JP6749485B2 - Method for manufacturing organic EL display - Google Patents

Description

The present invention relates to a method for manufacturing an organic EL display.

For example, in a display using an organic light emitting diode (OLED) (hereinafter, also referred to as “organic EL (Electro Luminescence) display”), a circularly polarizing plate is used to suppress reflection of external light. There is. The circularly polarizing plate is produced by laminating a linearly polarizing plate and a wave plate (retarder) so that their polarization axes intersect at 45 degrees.

Also, for example, only the wave plate may be formed so that its polarization axis is inclined at 15 degrees or 75 degrees. Therefore, it is necessary to form the polarizing plate and the wave plate at an arbitrary angle. Further, since the polarization axes of the polarizing plate and the wave plate are intersected at an arbitrary angle, it is necessary to individually form the polarizing plate and the wave plate.

Conventionally, such a polarizing plate and a wave plate are produced using a stretched film, for example. The stretched film is obtained by orienting the molecules in the material in one direction by stretching and sticking the film in one direction.

By the way, in recent years, along with the thinning of organic EL displays, there has been a demand for thinner polarizing plates and wavelength plates. However, in the case where a stretched film is used as in the prior art in producing a polarizing plate or a wave plate, there is a limit to reducing the film thickness of the stretched film itself, and a sufficiently thin plate cannot be obtained.

Therefore, a thin plate is achieved by applying a coating liquid having a predetermined material on a substrate to form a polarizing plate and a wave plate having a required film thickness. Specifically, for example, a coating liquid having a liquid crystallinity is applied as a predetermined material to a substrate, and is cast and oriented. The liquid crystal molecules form a supramolecular aggregate in the coating liquid, and when the coating liquid is made to flow while applying shear stress, the long axis direction of the supramolecular aggregate is oriented in the flow direction.

In order to make it possible to apply the coating liquid to the substrate in this way, various devices have been conventionally proposed. For example, the polarizing film printer described in Patent Document 1 has a table for holding a substrate and a slot die for ejecting ink liquid onto the substrate. The slot die is moved in the printing direction to apply the ink liquid to the substrate.

Japanese Patent Laid-Open No. 2005-62502

A technique for forming an optical member such as a circularly polarizing plate by applying a coating liquid on a substrate and drying the substrate has been developed and studied.

Conventionally, the substrate on which the coating liquid for the optical member is applied has been prepared and attached separately from the substrate on which the organic light emitting diode is formed.

Therefore, the number of components such as the substrate and the adhesive layer is large, the organic EL display is not sufficiently thin, and the flexibility of the organic EL display is not sufficient.

The present invention has been made in view of the above problems, and a main object of the present invention is to provide an organic EL display including an optical member, which is thin and has improved flexibility.

To solve the above problems, according to one embodiment of the present invention,
On a substrate an organic light emitting diode is formed in advance by drying the coated optical film coating solution containing liquid crystal molecules and a solvent, possess an optical member forming step in which the liquid crystal molecules form an optical film that is oriented ,
The optical member forming step,
By applying a first optical film coating liquid containing liquid crystal molecules and a solvent onto the substrate on which the organic light emitting diode is formed in advance and drying the liquid crystal, a first optical film as a phase difference film or a polarizing film is obtained. A first optical film forming step of forming one optical film;
After the step of forming the first optical film, a coating solution for the second optical film containing liquid crystal molecules and a solvent is applied onto the first optical film and dried, whereby the remaining parts of the retardation film and the polarizing film are removed. A second optical film forming step of forming one second optical film;
After the first optical film forming step and before the second optical film forming step, an intermediate film coating solution different from the first optical film coating solution is applied on the first optical film. An intermediate film forming step of forming an intermediate film by drying,
After the intermediate film forming step and before the second optical film forming step, the intermediate film that covers only a part of the first optical film is used as a mask to remove the remaining portion of the first optical film. And a first optical film patterning step for manufacturing the organic EL display.

According to one aspect of the present invention, there is provided an organic EL display including an optical member, which is thin and has improved flexibility.

