CN110574495A

CN110574495A - Method for manufacturing organic EL display

Info

Publication number: CN110574495A
Application number: CN201880028327.6A
Authority: CN
Inventors: 池田文彦
Original assignee: Tokyo Electron Ltd
Current assignee: Tokyo Electron Ltd
Priority date: 2017-05-01
Filing date: 2018-04-18
Publication date: 2019-12-13
Anticipated expiration: 2038-04-18
Also published as: TW201904103A; WO2018203478A1; KR102502812B1; JP6749485B2; JPWO2018203478A1; CN110574495B; TWI759462B; KR20200002948A

Abstract

A method for manufacturing an organic EL display includes an optical member forming step of forming an optical film in which liquid crystal molecules are aligned by applying a coating liquid for the optical film containing the liquid crystal molecules and a solvent onto a substrate on which an organic light emitting diode is formed in advance and drying the coating liquid.

Description

Method for manufacturing organic EL display

Technical Field

The present invention relates to a method of manufacturing an organic EL display.

Background

For example, in a display using an Organic Light Emitting Diode (OLED) (hereinafter also referred to as an "Organic el (electroluminescence) display"), a circularly polarizing plate is used in order to suppress reflection of external Light. The circularly polarizing plate is produced by laminating a linearly polarizing plate and a wavelength plate (phase difference plate) so that their polarization axes intersect at 45 degrees.

For example, the wavelength plate may be formed such that the polarization axis thereof is inclined by 15 degrees or 75 degrees. Therefore, it is necessary to form the polarizing plate and the wavelength plate at arbitrary angles. In addition, in order to make the polarization axes of the polarizing plate and the wavelength plate intersect at an arbitrary angle, it is necessary to form the polarizing plate and the wavelength plate separately.

conventionally, such a polarizing plate and a wavelength plate have been manufactured using, for example, an extension film. The stretched film is a film in which molecules in the material are oriented in one direction by stretching and sticking the film in one direction.

however, in recent years, as organic EL displays have been made thinner, there has been a demand for thinner polarizing plates and wavelength plates. However, when a polarizing plate or a wavelength plate is manufactured, if an extension film is used as in the conventional art, there is a limit to reducing the film thickness of the extension film itself, and a sufficiently thin sheet cannot be obtained.

Therefore, a coating liquid having a predetermined material is applied to a substrate to form a polarizing plate or a wavelength plate having a desired film thickness, thereby realizing a sheet formation. Specifically, for example, a coating liquid having liquid crystallinity as a predetermined material is applied to a substrate, and cast and oriented. The liquid crystal molecules form a supramolecular polymer in the coating liquid, and when the coating liquid is made to flow while applying a shear stress, the long axis direction of the supramolecular polymer is oriented in the flow direction.

In order to apply the coating liquid to the substrate as described above, various apparatuses have been proposed. For example, a polarizing film printing apparatus described in patent document 1 includes: a stage for holding a substrate; and a slot die (slot die) for ejecting ink onto the substrate. The slot coating die is moved in the print direction to apply ink to the substrate.

Documents of the prior art

Patent document

Patent document 1: japanese unexamined patent application publication No. 2005-62502

Disclosure of Invention

Technical problem to be solved by the invention

The inventors have developed and studied a technique for forming an optical member such as a circularly polarizing plate by applying a coating liquid to a substrate and drying the coating liquid.

Conventionally, substrates to be coated with a coating liquid for an optical member are prepared separately from substrates on which organic light emitting diodes are formed, and these substrates are bonded together.

Therefore, the number of components such as the substrate and the bonding layer is large, and the organic EL display is not thin enough and is not flexible enough.

The present invention has been made in view of the above-described problems, and a main object of the present invention is to provide an organic EL display having an optical member in which the thinning and flexibility are enhanced.

Technical solution for solving technical problem

In order to solve the above-described problems, according to one aspect of the present invention, there is provided a method for manufacturing an organic EL display, including an optical member forming step of forming an optical film in which liquid crystal molecules are aligned by applying an optical film coating liquid containing liquid crystal molecules and a solvent onto a substrate on which an organic light emitting diode is formed in advance and drying the optical film coating liquid.

Effects of the invention

According to one embodiment of the present invention, an organic EL display having an optical member in which thinning and flexibility are enhanced can be provided.

Drawings

Fig. 1 is a plan view showing an organic EL display according to an embodiment.

fig. 2 is a cross-sectional view showing a main part of an organic EL display according to an embodiment.

Fig. 3 is a flowchart showing a method of manufacturing an organic EL display according to an embodiment.

Fig. 4 is a flowchart showing a touch sensor forming step according to an embodiment.

FIG. 5 is a cross-sectional view illustrating a first metal film formed on a substrate according to one embodiment.

fig. 6 is a cross-sectional view showing a resist film formed on a first metal film according to an embodiment.

FIG. 7 is a sectional view showing a resist film after exposure and development according to one embodiment.

Fig. 8 is a cross-sectional view showing the first metal film after etching according to the embodiment.

Fig. 9 is a cross-sectional view showing the first metal film after the resist film is removed according to the embodiment.

Fig. 10 is a cross-sectional view showing an insulating film formed on a first metal film according to an embodiment.

Fig. 11 is a plan view showing a state where a part of the second metal film formed on the insulating film is removed according to one embodiment.

Fig. 12 is a flowchart showing an optical member forming step of the first embodiment.

Fig. 13 is a side view showing a liquid film of the first optical film coating liquid applied to the substrate according to the first embodiment.

Fig. 14 is a side view showing the first optical film formed by drying the liquid film of the first optical film coating liquid according to the first embodiment.

Fig. 15 is a side view showing a portion of an insoluble first optical film of the first embodiment.

Fig. 16 is a side view showing a liquid film of the coating liquid for an intermediate film applied to the first optical film according to the first embodiment.

Fig. 17 is a side view showing an interlayer film formed by drying a liquid film of the coating liquid for an interlayer film according to the first embodiment.

Fig. 18 is a side view showing the first optical film of the first embodiment after removing a portion not covered with the intermediate film.

Fig. 19 is a side view showing a liquid film of the second optical film coating liquid applied to the intermediate film according to the first embodiment.

Fig. 20 is a side view showing a second optical film formed by drying a liquid film of the coating liquid for a second optical film according to the first embodiment.

Fig. 21 is a side view showing a portion of the second optical film of the first embodiment that is insoluble.

Fig. 22 is a side view showing a liquid film of the coating liquid for a protective film applied to the second optical film according to the first embodiment.

Fig. 23 is a side view showing the protective film formed by drying the liquid film of the coating liquid for the protective film in the first embodiment.

Fig. 24 is a side view showing the second optical film of the first embodiment except for a portion not covered with the protective film.

Fig. 25 is a flowchart showing an optical member forming step of the second embodiment.

Fig. 26 is a side view showing the first optical film after removing the portion without insolubilization of the second embodiment.

Fig. 27 is a side view showing a liquid film of the coating liquid for an intermediate film applied to the first optical film according to the second embodiment.

Fig. 28 is a side view showing an interlayer film formed by drying a liquid film of the coating liquid for an interlayer film according to the second embodiment.

Fig. 29 is a side view showing a liquid film of the second optical film coating liquid applied to the intermediate film according to the second embodiment.

Fig. 30 is a side view showing a second optical film formed by drying a liquid film of a second optical film coating liquid according to the second embodiment.

Fig. 31 is a side view showing a portion of a second optical film that is insoluble in the second embodiment.

Fig. 32 is a side view showing the second optical film after removing the portion without insolubilization of the second embodiment.

Fig. 33 is a side view showing a liquid film of the coating liquid for a protective film applied to the second optical film according to the second embodiment.

Fig. 34 is a side view showing a protective film formed by drying a liquid film of a coating liquid for a protective film in the second embodiment.

Detailed Description

hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. In the drawings, the same or corresponding components are denoted by the same or corresponding reference numerals, and description thereof is omitted.

< organic EL display >

fig. 1 is a plan view showing an organic EL display according to an embodiment. In fig. 1, a circuit of one unit circuit 11 is shown in an enlarged manner.

the organic EL display 1 includes a substrate 10, a plurality of unit circuits 11 arranged on the substrate 10, a scanning line drive circuit 14 provided on the substrate 10, and a data line drive circuit 15 provided on the substrate 10. The unit circuit 11 is provided in a region surrounded by a plurality of scanning lines 16 connected to the scanning line driving circuit 14 and a plurality of data lines 17 connected to the data line driving circuit 15. The unit circuit 11 includes a TFT layer 12 and an organic light emitting diode 13.

The TFT layer 12 has a plurality of TFTs (Thin Film transistors). One TFT has a function as a switching element, and the other TFT has a function as a current control element that controls the amount of current flowing through the organic light emitting diode 13. The TFT layer 12 operates by a scanning line driving circuit 14 and a data line driving circuit 15, and supplies current to the organic light emitting diode 13. The TFT layer 12 is provided for each unit circuit 11, and can independently control the plurality of unit circuits 11. The TFT layer 12 may have a general structure, and is not limited to the structure shown in fig. 1.

The driving method of the organic EL display 1 is an active matrix method in the present embodiment, but may be a passive matrix method.

Fig. 2 is a cross-sectional view showing a main part of an organic EL display according to an embodiment. The organic EL display 1 shown in fig. 2 is of a top emission type, and has a substrate 10, an organic light emitting diode 13, a sealing layer 30, a touch sensor 40, and an optical member 50 in this order. The touch sensor 40 is incorporated into the organic EL display 1 when the organic EL display 1 is a touch panel.

The substrate 10 may be any of a resin substrate, a glass substrate, a semiconductor substrate, a metal substrate, and the like, and a resin substrate is preferable from the viewpoint of improvement in flexibility. The substrate 10 may be a laminated substrate of a resin substrate and a glass substrate from the viewpoint of improvement in flexibility and reduction in moisture transmittance. A TFT layer 12 is formed on the substrate 10. A planarization layer 18 for planarizing the step formed by the TFT layer 12 is formed on the TFT layer 12.

