 92, it does not come into contact with the cleaning liquid and does not lose its shape due to the cleaning liquid. On the other hand, since the remaining part of the second optical film 82 is in contact with the cleaning liquid, it is dissolved and removed by the cleaning liquid.
　尚、洗浄液は洗浄槽に貯えられ、洗浄槽の洗浄液に基板１０を浸漬することで、第２光学膜８２の一部８３を残しつつ、第２光学膜８２の残部を溶かして除去してもよい。洗浄槽の洗浄液は、撹拌翼などで撹拌されてもよい。 The cleaning liquid is stored in the cleaning tank, and the substrate 10 is immersed in the cleaning liquid in the cleaning tank so that the remaining portion of the second optical film 82 can be dissolved and removed while leaving the portion 83 of the second optical film 82. Good. The cleaning liquid in the cleaning tank may be stirred with a stirring blade or the like.
　第２光学膜８２の一部８３が確実に残るように、上記第２光学膜形成工程Ｓ１２４や上記保護膜形成工程Ｓ１２５において、第２光学膜８２の一部８３を洗浄液に対し不溶化することは有効である。洗浄液の回り込みによる過剰な除去を防止でき、第２光学膜８２の一部８３を確実に残すことができる。 In order to ensure that the part 83 of the second optical film 82 remains, the part 83 of the second optical film 82 is insolubilized in the cleaning liquid in the second optical film forming step S124 and the protective film forming step S125. It is valid. Excessive removal due to the wraparound of the cleaning liquid can be prevented, and the part 83 of the second optical film 82 can be reliably left.
　尚、保護膜９２は洗浄液に対する不溶性を有するため、上記第２光学膜形成工程Ｓ１２４や上記保護膜形成工程Ｓ１２５において、第２光学膜８２の一部不溶化を行わなくても、第２光学膜８２のパターンニングは可能である。この場合、工程数を削減できる。 Since the protective film 92 is insoluble in the cleaning liquid, the second optical film 82 can be obtained without partially insolubilizing the second optical film 82 in the second optical film forming step S124 or the protective film forming step S125. Patterning is possible. In this case, the number of processes can be reduced.
　上記第２光学膜形成工程Ｓ１２４では、せん断応力を加えながら第２光学膜用塗布液８１を塗布するため、画素エリアのみに第２光学膜用塗布液８１を塗布するのは困難である。従って、第２光学膜パターンニング工程Ｓ１２６を行うことは有効である。 In the second optical film forming step S124, since the second optical film coating liquid 81 is applied while applying a shear stress, it is difficult to apply the second optical film coating liquid 81 only to the pixel area. Therefore, it is effective to perform the second optical film patterning step S126.
　尚、本実施形態では洗浄液を用いて第２光学膜８２の残部を除去するが、第２光学膜８２の残部の除去方法は特に限定されない。例えば、エッチング法が用いられてもよい。エッチングは、ウェットエッチング、ドライエッチングのいずれでもよい。 In the present embodiment, the remaining portion of the second optical film 82 is removed using a cleaning liquid, but the method for removing the remaining portion of the second optical film 82 is not particularly limited. For example, an etching method may be used. Etching may be either wet etching or dry etching.
　以下、第２光学膜パターンニング工程Ｓ１２６で残る第２光学膜８２の一部８３を、「第２光学膜８３」とも称する。 Hereinafter, the part 83 of the second optical film 82 remaining in the second optical film patterning step S126 is also referred to as “second optical film 83”.
　本実施形態によれば、図２４に示すように、第１光学膜６３、中間膜７２、第２光学膜８３および保護膜９２で構成される光学部材５０が、基板１０上に間隔をおいて複数形成される。よって、光学部材５０の多面取りが可能であり、有機ＥＬディスプレイ１の多面取りが可能である。また、光学部材５０は画素エリアに選択的に形成されるため、画素エリアの周囲に設けられた端子が適切に機能できる。 According to the present embodiment, as shown in FIG. 24, the optical member 50 composed of the first optical film 63, the intermediate film 72, the second optical film 83, and the protective film 92 is spaced on the substrate 10. A plurality are formed. Therefore, the optical member 50 can be multi-surfaced, and the organic EL display 1 can be multi-surfaced. In addition, since the optical member 50 is selectively formed in the pixel area, terminals provided around the pixel area can function appropriately.
　＜第１実施形態の光学部材形成工程のまとめ＞
　以上説明したように、本実施形態によれば、第１光学膜形成工程Ｓ１２１と、中間膜形成工程Ｓ１２２と、第２光学膜形成工程Ｓ１２４とがこの順で行われる。第１光学膜６３と第２光学膜８３との間に中間膜７２が形成される。中間膜７２は、第１光学膜６３に傷や異物などが付かないように、第１光学膜６３を保護できる。よって、光学部材５０の品質を向上できる。光学部材５０の製造が途中で一時的に中断され、再開までに時間がかかる場合、傷や異物が付くリスクが高いため、特に有効である。 <Summary of Optical Member Forming Process of First Embodiment>
As described above, according to the present embodiment, the first optical film forming step S121, the intermediate film forming step S122, and the second optical film forming step S124 are performed in this order. An intermediate film 72 is formed between the first optical film 63 and the second optical film 83. The intermediate film 72 can protect the first optical film 63 so that the first optical film 63 is not damaged or foreign matter. Therefore, the quality of the optical member 50 can be improved. This is particularly effective when the production of the optical member 50 is temporarily interrupted and it takes a long time to resume, since there is a high risk of scratches and foreign matter.
　本実施形態によれば、中間膜形成工程Ｓ１２２の後であって第２光学膜形成工程Ｓ１２４の前に、第１光学膜６２の一部６３のみを覆う中間膜７２をマスクとして用いて、第１光学膜６２の残部を除去する第１光学膜パターンニング工程Ｓ１２３が行われる。第１光学膜パターンニング工程Ｓ１２３の間、第１光学膜６２の一部６３を中間膜７２で保護でき、第１光学膜６２の一部６３の形状崩れを抑制できる。よって、光学部材５０の品質を向上できる。 According to this embodiment, after the intermediate film formation step S122 and before the second optical film formation step S124, the intermediate film 72 that covers only a part 63 of the first optical film 62 is used as a mask. A first optical film patterning step S123 for removing the remaining part of the first optical film 62 is performed. During the first optical film patterning step S123, the part 63 of the first optical film 62 can be protected by the intermediate film 72, and the shape collapse of the part 63 of the first optical film 62 can be suppressed. Therefore, the quality of the optical member 50 can be improved.
　本実施形態によれば、第１光学膜パターンニング工程Ｓ１２３では、第１光学膜６２を溶かす洗浄液を用いる。第１光学膜６２の一部６３は、中間膜７２で覆われているため、洗浄液と接触することがなく、洗浄液によって型崩れしない。一方、第１光学膜６２の残部は、洗浄液と接触するため、洗浄液で溶かされ、除去される。 According to the present embodiment, a cleaning liquid that dissolves the first optical film 62 is used in the first optical film patterning step S123. Since a part 63 of the first optical film 62 is covered with the intermediate film 72, it does not come into contact with the cleaning liquid and is not deformed by the cleaning liquid. On the other hand, the remaining portion of the first optical film 62 comes into contact with the cleaning liquid and is dissolved and removed by the cleaning liquid.
　本実施形態によれば、第１光学膜形成工程Ｓ１２１では、第１光学膜６２の一部６３のみを第１光学膜パターンニング工程Ｓ１２３で用いられる洗浄液に対し不溶化する。よって、第１光学膜パターンニング工程Ｓ１２３において、洗浄液の回り込みによる過剰な除去を防止でき、第１光学膜６２の一部６３を確実に残すことができる。 According to this embodiment, in the first optical film forming step S121, only a part 63 of the first optical film 62 is insolubilized in the cleaning liquid used in the first optical film patterning step S123. Therefore, in the first optical film patterning step S123, excessive removal due to the wrapping of the cleaning liquid can be prevented, and a part 63 of the first optical film 62 can be reliably left.
　本実施形態によれば、中間膜形成工程Ｓ１２２では、第１光学膜６２の一部６３のみに中間膜用塗布液７１を塗布することで、第１光学膜６２の一部６３のみを第１光学膜パターンニング工程Ｓ１２３で用いられる洗浄液に対し不溶化する。よって、第１光学膜パターンニング工程Ｓ１２３において、洗浄液の回り込みによる過剰な除去を防止でき、第１光学膜６２の一部６３を確実に残すことができる。 According to the present embodiment, in the intermediate film forming step S122, only the part 63 of the first optical film 62 is applied to the first optical film 62 by applying the intermediate film coating liquid 71 only to the part 63 of the first optical film 62. It is insolubilized in the cleaning liquid used in the optical film patterning step S123. Therefore, in the first optical film patterning step S123, excessive removal due to the wrapping of the cleaning liquid can be prevented, and a part 63 of the first optical film 62 can be reliably left.