FIG. 3 is a plan view showing an organic EL display according to one embodiment. FIG. 3 is a cross-sectional view showing a main part of an organic EL display according to an embodiment. 6 is a flowchart showing a method for manufacturing an organic EL display according to an embodiment. 6 is a flowchart illustrating a touch sensor forming process according to an embodiment. FIG. 6 is a cross-sectional view showing a first metal film formed on a substrate according to an embodiment. FIG. 6 is a cross-sectional view showing a resist film formed on a first metal film according to an embodiment. FIG. 6 is a cross-sectional view showing a resist film after exposure and development according to one embodiment. FIG. 6 is a cross-sectional view showing a first metal film after etching according to an embodiment. FIG. 6 is a cross-sectional view showing the first metal film after the resist film is removed according to one embodiment. FIG. 6 is a cross-sectional view showing an insulating film formed on a first metal film according to an embodiment. FIG. 6 is a plan view showing a state after the second metal film formed on the insulating film according to one embodiment is partially removed. 6 is a flowchart showing an optical member forming process according to the first embodiment. FIG. 4 is a side view showing a liquid film of a first optical film coating liquid applied on the substrate according to the first embodiment. FIG. 6 is a side view showing the first optical film formed by drying the liquid film of the first optical film coating liquid according to the first embodiment. FIG. 4 is a side view showing the partially insolubilized first optical film according to the first embodiment. FIG. 6 is a side view showing a liquid film of an intermediate film coating liquid applied on the first optical film according to the first embodiment. FIG. 3 is a side view showing an intermediate film formed by drying a liquid film of an intermediate film coating liquid according to the first embodiment. FIG. 6 is a side view showing the first optical film in which a portion not covered with the intermediate film according to the first embodiment is removed. FIG. 6 is a side view showing a liquid film of a second optical film coating liquid applied onto the intermediate film according to the first embodiment. FIG. 6 is a side view showing the second optical film formed by drying the liquid film of the second optical film coating liquid according to the first embodiment. FIG. 4 is a side view showing the partially insolubilized second optical film according to the first embodiment. FIG. 6 is a side view showing a liquid film of a protective film coating liquid applied on the second optical film according to the first embodiment. FIG. 3 is a side view showing a protective film formed by drying a liquid film of a protective film coating liquid according to the first embodiment. FIG. 6 is a side view showing the second optical film in which the portion not covered with the protective film according to the first embodiment is removed. It is a flow chart which shows an optical member formation process by a 2nd embodiment. It is a side view which shows the 1st optical film from which the part which was not made insolubilized by 2nd Embodiment was removed. FIG. 11 is a side view showing a liquid film of an intermediate film coating liquid applied on the first optical film according to the second embodiment. FIG. 8 is a side view showing an intermediate film formed by drying a liquid film of an intermediate film coating liquid according to the second embodiment. FIG. 11 is a side view showing a liquid film of a second optical film coating liquid applied on the intermediate film according to the second embodiment. It is a side view which shows the 2nd optical film formed by drying the liquid film of the coating liquid for 2nd optical films by 2nd Embodiment. FIG. 8 is a side view showing a partially insolubilized second optical film according to the second embodiment. It is a side view which shows the 2nd optical film from which the part which was not made insolubilized by 2nd Embodiment was removed. FIG. 9 is a side view showing a liquid film of a protective film coating liquid applied on a second optical film according to the second embodiment. FIG. 9 is a side view showing a protective film formed by drying a liquid film of a protective film coating liquid according to the second embodiment.

Embodiments for carrying out the present invention will be described below with reference to the drawings. In each of the drawings, the same or corresponding components are designated by the same or corresponding reference numerals and the description thereof is omitted.

<Organic EL display>
FIG. 1 is a plan view showing an organic EL display according to an embodiment. In FIG. 1, the circuit of one unit circuit 11 is enlarged and shown.

The organic EL display 1 includes a substrate 10, a plurality of unit circuits 11 arranged on the substrate 10, a scanning line driving circuit 14 provided on the substrate 10, and a data line driving circuit 15 provided on the substrate 10. Have. The unit circuit 11 is provided in a region surrounded by the plurality of scanning lines 16 connected to the scanning line driving circuit 14 and the plurality of data lines 17 connected to the data line driving circuit 15. The unit circuit 11 includes a TFT layer 12 and an organic light emitting diode 13.

The TFT layer 12 has a plurality of TFTs (Thin Film Transistor). One TFT has a function as a switching element, and the other TFT has a function as a current control element for controlling the amount of current flowing through the organic light emitting diode 13. The TFT layer 12 is operated by the scanning line driving circuit 14 and the data line driving circuit 15, and supplies a current to the organic light emitting diode 13. The TFT layer 12 is provided for each unit circuit 11, and the plurality of unit circuits 11 are independently controlled. The TFT layer 12 may have a general structure and is not limited to the structure shown in FIG.

The driving method of the organic EL display 1 is the active matrix method in this embodiment, but may be the passive matrix method.

FIG. 2 is a sectional view showing a main part of the organic EL display according to the embodiment. The organic EL display 1 shown in FIG. 2 is a top emission type and has a substrate 10, an organic light emitting diode 13, a sealing layer 30, a touch sensor 40, and an optical member 50 in this order. The touch sensor 40 is incorporated in the organic EL display 1 when the organic EL display 1 is a touch panel.

The substrate 10 may be a resin substrate, a glass substrate, a semiconductor substrate, a metal substrate, or the like, and is preferably a resin substrate from the viewpoint of improving flexibility. The substrate 10 may be a laminated substrate of a resin substrate and a glass substrate from the viewpoint of improving flexibility and reducing moisture permeability. A TFT layer 12 is formed on the substrate 10. A flattening layer 18 that flattens the steps formed by the TFT layer 12 is formed on the TFT layer 12.