The planarization layer 18 has insulation properties. A connection plug 19 is formed in a connection hole penetrating the planarization layer 18. The connection plug 19 electrically connects the pixel electrode 21 formed on the flat surface of the planarization layer 18 and the TFT layer 12. The connection plug 19 may be formed simultaneously with the pixel electrode 21 from the same material.

the organic light emitting diode 13 is formed on the flat surface of the planarization layer 18. The organic light emitting diode 13 includes: a pixel electrode 21; a counter electrode 22 provided on the opposite side of the substrate 10 with respect to the pixel electrode 21; and an organic layer 23 formed between the pixel electrode 21 and the counter electrode 22. By operating the TFT layer 12, a voltage is applied between the pixel electrode 21 and the counter electrode 22, and the organic layer 23 emits light.

The pixel electrode 21 is a cathode, is formed of a metal material such as aluminum, and reflects light from the organic layer 23 toward the organic layer 23. The light reflected by the pixel electrode 21 is transmitted through the organic layer 23 and the counter electrode 22, and is taken out to the outside. A pixel electrode 21 is provided at each unit circuit 11.

The counter electrode 22 is an anode, is formed of a transparent material such as ito (indium Tin oxide), and transmits light from the organic layer 23. The light transmitted through the counter electrode 22 passes through the sealing layer 30, the touch sensor 40, and the optical member 50, and is extracted to the outside. The counter electrode 22 is the same in the plurality of unit circuits 11.

The organic layer 23 includes, for example, an electron injection layer 24, an electron transport layer 25, a light-emitting layer 26, a hole transport layer 27, and a hole injection layer 28 in this order from the cathode side to the anode side. When a voltage is applied between the cathode and the anode, electrons are injected from the cathode into the electron injection layer 24, and holes are injected from the anode into the hole injection layer 28. Electrons injected into the electron injection layer 24 are transported to the light emitting layer 26 by the electron transport layer 25. In addition, holes injected into the hole injection layer 28 are transported to the light-emitting layer 26 by the hole transport layer 27. In this way, holes and electrons are recombined in the light-emitting layer 26, and the light-emitting material of the light-emitting layer 26 is excited, whereby the light-emitting layer 26 emits light. The light-emitting layer 26 is formed of, for example, a red light-emitting layer that emits red light, a green light-emitting layer that emits green light, and a blue light-emitting layer that emits blue light.

In the present embodiment, the organic layer 23 includes an electron injection layer 24, an electron transport layer 25, a light-emitting layer 26, a hole transport layer 27, and a hole injection layer 28 in this order from the cathode side to the anode side, but may include at least the light-emitting layer 26. The organic layer 23 is not limited to the structure shown in fig. 2.

The sealing layer 30 seals the organic light emitting diode 13 between it and the substrate 10. The sealing layer 30 may be formed using a silicon oxide layer, a silicon nitride layer, or the like, for example, by low-temperature CVD at a film formation temperature of 100 ℃. Alternatively, a resin film having a moisture-proof layer formed thereon may be attached as the sealing layer 30.

The touch sensor 40 detects contact or proximity of an object such as a finger to the screen of the organic EL display 1. The detection method of the touch sensor 40 is not particularly limited, and may be, for example, a capacitance method. Examples of the capacitance system include a surface type capacitance system and a projection type capacitance system. As the projection type electrostatic capacitance system, there are a self capacitance system, a phase capacitance system, and the like. When the mutual capacitance method is used, multipoint detection can be performed at the same time, which is preferable.

The touch sensor 40 is formed on the substrate 10 on which the organic light emitting diode 13 is formed in advance, and will be described in detail later. Therefore, compared to the case where the touch sensor 40 is formed on a substrate other than the substrate 10 and is bonded to the substrate 10 as in the related art, the number of components such as the substrate and the bonding layer can be reduced, and therefore the organic EL display 1 can be thinned, and the flexibility of the organic EL display 1 can be improved.

The touch sensor 40 is formed between the organic light emitting diode 13 and the optical member 50. When the optical member 50 is a circular polarizing film that suppresses external light reflection, the circular polarizing film is disposed on the light extraction side of the touch sensor 40, and therefore, the efficiency of suppressing external light reflection can be improved.

The optical member 50 is, for example, a circular polarizing film that suppresses external light reflection, and in the present embodiment, an 1/4 wavelength film (λ/4 film) is provided as the first optical film, and a linear polarizing film is provided as the second optical film. The 1/4 wavelength film and the linear polarization film were formed so that their polarization axes crossed at 45 degrees. The number of optical films constituting the optical member 50 is not particularly limited.

The optical member 50 is formed on the substrate 10 on which the organic light emitting diode 13 is formed in advance, and will be described in detail later. Therefore, compared to the case where the optical member 50 is formed on a substrate other than the substrate 10 and bonded to the substrate 10 as in the related art, the number of members such as the substrate and the bonding layer can be reduced, and therefore the organic EL display 1 can be thinned, and the flexibility of the organic EL display 1 can be improved.

In order to suppress deterioration of the organic layer 23 by ultraviolet rays, the optical member 50 can be manufactured without using ultraviolet irradiation. In addition, the optical member 50 can be manufactured at a temperature of 100 ℃ or lower in order to suppress the degradation of the organic layer 23 due to heat.

The organic EL display 1 shown in fig. 2 is of a top emission type, but may be of a bottom emission type. In the case of the bottom emission type, light from the light-emitting layer 26 is taken out from the substrate 10 through the pixel electrode 21, and therefore, an anode which is a transparent electrode is used as the pixel electrode 21, and a cathode which is a reflective electrode is used as the counter electrode 22. That is, in the case of the bottom emission type, the arrangement of the anode and the cathode is reversed. In addition, in the case of the bottom emission type, the substrate 10 is a transparent substrate. In the case of the bottom emission type, the touch sensor 40 and the optical member 50 are formed on the opposite side of the organic light emitting diode 13 with respect to the substrate 10.

< method for producing organic EL display >

Fig. 3 is a flowchart showing a method of manufacturing an organic EL display according to an embodiment. Such as

As shown in fig. 3, the method of manufacturing the organic EL display 1 includes a touch sensor forming step S110 and an optical member forming step S120. Further, the touch sensor forming step S110 is performed in the case where the organic EL display 1 is a touch panel. Hereinafter, each step will be described.

< touch sensor Forming step >

The touch sensor forming step S110 forms the touch sensor 40 on the substrate 10 on which the organic light emitting diode 13 is previously formed, before the optical member forming step S120. Therefore, compared to a case where the touch sensor 40 is formed on a substrate other than the substrate 10 and is bonded to the substrate 10 as in the related art, the number of components such as the substrate and the bonding layer can be reduced, and therefore the organic EL display 1 can be thinned, and the flexibility of the organic EL display 1 can be improved.

Fig. 4 is a flowchart showing a touch sensor forming step according to an embodiment. FIG. 5 is a cross-sectional view illustrating a first metal film formed on a substrate according to one embodiment. Fig. 6 is a cross-sectional view showing a resist film formed on a first metal film according to an embodiment. FIG. 7 is a sectional view showing a resist film after exposure and development according to one embodiment. Fig. 8 is a cross-sectional view showing the first metal film after etching according to the embodiment. Fig. 9 is a cross-sectional view showing the first metal film after the resist film is removed according to the embodiment. Fig. 10 is a cross-sectional view showing an insulating film formed on a first metal film according to an embodiment. Fig. 11 is a plan view showing a state where a part of the second metal film formed on the insulating film is removed according to one embodiment. Fig. 5 to 10 are sectional views taken along line a-a of fig. 11. In fig. 5 to 11, the organic light emitting diode 13, the sealing layer 30, and the like shown in fig. 2 are not shown.

The touch sensor forming step S110 includes: a step S111 of forming a light-shielding first metal film 41 on the substrate 10; and a step S112 of selectively removing a part of the first metal film 41 by photolithography and etching. As shown in fig. 5, a first metal film 41 is formed on the substrate 10 (in more detail, for example, on the sealing layer 30). As shown in fig. 6, a resist film 42 is formed on the first metal film 41. The resist film 42 is patterned as shown in fig. 7 by exposure and development. The resist film 42 may be a positive type in which an exposed portion is removed by development, or a negative type in which an exposed portion remains after development. The exposed light is blocked by the first metal film 41, and thus there is no problem of deteriorating the organic light emitting diode 13. Thereafter, using the patterned resist film 42 as a mask, a part of the first metal film 41 is selectively removed as shown in fig. 8. The first metal film 41, a part of which is selectively removed, is formed in a stripe shape in a plan view as shown by a broken line in fig. 11. After that, the resist film 42 used for patterning the first metal film 41 is removed as shown in fig. 9.

In the present specification, the first metal film 41 having light-shielding properties means that the transmittance of the first metal film 41 is 5% or less. The transmittance of the first metal film 41 is preferably 3% or less. Here, the transmittance of the first metal film 41 is a ratio at which light (for example, light having a wavelength of 365 nm) exposed to the resist film 42 formed on the first metal film 41 is transmitted through the first metal film 41. The first metal film 41 is formed of, for example, copper.

In addition, the touch sensor forming step S110 includes a step S113 of forming the insulating film 43 on the first metal film 41 of which a portion is selectively removed. The insulating film 43 insulates the first metal film 41 from the second metal film 45. As the insulating film 43, a silicon oxide film, a silicon nitride film, or the like can be used, and the film formation temperature is, for example, 100 ℃.

Also, the touch sensor forming step S110 includes: step S114 of forming a light-shielding second metal film 45 on the insulating film 43; and a step S115 of selectively removing a portion of the second metal film 45 by photolithography and etching. The formation of the second metal film 45 and the partial removal of the second metal film are performed in the same manner as the formation of the first metal film 41 and the partial removal of the first metal film 41. The second metal film 45, a part of which is selectively removed, is formed in a stripe shape in a plan view as shown in fig. 11. After that, the resist film used in the patterning of the second metal film 45 is removed.

In the present specification, the second metal film 45 having light-shielding properties means that the transmittance of the second metal film 45 is 5% or less. The transmittance of the second metal film 45 is preferably 3% or less. Here, the transmittance of the second metal film 45 is a ratio at which light (for example, light having a wavelength of 365 nm) that exposes the resist film formed on the second metal film 45 is transmitted through the second metal film 45. The second metal film 45 is formed of, for example, copper.