　本実施形態によれば、第２光学膜８３を保護する保護膜９２を形成する保護膜形成工程Ｓ１２５が行われる。保護膜９２は、光学部材５０の製造後に、第２光学膜８３に傷や異物などが付かないように、第２光学膜８３を保護できる。よって、光学部材５０の品質を向上できる。 According to the present embodiment, the protective film forming step S125 for forming the protective film 92 that protects the second optical film 83 is performed. The protective film 92 can protect the second optical film 83 so that the second optical film 83 is not damaged or foreign matter after the optical member 50 is manufactured. Therefore, the quality of the optical member 50 can be improved.
　本実施形態によれば、保護膜形成工程Ｓ１２５の後であって第２光学膜８２の一部８３のみを覆う保護膜９２をマスクとして用いて、第２光学膜８２の残部を除去する第２光学膜パターンニング工程Ｓ１２６が行われる。第２光学膜パターンニング工程Ｓ１２６の間、第２光学膜８２の一部８３を保護膜９２で保護でき、第２光学膜８２の一部８３の形状崩れを抑制できる。よって、光学部材５０の品質を向上できる。 According to the present embodiment, after the protective film formation step S125, the remaining part of the second optical film 82 is removed using the protective film 92 that covers only a part 83 of the second optical film 82 as a mask. An optical film patterning step S126 is performed. During the second optical film patterning step S126, the part 83 of the second optical film 82 can be protected by the protective film 92, and the shape collapse of the part 83 of the second optical film 82 can be suppressed. Therefore, the quality of the optical member 50 can be improved.
　本実施形態によれば、第２光学膜パターンニング工程Ｓ１２６では、第２光学膜８２を溶かす洗浄液を用いる。第２光学膜８２の一部８３は、保護膜９２で覆われているため、洗浄液と接触することがなく、洗浄液によって型崩れしない。一方、第２光学膜８２の残部は、洗浄液と接触するため、洗浄液で溶かされ、除去される。 According to the present embodiment, a cleaning liquid that dissolves the second optical film 82 is used in the second optical film patterning step S126. Since a part 83 of the second optical film 82 is covered with the protective film 92, it does not come into contact with the cleaning liquid and does not lose its shape due to the cleaning liquid. On the other hand, since the remaining part of the second optical film 82 is in contact with the cleaning liquid, it is dissolved and removed by the cleaning liquid.
　本実施形態によれば、第２光学膜形成工程Ｓ１２４では、第２光学膜８２の一部８３のみを第２光学膜パターンニング工程Ｓ１２６で用いられる洗浄液に対し不溶化する。よって、第２光学膜パターンニング工程Ｓ１２６において、洗浄液の回り込みによる過剰な除去を防止でき、第２光学膜８２の一部８３を確実に残すことができる。 According to the present embodiment, in the second optical film forming step S124, only a part 83 of the second optical film 82 is insolubilized in the cleaning liquid used in the second optical film patterning step S126. Therefore, in the second optical film patterning step S126, it is possible to prevent excessive removal due to wraparound of the cleaning liquid, and it is possible to reliably leave a part 83 of the second optical film 82.
　本実施形態によれば、保護膜形成工程Ｓ１２５では、第２光学膜８２の一部８３のみに保護膜用塗布液９１を塗布することで、第２光学膜８２の一部８３のみを第２光学膜パターンニング工程Ｓ１２６で用いられる洗浄液に対し不溶化する。よって、第２光学膜パターンニング工程Ｓ１２６において、洗浄液の回り込みによる過剰な除去を防止でき、第２光学膜８２の一部８３を確実に残すことができる。 According to the present embodiment, in the protective film forming step S125, only the part 83 of the second optical film 82 is applied to the second optical film 82 by applying the coating liquid 91 for protective film only to the part 83 of the second optical film 82. It is insolubilized in the cleaning liquid used in the optical film patterning step S126. Therefore, in the second optical film patterning step S126, it is possible to prevent excessive removal due to wraparound of the cleaning liquid, and it is possible to reliably leave a part 83 of the second optical film 82.
　＜第２実施形態の光学部材形成工程＞
　上記第１実施形態では中間膜形成工程Ｓ１２２の後に第１光学膜パターンニング工程Ｓ１２３が行われるの対し、本実施形態では第１光学膜パターンニング工程Ｓ１２３の後に中間膜形成工程Ｓ１２２が行われる点で相違する。 <Optical member formation process of 2nd Embodiment>
In the first embodiment, the first optical film patterning process S123 is performed after the intermediate film formation process S122, whereas in the present embodiment, the intermediate film formation process S122 is performed after the first optical film patterning process S123. Is different.
　そのため、本実施形態の中間膜７２は、上記第１実施形態と異なり、第１光学膜６２の一部６３を残し第１光学膜６２の残部を除去するためのマスクの役割を果たさない。本実施形態の中間膜７２は、第１光学膜６２の一部６３に傷や異物などが付かないように第１光学膜６２の一部６３を保護する役割を果たす。 Therefore, unlike the first embodiment, the intermediate film 72 of the present embodiment does not serve as a mask for removing a part of the first optical film 62 while leaving a part 63 of the first optical film 62. The intermediate film 72 of the present embodiment plays a role of protecting the part 63 of the first optical film 62 so that the part 63 of the first optical film 62 is not damaged or foreign matter.
　また、上記第１実施形態では保護膜形成工程Ｓ１２５の後に第２光学膜パターンニング工程Ｓ１２６が行われるのに対し、本実施形態では第２光学膜パターンニング工程Ｓ１２６の後に保護膜形成工程Ｓ１２５が行われる点で相違する。 In the first embodiment, the second optical film patterning step S126 is performed after the protective film forming step S125, whereas in the present embodiment, the protective film forming step S125 is performed after the second optical film patterning step S126. It differs in that it is done.
　そのため、本実施形態の保護膜９２は、上記第１実施形態と異なり、第２光学膜８２の一部８３を残し第２光学膜８２の残部を除去するためのマスクの役割を果たさない。本実施形態の保護膜９２は、第２光学膜８２の一部８３に傷や異物が付かないように第２光学膜８２の一部８３を保護する役割を果たす。 Therefore, unlike the first embodiment, the protective film 92 according to the present embodiment does not serve as a mask for removing the remaining portion of the second optical film 82 while leaving a part 83 of the second optical film 82. The protective film 92 of the present embodiment plays a role of protecting the part 83 of the second optical film 82 so that the part 83 of the second optical film 82 is not damaged or foreign matter.
　以下、図２５などを参照して相違点について主に説明する。図２５は、第２実施形態による光学部材形成工程を示すフローチャートである。図２５に示すように、光学部材形成工程Ｓ１２０は、第１光学膜形成工程Ｓ１２１と、第１光学膜パターンニング工程Ｓ１２３と、中間膜形成工程Ｓ１２２と、第２光学膜形成工程Ｓ１２４と、第２光学膜パターンニング工程Ｓ１２６と、保護膜形成工程Ｓ１２５とをこの順で有する。 Hereinafter, differences will be mainly described with reference to FIG. FIG. 25 is a flowchart showing an optical member forming process according to the second embodiment. As shown in FIG. 25, the optical member forming step S120 includes a first optical film forming step S121, a first optical film patterning step S123, an intermediate film forming step S122, a second optical film forming step S124, It has 2 optical film patterning process S126 and protective film formation process S125 in this order.
　尚、図２５に示す全ての工程が行われなくてもよい。例えば詳しくは後述するが、第１光学膜パターンニング工程Ｓ１２３や第２光学膜パターンニング工程Ｓ１２６は、光学部材５０を基板１０上に間隔をおいて複数形成する場合には有効であるが、光学部材５０を基板１０上に１つのみ形成する場合には省略してもよい。後述の一部不溶化の処理について同様である。 Note that all the steps shown in FIG. 25 need not be performed. For example, as will be described in detail later, the first optical film patterning step S123 and the second optical film patterning step S126 are effective when a plurality of optical members 50 are formed on the substrate 10 at intervals. When only one member 50 is formed on the substrate 10, it may be omitted. The same applies to the partially insolubilizing process described later.
　また、図２５に示す工程以外の工程が行われてもよい。例えば、第１光学膜形成工程Ｓ１２１の前に、基板に対する第１光学膜の密着性を改善するため、基板の第１光学膜が形成される面を表面改質する工程が行われてもよい。表面改質膜として、シランカップリング剤などの有機膜、または窒化珪素などの無機膜が形成されてよい。 Further, steps other than the steps shown in FIG. 25 may be performed. For example, before the first optical film forming step S121, a step of modifying the surface of the substrate on which the first optical film is formed may be performed in order to improve the adhesion of the first optical film to the substrate. . As the surface modification film, an organic film such as a silane coupling agent or an inorganic film such as silicon nitride may be formed.
　さらに、図２５に示す第１光学膜形成工程Ｓ１２１、第１光学膜パターンニング工程Ｓ１２３および中間膜形成工程Ｓ１２２、ならびに図１２に示す第２光学膜形成工程Ｓ１２４、保護膜形成工程Ｓ１２５および第２光学膜パターンニング工程Ｓ１２６が、この順で行われてもよい。 Further, the first optical film forming step S121, the first optical film patterning step S123, and the intermediate film forming step S122 shown in FIG. 25, and the second optical film forming step S124, the protective film forming step S125, and the second shown in FIG. The optical film patterning step S126 may be performed in this order.