The flattening layer 18 has an insulating property. A contact plug 19 is formed in the contact hole penetrating the flattening layer 18. The contact plug 19 electrically connects the pixel electrode 21 formed on the flat surface of the flattening layer 18 and the TFT layer 12. The contact plug 19 may be formed of the same material as the pixel electrode 21 at the same time.

The organic light emitting diode 13 is formed on the flat surface of the flattening layer 18. The organic light emitting diode 13 has a pixel electrode 21, a counter electrode 22 provided on the opposite side of the substrate 10 with respect to the pixel electrode 21, and an organic layer 23 formed between the pixel electrode 21 and the counter electrode 22. .. By operating the TFT layer 12, a voltage is applied between the pixel electrode 21 and the counter electrode 22, and the organic layer 23 emits light.

The pixel electrode 21 is, for example, a cathode, is made of a metal material such as aluminum, and reflects light from the organic layer 23 toward the organic layer 23. The light reflected by the pixel electrode 21 passes through the organic layer 23 and the counter electrode 22 and is extracted to the outside. The pixel electrode 21 is provided for each unit circuit 11.

The counter electrode 22 is, for example, an anode, is made of a transparent material such as ITO (Indium Tin Oxide), and transmits light from the organic layer 23. The light transmitted through the counter electrode 22 passes through the sealing layer 30, the touch sensor 40, and the optical member 50 and is extracted to the outside. The counter electrode 22 is common to the plurality of unit circuits 11.

The organic layer 23 has, for example, an electron injection layer 24, an electron transport layer 25, a light emitting layer 26, a hole transport layer 27, and a hole injection layer 28 in this order from the cathode side to the anode side. When a voltage is applied between the cathode and the anode, electrons are injected from the cathode into the electron injection layer 24, and holes are injected from the anode into the hole injection layer 28. The electrons injected into the electron injection layer 24 are transported to the light emitting layer 26 by the electron transport layer 25. The holes injected into the hole injection layer 28 are transported to the light emitting layer 26 by the hole transport layer 27. Then, holes and electrons are recombined in the light emitting layer 26, the light emitting material of the light emitting layer 26 is excited, and the light emitting layer 26 emits light. As the light emitting layer 26, for example, a red light emitting layer that emits red light, a green light emitting layer that emits green light, and a blue light emitting layer that emits blue light are formed.

In the present embodiment, the organic layer 23 includes an electron injection layer 24, an electron transport layer 25, a light emitting layer 26, a hole transport layer 27, and a hole injection layer 28 in this order from the cathode side to the anode side. However, it is sufficient that at least the light emitting layer 26 is provided. The organic layer 23 is not limited to the configuration shown in FIG.

The sealing layer 30 seals the organic light emitting diode 13 with the substrate 10. A silicon oxide layer, a silicon nitride layer, or the like is used as the sealing layer 30, and is formed by, for example, low temperature CVD at a film forming temperature of 100° C. or less. Alternatively, a resin film on which a moisture-proof layer is formed may be attached to form the sealing layer 30.

The touch sensor 40 detects contact or proximity of an object such as a finger to the screen of the organic EL display 1. The detection method of the touch sensor 40 is not particularly limited, but may be, for example, a capacitance method. As the electrostatic capacity method, there are a surface type electrostatic capacity method and a projection type electrostatic capacity method. The projected electrostatic capacity method includes a self-capacitance method, a mutual capacitance method, and the like. It is preferable to use the mutual capacitance method because simultaneous multipoint detection is possible.

The touch sensor 40, which will be described in detail later, is formed on the substrate 10 on which the organic light emitting diode 13 is formed in advance. Therefore, as compared with the case where the touch sensor 40 is formed on a substrate different from the substrate 10 and is bonded to the substrate 10 as in the related art, the number of components such as the substrate and the adhesive layer can be reduced, so that the organic EL display 1 can be realized. The thickness can be reduced and the flexibility of the organic EL display 1 can be improved.

The touch sensor 40 is formed between the organic light emitting diode 13 and the optical member 50. When the optical member 50 is a circularly polarizing film that suppresses reflection of external light, the circularly polarizing film is disposed on the light extraction side of the touch sensor 40, so that the efficiency of suppressing external light reflection can be improved.

The optical member 50 is, for example, a circularly polarizing film that suppresses reflection of external light. In this embodiment, the optical member 50 has a quarter wavelength film (λ/4 film) as the first optical film and a linear film as the second optical film. And a polarizing film. The quarter-wave film and the linear polarization film are formed so that their polarization axes intersect at 45 degrees. The number of optical films forming the optical member 50 is not particularly limited.

The optical member 50, which will be described in detail later, is formed on the substrate 10 on which the organic light emitting diode 13 is formed in advance. Therefore, the number of components such as the substrate and the adhesive layer can be reduced as compared with the case where the optical member 50 is formed on a substrate different from the substrate 10 and is bonded to the substrate 10 as in the conventional case. The thickness can be reduced and the flexibility of the organic EL display 1 can be improved.