The touch sensor forming step S110 further includes a step S116 of forming a touch sensor protective film 47 on a portion of the selectively removed second metal film 45. The touch sensor protective film 47 is formed in the same manner as the insulating film 43. For example, a silicon oxide film, a silicon nitride film, or the like can be used as the touch sensor protective film 47, and the film is formed by low-temperature CVD at a film formation temperature of 100 ℃.

As described above, the touch sensor 40 configured by the first metal film 41, the insulating film 43, the second metal film 45, and the touch sensor protective film 47 can be obtained. The wire-like first metal film 41 and the wire-like second metal film 45 are formed in a grid pattern as shown in fig. 11 so as not to overlap with the organic layer 23 of the organic light-emitting diode 13 in a plan view. That is, the organic layer 23 is disposed in the opening of the square in a plan view. Light from the organic layer 23 is easily extracted to the outside. One of the first metal film 41 and the second metal film 45 is used as a drive electrode, and the other is used as a receiving electrode. The touch sensor 40 detects a change in capacitance between the drive electrode and the receiving electrode to detect contact or proximity of an object such as a finger with the screen of the organic EL display 1.

According to the touch sensor forming step S110 of the present embodiment, the touch sensor 40 can be formed on the substrate 10 on which the organic light emitting diode 13 is formed in advance while suppressing degradation of the organic layer 23 of the organic light emitting diode 13 due to exposure by photolithography. Compared with the case where the touch sensor 40 is formed on a substrate other than the substrate 10 and is bonded to the substrate 10 as in the related art, the number of components such as the substrate and the bonding layer can be reduced, and therefore the organic EL display 1 can be thinned, and the flexibility of the organic EL display 1 can be improved.

The touch sensor forming step S110 of the present embodiment is performed before the optical member forming step S120, and thus the touch sensor 40 is formed between the organic light emitting diode 13 and the optical member 50. When the optical component 50 is a circular polarizing film that suppresses external light reflection, the circular polarizing film is disposed on the light extraction side of the touch sensor 40, and therefore the efficiency of suppressing external light reflection can be improved.

< optical Member Forming step >

the optical member forming step S120 forms an optical film in which liquid crystal molecules are oriented by applying a coating liquid for an optical film containing liquid crystal molecules and a solvent on the substrate 10 on which the organic light emitting diode 13 is formed in advance and drying the same. The optical member 50 is constituted by an optical film or the like.

The optical member 50 includes, for example, a first optical film and a second optical film. Either one of the first optical film and the second optical film is a phase difference film, and the other is a polarizing film.

According to the optical member forming step S120 of the present embodiment, the optical member 50 is formed on the substrate 10 on which the organic light emitting diode 13 is formed in advance. Therefore, compared to a method in which the optical member 50 is formed on a substrate other than the substrate 10 and bonded to the substrate 10 as in the related art, the number of members such as a substrate and a bonding layer can be reduced, and therefore, the organic EL display 1 can be thinned, and the flexibility of the organic EL display 1 can be improved.

According to the optical member forming step S120 of the present embodiment, the optical member 50 can be manufactured without using ultraviolet irradiation in order to suppress deterioration of the organic layer 23 by ultraviolet rays. In addition, the optical member 50 can be manufactured at a temperature of 100 ℃ or lower in order to suppress the degradation of the organic layer 23 due to heat.

< optical Member Forming step of first embodiment >

Fig. 12 is a flowchart showing an optical member forming step of the first embodiment. As shown in fig. 12, the optical member forming step S120 includes a first optical film forming step S121, an intermediate film forming step S122, a first optical film patterning step S123, a second optical film forming step S124, a protective film forming step S125, and a second optical film patterning step S126 in this order. The respective steps will be explained below.

All the steps shown in fig. 12 may not be performed. For example, the first optical film patterning step S123 and the second optical film patterning step S126 (details will be described later) are effective in the case where a plurality of optical members 50 are formed on the substrate 10 at intervals, but may be omitted in the case where only one optical member 50 is formed on the substrate 10. The partial insolubilization treatment described later is also the same.

In addition, steps other than those shown in fig. 12 may be performed. For example, before the first optical film forming step S121, in order to improve the adhesion of the first optical film to the substrate 10, a step of surface-modifying the surface of the substrate 10 on which the first optical film is to be formed (more specifically, the sealing layer 30 or the touch sensor protective film 47) may be performed. As the surface-modified film, an organic film such as a silane coupling agent or an inorganic film such as silicon nitride can be formed.

< first optical film Forming step of first embodiment >

in the first optical film forming step S121 of fig. 12, as shown in fig. 13 to 15, the first optical film 62 is formed by applying the first optical film coating liquid 61 containing the liquid crystal molecules and the solvent onto the substrate 10 and drying it. The first optical film 62 is, for example, an 1/4 wavelength film.

Fig. 13 is a side view showing a liquid film of the first optical film coating liquid applied to the substrate according to the first embodiment. Fig. 14 is a side view showing the first optical film formed by drying the liquid film of the first optical film coating liquid according to the first embodiment. Fig. 15 is a side view showing a portion of an insoluble first optical film of the first embodiment.

In fig. 13 to 15, the organic light emitting diode 13, the sealing layer 30, and the like shown in fig. 2 are not shown. In fig. 16 to 24, the organic light emitting diode 13, the sealing layer 30, and the like shown in fig. 2 are also omitted.

As shown in fig. 13, in the first optical film forming step S121, the coating liquid 61 for the first optical film is coated on the substrate 10 from the coating nozzle 60. The application nozzle 60 is, for example, a slit applicator (slitcoat) having a slit-shaped discharge port on the lower surface.

the first optical film coating liquid 61 contains liquid crystal molecules such as lyotropic liquid crystal molecules or thermotropic liquid crystal molecules, and a solvent for dissolving the liquid crystal molecules. As the solvent, water or the like can be used, for example. Further, as the solvent, an organic solvent may also be used.

The coating nozzle 60 and the substrate 10 are relatively moved in one direction, and a shear stress can be applied to the first optical film coating liquid 61 coated on the substrate 10. The direction of action of the shear stress coincides with the direction of relative movement of the coating nozzle 60 and the substrate 10. By controlling the direction of action of the shear stress, the orientation direction of the liquid crystal molecules can be controlled.

In the present embodiment, a slit coater is used for coating the first optical film coating liquid 61, but a dip coater (dip coater) or the like may be used. The direction of action of the shear stress can be controlled as long as the shear stress can be applied to the first optical film coating liquid 61.

As shown in fig. 14, in the first optical film forming step S121, a liquid film of the first optical film coating liquid 61 (see fig. 13) applied to the substrate 10 is dried to form the first optical film 62. The solvent is removed from the liquid film of the first optical film coating liquid 61, and the alignment of the liquid crystal molecules is properly maintained. The first optical film 62 is, for example, an 1/4 wavelength film.

The liquid film of the first optical film coating liquid 61 can be dried by reduced pressure drying, natural drying, heat drying, air drying, or the like. The reduced pressure drying can shorten the treatment time as compared with the natural drying. In addition, the reduced pressure drying can suppress convection of the liquid film and can suppress disorder of alignment of liquid crystal molecules, as compared with the heat drying and the air drying. When the solvent remains in the reduced-pressure drying, the drying may be further performed by heating.

As shown in fig. 15, in the first optical film forming step S121, only the part 63 of the first optical film 62 may be made insoluble in the cleaning liquid used in the first optical film patterning step S123. This partial insolubilization can be carried out as desired.

As the cleaning liquid used in the first optical film patterning step S123, the same cleaning liquid as the solvent of the first optical film coating liquid 61 may be used, and for example, water may be used. In this case, a water-insoluble procedure was performed.

The fixing liquid 110 that does not dissolve the part 63 of the first optical film 62 is discharged from, for example, an application nozzle 111 of an ink jet system. The application nozzle 111 has a plurality of discharge nozzles for discharging droplets of the stationary liquid 110 on the lower surface.

While the coating nozzle 111 is moved relative to the substrate 10, droplets of the fixer solution 110 are discharged from the coating nozzle 111, and the fixer solution 110 is selectively applied to the portion 63 of the first optical film 62. Thereby, the portion 63 of the first optical film 62 is insolubilized.

The fixing liquid 110 insolubilizes the part 63 of the first optical film 62 by, for example, replacing a functional group (for example, a water-soluble functional group such as an OH group) at the end of the first optical film 62 with another functional group. The fixing liquid 110 may be made into a polymer by a condensation reaction (for example, dehydration condensation reaction of OH groups or the like) so that the part 63 of the first optical film 62 is not dissolved. In the latter case, the polymer becomes higher and thus insolubilization is more likely to progress than in the former case.

The fixing liquid 110 is removed after the part 63 of the first optical film 62 is insolubilized. The fixing liquid 110 may contain water or an organic solvent.

The region to which the fixing liquid 110 is applied may be, for example, a region where a plurality of pixels such as OLEDs are formed (hereinafter referred to as "pixel region").

In the present embodiment, the application nozzle 111 of the ink jet system is used to apply the fixing liquid 110 only to the part 63 of the first optical film 62, but the present invention is not limited to this. For example, the fixing liquid may be applied to only a part 63 of the first optical film 62 by covering only the remaining part of the first optical film 62 with a mask and then immersing the entire substrate 10 in the fixing liquid 110.

< intermediate film formation step of first embodiment >

In the intermediate film forming step S122 in fig. 12, as shown in fig. 16 to 17, an intermediate film 72 is formed by applying and drying an intermediate film coating liquid 71 different from the first optical film coating liquid 61 on the first optical film 62.

Fig. 16 is a side view showing a liquid film of the coating liquid for an intermediate film applied to the first optical film according to the first embodiment. Fig. 17 is a side view showing an interlayer film formed by drying a liquid film of the coating liquid for an interlayer film according to the first embodiment.

as shown in fig. 16, in the interlayer forming step S122, the coating liquid 71 for an interlayer is applied from the coating nozzle 70 onto the substrate 10 on which the first optical film 62 is formed. The coating nozzle 70 may be an ink jet type, and has a plurality of discharge nozzles for discharging droplets of the coating liquid 71 for an intermediate film to the lower surface.

While the coating nozzle 70 is moved relative to the substrate 10, droplets of the coating liquid 71 for an interlayer film are discharged from the coating nozzle 70, and the coating liquid 71 for an interlayer film is selectively applied to the part 63 of the first optical film 62.