　さらにまた、図１２に示す第１光学膜形成工程Ｓ１２１、中間膜形成工程Ｓ１２２および第１光学膜パターンニング工程Ｓ１２３、ならびに図２５に示す第２光学膜形成工程Ｓ１２４、第２光学膜パターンニング工程Ｓ１２６および保護膜形成工程Ｓ１２５が、この順で行われてもよい。 Furthermore, the first optical film forming step S121, the intermediate film forming step S122 and the first optical film patterning step S123 shown in FIG. 12, and the second optical film forming step S124 and the second optical film patterning step shown in FIG. S126 and protective film formation step S125 may be performed in this order.
　＜第２実施形態の第１光学膜形成工程＞
　図２５の第１光学膜形成工程Ｓ１２１では、図１３～図１４に示すように、液晶分子と溶媒を含む第１光学膜用塗布液６１を基板１０上に塗布して乾燥することにより第１光学膜６２を形成する。第１光学膜６２は、例えば１／４波長膜である。 <First Optical Film Formation Step of Second Embodiment>
In the first optical film forming step S121 of FIG. 25, as shown in FIGS. 13 to 14, the first optical film coating liquid 61 containing liquid crystal molecules and a solvent is applied onto the substrate 10 and dried to thereby form the first optical film. An optical film 62 is formed. The first optical film 62 is, for example, a quarter wavelength film.
　本実施形態の第１光学膜形成工程Ｓ１２１では、図１５に示す第１光学膜６２の一部６３を不溶化する処理は行われない。この処理は、第１光学膜パターンニング工程Ｓ１２３で行われる。 In the first optical film forming step S121 of the present embodiment, the process for insolubilizing the part 63 of the first optical film 62 shown in FIG. 15 is not performed. This process is performed in the first optical film patterning step S123.
　＜第２実施形態の第１光学膜パターンニング工程＞
　図２５の第１光学膜パターンニング工程Ｓ１２３では、第１光学膜形成工程Ｓ１２１の後であって中間膜形成工程Ｓ１２２の前に、第１光学膜６２の一部６３を残し第１光学膜６２の残部を除去する。 <First Optical Film Patterning Step of Second Embodiment>
In the first optical film patterning step S123 of FIG. 25, a part 63 of the first optical film 62 is left after the first optical film formation step S121 and before the intermediate film formation step S122. Remove the rest of the.
　例えば、第１光学膜パターンニング工程Ｓ１２３では、図１５に示すように第１光学膜６２の一部６３のみを洗浄液に対し不溶化し、その後、図２６に示すように第１光学膜６２の残部を洗浄液で溶かす。図２６は、第２実施形態による不溶化されていない部分が除去された第１光学膜を示す側面図である。 For example, in the first optical film patterning step S123, only a part 63 of the first optical film 62 is insolubilized in the cleaning liquid as shown in FIG. 15, and then the remaining part of the first optical film 62 is shown in FIG. Dissolve with cleaning solution. FIG. 26 is a side view showing the first optical film from which a portion not insolubilized is removed according to the second embodiment.
　洗浄液は、例えばスピンチャックで基板１０を回転させながら、基板１０に供給される。基板１０に供給された洗浄液は、遠心力によって基板１０の全体に広がり、基板１０の外周縁から振り切られる。 The cleaning liquid is supplied to the substrate 10 while rotating the substrate 10 with, for example, a spin chuck. The cleaning liquid supplied to the substrate 10 spreads over the entire substrate 10 by centrifugal force and is shaken off from the outer peripheral edge of the substrate 10.
　第１光学膜６２の一部６３は、洗浄液に対し不溶化されているため、洗浄液によって型崩れしない。一方、第１光学膜６２の残部は、洗浄液に対し不溶化されていないため、洗浄液で溶かされ、除去される。 Since a part 63 of the first optical film 62 is insolubilized in the cleaning liquid, it does not lose its shape due to the cleaning liquid. On the other hand, the remaining portion of the first optical film 62 is not insolubilized in the cleaning liquid, and is dissolved and removed by the cleaning liquid.
　尚、洗浄液は洗浄槽に貯えられ、洗浄槽の洗浄液に基板１０を浸漬することで、第１光学膜６２の一部６３を残しつつ、第１光学膜６２の残部を溶かして除去してもよい。洗浄槽の洗浄液は、撹拌翼などで撹拌されてもよい。 The cleaning liquid is stored in the cleaning tank, and the substrate 10 is immersed in the cleaning liquid in the cleaning tank so that the remaining portion of the first optical film 62 can be dissolved and removed while leaving a part 63 of the first optical film 62. Good. The cleaning liquid in the cleaning tank may be stirred with a stirring blade or the like.
　図２６に示すように、本実施形態では、中間膜７２（図２８参照）が形成される前に、第１光学膜６２の一部６３を残し第１光学膜６２の残部が除去され、第１光学膜６２がパターンニングされる。 As shown in FIG. 26, in this embodiment, before the intermediate film 72 (see FIG. 28) is formed, a part 63 of the first optical film 62 is left, and the remaining part of the first optical film 62 is removed. One optical film 62 is patterned.
　上記第１光学膜形成工程Ｓ１２１では、せん断応力を加えながら第１光学膜用塗布液６１を塗布するため、画素エリアのみに第１光学膜用塗布液６１を塗布するのは困難である。従って、第１光学膜パターンニング工程Ｓ１２３を行うことは有効である。 In the first optical film forming step S121, since the first optical film coating liquid 61 is applied while applying a shear stress, it is difficult to apply the first optical film coating liquid 61 only to the pixel area. Therefore, it is effective to perform the first optical film patterning step S123.
　以下、第１光学膜パターンニング工程Ｓ１２３で残る第１光学膜６２の一部６３を、「第１光学膜６３」とも称する。 Hereinafter, the part 63 of the first optical film 62 remaining in the first optical film patterning step S123 is also referred to as “first optical film 63”.
　＜第２実施形態の中間膜形成工程＞
　図２５の中間膜形成工程Ｓ１２２では、図２７～図２８に示すように、第１光学膜用塗布液６１とは異なる中間膜用塗布液７１を第１光学膜６３上に塗布して乾燥することにより中間膜７２を形成する。 <Intermediate Film Forming Process of Second Embodiment>
In the intermediate film forming step S122 of FIG. 25, as shown in FIGS. 27 to 28, an intermediate film coating liquid 71 different from the first optical film coating liquid 61 is applied onto the first optical film 63 and dried. Thus, the intermediate film 72 is formed.
　図２７は、第２実施形態による第１光学膜上に塗布された中間膜用塗布液の液膜を示す図である。図２８は、第２実施形態による中間膜用塗布液の液膜の乾燥により形成された中間膜を示す図である。 FIG. 27 is a view showing a liquid film of the coating liquid for intermediate film applied on the first optical film according to the second embodiment. FIG. 28 is a view showing an intermediate film formed by drying a liquid film of the intermediate film coating liquid according to the second embodiment.
　図２７に示すように、中間膜形成工程Ｓ１２２では、第１光学膜６３が形成された基板１０上に塗布ノズル７０から中間膜用塗布液７１を塗布する。塗布ノズル７０は、インクジェット方式であってよく、下面に中間膜用塗布液７１の液滴を吐出する吐出ノズルを複数有する。 27, in the intermediate film forming step S122, the intermediate film coating liquid 71 is applied from the coating nozzle 70 onto the substrate 10 on which the first optical film 63 is formed. The coating nozzle 70 may be an ink jet method, and has a plurality of ejection nozzles that eject droplets of the coating liquid 71 for the intermediate film on the lower surface.
　塗布ノズル７０と基板１０とを相対的に移動させながら、塗布ノズル７０から中間膜用塗布液７１の液滴を吐出することで、第１光学膜６３およびその近傍のみ（例えば画素エリアおよびその近傍のみ）に中間膜用塗布液７１を選択的に塗布する。 By ejecting droplets of the coating liquid 71 for the intermediate film from the coating nozzle 70 while relatively moving the coating nozzle 70 and the substrate 10, only the first optical film 63 and the vicinity thereof (for example, the pixel area and the vicinity thereof). Only) is applied selectively with the intermediate film coating liquid 71.
　中間膜用塗布液７１は、第１光学膜６３上に塗布される。そのため、第１光学膜６３を形成する液晶分子は、中間膜用塗布液７１の溶媒に対し不溶性を有してよい。中間膜用塗布液７１の塗布によって第１光学膜６３が溶けることを防止できる。 The intermediate film coating solution 71 is applied onto the first optical film 63. Therefore, the liquid crystal molecules forming the first optical film 63 may be insoluble in the solvent of the intermediate film coating liquid 71. It is possible to prevent the first optical film 63 from being melted by the application of the intermediate film coating liquid 71.
　中間膜用塗布液７１は、中間膜７２を形成する有機材料と、その有機材料を溶かす溶媒とを含む。中間膜７２を形成する有機材料は、中間膜７２上に塗布される第２光学膜用塗布液８１（図２９参照）の溶媒に対し不溶性の高分子などを含む。 The intermediate film coating solution 71 includes an organic material that forms the intermediate film 72 and a solvent that dissolves the organic material. The organic material forming the intermediate film 72 includes a polymer that is insoluble in the solvent of the second optical film coating solution 81 (see FIG. 29) applied on the intermediate film 72.