The optical member 50 suppresses deterioration of the organic layer 23 due to ultraviolet rays, and thus is manufactured without using ultraviolet irradiation. Further, the optical member 50 is manufactured at a temperature of 100° C. or lower in order to suppress deterioration of the organic layer 23 due to heat.

The organic EL display 1 shown in FIG. 2 is a top emission type, but may be a bottom emission type. In the case of the bottom emission system, light from the light emitting layer 26 passes through the pixel electrode 21 and is extracted from the substrate 10. Therefore, the anode, which is a transparent electrode, is used as the pixel electrode 21, and the cathode, which is a reflective electrode, is used as the counter electrode 22. To be That is, in the case of the bottom emission type, the arrangement of the anode and the cathode is reversed. In the case of the bottom emission type, the substrate 10 is a transparent substrate. Further, in the case of the bottom emission type, the touch sensor 40 and the optical member 50 are formed on the side opposite to the organic light emitting diode 13 with the substrate 10 as a reference.

<Method for manufacturing organic EL display>
FIG. 3 is a flowchart showing a method for manufacturing an organic EL display according to an embodiment. As shown in FIG. 3, the method for manufacturing the organic EL display 1 includes a touch sensor forming step S110 and an optical member forming step S120. The touch sensor forming step S110 is performed when the organic EL display 1 is a touch panel. Each step will be described below.

<Touch sensor formation process>
In the touch sensor forming step S110, the touch sensor 40 is formed on the substrate 10 on which the organic light emitting diode 13 is formed in advance, before the optical member forming step S120. Therefore, as compared with the case where the touch sensor 40 is formed on a substrate different from the substrate 10 and is bonded to the substrate 10 as in the related art, the number of components such as the substrate and the adhesive layer can be reduced, so that the organic EL display 1 can be realized. The thickness can be reduced and the flexibility of the organic EL display 1 can be improved.

FIG. 4 is a flowchart showing a touch sensor forming process according to an embodiment. FIG. 5 is a cross-sectional view showing a first metal film formed on a substrate according to an embodiment. FIG. 6 is a cross-sectional view showing a resist film formed on the first metal film according to one embodiment. FIG. 7 is a sectional view showing a resist film after exposure and development according to one embodiment. FIG. 8 is a cross-sectional view showing the first metal film after etching according to the embodiment. FIG. 9 is a cross-sectional view showing the first metal film after the removal of the resist film according to the embodiment. FIG. 10 is a cross-sectional view showing an insulating film formed on the first metal film according to one embodiment. FIG. 11 is a plan view showing a state after the second metal film formed on the insulating film according to the embodiment is partially removed. 5 to 10 are sectional views taken along the line AA of FIG. 11. 5 to 11, the illustration of the organic light emitting diode 13 and the sealing layer 30 shown in FIG. 2 is omitted.

The touch sensor forming step S110 includes a step S111 of forming the light shielding first metal film 41 on the substrate 10 and a step S112 of selectively removing a part of the first metal film 41 by a photolithography method and an etching method. Have. The first metal film 41 is formed on the substrate 10 (more specifically, for example, the sealing layer 30) as shown in FIG. A resist film 42 is formed on the first metal film 41 as shown in FIG. The resist film 42 is patterned by exposure and development as shown in FIG. The resist film 42 may be a positive type in which the exposed portion is removed by the development or a negative type in which the exposed portion remains after the development. Since the exposure light is blocked by the first metal film 41, the organic light emitting diode 13 is not deteriorated. Then, using the patterned resist film 42 as a mask, a part of the first metal film 41 is selectively removed as shown in FIG. The first metal film 41 from which a part is selectively removed is formed in a striped shape in plan view as shown by a broken line in FIG. After that, the resist film 42 used for patterning the first metal film 41 is removed as shown in FIG.

In the present specification, that the first metal film 41 has a light shielding property means that the transmittance of the first metal film 41 is 5% or less. The transmittance of the first metal film 41 is preferably 3% or less. Here, the transmittance of the first metal film 41 is the ratio of the exposure light (for example, light having a wavelength of 365 nm) of the resist film 42 formed on the first metal film 41 to the first metal film 41. is there. The first metal film 41 is formed of copper, for example.

In addition, the touch sensor forming step S110 includes a step S113 of forming the insulating film 43 on the first metal film 41, a portion of which has been selectively removed. The insulating film 43 insulates the first metal film 41 and the second metal film 45 from each other. A silicon oxide film, a silicon nitride film, or the like is used as the insulating film 43, and is formed by, for example, low temperature CVD at a film forming temperature of 100° C. or lower.