The intermediate film coating liquid 71 is applied to the first optical film 62. Therefore, the liquid crystal molecules forming the first optical film 62 may be insoluble in the solvent of the intermediate film coating liquid 71. The first optical film 62 can be prevented from being dissolved by the application of the intermediate film coating liquid 71.

The intermediate film coating liquid 71 contains an organic material for forming the intermediate film 72 and a solvent for dissolving the organic material. The organic material forming the intermediate film 72 includes a polymer or the like insoluble in the cleaning liquid used in the first optical film patterning step S123.

As the intermediate film coating liquid 71, for example, a thermosetting type clear coating material, a chemical reaction type clear coating material, a dry curing type clear coating material, or the like can be used. Specifically, the paint may be an oil enamel paint, a phthalic resin paint, or the like.

The thermosetting clear coating material, the chemical reaction clear coating material, the dry curing clear coating material, or the like is polymerized by thermosetting, chemical reaction, or dry curing, and thus the dense intermediate film 72 can be formed. Therefore, the insolubility of the intermediate film 72 with respect to the cleaning liquid used in the first optical film patterning step S123 can be improved.

The intermediate film coating liquid 71 may have the same function as the fixing liquid 110. A portion of the first optical film 62 can be promoted to be insoluble. In the case where a part of the first optical film 62 is insolubilized by the intermediate film coating liquid 71, the part of the first optical film 62 may not be insolubilized in the first optical film forming step S121.

For example, the intermediate film coating liquid 71 may be configured to insolubilize the part 63 of the first optical film 62 by replacing a functional group (for example, a water-soluble functional group such as an OH group) at the end of the first optical film 62 with another functional group. The intermediate film coating liquid 71 may be made into a polymer by a condensation reaction (for example, dehydration condensation reaction of OH group or the like) so as to insolubilize the part 63 of the first optical film 62. In the latter case, the polymer becomes higher than in the former case, and thus insolubilization is likely to progress.

the area to which the intermediate film coating liquid 71 is applied may coincide with the area to which the fixing liquid 110 is applied. For example, the region to which the intermediate film coating liquid 71 is applied may be a pixel region on the substrate 10.

As shown in fig. 17, in the intermediate film forming step S122, a liquid film of the coating liquid 71 for an intermediate film (see fig. 16) applied to the substrate 10 is dried to form an intermediate film 72. The solvent is removed from the liquid film of the intermediate film coating liquid 71 to form an intermediate film 72.

The liquid film of the intermediate film coating liquid 71 may be dried under reduced pressure, dried naturally, dried by heating, dried by air drying, or the like. The reduced pressure drying can shorten the treatment time as compared with the natural drying. When the solvent remains in the reduced-pressure drying, the drying may be further performed by heating.

The intermediate film 72 is insoluble in the cleaning liquid used in the first optical film patterning step S123. The intermediate film 72 has isotropic optical characteristics, unlike the first optical film 62. The intermediate film 72 preferably has a visible light transmittance of 95% or more. The thickness of the intermediate film 72 is preferably 10 μm or less. In order to suppress the deformation of the optical member, it is preferable that the residual stress of the intermediate film 72 is as small as possible.

The intermediate film 72 covers a major surface of a portion 63 of the first optical film 62. The intermediate film 72 also functions to protect the part 63 of the first optical film 62 so that scratches, foreign substances, and the like do not occur in the part 63 of the first optical film 62. The pencil hardness of the intermediate film 72 is preferably 2H or more. In the case where it takes time to once stop the production of the optical member until restarting, the risk of scratches and foreign matter adhering is high, and therefore, the method is particularly effective.

In addition, since the remaining portion of the first optical film 62 is removed in the first optical film patterning step S123, the occurrence of scratches or the presence of foreign matter is not a problem. Further, the foreign matter adhering to the intermediate film 72 can be removed by cleaning, and there is no case where a flaw is generated in the part 63 of the first optical film 62 by the cleaning.

< first optical film patterning step of first embodiment >

In the first optical film patterning step S123 of fig. 12, after the intermediate film forming step S122 and before the second optical film forming step S124, the remaining part of the first optical film 62 is removed as shown in fig. 18 by using the intermediate film 72 covering only the part 63 (see fig. 17) of the first optical film 62 as a mask.

Fig. 18 is a side view showing the first optical film of the first embodiment except for a portion not covered with the intermediate film. In the first optical film patterning step S123, the intermediate film 72 can protect the part 63 of the first optical film 62, and the shape collapse of the part 63 of the first optical film 62 can be suppressed. Therefore, the quality of the optical member can be improved.

For example, in the first optical film patterning step S123, a cleaning liquid that dissolves the first optical film 62 is used. The cleaning liquid is supplied to the substrate 10 while rotating the substrate 10 with, for example, a spin chuck. The cleaning liquid supplied to the substrate 10 is spread over the entire substrate 10 by centrifugal force and is spun off from the outer peripheral edge of the substrate 10.

Since the part 63 of the first optical film 62 is covered with the intermediate film 72, it does not come into contact with the cleaning liquid and does not collapse in shape due to the cleaning liquid. On the other hand, the remaining portion of the first optical film 62 is in contact with the cleaning liquid, and therefore can be dissolved and removed by the cleaning liquid.

Alternatively, the cleaning solution may be stored in a cleaning tank, and the substrate 10 may be immersed in the cleaning solution in the cleaning tank to leave the part 63 of the first optical film 62 and dissolve and remove the remaining part of the first optical film 62. The cleaning liquid in the cleaning tank may be stirred by a stirring blade or the like.

In order to reliably leave the part 63 of the first optical film 62, it is effective to make the part 63 of the first optical film 62 insoluble in the cleaning liquid in the first optical film forming step S121 and the intermediate film forming step S122. Excessive removal due to the bypass of the cleaning liquid can be prevented, and the part 63 of the first optical film 62 can be reliably left.

Since the intermediate film 72 is insoluble in the cleaning liquid, the first optical film 62 can be patterned in the first optical film forming step S121 and the intermediate film forming step S122 without dissolving a part of the first optical film 62. In this case, the number of steps can be reduced.

In the first optical film forming step S121, since the first optical film coating liquid 61 is applied while applying shear stress, it is difficult to apply the first optical film coating liquid 61 only in the pixel region. Therefore, it is effective to perform the first optical film patterning step S123.

In the present embodiment, the remaining portion of the first optical film 62 is removed using a cleaning liquid, but the method for removing the remaining portion of the first optical film 62 is not particularly limited. For example, an etching method may be used. The etching may be either wet etching or dry etching.

Hereinafter, the part 63 of the first optical film 62 remaining in the first optical film patterning step S123 is referred to as a "first optical film 63".

< second optical film Forming step of first embodiment >

In the second optical film forming step S124 of fig. 12, as shown in fig. 19 to 21, the second optical film 82 is formed by applying the second optical film coating liquid 81 containing the liquid crystal molecules and the solvent onto the intermediate film 72 and drying the same. The second optical film 82 is, for example, a linear polarizing film.

Fig. 19 to 21 are side views illustrating the second optical film forming step of the first embodiment. Fig. 19 is a side view showing a liquid film of the second optical film coating liquid applied to the intermediate film according to the first embodiment. Fig. 20 is a side view showing a second optical film formed by drying a liquid film of the coating liquid for a second optical film according to the first embodiment. Fig. 21 is a side view showing a portion of the second optical film of the first embodiment that is insoluble.

As shown in fig. 19, in the second optical film forming step S124, the coating liquid 81 for the second optical film is coated on the substrate 10 from the coating nozzle 80. The application nozzle 80 is, for example, a slit applicator having a slit-shaped discharge port on the lower surface.

The second optical film coating liquid 81 is applied to the intermediate film 72. Therefore, the organic material forming the intermediate film 72 may be insoluble in the solvent of the second optical film coating liquid 81. The intermediate film 72 can be prevented from being dissolved by the application of the second optical film coating liquid 81.

The second optical film coating liquid 81 contains liquid crystal molecules such as lyotropic liquid crystal molecules and thermotropic liquid crystal molecules, and a solvent for dissolving the liquid crystal molecules. As the solvent, for example, water or the like can be used. Further, as the solvent, an organic solvent may also be used.

By moving the coating nozzle 80 in one direction relative to the substrate 10, a shear stress can be applied to the second optical film coating liquid 81 coated on the substrate 10. The direction of action of the shear stress coincides with the direction of relative movement of the coating nozzle 80 and the substrate 10. By controlling the direction of action of the shear stress, the orientation direction of the liquid crystal molecules can be controlled.

The direction of action of the shear stress in the second optical film formation step S124 is a direction crossing the direction of action of the shear stress in the first optical film formation step S121 with an inclination of 45 °. Thus, the 1/4 wavelength film and the linear polarization film were formed so that their polarization axes crossed at 45 degrees.

In the present embodiment, a slit coater is used for coating the second optical film coating liquid 81, but a dip coater or the like may be used. The direction of action of the shear stress can be controlled as long as the shear stress can be applied to the second optical film coating liquid 81.

As shown in fig. 20, in the second optical film forming step S124, the second optical film 82 is formed by drying the liquid film of the second optical film coating liquid 81 (see fig. 19) applied to the substrate 10. The solvent is removed from the liquid film of the second optical film coating liquid 81 to maintain the alignment of the liquid crystal molecules properly. The second optical film 82 is, for example, a linear polarizing film.

The liquid film of the second optical film coating liquid 81 may be dried under reduced pressure, dried naturally, dried by heating, dried by air drying, or the like. The reduced pressure drying can shorten the treatment time as compared with the natural drying. In addition, the reduced pressure drying can suppress convection of the liquid film and can suppress disorder of alignment of liquid crystal molecules, as compared with the heat drying or air drying. When the solvent remains in the reduced-pressure drying, the drying may be further performed by heating.

As shown in fig. 21, in the second optical film forming step S124, only a portion 83 of the second optical film 82 may be made insoluble in the cleaning liquid used in the second optical film patterning step S126. This partial insolubilization can be carried out as desired.

as the cleaning liquid used in the second optical film patterning step S126, the same cleaning liquid as the solvent of the second optical film coating liquid 81 may be used, and for example, water may be used. In this case, a water-insoluble procedure was performed.

the fixing liquid 120 that does not dissolve the part 83 of the second optical film 82 is discharged from, for example, an application nozzle 121 of an ink jet system. The application nozzle 121 has a plurality of discharge nozzles for discharging droplets of the stationary liquid 120 on the lower surface.