　中間膜用塗布液７１としては、例えば、熱硬化型の透明塗料、化学反応型の透明塗料、乾燥硬化型の透明塗料などが用いられる。具体的には、油性エナメル塗料、フタル酸樹脂塗料などが用いられる。 As the intermediate film coating liquid 71, for example, a thermosetting transparent paint, a chemical reaction type transparent paint, a dry curing type transparent paint, or the like is used. Specifically, oil-based enamel paint, phthalate resin paint, or the like is used.
　熱硬化型の透明塗料、化学反応型の透明塗料、乾燥硬化型の透明塗料などは、熱硬化や化学反応または乾燥硬化によって高分子化されるため、緻密な中間膜７２を形成できる。 A thermosetting transparent paint, a chemical reaction type transparent paint, a dry curing type transparent paint, and the like are polymerized by thermal curing, chemical reaction, or dry curing, and thus a dense intermediate film 72 can be formed.
　中間膜用塗布液７１は、図２７に示すように、第１光学膜６３の主表面のみならず、第１光学膜６３の端面を覆うように塗布されてよい。第１光学膜６３の主表面のみならず、第１光学膜６３の端面に傷や異物が付かないように、第１光学膜６３を中間膜７２で保護できる。 The intermediate film coating solution 71 may be applied so as to cover not only the main surface of the first optical film 63 but also the end surface of the first optical film 63 as shown in FIG. The first optical film 63 can be protected by the intermediate film 72 so that not only the main surface of the first optical film 63 but also the end surface of the first optical film 63 is not damaged or foreign matter.
　中間膜用塗布液７１が塗布される領域は、基板１０上の画素エリアおよびその近傍に限定されてよい。 The region where the intermediate film coating liquid 71 is applied may be limited to the pixel area on the substrate 10 and the vicinity thereof.
　尚、中間膜用塗布液７１が塗布される領域を限定するため、基板１０上にフィルムなどのマスクを貼り付けてもよい。このマスクは、後で剥離される際に第１光学膜６３を損傷しないように、第１光学膜６３との間に隙間を形成してよい。 It should be noted that a mask such as a film may be affixed on the substrate 10 in order to limit the region to which the intermediate film coating solution 71 is applied. This mask may form a gap between the first optical film 63 and the first optical film 63 so as not to damage the first optical film 63 when it is peeled later.
　図２８に示すように、中間膜形成工程Ｓ１２２では、基板１０上に塗布された中間膜用塗布液７１の液膜（図２７参照）を乾燥して、中間膜７２を形成する。中間膜用塗布液７１の液膜から溶媒が除去され、中間膜７２が形成される。 28, in the intermediate film forming step S122, the liquid film (see FIG. 27) of the intermediate film coating liquid 71 applied on the substrate 10 is dried to form the intermediate film 72. The solvent is removed from the liquid film of the intermediate film coating liquid 71 to form the intermediate film 72.
　中間膜７２は、第１光学膜６３とは異なり、等方的な光学特性を有する。中間膜７２の可視光透過率は９５％以上であることが好ましい。また、中間膜７２の膜厚は、１０μｍ以下であることが好ましい。また、中間膜７２の残留応力は、光学部材の変形を抑制するため、小さいほど好ましい。 Unlike the first optical film 63, the intermediate film 72 has isotropic optical characteristics. The visible light transmittance of the intermediate film 72 is preferably 95% or more. The film thickness of the intermediate film 72 is preferably 10 μm or less. Further, the residual stress of the intermediate film 72 is preferably as small as possible in order to suppress deformation of the optical member.
　中間膜７２は、第１光学膜６３の主表面のみならず第１光学膜６３の端面を覆う。中間膜７２は、第１光学膜６３に傷や異物などが付かないように、第１光学膜６３を保護する役割を果たす。中間膜７２の鉛筆硬度は、２Ｈ以上であることが好ましい。光学部材の製造が途中で一時的に中断され、再開までに時間がかかる場合、傷や異物が付くリスクが高いため、特に有効である。 The intermediate film 72 covers not only the main surface of the first optical film 63 but also the end surface of the first optical film 63. The intermediate film 72 serves to protect the first optical film 63 so that the first optical film 63 is not damaged or foreign matter. The pencil hardness of the intermediate film 72 is preferably 2H or more. This is particularly effective when the production of the optical member is temporarily interrupted and it takes a long time to resume since there is a high risk of scratches and foreign matter.
　中間膜７２は、基板１０上の画素エリアおよびその近傍のみに形成され、基板１０上に間隔をおいて複数形成される。尚、画素エリアの周辺に設けられた端子の取出しが不要である場合、基板１０の略全体に中間膜７２が形成されてもよい。中間膜７２上に第２光学膜用塗布液８１を塗布する際に、第２光学膜用塗布液８１の液晶分子の配向制御性が良い。 The intermediate film 72 is formed only in the pixel area on the substrate 10 and in the vicinity thereof, and a plurality of intermediate films 72 are formed on the substrate 10 at intervals. Note that, when it is not necessary to take out terminals provided around the pixel area, the intermediate film 72 may be formed on substantially the entire substrate 10. When the second optical film coating liquid 81 is applied onto the intermediate film 72, the alignment controllability of the liquid crystal molecules of the second optical film coating liquid 81 is good.
　＜第２実施形態の第２光学膜形成工程＞
　図２５の第２光学膜形成工程Ｓ１２４では、図２９～図３０に示すように、液晶分子と溶媒を含む第２光学膜用塗布液８１を中間膜７２上に塗布して乾燥することにより第２光学膜８２を形成する。第２光学膜８２は、例えば直線偏光膜である。 <Second Optical Film Forming Step of Second Embodiment>
In the second optical film forming step S124 of FIG. 25, as shown in FIGS. 29 to 30, a second optical film coating solution 81 containing liquid crystal molecules and a solvent is applied onto the intermediate film 72 and dried to thereby form the first optical film. Two optical films 82 are formed. The second optical film 82 is, for example, a linearly polarizing film.
　図２９は、第２実施形態による中間膜上に塗布された第２光学膜用塗布液の液膜を示す側面図である。図３０は、第２実施形態による第２光学膜用塗布液の液膜の乾燥により形成された第２光学膜を示す側面図である。 FIG. 29 is a side view showing a liquid film of the second optical film coating liquid applied on the intermediate film according to the second embodiment. FIG. 30 is a side view showing a second optical film formed by drying the liquid film of the second optical film coating liquid according to the second embodiment.
　図２９に示すように、第２光学膜形成工程Ｓ１２４では、基板１０上に塗布ノズル８０から第２光学膜用塗布液８１を塗布する。塗布ノズル８０は、例えば下面にスリット状の吐出口を有するスリットコータである。 As shown in FIG. 29, in the second optical film forming step S124, the second optical film coating liquid 81 is applied onto the substrate 10 from the coating nozzle 80. The application nozzle 80 is, for example, a slit coater having a slit-like discharge port on the lower surface.
　第２光学膜用塗布液８１は、中間膜７２上に塗布される。そのため、中間膜７２を形成する有機材料は、第２光学膜用塗布液８１の溶媒に対し不溶性を有してよい。第２光学膜用塗布液８１の塗布によって中間膜７２が溶けることを防止できる。 The second optical film coating solution 81 is applied onto the intermediate film 72. Therefore, the organic material forming the intermediate film 72 may be insoluble in the solvent of the second optical film coating liquid 81. It is possible to prevent the intermediate film 72 from being melted by the application of the second optical film coating liquid 81.
　尚、本実施形態では第２光学膜用塗布液８１の塗布にスリットコータが用いられるが、ディップコータなどが用いられてもよい。第２光学膜用塗布液８１にせん断応力を加えることができ、そのせん断応力の作用方向を制御できればよい。 In this embodiment, a slit coater is used to apply the second optical film coating solution 81, but a dip coater or the like may be used. It is only necessary that a shear stress can be applied to the second optical film coating solution 81 and the direction of action of the shear stress can be controlled.
　図３０に示すように、第２光学膜形成工程Ｓ１２４では、基板１０上に塗布された第２光学膜用塗布液８１の液膜（図２９参照）を乾燥して、第２光学膜８２を形成する。第２光学膜用塗布液８１の液膜から溶媒が除去され、液晶分子の配向が適切に維持される。第２光学膜８２は、例えば直線偏光膜である。 As shown in FIG. 30, in the second optical film forming step S124, the liquid film (see FIG. 29) of the second optical film coating liquid 81 applied on the substrate 10 is dried to form the second optical film 82. Form. The solvent is removed from the liquid film of the second optical film coating liquid 81, and the alignment of the liquid crystal molecules is appropriately maintained. The second optical film 82 is, for example, a linearly polarizing film.
　＜第２実施形態の第２光学膜パターンニング工程＞
　図２５の第２光学膜パターンニング工程Ｓ１２６では、第２光学膜形成工程Ｓ１２４の後であって保護膜形成工程Ｓ１２５の前に、第２光学膜８２の一部８３を残し第２光学膜８２の残部を除去する。 <Second Optical Film Patterning Step of Second Embodiment>
In the second optical film patterning step S126 of FIG. 25, after the second optical film formation step S124 and before the protective film formation step S125, a part 83 of the second optical film 82 is left and the second optical film 82 is left. Remove the rest of the.