Further, in the touch sensor forming step S110, a step S114 of forming the light shielding second metal film 45 on the insulating film 43 and a part of the second metal film 45 are selectively removed by the photolithography method and the etching method. And step S115. The formation of the second metal film 45 and the partial removal of the second metal film are performed in the same manner as the formation of the first metal film 41 and the partial removal of the first metal film 41. The second metal film 45, a portion of which is selectively removed, is formed in a striped shape in plan view as shown in FIG. After that, the resist film used for patterning the second metal film 45 is removed.

In the present specification, the second metal film 45 having a light shielding property means that the transmittance of the second metal film 45 is 5% or less. The transmittance of the second metal film 45 is preferably 3% or less. Here, the transmittance of the second metal film 45 is the ratio of the exposure light (for example, the light having a wavelength of 365 nm) of the resist film formed on the second metal film 45, which is transmitted through the second metal film 45. .. The second metal film 45 is formed of copper, for example.

Further, the touch sensor forming step S110 includes a step S116 of forming the touch sensor protective film 47 on the second metal film 45, which is partially removed. The touch sensor protective film 47 is formed similarly to the insulating film 43. For example, a silicon oxide film, a silicon nitride film, or the like is used as the touch sensor protective film 47, and is formed by, for example, low temperature CVD at a film forming temperature of 100° C. or less.

In this way, the touch sensor 40 including the first metal film 41, the insulating film 43, the second metal film 45, and the touch sensor protective film 47 is obtained. The wire-shaped first metal film 41 and the wire-shaped second metal film 45 are formed in a square lattice shape as shown in FIG. 11 so as not to overlap the organic layer 23 of the organic light emitting diode 13 in a plan view. That is, the organic layer 23 is disposed in the openings of the square lattice in plan view. It is easy to take out the light from the organic layer 23 to the outside. One of the first metal film 41 and the second metal film 45 is used as a driving electrode, and the other one is used as a receiving electrode. The touch sensor 40 detects contact or proximity of an object such as a finger to the screen of the organic EL display 1 by detecting a capacitance change between the driving electrode and the receiving electrode.

According to the touch sensor forming step S110 of the present embodiment, the touch sensor 40 is formed on the substrate 10 on which the organic light emitting diode 13 is formed in advance while suppressing the deterioration of the organic layer 23 of the organic light emitting diode 13 due to the exposure of the photolithography method. Can be formed. Compared with the case where the touch sensor 40 is formed on a substrate different from the substrate 10 as in the past and is bonded to the substrate 10, the number of components such as the substrate and the adhesive layer can be reduced, and thus the organic EL display 1 can be made thin. Therefore, the flexibility of the organic EL display 1 can be improved.

Since the touch sensor forming step S110 of this embodiment is performed before the optical member forming step S120, the touch sensor 40 is formed between the organic light emitting diode 13 and the optical member 50. When the optical member 50 is a circularly polarizing film that suppresses reflection of external light, the circularly polarizing film is disposed on the light extraction side of the touch sensor 40, so that the efficiency of suppressing external light reflection can be improved.

<Optical member forming step>
In the optical member forming step S120, the optical film coating liquid containing the liquid crystal molecules and the solvent is applied onto the substrate 10 on which the organic light emitting diode 13 is preliminarily formed, and dried to form an optical film in which the liquid crystal molecules are aligned. Form. The optical member 50 is composed of an optical film or the like.

The optical member 50 has, for example, a first optical film and a second optical film. One of the first optical film and the second optical film is a retardation film, and the other one is a polarizing film.

The optical member 50 is, for example, a circularly polarizing film that suppresses reflection of external light. In the present embodiment, the optical member 50 has a quarter wavelength film (λ/4 film) as the first optical film and a linear film as the second optical film. And a polarizing film. The quarter-wave film and the linear polarization film are formed so that their polarization axes intersect at 45 degrees. The number of optical films forming the optical member 50 is not particularly limited.

According to the optical member forming step S120 of the present embodiment, the optical member 50 is formed on the substrate 10 on which the organic light emitting diode 13 is formed in advance. Therefore, the number of components such as the substrate and the adhesive layer can be reduced as compared with the case where the optical member 50 is formed on a substrate different from the substrate 10 and is bonded to the substrate 10 as in the related art. The thickness can be reduced and the flexibility of the organic EL display 1 can be improved.

According to the optical member forming step S120 of the present embodiment, the optical member 50 is manufactured without using ultraviolet irradiation in order to suppress deterioration of the organic layer 23 due to ultraviolet rays. Further, the optical member 50 is manufactured at a temperature of 100° C. or lower in order to suppress deterioration of the organic layer 23 due to heat.

<Optical Member Forming Step of First Embodiment>
FIG. 12 is a flowchart showing the optical member forming process according to the first embodiment. As shown in FIG. 12, the optical member forming step S120 includes a first optical film forming step S121, an intermediate film forming step S122, a first optical film patterning step S123, a second optical film forming step S124, and protection. It has a film forming step S125 and a second optical film patterning step S126 in this order. Each step will be described below.