While the coating nozzle 121 is moved relative to the substrate 10, droplets of the fixer fluid 120 are discharged from the coating nozzle 121, and the fixer fluid 120 is selectively applied to the portion 83 of the second optical film 82. Thereby, the portion 83 of the second optical film 82 is insolubilized.

the fixing liquid 120, for example, replaces a functional group (for example, a water-soluble functional group such as an OH group) at the end of the second optical film 82 with another functional group, and insolubilizes a part 83 of the second optical film 82. The fixing liquid 120 may be made into a polymer by a condensation reaction (for example, dehydration condensation reaction of OH group or the like) so as to insolubilize the part 83 of the second optical film 82. In the latter case, the polymer becomes higher than in the former case, and thus insolubilization easily progresses.

The fixing liquid 120 is removed after insolubilizing the part 83 of the second optical film 82. The fixing liquid 120 may contain water or an organic solvent.

The region to which the fixing liquid 120 is applied may be, for example, a pixel region.

In the present embodiment, the fixing liquid 120 is applied only to the part 83 of the second optical film 82, and therefore the application nozzle 121 of the ink jet system is used, but the present invention is not limited thereto. For example, the fixing liquid may be applied to only a part 83 of the second optical film 82 by covering only the remaining part of the second optical film 82 with a mask and then immersing the entire substrate 10 in the fixing liquid 120.

< protective film formation step of first embodiment >

In the protective film forming step S125 of fig. 12, as shown in fig. 22 to 23, a protective film 92 is formed by applying a protective film coating liquid 91 different from the second optical film coating liquid 81 to the second optical film 82 and drying the same.

Fig. 22 is a side view showing a liquid film of the coating liquid for a protective film applied to the second optical film according to the first embodiment. Fig. 23 is a side view showing the protective film formed by drying the liquid film of the coating liquid for the protective film in the first embodiment.

As shown in fig. 22, in the protective film forming step S125, the protective film coating liquid 91 is applied from the coating nozzle 90 onto the substrate 10 on which the second optical film 82 is formed. The coating nozzle 90 may be an ink jet type, and has a plurality of discharge nozzles for discharging droplets of the coating liquid 91 for a protective film to the lower surface.

The coating liquid 91 for the protective film is selectively applied to the part 83 of the second optical film 82 by discharging droplets of the coating liquid 91 for the protective film from the coating nozzle 90 while relatively moving the coating nozzle 90 and the substrate 10.

The coating liquid 91 for a protective film is applied on the second optical film 82. Therefore, the liquid crystal molecules forming the second optical film 82 may be insoluble in the solvent of the protective film coating liquid 91. The second optical film 82 can be prevented from being dissolved by the coating liquid 91 for the protective film.

The coating liquid 91 for a protective film includes an organic material for forming the protective film 92 and a solvent for dissolving the organic material. The organic material forming the protective film 92 contains a polymer or the like that is insoluble in the cleaning liquid used in the second optical film patterning step S126.

As the coating liquid 91 for the protective film, for example, a thermosetting type clear paint, a chemical reaction type clear paint, a dry curing type clear paint, or the like can be used. Specifically, the paint may be an oil enamel paint, a phthalic resin paint, or the like.

The thermosetting clear coating material, the chemical reaction clear coating material, the dry curing clear coating material, or the like is polymerized by thermosetting, chemical reaction, or dry curing, and thus the protective film 92 can be formed densely. Therefore, the insolubility of the protective film 92 with respect to the cleaning liquid used in the second optical film patterning step S126 can be improved.

The protective film coating liquid 91 may have the same function as the fixing liquid 120. A portion of the second optical film 82 can be promoted to be insoluble. In the case where a part of the second optical film 82 is insolubilized by the protective film coating liquid 91, the second optical film forming step S124 may not insolubilize a part of the second optical film 82.

For example, the protective film coating liquid 91 may replace a functional group (for example, a water-soluble functional group such as an OH group) at the end of the second optical film 82 with another functional group to insolubilize the part 83 of the second optical film 82. The protective film coating liquid 91 may be made to have a high molecular weight by a condensation reaction (for example, dehydration condensation reaction of OH groups or the like) so as to insolubilize the part 83 of the second optical film 82. In the latter case, the polymer becomes higher than in the former case, and thus insolubilization easily progresses.

The area to which the coating liquid 91 for a protective film is applied may coincide with the area to which the fixing liquid 120 is applied. For example, the region to which the coating liquid 91 for a protective film is applied may be a pixel region on the substrate 10.

As shown in fig. 23, in the protective film forming step S125, a liquid film of the protective film coating liquid 91 (see fig. 22) applied to the substrate 10 is dried to form the protective film 92. The solvent is removed from the liquid film of the coating liquid 91 for a protective film to form a protective film 92.

The liquid film of the coating liquid 91 for protective film may be dried under reduced pressure, dried naturally, dried by heating, dried by air drying, or the like. The reduced pressure drying can shorten the treatment time as compared with the natural drying. When the solvent remains in the reduced-pressure drying, the drying may be further performed by heating.

The protective film 92 is insoluble with respect to the cleaning liquid used in the second optical film patterning step S126. The protective film 92 has isotropic optical characteristics, unlike the second optical film 82. The protective film 92 preferably has a visible light transmittance of 95% or more. The thickness of the protective film 92 is preferably 10 μm or less. In order to suppress the deformation of the optical member, it is preferable that the residual stress of the protective film 92 is as small as possible.

The protective film 92 covers a major surface of a portion 83 of the second optical film 82. The protective film 92 functions to protect the portion 83 of the second optical film 82 so that scratches, foreign substances, and the like are not generated in the portion 83 of the second optical film 82. The pencil hardness of the intermediate film 72 is preferably 2H or more.

In addition, since the remaining portion of the second optical film 82 is removed in the second optical film patterning step S126, the occurrence of scratches or the adhesion of foreign matter is not a problem. Further, the foreign matter adhering to the protective film 92 can be removed by cleaning, and there is no case where a flaw is generated in the part 83 of the second optical film 82 by the cleaning.

The protective film 92 of the present embodiment is formed by applying the protective film coating liquid 91 to the second optical film 82 and drying the same, but may be attached to the second optical film 82 in the form of a film.

< second optical film patterning step of first embodiment >

In the second optical film patterning step S126 of fig. 12, after the protective film forming step S125, the remaining portion of the second optical film 82 is removed as shown in fig. 24 using the protective film 92 (see fig. 23) covering only the part 83 of the second optical film 82 as a mask.

Fig. 24 is a side view showing the second optical film of the first embodiment after removing a portion not covered with the protective film. In the second optical film patterning step S126, the portion 83 of the second optical film 82 can be protected by the protective film 92, and the shape collapse of the portion 83 of the second optical film 82 can be suppressed. Therefore, the quality of the optical member can be improved.

For example, in the second optical film patterning step S126, a cleaning liquid that dissolves the second optical film 82 is used. The cleaning liquid is supplied to the substrate 10 while rotating the substrate 10 with, for example, a spin chuck. The cleaning liquid supplied to the substrate 10 is spread over the entire substrate 10 by centrifugal force and is spun off from the outer peripheral edge of the substrate 10.

Since the part 83 of the second optical film 82 is covered with the protective film 92, it does not come into contact with the cleaning liquid and does not collapse in shape due to the cleaning liquid. On the other hand, the remaining portion of the second optical film 82 is in contact with the cleaning liquid, and therefore can be dissolved and removed by the cleaning liquid.

Alternatively, the cleaning solution may be stored in a cleaning tank, and the substrate 10 may be immersed in the cleaning solution in the cleaning tank to leave a part 83 of the second optical film 82 and dissolve and remove the remaining part of the second optical film 82. The cleaning liquid in the cleaning tank may be stirred by a stirring blade or the like.

In order to reliably leave the part 83 of the second optical film 82, it is effective to make the part 83 of the second optical film 82 insoluble in the cleaning liquid in the second optical film forming step S124 and the protective film forming step S125. Excessive removal due to the bypass of the cleaning liquid can be prevented, and the part 83 of the second optical film 82 can be reliably left.

Since the protective film 92 is insoluble in the cleaning liquid, the second optical film 82 can be patterned in the second optical film forming step S124 and the protective film forming step S125 without dissolving a part of the second optical film 82. In this case, the number of steps can be reduced.

In the second optical film forming step S124, the second optical film coating liquid 81 is applied while applying shear stress, and therefore it is difficult to apply the second optical film coating liquid 81 only to the pixel region. Therefore, it is effective to perform the second optical film patterning step S126.

In the present embodiment, the remaining portion of the second optical film 82 is removed using a cleaning liquid, but the method for removing the remaining portion of the second optical film 82 is not particularly limited. For example, an etching method may be used. The etching may be either wet etching or dry etching.

Hereinafter, the portion 83 of the second optical film 82 remaining in the second optical film patterning step S126 is referred to as "second optical film 83".

According to the present embodiment, as shown in fig. 24, a plurality of optical members 50 composed of the first optical film 63, the intermediate film 72, the second optical film 83, and the protective film 92 are formed on the substrate 10 at intervals. Therefore, multi-surface imposition of the optical member 50 can be achieved, and multi-surface imposition of the organic EL display 1 can be achieved. In addition, since the optical member 50 is selectively formed in the pixel region, the terminals provided around the pixel region can function appropriately.

< summary of optical component Forming step of first embodiment >

As described above, according to the present embodiment, the first optical film forming step S121, the intermediate film forming step S122, and the second optical film forming step S124 are performed in this order. The intermediate film 72 is formed between the first optical film 63 and the second optical film 83. The intermediate film 72 can protect the first optical film 63 so that scratches, foreign substances, and the like do not adhere to the first optical film 63. Therefore, the quality of the optical member 50 can be improved. In the case where it takes time to resume the production of the optical member 50 after the production is temporarily interrupted, the risk of scratches and foreign matter adhering is high, and therefore, this is particularly effective.