　例えば、第２光学膜パターンニング工程Ｓ１２６では、図３１に示すように第２光学膜８２の一部８３のみを洗浄液に対し不溶化し、その後、図３２に示すように第２光学膜８２の残部を洗浄液で溶かす。 For example, in the second optical film patterning step S126, only a part 83 of the second optical film 82 is insolubilized in the cleaning liquid as shown in FIG. 31, and then the remaining part of the second optical film 82 is shown in FIG. Dissolve with cleaning solution.
　図３１は、第２実施形態による一部不溶化された第２光学膜を示す側面図である。図３２は、第２実施形態による不溶化されていない部分が除去された第２光学膜を示す側面図である。 FIG. 31 is a side view showing the second optical film partially insolubilized according to the second embodiment. FIG. 32 is a side view showing the second optical film from which the insoluble portion has been removed according to the second embodiment.
　図３１に示すように、第２光学膜パターンニング工程Ｓ１２６では、第２光学膜８２の一部８３のみを洗浄液に対し不溶化する。洗浄液としては、第２光学膜用塗布液８１の溶媒と同じものが用いられてよく、例えば水が用いられてよい。この場合、水に対する不溶化が行われる。 As shown in FIG. 31, in the second optical film patterning step S126, only a part 83 of the second optical film 82 is insolubilized in the cleaning liquid. As the cleaning liquid, the same solvent as the solvent of the second optical film coating liquid 81 may be used. For example, water may be used. In this case, insolubilization with water is performed.
　第２光学膜８２の一部８３を不溶化する定着液１２０は、例えばインクジェット方式の塗布ノズル１２１から吐出される。塗布ノズル１２１は、下面に定着液１２０の液滴を吐出する吐出ノズルを複数有する。 The fixing liquid 120 that insolubilizes the part 83 of the second optical film 82 is discharged from, for example, an ink jet type application nozzle 121. The coating nozzle 121 has a plurality of ejection nozzles that eject droplets of the fixing liquid 120 on the lower surface.
　塗布ノズル１２１と基板１０とを相対的に移動させながら、塗布ノズル１２１から定着液１２０の液滴を吐出することで、第２光学膜８２の一部８３に定着液１２０を選択的に塗布する。これにより、第２光学膜８２の一部８３が不溶化される。 The fixing liquid 120 is selectively applied to a part 83 of the second optical film 82 by discharging droplets of the fixing liquid 120 from the application nozzle 121 while relatively moving the application nozzle 121 and the substrate 10. . Thereby, a part 83 of the second optical film 82 is insolubilized.
　定着液１２０が塗布される領域は、例えば画素エリアであってよい。 The area where the fixing liquid 120 is applied may be, for example, a pixel area.
　図３２に示すように、第２光学膜パターンニング工程Ｓ１２６では、第２光学膜８２の一部８３のみを残し、第２光学膜８２の残部を除去する。第２光学膜８２の残部の除去には、例えば洗浄液が用いられる。 32, in the second optical film patterning step S126, only a part 83 of the second optical film 82 is left and the remaining part of the second optical film 82 is removed. For example, a cleaning liquid is used to remove the remaining portion of the second optical film 82.
　洗浄液は、例えばスピンチャックで基板１０を回転させながら、基板１０に供給される。基板１０に供給された洗浄液は、遠心力によって基板１０の全体に広がり、基板１０の外周縁から振り切られる。 The cleaning liquid is supplied to the substrate 10 while rotating the substrate 10 with, for example, a spin chuck. The cleaning liquid supplied to the substrate 10 spreads over the entire substrate 10 by centrifugal force and is shaken off from the outer peripheral edge of the substrate 10.
　第２光学膜８２の一部８３は、洗浄液に対し不溶化されているため、洗浄液によって型崩れしない。一方、第２光学膜８２の残部は、洗浄液に対し不溶化されていないため、洗浄液で溶かされ、除去される。 The part 83 of the second optical film 82 is insolubilized in the cleaning liquid, so that it does not lose its shape due to the cleaning liquid. On the other hand, since the remaining portion of the second optical film 82 is not insolubilized in the cleaning liquid, it is dissolved and removed by the cleaning liquid.
　尚、洗浄液は洗浄槽に貯えられ、洗浄槽の洗浄液に基板１０を浸漬することで、第２光学膜８２の一部８３を残しつつ、第２光学膜８２の残部を溶かして除去してもよい。洗浄槽の洗浄液は、撹拌翼などで撹拌されてもよい。 The cleaning liquid is stored in the cleaning tank, and the substrate 10 is immersed in the cleaning liquid in the cleaning tank so that the remaining portion of the second optical film 82 can be dissolved and removed while leaving the portion 83 of the second optical film 82. Good. The cleaning liquid in the cleaning tank may be stirred with a stirring blade or the like.
　図３２に示すように、本実施形態では、保護膜９２（図３４参照）が形成される前に、第２光学膜８２の一部８３を残し第２光学膜８２の残部が除去され、第２光学膜８２がパターンニングされる。 As shown in FIG. 32, in this embodiment, before the protective film 92 (see FIG. 34) is formed, a part 83 of the second optical film 82 is left and the remaining part of the second optical film 82 is removed. Two optical films 82 are patterned.
　上記第２光学膜形成工程Ｓ１２４では、せん断応力を加えながら第２光学膜用塗布液８１を塗布するため、画素エリアのみに第２光学膜用塗布液８１を塗布するのは困難である。従って、第２光学膜パターンニング工程Ｓ１２６を行うことは有効である。 In the second optical film forming step S124, since the second optical film coating liquid 81 is applied while applying a shear stress, it is difficult to apply the second optical film coating liquid 81 only to the pixel area. Therefore, it is effective to perform the second optical film patterning step S126.
　以下、第２光学膜パターンニング工程Ｓ１２６で残る第２光学膜８２の一部８３を、「第２光学膜８３」とも称する。 Hereinafter, the part 83 of the second optical film 82 remaining in the second optical film patterning step S126 is also referred to as “second optical film 83”.
　＜第２実施形態の保護膜形成工程＞
　図２５の保護膜形成工程Ｓ１２５では、図３３～図３４に示すように、第２光学膜用塗布液８１とは異なる保護膜用塗布液９１を第２光学膜８３上に塗布して乾燥することにより保護膜９２を形成する。 <Protective film formation process of 2nd Embodiment>
In the protective film forming step S125 of FIG. 25, as shown in FIGS. 33 to 34, a protective film coating liquid 91 different from the second optical film coating liquid 81 is applied onto the second optical film 83 and dried. Thereby, the protective film 92 is formed.
　図３３は、第２実施形態による第２光学膜上に塗布された保護膜用塗布液の液膜を示す側面図である。図３４は、第２実施形態による保護膜用塗布液の液膜の乾燥により形成された保護膜を示す側面図である。 FIG. 33 is a side view showing a liquid film of a coating liquid for a protective film applied on the second optical film according to the second embodiment. FIG. 34 is a side view showing the protective film formed by drying the liquid film of the protective film coating liquid according to the second embodiment.
　図３３に示すように、保護膜形成工程Ｓ１２５では、第２光学膜８３が形成された基板１０上に塗布ノズル９０から保護膜用塗布液９１を塗布する。塗布ノズル９０は、インクジェット方式であってよく、下面に保護膜用塗布液９１の液滴を吐出する吐出ノズルを複数有する。 As shown in FIG. 33, in the protective film forming step S125, the protective film coating liquid 91 is applied from the coating nozzle 90 onto the substrate 10 on which the second optical film 83 is formed. The coating nozzle 90 may be an ink jet system, and has a plurality of ejection nozzles that eject droplets of the protective film coating liquid 91 on the lower surface.
　塗布ノズル９０と基板１０とを相対的に移動させながら、塗布ノズル９０から保護膜用塗布液９１の液滴を吐出することで、第２光学膜８３およびその近傍のみ（例えば画素エリアおよびその近傍のみ）に保護膜用塗布液９１を選択的に塗布する。 By ejecting droplets of the coating liquid 91 for the protective film from the coating nozzle 90 while relatively moving the coating nozzle 90 and the substrate 10, only the second optical film 83 and the vicinity thereof (for example, the pixel area and the vicinity thereof). Only) is selectively applied with the coating liquid 91 for the protective film.
　保護膜用塗布液９１は、第２光学膜８３上に塗布される。そのため、第２光学膜８３を形成する液晶分子は、保護膜用塗布液９１の溶媒に対し不溶性を有してよい。保護膜用塗布液９１の塗布によって第２光学膜８３が溶けることを防止できる。 The protective film coating solution 91 is applied onto the second optical film 83. Therefore, the liquid crystal molecules forming the second optical film 83 may be insoluble in the solvent of the protective film coating solution 91. It is possible to prevent the second optical film 83 from being melted by the application of the protective film coating liquid 91.
　保護膜用塗布液９１は、保護膜９２を形成する有機材料と、その有機材料を溶かす溶媒とを含む。 The protective film coating solution 91 includes an organic material that forms the protective film 92 and a solvent that dissolves the organic material.