Note that all the steps shown in FIG. 12 may not be performed. For example, as will be described later in detail, the first optical film patterning step S123 and the second optical film patterning step S126 are effective when a plurality of optical members 50 are formed on the substrate 10 at intervals, but It may be omitted when only one member 50 is formed on the substrate 10. The same applies to the partial insolubilization process described later.

Further, steps other than the steps shown in FIG. 12 may be performed. For example, before the first optical film forming step S121, in order to improve the adhesion of the first optical film to the substrate 10, the surface of the substrate 10 on which the first optical film is formed (more specifically, the sealing layer 30). Alternatively, a step of modifying the surface of the touch sensor protective film 47) may be performed. As the surface modification film, an organic film such as a silane coupling agent or an inorganic film such as silicon nitride may be formed.

<First Optical Film Forming Step of First Embodiment>
In the first optical film forming step S121 of FIG. 12, as shown in FIGS. 13 to 15, the first optical film coating liquid 61 containing liquid crystal molecules and a solvent is applied onto the substrate 10 and dried to form a first optical film. The optical film 62 is formed. The first optical film 62 is, for example, a 1/4 wavelength film.

FIG. 13 is a side view showing the liquid film of the first optical film coating liquid applied on the substrate according to the first embodiment. FIG. 14 is a side view showing the first optical film formed by drying the liquid film of the coating liquid for the first optical film according to the first embodiment. FIG. 15 is a side view showing the partially insolubilized first optical film according to the first embodiment.

13 to 15, the illustration of the organic light emitting diode 13 and the sealing layer 30 shown in FIG. 2 is omitted. 16 to 24, similarly, the illustration of the organic light emitting diode 13, the sealing layer 30 and the like shown in FIG. 2 is omitted.

As shown in FIG. 13, in the first optical film forming step S121, the coating liquid 61 for the first optical film is applied onto the substrate 10 from the application nozzle 60. The coating nozzle 60 is, for example, a slit coater having a slit-shaped discharge port on the lower surface.

The first optical film coating liquid 61 contains liquid crystal molecules such as lyotropic liquid crystal molecules and thermotropic liquid crystal molecules, and a solvent that dissolves the liquid crystal molecules. For example, water is used as the solvent. An organic solvent may be used as the solvent.

By moving the coating nozzle 60 and the substrate 10 relatively in one direction, shear stress can be applied to the first optical film coating liquid 61 coated on the substrate 10. The acting direction of the shear stress coincides with the relative moving direction of the coating nozzle 60 and the substrate 10. By controlling the action direction of the shear stress, the alignment direction of the liquid crystal molecules can be controlled.

In the present embodiment, the slit coater is used for coating the first optical film coating liquid 61, but a dip coater or the like may be used. It suffices that a shear stress can be applied to the first optical film coating liquid 61 and the action direction of the shear stress can be controlled.

As shown in FIG. 14, in the first optical film forming step S121, the liquid film (see FIG. 13) of the first optical film coating liquid 61 applied on the substrate 10 is dried to form the first optical film 62. Form. The solvent is removed from the liquid film of the first optical film coating liquid 61, and the alignment of the liquid crystal molecules is appropriately maintained. The first optical film 62 is, for example, a 1/4 wavelength film.

For drying the liquid film of the first optical film coating liquid 61, vacuum drying, natural drying, heat drying, air drying or the like is used. The reduced pressure drying can shorten the processing time more than the natural drying. Further, the reduced-pressure drying can suppress the convection of the liquid film and the disturbance of the alignment of the liquid crystal molecules as compared with the heating drying and the air drying. When the solvent remains after drying under reduced pressure, heat drying may be further performed.

As shown in FIG. 15, in the first optical film forming step S121, only a part 63 of the first optical film 62 may be insolubilized in the cleaning liquid used in the first optical film patterning step S123. This partial insolubilization is performed as needed.

As the cleaning liquid used in the first optical film patterning step S123, the same solvent as the solvent of the first optical film coating liquid 61 may be used, for example, water may be used. In this case, insolubilization in water is performed.

The fixing liquid 110 that insolubilizes the part 63 of the first optical film 62 is ejected from, for example, an inkjet coating nozzle 111. The application nozzle 111 has a plurality of ejection nozzles for ejecting droplets of the fixing liquid 110 on the lower surface.

The fixing liquid 110 is selectively applied to the part 63 of the first optical film 62 by ejecting droplets of the fixing liquid 110 from the applying nozzle 111 while moving the coating nozzle 111 and the substrate 10 relatively. .. As a result, the part 63 of the first optical film 62 is insolubilized.

The fixing liquid 110 replaces the part 63 of the first optical film 62 by, for example, substituting a functional group at the end of the first optical film 62 (for example, a water-soluble functional group such as an OH group) with another functional group. Insolubilize. Further, the fixing liquid 110 may be polymerized by a condensation reaction (for example, a dehydration condensation reaction of an OH group or the like) to insolubilize a part 63 of the first optical film 62. In the latter case, compared with the former case, the polymerization proceeds, and thus the insolubilization is likely to proceed.