According to the present embodiment, after the interlayer forming step S122 and before the second optical film forming step S124, the first optical film patterning step S123 of removing the remaining portion of the first optical film 62 is performed using the interlayer 72 covering only the portion 63 of the first optical film 62 as a mask. In the first optical film patterning step S123, the intermediate film 72 can protect the part 63 of the first optical film 62, and the shape collapse of the part 63 of the first optical film 62 can be suppressed. Therefore, the quality of the optical member 50 can be improved.

In the first optical film patterning step S123 according to the present embodiment, a cleaning solution that dissolves the first optical film 62 is used. Since the part 63 of the first optical film 62 is covered with the intermediate film 72, it does not come into contact with the cleaning liquid and does not collapse in shape due to the cleaning liquid. On the other hand, the remaining portion of the first optical film 62 is in contact with the cleaning liquid, and therefore can be dissolved and removed by the cleaning liquid.

According to the present embodiment, in the first optical film forming step S121, only the part 63 of the first optical film 62 is made insoluble in the cleaning liquid used in the first optical film patterning step S123. Therefore, in the first optical film patterning step S123, excessive removal due to the bypass of the cleaning liquid can be prevented, and the part 63 of the first optical film 62 can be reliably left.

In the present embodiment, in the interlayer forming step S122, the interlayer coating liquid 71 is applied to only the part 63 of the first optical film 62, whereby only the part 63 of the first optical film 62 is made insoluble in the cleaning liquid used in the first optical film patterning step S123. Therefore, in the first optical film patterning step S123, excessive removal due to the bypass of the cleaning liquid can be prevented, and the part 63 of the first optical film 62 can be reliably left.

according to the present embodiment, the protective film forming step S125 of forming the protective film 92 that protects the second optical film 83 is performed. The protective film 92 can protect the second optical film 83 from scratches, foreign substances, and the like on the second optical film 83 after the optical member 50 is manufactured. Therefore, the quality of the optical member 50 can be improved.

According to the present embodiment, after the protective film forming step S125, a second optical film patterning step S126 of removing the remaining portion of the second optical film 82 is performed using the protective film 92 covering only the portion 83 of the second optical film 82 as a mask. In the second optical film patterning step S126, the portion 83 of the second optical film 82 can be protected by the protective film 92, and the shape collapse of the portion 83 of the second optical film 82 can be suppressed. Therefore, the quality of the optical member 50 can be improved.

In the present embodiment, a cleaning solution that dissolves the second optical film 82 is used in the second optical film patterning step S126. Since the part 83 of the second optical film 82 is covered with the protective film 92, it does not come into contact with the cleaning liquid and does not collapse in shape due to the cleaning liquid. On the other hand, the remaining portion of the second optical film 82 is in contact with the cleaning liquid, and therefore can be dissolved and removed by the cleaning liquid.

According to the present embodiment, in the second optical film forming step S124, only the part 83 of the second optical film 82 is made insoluble in the cleaning liquid used in the second optical film patterning step S126. Therefore, in the second optical film patterning step S126, excessive removal due to the bypass of the cleaning liquid can be prevented, and the part 83 of the second optical film 82 can be reliably left.

In the protective film forming step S125, the protective film coating liquid 91 is applied to only the part 83 of the second optical film 82, and only the part 83 of the second optical film 82 is made insoluble in the cleaning liquid used in the second optical film patterning step S126. Therefore, in the second optical film patterning step S126, excessive removal due to the bypass of the cleaning liquid can be prevented, and the part 83 of the second optical film 82 can be reliably left.

< step of forming optical Member of second embodiment >

While the first embodiment described above differs from the first embodiment in that the first optical film patterning step S123 is performed after the intermediate film forming step S122, the present embodiment differs from the first embodiment in that the intermediate film forming step S122 is performed after the first optical film patterning step S123.

Therefore, unlike the first embodiment, the intermediate film 72 of the present embodiment does not function as a mask for leaving the part 63 of the first optical film 62 and removing the remaining part of the first optical film 62. The intermediate film 72 of the present embodiment functions to protect the part 63 of the first optical film 62 so as not to cause scratches, adhesion of foreign matter, and the like on the part 63 of the first optical film 62.

While the second optical film patterning step S126 is performed after the protective film forming step S125 in the first embodiment, the protective film forming step S125 is performed after the second optical film patterning step S126 in the present embodiment, this is different.

Therefore, unlike the first embodiment, the protective film 92 of the present embodiment does not function as a mask for leaving the part 83 of the second optical film 82 and removing the remaining part of the second optical film 82. The protective film 92 of the present embodiment functions to protect the part 83 of the second optical film 82 so as not to cause scratches, adhesion of foreign matter, and the like on the part 83 of the second optical film 82.

Hereinafter, the difference will be mainly described with reference to fig. 25 and the like. Fig. 25 is a flowchart showing an optical member forming step of the second embodiment. As shown in fig. 25, the optical member forming step S120 includes a first optical film forming step S121, a first optical film patterning step S123, an intermediate film forming step S122, a second optical film forming step S124, a second optical film patterning step S126, and a protective film forming step S125 in this order.

In addition, all the steps shown in fig. 25 may not be performed. For example, the first optical film patterning step S123 and the second optical film patterning step S126 (details will be described later) are effective in the case where a plurality of optical members 50 are formed on the substrate 10 at intervals, but may be omitted in the case where only one optical member 50 is formed on the substrate 10. The partial insolubilization treatment described later is also the same.

Further, steps other than those shown in fig. 25 may be performed. For example, before the first optical film forming step S121, in order to improve the adhesion of the first optical film to the substrate, a step of surface-modifying the surface of the substrate on which the first optical film is to be formed may be performed. The surface-modified film may be formed of an organic film such as a silane coupling agent or an inorganic film such as silicon nitride.

Further, the first optical film forming step S121, the first optical film patterning step S123, and the intermediate film forming step S122 shown in fig. 25, and the second optical film forming step S124, the protective film forming step S125, and the second optical film patterning step S126 shown in fig. 12 may be performed in this order.

Further, the first optical film forming step S121, the intermediate film forming step S122, and the first optical film patterning step S123 shown in fig. 12, and the second optical film forming step S124, the second optical film patterning step S126, and the protective film forming step S125 shown in fig. 25 may be performed in this order.

< first optical film Forming step of second embodiment >

In the first optical film forming step S121 of fig. 25, as shown in fig. 13 to 14, the first optical film 62 is formed by applying the first optical film coating liquid 61 containing the liquid crystal molecules and the solvent onto the substrate 10 and drying the same. The first optical film 62 is, for example, an 1/4 wavelength film.

In the first optical film forming step S121 of the present embodiment, the treatment of insolubilizing the part 63 of the first optical film 62 shown in fig. 15 is not performed. This process is performed in the first optical film patterning step S123.

< first optical film patterning step of second embodiment >

In the first optical film patterning step S123 of fig. 25, after the first optical film forming step S121 and before the intermediate film forming step S122, a part 63 of the first optical film 62 is left, and the remaining part of the first optical film 62 is removed.

For example, in the first optical film patterning step S123, as shown in fig. 15, only a part 63 of the first optical film 62 is made insoluble in the cleaning liquid, and thereafter, as shown in fig. 26, the remaining part of the first optical film 62 is made soluble by the cleaning liquid. Fig. 26 is a side view showing the first optical film of the second embodiment without removing insoluble portions.

The cleaning liquid is supplied to the substrate 10 while rotating the substrate 10 with, for example, a spin chuck. The cleaning liquid supplied to the substrate 10 is spread over the entire substrate 10 by centrifugal force and is thrown off from the outer peripheral edge of the substrate 10.

The part 63 of the first optical film 62 is insoluble in the cleaning liquid, and thus does not collapse in shape due to the cleaning liquid. On the other hand, the remaining portion of the first optical film 62 is not insoluble in the cleaning liquid, and therefore can be dissolved and removed by the cleaning liquid.

Further, the cleaning solution is stored in the cleaning tank, and the substrate 10 is immersed in the cleaning solution in the cleaning tank, whereby a part 63 of the first optical film 62 is left, and the remaining part of the first optical film 62 is dissolved and removed. The cleaning liquid in the cleaning tank may be stirred by a stirring blade or the like.

As shown in fig. 26, in the present embodiment, before forming the intermediate film 72 (see fig. 28), the first optical film 62 is patterned by leaving a part 63 of the first optical film 62 and removing the remaining part of the first optical film 62.

In the first optical film forming step S121, the first optical film coating liquid 61 is applied while applying shear stress, and therefore it is difficult to apply the first optical film coating liquid 61 only in the pixel region. Therefore, it is effective to perform the first optical film patterning step S123.

hereinafter, the portion 63 of the first optical film 62 remaining in the first optical film patterning step S123 is referred to as a "first optical film 63".

< intermediate film Forming step of second embodiment >

In the intermediate film forming step S122 of fig. 25, as shown in fig. 27 to 28, an intermediate film 72 is formed by applying and drying an intermediate film coating liquid 71 different from the first optical film coating liquid 61 on the first optical film 63.

Fig. 27 is a view showing a liquid film of the coating liquid for an intermediate film applied to the first optical film in the second embodiment. Fig. 28 is a view showing an interlayer film formed by drying a liquid film of the coating liquid for an interlayer film according to the second embodiment.

As shown in fig. 27, in the interlayer forming step S122, the coating liquid 71 for an interlayer is applied from the coating nozzle 70 onto the substrate 10 on which the first optical film 63 is formed. The coating nozzle 70 may be an ink jet type, and has a plurality of discharge nozzles for discharging droplets of the intermediate film coating liquid 71 to the lower surface.

The coating liquid 71 for the intermediate film is selectively applied only to the first optical film 63 and its vicinity (for example, only the pixel region and its vicinity) by discharging droplets of the coating liquid 71 for the intermediate film from the coating nozzle 70 while relatively moving the coating nozzle 70 and the substrate 10.

The intermediate film coating liquid 71 is applied to the first optical film 63. Therefore, the liquid crystal molecules forming the first optical film 63 may be insoluble in the solvent of the intermediate film coating liquid 71. The first optical film 63 can be prevented from being dissolved by the application of the intermediate film coating liquid 71.