　保護膜用塗布液９１としては、例えば、熱硬化型の透明塗料、化学反応型の透明塗料、乾燥硬化型の透明塗料などが用いられる。具体的には、油性エナメル塗料、フタル酸樹脂塗料などが用いられる。 As the protective film coating liquid 91, for example, a thermosetting transparent paint, a chemical reaction type transparent paint, a dry curing type transparent paint, or the like is used. Specifically, oil-based enamel paint, phthalate resin paint, or the like is used.
　熱硬化型の透明塗料、化学反応型の透明塗料、乾燥硬化型の透明塗料などは、熱硬化や化学反応または乾燥硬化によって高分子化されるため、緻密な保護膜９２を形成できる。 A thermosetting transparent coating, a chemical reaction type transparent coating, a dry curing type transparent coating, and the like are polymerized by thermal curing, chemical reaction, or drying curing, so that a dense protective film 92 can be formed.
　保護膜用塗布液９１は、図３３に示すように、第２光学膜８３の主表面だけではなく、第２光学膜８３の端面を覆うように塗布されてよい。第２光学膜８３の主表面のみならず、第２光学膜８３の端面に傷や異物が付かないように、第２光学膜８３を保護膜９２で保護できる。 As shown in FIG. 33, the protective film coating liquid 91 may be applied so as to cover not only the main surface of the second optical film 83 but also the end surface of the second optical film 83. The second optical film 83 can be protected by the protective film 92 so that not only the main surface of the second optical film 83 but also the end surface of the second optical film 83 is not damaged or foreign matter.
　尚、保護膜用塗布液９１は、図３３では中間膜７２の端面を覆っていないが、中間膜７２の端面を覆うように塗布されてもよい。 The protective film coating solution 91 does not cover the end face of the intermediate film 72 in FIG. 33, but may be applied so as to cover the end face of the intermediate film 72.
　保護膜用塗布液９１が塗布される領域は、基板１０上の画素エリアおよびその近傍に限定されてよい。 The region where the protective film coating liquid 91 is applied may be limited to the pixel area on the substrate 10 and the vicinity thereof.
　尚、保護膜用塗布液９１が塗布される領域を限定するため、基板１０上にフィルムなどのマスクを貼り付けてもよい。このマスクは、後で剥離される際に第２光学膜８３を損傷しないように、第２光学膜８３との間に隙間を形成してよい。 Note that a mask such as a film may be affixed on the substrate 10 in order to limit the region to which the protective film coating solution 91 is applied. A gap may be formed between the mask and the second optical film 83 so as not to damage the second optical film 83 when it is later peeled off.
　図３４に示すように、保護膜形成工程Ｓ１２５では、基板１０上に塗布された保護膜用塗布液９１の液膜（図３３参照）を乾燥して、保護膜９２を形成する。保護膜用塗布液９１の液膜から溶媒が除去され、保護膜９２が形成される。 As shown in FIG. 34, in the protective film forming step S125, the liquid film (see FIG. 33) of the protective film coating liquid 91 applied on the substrate 10 is dried to form the protective film 92. The solvent is removed from the liquid film of the protective film coating liquid 91 to form a protective film 92.
　保護膜９２は、第２光学膜８３とは異なり、等方的な光学特性を有する。保護膜９２の可視光透過率は９５％以上であることが好ましい。また、保護膜９２の膜厚は、１０μｍ以下であることが好ましい。また、保護膜９２の残留応力は、光学部材の変形を抑制するため、小さいほど好ましい。 Unlike the second optical film 83, the protective film 92 has isotropic optical characteristics. The visible light transmittance of the protective film 92 is preferably 95% or more. The film thickness of the protective film 92 is preferably 10 μm or less. Further, the residual stress of the protective film 92 is preferably as small as possible in order to suppress deformation of the optical member.
　保護膜９２は、第２光学膜８３の主表面のみならず第２光学膜８３の端面を覆う。保護膜９２は、第２光学膜８３に傷や異物などが付かないように、第２光学膜８３を保護する役割を果たす。保護膜９２の鉛筆硬度は、２Ｈ以上であることが好ましい。 The protective film 92 covers not only the main surface of the second optical film 83 but also the end surface of the second optical film 83. The protective film 92 serves to protect the second optical film 83 so that the second optical film 83 is not scratched or foreign. The pencil hardness of the protective film 92 is preferably 2H or higher.
　保護膜９２は、基板１０上の画素エリアおよびその近傍のみに形成され、基板１０上に間隔をおいて複数形成される。尚、画素エリアの周辺に設けられた端子の取出しが不要である場合、基板１０の略全体に保護膜９２が形成されてもよい。 The protective film 92 is formed only in the pixel area on the substrate 10 and in the vicinity thereof, and a plurality of protective films 92 are formed on the substrate 10 at intervals. Note that when it is not necessary to take out terminals provided around the pixel area, the protective film 92 may be formed on substantially the entire substrate 10.
　尚、本実施形態の保護膜９２は、保護膜用塗布液９１を第２光学膜８３上に塗布して乾燥することにより形成するが、フィルムの形態で第２光学膜８３に貼り付けられてもよい。 The protective film 92 of the present embodiment is formed by applying the protective film coating liquid 91 on the second optical film 83 and drying it. The protective film 92 is attached to the second optical film 83 in the form of a film. Also good.
　本実施形態によれば、図３４に示すように、第１光学膜６３、中間膜７２、第２光学膜８３および保護膜９２で構成される光学部材５０が、基板１０上に間隔をおいて複数形成される。よって、光学部材５０の多面取りが可能であり、有機ＥＬディスプレイ１の多面取りが可能である。また、光学部材５０は画素エリアおよびその近傍に選択的に形成されるため、画素エリアの周囲に設けられた端子が適切に機能できる。 According to the present embodiment, as shown in FIG. 34, the optical member 50 including the first optical film 63, the intermediate film 72, the second optical film 83, and the protective film 92 is spaced apart on the substrate 10. A plurality are formed. Therefore, the optical member 50 can be multi-surfaced, and the organic EL display 1 can be multi-surfaced. Moreover, since the optical member 50 is selectively formed in the pixel area and its vicinity, the terminals provided around the pixel area can function appropriately.
　＜第２実施形態の光学部材形成工程のまとめ＞
　以上説明したように、本実施形態によれば、第１光学膜形成工程Ｓ１２１と、中間膜形成工程Ｓ１２２と、第２光学膜形成工程Ｓ１２４とがこの順で行われる。第１光学膜６３と第２光学膜８３との間に中間膜７２が形成される。中間膜７２は、第１光学膜６３に傷や異物などが付かないように、第１光学膜６３を保護できる。よって、光学部材５０の品質を向上できる。光学部材５０の製造が途中で一時的に中断され、再開までに時間がかかる場合、傷や異物が付くリスクが高いため、特に有効である。 <Summary of Optical Member Forming Process of Second Embodiment>
As described above, according to the present embodiment, the first optical film forming step S121, the intermediate film forming step S122, and the second optical film forming step S124 are performed in this order. An intermediate film 72 is formed between the first optical film 63 and the second optical film 83. The intermediate film 72 can protect the first optical film 63 so that the first optical film 63 is not damaged or foreign matter. Therefore, the quality of the optical member 50 can be improved. This is particularly effective when the production of the optical member 50 is temporarily interrupted and it takes a long time to resume, since there is a high risk of scratches and foreign matter.
　本実施形態によれば、第１光学膜形成工程Ｓ１２１の後であって中間膜形成工程Ｓ１２２の前に、第１光学膜６２の一部６３を残し第１光学膜６２の残部を除去する第１光学膜パターンニング工程Ｓ１２３が行われる。よって、第１光学膜パターンニング工程Ｓ１２３の後に残る第１光学膜６３の主表面のみならず第１光学膜６３の端面を中間膜７２で覆うことが可能になる。 According to this embodiment, after the first optical film forming step S121 and before the intermediate film forming step S122, the part 63 of the first optical film 62 is left and the remaining part of the first optical film 62 is removed. One optical film patterning step S123 is performed. Therefore, it is possible to cover not only the main surface of the first optical film 63 remaining after the first optical film patterning step S123 but also the end surface of the first optical film 63 with the intermediate film 72.
　本実施形態によれば、第１光学膜パターンニング工程Ｓ１２３では、第１光学膜６２を溶かす洗浄液に対し第１光学膜６２の一部６３のみを不溶化し、その後、第１光学膜６２の残部を洗浄液で溶かす。第１光学膜６２の一部６３は、洗浄液に対し不溶化されているため、洗浄液によって型崩れしない。一方、第１光学膜６２の残部は、洗浄液に対し不溶化されていないため、洗浄液で溶かされ、除去される。 According to this embodiment, in the first optical film patterning step S123, only a part 63 of the first optical film 62 is insolubilized in the cleaning liquid that dissolves the first optical film 62, and then the remaining part of the first optical film 62 is obtained. Dissolve with cleaning solution. Since a part 63 of the first optical film 62 is insolubilized in the cleaning liquid, the mold is not lost by the cleaning liquid. On the other hand, the remaining portion of the first optical film 62 is not insolubilized in the cleaning liquid, and is dissolved and removed by the cleaning liquid.