The fixing liquid 110 is removed after insolubilizing the part 63 of the first optical film 62. The fixing liquid 110 may include water or an organic solvent.

The area to which the fixing liquid 110 is applied may be, for example, an area in which a plurality of pixels such as an OLED is formed (hereinafter, also referred to as “pixel area”).

In addition, in this embodiment, since the fixing liquid 110 is applied only to the part 63 of the first optical film 62, the ink jet type application nozzle 111 is used, but the present invention is not limited to this. For example, only the remaining portion of the first optical film 62 may be covered with a mask, and then the entire substrate 10 may be dipped in the fixing liquid 110 to apply the fixing liquid only to the part 63 of the first optical film 62.

<Intermediate film forming step of the first embodiment>
In the intermediate film forming step S122 of FIG. 12, as shown in FIGS. 16 to 17, an intermediate film coating liquid 71 different from the first optical film coating liquid 61 is applied onto the first optical film 62 and dried. Thus, the intermediate film 72 is formed.

FIG. 16 is a side view showing a liquid film of an intermediate film coating liquid applied on the first optical film according to the first embodiment. FIG. 17 is a side view showing the intermediate film formed by drying the liquid film of the coating liquid for intermediate film according to the first embodiment.

As shown in FIG. 16, in the intermediate film formation step S122, the intermediate film coating liquid 71 is applied from the application nozzle 70 onto the substrate 10 on which the first optical film 62 is formed. The coating nozzle 70 may be an inkjet type, and has a plurality of discharge nozzles for discharging droplets of the intermediate film coating liquid 71 on the lower surface.

By ejecting a droplet of the intermediate film coating liquid 71 from the coating nozzle 70 while moving the coating nozzle 70 and the substrate 10 relatively, the intermediate film coating liquid 71 is applied to a part 63 of the first optical film 62. Is selectively applied.

The intermediate film coating liquid 71 is applied onto the first optical film 62. Therefore, the liquid crystal molecules forming the first optical film 62 may be insoluble in the solvent of the intermediate film coating liquid 71. It is possible to prevent the first optical film 62 from being melted by applying the intermediate film coating liquid 71.

The intermediate film coating liquid 71 contains an organic material that forms the intermediate film 72 and a solvent that dissolves the organic material. The organic material forming the intermediate film 72 includes a polymer insoluble in the cleaning liquid used in the first optical film patterning step S123.

As the intermediate film coating liquid 71, for example, a thermosetting transparent coating material, a chemical reaction type transparent coating material, a dry curing type transparent coating material, or the like is used. Specifically, oil-based enamel paint, phthalic acid resin paint, etc. are used.

A thermosetting transparent coating material, a chemical reaction type transparent coating material, a dry curing type transparent coating material and the like are polymerized by heat curing, chemical reaction or dry curing, so that a dense intermediate film 72 can be formed. Therefore, the insolubility of the intermediate film 72 with respect to the cleaning liquid used in the first optical film patterning step S123 can be improved.

The intermediate film coating liquid 71 may have the same function as the fixing liquid 110. It is possible to promote partial insolubilization of the first optical film 62. When partially insolubilizing the first optical film 62 with the intermediate film coating liquid 71, it is not necessary to partially insolubilize the first optical film 62 in the first optical film forming step S121.

For example, the coating liquid 71 for intermediate film replaces the functional group at the end of the first optical film 62 (for example, a water-soluble functional group such as an OH group) with another functional group, and The part 63 may be insolubilized. The intermediate film coating liquid 71 may be polymerized by a condensation reaction (for example, a dehydration condensation reaction of an OH group) to insolubilize a part 63 of the first optical film 62. In the latter case, compared with the former case, the polymerization proceeds, and thus the insolubilization is likely to proceed.

The area where the intermediate film coating liquid 71 is applied may coincide with the area where the fixing liquid 110 is applied. For example, the region to which the intermediate film coating liquid 71 is applied may be a pixel area on the substrate 10.

As shown in FIG. 17, in the intermediate film forming step S122, the liquid film (see FIG. 16) of the intermediate film coating liquid 71 applied on the substrate 10 is dried to form the intermediate film 72. The solvent is removed from the liquid film of the intermediate film coating liquid 71 to form the intermediate film 72.

For drying the liquid film of the intermediate film coating liquid 71, vacuum drying, natural drying, heat drying, air drying, or the like is used. The reduced pressure drying can shorten the processing time more than the natural drying. When the solvent remains after drying under reduced pressure, heat drying may be further performed.

The intermediate film 72 is insoluble in the cleaning liquid used in the first optical film patterning step S123. Unlike the first optical film 62, the intermediate film 72 has isotropic optical characteristics. The visible light transmittance of the intermediate film 72 is preferably 95% or more. The thickness of the intermediate film 72 is preferably 10 μm or less. Further, the residual stress of the intermediate film 72 is preferably as small as possible in order to suppress the deformation of the optical member.