The intermediate film coating liquid 71 contains an organic material for forming the intermediate film 72 and a solvent for dissolving the organic material. The organic material forming the intermediate film 72 includes a polymer or the like that is insoluble in a solvent of the second optical film coating liquid 81 (see fig. 29) applied to the intermediate film 72.

As the intermediate film coating liquid 71, for example, a thermosetting type clear coating material, a chemical reaction type clear coating material, a dry curing type clear coating material, or the like can be used. Specifically, oil enamel paint, phthalic resin paint, and the like can be used.

The thermosetting clear coating material, the chemical reaction clear coating material, the dry curing clear coating material, or the like is polymerized by thermosetting, chemical reaction, or dry curing, and thus the dense intermediate film 72 can be formed.

As shown in fig. 27, the intermediate film coating liquid 71 may be applied so as to cover not only the main surface of the first optical film 63 but also the end surface of the first optical film 63. The first optical film 63 can be protected by the intermediate film 72 so that scratches and foreign substances do not occur not only on the main surface of the first optical film 63 but also on the end surface of the first optical film 63.

The area to which the intermediate film coating liquid 71 is applied is not limited to the pixel area on the substrate 10 and the vicinity thereof.

In addition, a mask such as a film may be attached to the substrate 10 in order to define a region to which the intermediate film coating liquid 71 is applied. The mask forms a gap with the first optical film 63 in such a manner that the first optical film 63 is not damaged when peeled off later.

As shown in fig. 28, in the intermediate film forming step S122, a liquid film (see fig. 27) of the intermediate film coating liquid 71 applied to the substrate 10 is dried to form an intermediate film 72. The solvent is removed from the liquid film of the intermediate film coating liquid 71 to form an intermediate film 72.

The intermediate film 72 has isotropic optical characteristics, unlike the first optical film 63. The intermediate film 72 preferably has a visible light transmittance of 95% or more. The thickness of the intermediate film 72 is preferably 10 μm or less. In order to suppress the deformation of the optical member, it is preferable that the residual stress of the intermediate film 72 is as small as possible.

The intermediate film 72 covers not only the main surface of the first optical film 63 but also the end face of the first optical film 63. The intermediate film 72 functions to protect the first optical film 63 so that scratches, foreign substances, and the like do not adhere to the first optical film 63. The pencil hardness of the intermediate film 72 is preferably 2H or more. In the case where it takes time to once stop the production of the optical member until restarting, the risk of scratches and foreign matter adhering is high, and therefore, the method is particularly effective.

The intermediate film 72 is formed only in the pixel region and its vicinity on the substrate 10, and a plurality of intermediate films are formed on the substrate 10 at intervals. In addition, the interlayer film 72 may be formed substantially over the entire substrate 10 without taking out a terminal provided in the periphery of the pixel region. When the second optical film coating liquid 81 is applied to the intermediate film 72, the alignment controllability of the liquid crystal molecules of the second optical film coating liquid 81 is good.

< second optical film Forming step of second embodiment >

In the second optical film forming step S124 of fig. 25, as shown in fig. 29 to 30, the second optical film 82 is formed by applying the second optical film coating liquid 81 containing the liquid crystal molecules and the solvent onto the intermediate film 72 and drying the same. The second optical film 82 is, for example, a linear polarizing film.

Fig. 29 is a side view showing a liquid film of the second optical film coating liquid applied to the intermediate film in the second embodiment. Fig. 30 is a side view showing a second optical film formed by drying a liquid film of a second optical film coating liquid according to the second embodiment.

As shown in fig. 29, in the second optical film forming step S124, the coating liquid 81 for the second optical film is coated on the substrate 10 from the coating nozzle 80. The application nozzle 80 is, for example, a slit applicator having a slit-shaped discharge port on the lower surface.

As shown in fig. 30, in the second optical film forming step S124, the second optical film 82 is formed by drying the liquid film of the second optical film coating liquid 81 (see fig. 29) applied to the substrate 10. The solvent is removed from the liquid film of the second optical film coating liquid 81, and the alignment of the liquid crystal molecules can be appropriately maintained. The second optical film 82 is, for example, a linear polarizing film.

< second optical film patterning step of second embodiment >

In the second optical film patterning step S126 of fig. 25, after the second optical film forming step S124 and before the protective film forming step S125, a part 83 of the second optical film 82 is left, and the remaining part of the second optical film 82 is removed.

For example, in the second optical film patterning step S126, as shown in fig. 31, only a part 83 of the second optical film 82 is made insoluble in the cleaning liquid, and thereafter, as shown in fig. 32, the remaining part of the second optical film 82 is dissolved with the cleaning liquid.

Fig. 31 is a side view showing a portion of a second optical film that is insoluble in the second embodiment. Fig. 32 is a side view showing the second optical film after removing the portion without insolubilization of the second embodiment.

As shown in fig. 31, in the second optical film patterning step S126, only a portion 83 of the second optical film 82 is made insoluble in the cleaning liquid. As the cleaning liquid, the same cleaning liquid as the solvent of the second optical film coating liquid 81 can be used, and for example, water can be used. In this case, a water-insoluble procedure was performed.

While the coating nozzle 121 is moved relative to the substrate 10, droplets of the fixing liquid 120 are discharged from the coating nozzle 121, and thereby the fixing liquid 120 is selectively coated on the part 83 of the second optical film 82. Thereby, the portion 83 of the second optical film 82 is insolubilized.

as shown in fig. 32, in the second optical film patterning step S126, only a portion 83 of the second optical film 82 is left, and the remaining portion of the second optical film 82 is removed. In the removal of the remaining portion of the second optical film 82, for example, a cleaning liquid may be used.

The part 83 of the second optical film 82 is insoluble in the cleaning liquid, and thus does not collapse in shape due to the cleaning liquid. On the other hand, the remaining portion of the second optical film 82 is not insoluble in the cleaning liquid, and therefore can be dissolved and removed by the cleaning liquid.

As shown in fig. 32, in the present embodiment, before the protective film 92 (see fig. 34) is formed, a part 83 of the second optical film 82 is left, and the remaining part of the second optical film 82 is removed to pattern the second optical film 82.

< protective film Forming step of second embodiment >

In the protective film forming step S125 of fig. 25, as shown in fig. 33 to 34, a protective film 92 is formed by applying a protective film coating liquid 91 different from the second optical film coating liquid 81 to the second optical film 83 and drying the same.

Fig. 33 is a side view showing a liquid film of the coating liquid for a protective film applied to the second optical film in the second embodiment. Fig. 34 is a side view showing a protective film formed by drying a liquid film of a coating liquid for a protective film in the second embodiment.

As shown in fig. 33, in the protective film forming step S125, the protective film coating liquid 91 is applied from the coating nozzle 90 onto the substrate 10 on which the second optical film 83 is formed. The coating nozzle 90 may be an ink jet type, and has a plurality of discharge nozzles for discharging droplets of the coating liquid 91 for a protective film to the lower surface.

By discharging droplets of the coating liquid 91 for the protective film from the coating nozzle 90 while relatively moving the coating nozzle 90 and the substrate 10, the coating liquid 91 for the protective film is selectively coated only on the second optical film 83 and its vicinity (for example, only on the pixel region and its vicinity).

The protective film coating liquid 91 is applied to the second optical film 83. Therefore, the liquid crystal molecules forming the second optical film 83 may be insoluble in the solvent of the protective film coating liquid 91. The second optical film 83 can be prevented from being dissolved by the coating liquid 91 for the protective film.

The coating liquid 91 for a protective film includes an organic material for forming the protective film 92 and a solvent for dissolving the organic material.

As the coating liquid 91 for the protective film, for example, a thermosetting type clear paint, a chemical reaction type clear paint, a dry curing type clear paint, or the like can be used. Specifically, oil enamel paint, phthalic resin paint, and the like can be used.

The thermosetting clear coating material, the chemical reaction clear coating material, the dry curing clear coating material, and the like are polymerized by thermosetting, chemical reaction, or dry curing, and thus the protective film 92 can be formed densely.

As shown in fig. 33, the protective film coating liquid 91 may be applied so as to cover not only the main surface of the second optical film 83 but also the end surface of the second optical film 83. The second optical film 83 can be protected by the protective film 92 so that scratches and foreign substances do not occur not only on the main surface of the second optical film 83 but also on the end surface of the second optical film 83.

In fig. 33, the protective film coating liquid 91 does not cover the end face of the intermediate film 72, but may be applied so as to cover the end face of the intermediate film 72.

The area to which the coating liquid 91 for a protective film is applied is not limited to the pixel area on the substrate 10 and the vicinity thereof.

In addition, a mask such as a film may be attached to the substrate 10 in order to define the region to which the coating liquid 91 for a protective film is applied. The mask forms a gap between the second optical film 83 and the mask in such a manner that the second optical film 83 is not damaged when peeled off later.

As shown in fig. 34, in the protective film forming step S125, a liquid film of the protective film coating liquid 91 (see fig. 33) applied to the substrate 10 is dried to form the protective film 92. The solvent is removed from the liquid film of the coating liquid 91 for a protective film to form a protective film 92.

The protective film 92 has isotropic optical characteristics, unlike the first optical film 83. The protective film 92 preferably has a visible light transmittance of 95% or more. The thickness of the protective film 92 is preferably 10 μm or less. In order to suppress the deformation of the optical member, it is preferable that the residual stress of the protective film 92 is as small as possible.

The protective film 92 covers not only the main surface of the second optical film 83 but also the end face of the second optical film 83. The protective film 92 functions to protect the second optical film 83 so that scratches, foreign substances, and the like do not occur in the second optical film 83. The pencil hardness of the protective film 92 is preferably 2H or more.

The protective film 92 is formed only in the pixel region and its vicinity on the substrate 10, and a plurality of protective films are formed on the substrate 10 at intervals. Further, the protective film 92 may be formed over substantially the entire substrate 10 without taking out a terminal provided in the periphery of the pixel region.

The protective film 92 of the present embodiment is formed by applying the protective film coating liquid 91 to the second optical film 83 and drying the same, but may be attached to the second optical film 83 in the form of a film.

According to the present embodiment, as shown in fig. 34, a plurality of optical members 50 composed of the first optical film 63, the intermediate film 72, the second optical film 83, and the protective film 92 are formed on the substrate 10 at intervals. Therefore, multi-surface imposition of the optical member 50 can be achieved, and multi-surface imposition of the organic EL display 1 can be achieved. Further, since the optical member 50 is selectively formed in the pixel region and the vicinity thereof, the terminals provided around the pixel region can function appropriately.