　本実施形態によれば、中間膜形成工程Ｓ１２２では、第１光学膜６３の主表面および第１光学膜６３の端面を覆うように中間膜７２を形成する。中間膜７２は、第１光学膜６３の主表面のみならず第１光学膜６３の端面に傷や異物などが付かないように、第１光学膜６３を保護できる。よって、光学部材５０の品質を向上できる。光学部材５０の製造が途中で一時的に中断され、再開までに時間がかかる場合、傷や異物が付くリスクが高いため、特に有効である。 According to the present embodiment, in the intermediate film forming step S122, the intermediate film 72 is formed so as to cover the main surface of the first optical film 63 and the end surface of the first optical film 63. The intermediate film 72 can protect the first optical film 63 so that not only the main surface of the first optical film 63 but also the end surface of the first optical film 63 is not damaged or foreign matter. Therefore, the quality of the optical member 50 can be improved. This is particularly effective when the production of the optical member 50 is temporarily interrupted and it takes a long time to resume, since there is a high risk of scratches and foreign matter.
　本実施形態によれば、第２光学膜８３を保護する保護膜９２を形成する保護膜形成工程Ｓ１２５が行われる。保護膜９２は、光学部材５０の製造後に、第２光学膜８３に傷や異物などが付かないように、第２光学膜８３を保護できる。よって、光学部材５０の品質を向上できる。 According to the present embodiment, the protective film forming step S125 for forming the protective film 92 that protects the second optical film 83 is performed. The protective film 92 can protect the second optical film 83 so that the second optical film 83 is not damaged or foreign matter after the optical member 50 is manufactured. Therefore, the quality of the optical member 50 can be improved.
　本実施形態によれば、第２光学膜形成工程Ｓ１２４の後であって保護膜形成工程Ｓ１２５の前に、第２光学膜８２の一部８３を残し第２光学膜８２の残部を除去する第２光学膜パターンニング工程Ｓ１２６が行われる。よって、第２光学膜パターンニング工程Ｓ１２６の後に残る第２光学膜８３の主表面のみならず第２光学膜８３の端面を保護膜９２で覆うことが可能になる。 According to this embodiment, after the second optical film forming step S124 and before the protective film forming step S125, the second optical film 82 is left as a part 83 and the remaining portion of the second optical film 82 is removed. Two optical film patterning process S126 is performed. Therefore, it is possible to cover not only the main surface of the second optical film 83 remaining after the second optical film patterning step S126 but also the end surface of the second optical film 83 with the protective film 92.
　本実施形態によれば、第２光学膜パターンニング工程Ｓ１２６では、第２光学膜８２を溶かす洗浄液に対し第２光学膜８２の一部８３のみを不溶化し、その後、第２光学膜８２の残部を洗浄液で溶かす。第２光学膜８２の一部８３は、洗浄液に対し不溶化されているため、洗浄液によって型崩れしない。一方、第２光学膜８２の残部は、洗浄液に対し不溶化されていないため、洗浄液で溶かされ、除去される。 According to the present embodiment, in the second optical film patterning step S126, only a part 83 of the second optical film 82 is insolubilized in the cleaning liquid that dissolves the second optical film 82, and then the remaining part of the second optical film 82 is obtained. Dissolve with cleaning solution. Since a part 83 of the second optical film 82 is insolubilized in the cleaning liquid, the mold is not lost by the cleaning liquid. On the other hand, since the remaining portion of the second optical film 82 is not insolubilized in the cleaning liquid, it is dissolved and removed by the cleaning liquid.
　本実施形態によれば、保護膜形成工程Ｓ１２５では、第２光学膜８３の主表面および第２光学膜８３の端面を覆うように保護膜９２を形成する。保護膜９２は、第２光学膜８３の主表面のみならず第２光学膜８３の端面に傷や異物などが付かないように、第２光学膜８３を保護できる。よって、光学部材５０の品質を向上できる。光学部材５０の製造が途中で一時的に中断され、再開までに時間がかかる場合、傷や異物が付くリスクが高いため、特に有効である。 According to the present embodiment, in the protective film forming step S125, the protective film 92 is formed so as to cover the main surface of the second optical film 83 and the end surface of the second optical film 83. The protective film 92 can protect the second optical film 83 so that not only the main surface of the second optical film 83 but also the end surface of the second optical film 83 is not damaged or foreign matter. Therefore, the quality of the optical member 50 can be improved. This is particularly effective when the production of the optical member 50 is temporarily interrupted and it takes a long time to resume, since there is a high risk of scratches and foreign matter.
　＜変形、改良＞
　以上、有機ＥＬディスプレイの製造方法の実施形態について説明したが、本発明は上記実施形態などに限定されず、特許請求の範囲に記載された本発明の要旨の範囲内において、種々の変形、改良が可能である。 <Deformation and improvement>
As mentioned above, although embodiment of the manufacturing method of the organic EL display was described, this invention is not limited to the said embodiment etc., In the range of the summary of this invention described in the claim, various deformation | transformation and improvement Is possible.
　例えば、光学部材５０は、上記実施形態では第１光学膜６３、中間膜７２、第２光学膜８３および保護膜９２を含むが、本発明はこれに限定されない。光学部材５０は液晶分子が配向された光学膜を含んでいればよく、光学膜の数も限定されない。 For example, the optical member 50 includes the first optical film 63, the intermediate film 72, the second optical film 83, and the protective film 92 in the above embodiment, but the present invention is not limited to this. The optical member 50 only needs to include an optical film in which liquid crystal molecules are aligned, and the number of optical films is not limited.
　本出願は、２０１７年５月１日に日本国特許庁に出願された特願２０１７－０９１４７１号に基づく優先権を主張するものであり、特願２０１７－０９１４７１号の全内容を本出願に援用する。 This application claims priority based on Japanese Patent Application No. 2017-091471 filed with the Japan Patent Office on May 1, 2017, and the entire contents of Japanese Patent Application No. 2017-091471 are incorporated herein by reference. To do.
１０　基板
１３　有機発光ダイオード
３０　封止層
４０　タッチセンサ
４１　第１金属膜
４３　絶縁膜
４５　第２金属膜
４７　タッチセンサ保護膜
５０　光学部材
６１　第１光学膜用塗布液
６２　第１光学膜
６３　第１光学膜
７１　中間膜用塗布液
７２　中間膜
８１　第２光学膜用塗布液
８２　第２光学膜
８３　第２光学膜
９１　保護膜用塗布液
９２　保護膜 10 substrate 13 organic light emitting diode 30 sealing layer 40 touch sensor 41 first metal film 43 insulating film 45 second metal film 47 touch sensor protective film 50 optical member 61 first optical film coating liquid 62 first optical film 63 first Optical film 71 Intermediate film coating liquid 72 Intermediate film 81 Second optical film coating liquid 82 Second optical film 83 Second optical film 91 Protective film coating liquid 92 Protective film

Claims (19)

  1. 　有機発光ダイオードが予め形成された基板上に、液晶分子と溶媒を含む光学膜用塗布液を塗布して乾燥することにより、液晶分子が配向された光学膜を形成する光学部材形成工程を有する、有機ＥＬディスプレイの製造方法。 An optical member forming step of forming an optical film in which liquid crystal molecules are aligned by applying and drying an optical film coating liquid containing liquid crystal molecules and a solvent on a substrate on which an organic light emitting diode is formed in advance; Manufacturing method of organic EL display.
  2. 　前記光学部材形成工程は、
    　前記有機発光ダイオードが予め形成された前記基板上に、液晶分子と溶媒を含む第１光学膜用塗布液を塗布して乾燥することにより、位相差膜および偏光膜のいずれか１つとしての第１光学膜を形成する第１光学膜形成工程と、
    　前記第１光学膜形成工程の後に、液晶分子と溶媒を含む第２光学膜用塗布液を前記第１光学膜上に塗布して乾燥することにより、前記位相差膜および前記偏光膜の残りの１つとしての第２光学膜を形成する第２光学膜形成工程とを有する、請求項１に記載の有機ＥＬディスプレイの製造方法。     The optical member forming step includes
    A first optical film coating liquid containing liquid crystal molecules and a solvent is applied onto the substrate on which the organic light emitting diodes are formed in advance, and dried, whereby the first optical film as a retardation film or a polarizing film is obtained. A first optical film forming step of forming one optical film;
    After the first optical film forming step, a coating liquid for a second optical film containing liquid crystal molecules and a solvent is applied onto the first optical film and dried, whereby the remaining portions of the retardation film and the polarizing film are dried. The manufacturing method of the organic electroluminescent display of Claim 1 which has a 2nd optical film formation process which forms the 2nd optical film as one.
  3. 　前記光学部材形成工程は、
    　前記第１光学膜形成工程の後であって前記第２光学膜形成工程の前に、前記第１光学膜用塗布液とは異なる中間膜用塗布液を前記第１光学膜上に塗布して乾燥することにより中間膜を形成する中間膜形成工程を有する、請求項２に記載の有機ＥＬディスプレイの製造方法。     The optical member forming step includes
    After the first optical film forming step and before the second optical film forming step, an intermediate film coating liquid different from the first optical film coating liquid is applied onto the first optical film. The manufacturing method of the organic electroluminescent display of Claim 2 which has an intermediate film formation process which forms an intermediate film by drying.