< summary of optical Member Forming step of second embodiment >

As described above, according to the present embodiment, the first optical film forming step S121, the intermediate film forming step S122, and the second optical film forming step S124 are performed in this order. The intermediate film 72 is formed between the first optical film 63 and the second optical film 83. The intermediate film 72 can protect the first optical film 63 so that scratches, foreign substances, and the like do not adhere to the first optical film 63. Therefore, the quality of the optical member 50 can be improved, and it is particularly effective because when it takes time to resume the production of the optical member 50 after the production is temporarily interrupted, the risk of scratches and foreign matter adhering is high.

according to the present embodiment, after the first optical film forming step S121 and before the intermediate film forming step S122, the first optical film patterning step S123 of leaving the part 63 of the first optical film 62 and removing the remaining part of the first optical film 62 is performed. Therefore, the intermediate film 72 can cover not only the main surface of the first optical film 63 remaining after the first optical film patterning step S123 but also the end surface of the first optical film 63.

In the first optical film patterning step S123 according to the present embodiment, only a portion 63 of the first optical film 62 is made insoluble in the cleaning liquid that dissolves the first optical film 62, and thereafter, the remaining portion of the first optical film 62 is dissolved with the cleaning liquid. The part 63 of the first optical film 62 is insoluble in the cleaning liquid, and thus does not collapse in shape due to the cleaning liquid. On the other hand, the remaining portion of the first optical film 62 is not insoluble in the cleaning liquid, and therefore can be dissolved and removed by the cleaning liquid.

In accordance with the present embodiment, in the intermediate film forming step S122, the intermediate film 72 is formed so as to cover the main surface of the second optical film 63 and the end face of the first optical film 63. The intermediate film 72 can protect the first optical film 63 so that scratches, foreign substances, and the like are not generated not only on the main surface of the first optical film 63 but also on the end surface of the first optical film 63. Therefore, the quality of the optical member 50 can be improved. In the case where it takes time to resume the production of the optical member 50 after the production is temporarily interrupted, the risk of scratches and foreign matter adhering is high, and therefore, this is particularly effective.

According to the present embodiment, the protective film forming step S125 of forming the protective film 92 that protects the second optical film 83 is performed. The protective film 92 can protect the second optical film 83 from scratches, foreign substances, and the like generated in the second optical film 83 after the optical member 50 is manufactured. Therefore, the quality of the optical member 50 can be improved.

According to the present embodiment, after the second optical film forming step S124 and before the protective film forming step S125, a second optical film patterning step S126 is performed in which a part 83 of the second optical film 82 is left and the remaining part of the second optical film 82 is removed. Therefore, it is possible to cover not only the main surface of the second optical film 83 remaining after the second optical film patterning step S126 but also the end face of the second optical film 83 with the protective film 92.

In the second optical film patterning step S126 according to the present embodiment, only a portion 83 of the second optical film 82 is made insoluble in the cleaning liquid that dissolves the second optical film 82, and thereafter, the remaining portion of the second optical film 82 is dissolved with the cleaning liquid. The part 83 of the second optical film 82 is insoluble in the cleaning liquid, and thus does not collapse in shape due to the cleaning liquid. On the other hand, the remaining portion of the second optical film 82 is not dissolved in the cleaning liquid, and therefore can be dissolved and removed by the cleaning liquid.

In accordance with the present embodiment, in the protective film forming step S125, the protective film 92 is formed so as to cover the main surface of the second optical film 83 and the end face of the second optical film 83. The protective film 92 can protect the second optical film 83 so that scratches, adhesion of foreign substances, and the like are not generated not only on the main surface of the second optical film 83 but also on the end surface of the second optical film 83. Therefore, the quality of the optical member 50 can be improved. In the case where it takes time to resume the production of the optical member 50 after the production is temporarily interrupted, the risk of scratches and foreign matter adhering is high, and therefore, this is particularly effective.

< modification and improvement >

While the embodiments of the method for manufacturing an organic EL display have been described above, the present invention is not limited to the above-described embodiments, and various modifications and improvements can be made within the scope of the present invention described in the claims.

For example, the optical member 50 includes the first optical film 63, the intermediate film 72, the second optical film 83, and the protective film 92 in the above embodiment, but the present invention is not limited thereto. The optical member 50 may include optical films in which liquid crystal molecules are aligned, and the number of the optical films is not limited.

The application claims that the entire contents of Japanese patent application No. 2017-.

Description of the reference numerals

10 substrate

13 organic light emitting diode

30 sealing layer

40 touch sensor

41 first metal film

43 insulating film

45 second metal film

47 touch sensor protective film

50 optical component

61 coating liquid for first optical film

62 first optical film

63 first optical film

71 coating liquid for interlayer film

72 intermediate film

81 coating liquid for second optical film

82 second optical film

83 second optical film

Coating liquid for 91 protective film

92 protective film.

Claims

1. A method of manufacturing an organic EL display, characterized in that:

The method comprises an optical member forming step of forming an optical film in which liquid crystal molecules are aligned by applying a coating liquid for an optical film containing liquid crystal molecules and a solvent onto a substrate on which an organic light emitting diode is formed in advance and drying the coating liquid.

2. The method of manufacturing an organic EL display as claimed in claim 1, wherein:

The optical member forming step includes:

A first optical film forming step of forming a first optical film, which is either a retardation film or a polarizing film, by applying a first optical film coating liquid containing liquid crystal molecules and a solvent to the substrate on which the organic light emitting diode is formed in advance and drying the first optical film coating liquid; and

A second optical film forming step of forming a second optical film, which is the remaining one of the phase difference film and the polarizing film, by applying a coating liquid for a second optical film containing liquid crystal molecules and a solvent on the first optical film and drying the same, after the first optical film forming step.

3. The method of manufacturing an organic EL display as claimed in claim 2, wherein:

The optical member forming step includes an intermediate film forming step of forming an intermediate film by applying a coating liquid for an intermediate film different from the coating liquid for the first optical film to the first optical film and drying the coating liquid, after the first optical film forming step and before the second optical film forming step.

4. The method of manufacturing an organic EL display as claimed in claim 3, wherein:

The optical member forming step includes a first optical film patterning step of removing a remaining portion of the first optical film using the intermediate film covering only a portion of the first optical film as a mask after the intermediate film forming step and before the second optical film forming step.

5. The method of manufacturing an organic EL display as claimed in claim 4, wherein:

In the first optical film patterning step, a cleaning solution that dissolves the first optical film is used.

6. The method of manufacturing an organic EL display as claimed in claim 5, wherein:

In the first optical film forming step, only the part of the first optical film is made insoluble in the cleaning liquid used in the first optical film patterning step.

7. The method of manufacturing an organic EL display as claimed in claim 5 or 6, wherein:

In the intermediate film forming step, the coating liquid for an intermediate film is applied only to the part of the first optical film, whereby only the part of the first optical film is made insoluble in the cleaning liquid used in the first optical film patterning step.

8. The method of manufacturing an organic EL display as claimed in claim 3, wherein:

The optical member forming step includes a first optical film patterning step of leaving a part of the first optical film and removing the remaining part of the first optical film after the first optical film forming step and before the intermediate film forming step.

9. The method of manufacturing an organic EL display as claimed in claim 8, wherein:

In the first optical film patterning step, only the part of the first optical film is made insoluble in a cleaning liquid that dissolves the first optical film, and thereafter, the remaining part of the first optical film is dissolved with the cleaning liquid.

10. The method of manufacturing an organic EL display as claimed in claim 8 or 9, wherein:

In the intermediate film forming step, the intermediate film is formed so as to cover a main surface of the first optical film and an end surface of the first optical film.

11. the method for manufacturing an organic EL display as claimed in any one of claims 3 to 10, wherein:

The optical member forming step includes a protective film forming step of forming a protective film for protecting the second optical film by applying a coating liquid for a protective film different from the coating liquid for the second optical film on the second optical film and drying it after the second optical film forming step.

12. The method of manufacturing an organic EL display as claimed in claim 11, wherein:

The optical member forming step includes a second optical film patterning step of removing a remaining portion of the second optical film using the protective film covering only a portion of the second optical film as a mask after the protective film forming step.

13. The method of manufacturing an organic EL display as claimed in claim 12, wherein:

In the second optical film patterning step, a cleaning solution that dissolves the second optical film is used.

14. The method of manufacturing an organic EL display as claimed in claim 13, wherein:

In the second optical film forming step, only the part of the second optical film is made insoluble in the cleaning liquid used in the second optical film patterning step.

15. The method of manufacturing an organic EL display as claimed in claim 13 or 14, wherein:

In the protective film forming step, the protective film coating liquid is applied only to the part of the second optical film, whereby only the part of the second optical film is made insoluble in the cleaning liquid used in the second optical film patterning step.

16. The method of manufacturing an organic EL display as claimed in claim 11, wherein:

The optical member forming step includes a second optical film patterning step of leaving a part of the second optical film and removing the remaining part of the second optical film after the second optical film forming step and before the protective film forming step.

17. The method of manufacturing an organic EL display as claimed in claim 16, wherein:

In the second optical film patterning step, only the part of the second optical film is made insoluble in a cleaning liquid that dissolves the second optical film, and thereafter, the remaining part of the second optical film is dissolved with the cleaning liquid.

18. The method of manufacturing an organic EL display as claimed in claim 16 or 17, wherein:

In the protective film forming step, the protective film is formed so as to cover a main surface of the second optical film and an end surface of the second optical film.

19. The method for manufacturing an organic EL display as claimed in any one of claims 1 to 18, wherein:

Including a touch sensor forming step of forming a touch sensor on the substrate on which the organic light emitting diode is previously formed, before the optical member forming step,

The touch sensor forming step includes:

Forming a light-shielding first metal film on the substrate on which the organic light-emitting diode is formed in advance;

a step of selectively removing a part of the first metal film by photolithography and etching;

A step of forming an insulating film on the first metal film from which a part is selectively removed;

A step of forming a light-shielding second metal film on the insulating film; and

A step of selectively removing a part of the second metal film by photolithography and etching.