  4. 　前記光学部材形成工程は、
    　前記中間膜形成工程の後であって前記第２光学膜形成工程の前に、前記第１光学膜の一部のみを覆う前記中間膜をマスクとして用いて、前記第１光学膜の残部を除去する第１光学膜パターンニング工程を有する、請求項３に記載の有機ＥＬディスプレイの製造方法。     The optical member forming step includes
    After the intermediate film forming step and before the second optical film forming step, the intermediate film covering only a part of the first optical film is used as a mask to remove the remaining portion of the first optical film. The manufacturing method of the organic electroluminescent display of Claim 3 which has a 1st optical film patterning process to do.
  5. 　前記第１光学膜パターンニング工程では、前記第１光学膜を溶かす洗浄液を用いる、請求項４に記載の有機ＥＬディスプレイの製造方法。 The method for manufacturing an organic EL display according to claim 4, wherein a cleaning liquid that dissolves the first optical film is used in the first optical film patterning step.
  6. 　前記第１光学膜形成工程では、前記第１光学膜の前記一部のみを前記第１光学膜パターンニング工程で用いられる前記洗浄液に対し不溶化する、請求項５に記載の有機ＥＬディスプレイの製造方法。 6. The method of manufacturing an organic EL display according to claim 5, wherein, in the first optical film forming step, only the part of the first optical film is insolubilized in the cleaning liquid used in the first optical film patterning step. .
  7. 　前記中間膜形成工程では、前記第１光学膜の前記一部のみに前記中間膜用塗布液を塗布することで、前記第１光学膜の前記一部のみを前記第１光学膜パターンニング工程で用いられる前記洗浄液に対し不溶化する、請求項５または６に記載の有機ＥＬディスプレイの製造方法。 In the intermediate film forming step, the intermediate film coating liquid is applied only to the part of the first optical film, so that only the part of the first optical film is applied to the first optical film patterning step. The manufacturing method of the organic electroluminescent display of Claim 5 or 6 insolubilized with respect to the said washing | cleaning liquid used.
  8. 　前記光学部材形成工程は、
    　前記第１光学膜形成工程の後であって前記中間膜形成工程の前に、前記第１光学膜の一部を残し前記第１光学膜の残部を除去する第１光学膜パターンニング工程を有する、請求項３に記載の有機ＥＬディスプレイの製造方法。     The optical member forming step includes
    After the first optical film forming step and before the intermediate film forming step, there is a first optical film patterning step for leaving a part of the first optical film and removing the remaining part of the first optical film. The manufacturing method of the organic electroluminescent display of Claim 3.
  9. 　前記第１光学膜パターンニング工程では、前記第１光学膜を溶かす洗浄液に対し前記第１光学膜の前記一部のみを不溶化し、その後、前記第１光学膜の前記残部を前記洗浄液で溶かす、請求項８に記載の有機ＥＬディスプレイの製造方法。 In the first optical film patterning step, only the part of the first optical film is insolubilized in the cleaning liquid that dissolves the first optical film, and then the remaining part of the first optical film is dissolved in the cleaning liquid. The manufacturing method of the organic electroluminescent display of Claim 8.
  10. 　前記中間膜形成工程では、前記第１光学膜の主表面および前記第１光学膜の端面を覆うように前記中間膜を形成する、請求項８または９に記載の有機ＥＬディスプレイの製造方法。 The method for manufacturing an organic EL display according to claim 8 or 9, wherein, in the intermediate film forming step, the intermediate film is formed so as to cover a main surface of the first optical film and an end surface of the first optical film.
  11. 　前記光学部材形成工程は、
    　前記第２光学膜形成工程の後に、前記第２光学膜用塗布液とは異なる保護膜用塗布液を前記第２光学膜上に塗布して乾燥することにより前記第２光学膜を保護する保護膜を形成する保護膜形成工程を有する、請求項３～１０のいずれか１項に記載の有機ＥＬディスプレイの製造方法。     The optical member forming step includes
    Protection for protecting the second optical film by applying a coating liquid for a protective film different from the coating liquid for the second optical film on the second optical film and drying after the second optical film forming step. The method for producing an organic EL display according to any one of claims 3 to 10, further comprising a protective film forming step of forming a film.
  12. 　前記光学部材形成工程は、
    　前記保護膜形成工程の後に、前記第２光学膜の一部のみを覆う前記保護膜をマスクとして用いて、前記第２光学膜の残部を除去する第２光学膜パターンニング工程を有する、請求項１１に記載の有機ＥＬディスプレイの製造方法。     The optical member forming step includes
    The second optical film patterning step of removing a remaining portion of the second optical film using the protective film that covers only a part of the second optical film as a mask after the protective film forming step. 11. A method for producing an organic EL display according to 11.
  13. 　前記第２光学膜パターンニング工程では、前記第２光学膜を溶かす洗浄液を用いる、請求項１２に記載の有機ＥＬディスプレイの製造方法。 The method for manufacturing an organic EL display according to claim 12, wherein a cleaning liquid that dissolves the second optical film is used in the second optical film patterning step.
  14. 　前記第２光学膜形成工程では、前記第２光学膜の前記一部のみを前記第２光学膜パターンニング工程で用いられる前記洗浄液に対し不溶化する、請求項１３に記載の有機ＥＬディスプレイの製造方法。 14. The method of manufacturing an organic EL display according to claim 13, wherein in the second optical film forming step, only the part of the second optical film is insolubilized in the cleaning liquid used in the second optical film patterning step. .
  15. 　前記保護膜形成工程では、前記第２光学膜の前記一部のみに前記保護膜用塗布液を塗布することで、前記第２光学膜の前記一部のみを前記第２光学膜パターンニング工程で用いられる前記洗浄液に対し不溶化する、請求項１３または１４に記載の有機ＥＬディスプレイの製造方法。 In the protective film forming step, the protective film coating liquid is applied only to the part of the second optical film, so that only the part of the second optical film is applied to the second optical film patterning step. The method for producing an organic EL display according to claim 13 or 14, wherein the organic EL display is insolubilized with respect to the cleaning liquid used.
  16. 　前記光学部材形成工程は、
    　前記第２光学膜形成工程の後であって前記保護膜形成工程の前に、前記第２光学膜の一部を残し前記第２光学膜の残部を除去する第２光学膜パターンニング工程を有する、請求項１１に記載の有機ＥＬディスプレイの製造方法。     The optical member forming step includes
    After the second optical film forming step and before the protective film forming step, there is a second optical film patterning step that leaves a part of the second optical film and removes the remaining part of the second optical film. The manufacturing method of the organic electroluminescent display of Claim 11.
  17. 　前記第２光学膜パターンニング工程では、前記第２光学膜を溶かす洗浄液に対し前記第２光学膜の前記一部のみを不溶化し、その後、前記第２光学膜の前記残部を前記洗浄液で溶かす、請求項１６に記載の有機ＥＬディスプレイの製造方法。 In the second optical film patterning step, only the part of the second optical film is insolubilized in the cleaning liquid that dissolves the second optical film, and then the remaining part of the second optical film is dissolved in the cleaning liquid. The manufacturing method of the organic electroluminescent display of Claim 16.
  18. 　前記保護膜形成工程では、前記第２光学膜の主表面および前記第２光学膜の端面を覆うように前記保護膜を形成する、請求項１６または１７に記載の有機ＥＬディスプレイの製造方法。 The organic EL display manufacturing method according to claim 16 or 17, wherein, in the protective film forming step, the protective film is formed so as to cover a main surface of the second optical film and an end surface of the second optical film.
  19. 　前記光学部材形成工程の前に、前記有機発光ダイオードが予め形成された前記基板上に、タッチセンサを形成するタッチセンサ形成工程を有し、
    　前記タッチセンサ形成工程は、
    　前記有機発光ダイオードが予め形成された前記基板上に、遮光性の第１金属膜を形成する工程と、
    　フォトリソグラフィ法およびエッチング法によって前記第１金属膜の一部を選択的に除去する工程と、
    　一部が選択的に除去された前記第１金属膜上に絶縁膜を形成する工程と、
    　前記絶縁膜上に、遮光性の第２金属膜を形成する工程と、
    　フォトリソグラフィ法およびエッチング法によって前記第２金属膜の一部を選択的に除去する工程とを有する、請求項１～１８のいずれか１項に記載の有機ＥＬディスプレイの製造方法。     Before the optical member forming step, a touch sensor forming step of forming a touch sensor on the substrate on which the organic light emitting diode is previously formed,
    The touch sensor forming step includes
    Forming a light-shielding first metal film on the substrate on which the organic light emitting diode is previously formed;
    Selectively removing a part of the first metal film by photolithography and etching;
    Forming an insulating film on the first metal film partially removed, and
    Forming a light-shielding second metal film on the insulating film;
    The method for manufacturing an organic EL display according to claim 1, further comprising a step of selectively removing a part of the second metal film by a photolithography method and an etching method.
PCT/JP2018/015998 2017-05-01 2018-04-18 Method for producing organic el display WO2018203478A1 (en)

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