The intermediate film 72 covers the main surface of the part 63 of the first optical film 62. The intermediate film 72 also plays a role of protecting the part 63 of the first optical film 62 so as to prevent the part 63 of the first optical film 62 from being scratched or foreign matter. The pencil hardness of the intermediate film 72 is preferably 2H or more. This is particularly effective when the manufacturing of the optical member is temporarily interrupted on the way and it takes a long time to restart it, because there is a high risk of scratches and foreign substances.

Since the remaining portion of the first optical film 62 is removed in the first optical film patterning step S123, scratches and foreign matters do not pose a problem. Further, the foreign matter attached to the intermediate film 72 can be removed by washing, and the washing does not damage the part 63 of the first optical film 62.

<First Optical Film Patterning Step of First Embodiment>
In the first optical film patterning step S123 of FIG. 12, after the intermediate film forming step S122 and before the second optical film forming step S124, an intermediate portion that covers only a part 63 (see FIG. 17) of the first optical film 62 is formed. Using the film 72 as a mask, the remaining portion of the first optical film 62 is removed as shown in FIG.

FIG. 18 is a side view showing the first optical film in which the portion not covered with the intermediate film according to the first embodiment is removed. During the first optical film patterning step S123, the part 63 of the first optical film 62 can be protected by the intermediate film 72, and the shape collapse of the part 63 of the first optical film 62 can be suppressed. Therefore, the quality of the optical member can be improved.

For example, in the first optical film patterning step S123, a cleaning liquid that dissolves the first optical film 62 is used. The cleaning liquid is supplied to the substrate 10 while rotating the substrate 10 with, for example, a spin chuck. The cleaning liquid supplied to the substrate 10 spreads over the entire substrate 10 by centrifugal force and is shaken off from the outer peripheral edge of the substrate 10.

Since the part 63 of the first optical film 62 is covered with the intermediate film 72, it does not come into contact with the cleaning liquid and does not lose its shape due to the cleaning liquid. On the other hand, the remaining portion of the first optical film 62 comes into contact with the cleaning liquid, and thus is dissolved and removed by the cleaning liquid.

The cleaning liquid is stored in the cleaning tank, and by immersing the substrate 10 in the cleaning liquid in the cleaning tank, even if a part 63 of the first optical film 62 is left and the remaining part of the first optical film 62 is melted and removed. Good. The cleaning liquid in the cleaning tank may be stirred by a stirring blade or the like.

In order to ensure that the part 63 of the first optical film 62 remains, it is possible to make the part 63 of the first optical film 62 insoluble in the cleaning liquid in the first optical film forming step S121 and the intermediate film forming step S122. It is valid. It is possible to prevent the cleaning liquid from being excessively removed by flowing around, and it is possible to reliably leave the part 63 of the first optical film 62.

Since the intermediate film 72 is insoluble in the cleaning liquid, the first optical film 62 does not have to be partially insolubilized in the first optical film forming step S121 and the intermediate film forming step S122. Patterning is possible. In this case, the number of steps can be reduced.

In the first optical film forming step S121, the first optical film coating liquid 61 is applied while applying a shear stress, so it is difficult to apply the first optical film coating liquid 61 only to the pixel area. Therefore, it is effective to perform the first optical film patterning step S123.

Although the remaining portion of the first optical film 62 is removed using the cleaning liquid in the present embodiment, the method for removing the remaining portion of the first optical film 62 is not particularly limited. For example, an etching method may be used. The etching may be either wet etching or dry etching.

Hereinafter, the part 63 of the first optical film 62 remaining in the first optical film patterning step S123 is also referred to as “first optical film 63”.

<Second Optical Film Forming Step of First Embodiment>
In the second optical film forming step S124 of FIG. 12, as shown in FIGS. 19 to 21, the second optical film coating liquid 81 containing liquid crystal molecules and a solvent is applied onto the intermediate film 72 and dried to obtain a second optical film. 2 The optical film 82 is formed. The second optical film 82 is, for example, a linear polarization film.

19 to 21 are explanatory side views of the second optical film forming step according to the first embodiment. FIG. 19 is a side view showing a liquid film of the second optical film coating liquid applied on the intermediate film according to the first embodiment. FIG. 20 is a side view showing the second optical film formed by drying the liquid film of the second optical film coating liquid according to the first embodiment. FIG. 21 is a side view showing the partially insolubilized second optical film according to the first embodiment.

As shown in FIG. 19, in the second optical film forming step S124, the coating liquid 81 for the second optical film is applied onto the substrate 10 from the application nozzle 80. The coating nozzle 80 is, for example, a slit coater having a slit-shaped discharge port on the lower surface.

The second optical film coating liquid 81 is applied onto the intermediate film 72. Therefore, the organic material forming the intermediate film 72 may be insoluble in the solvent of the second optical film coating liquid 81. The application of the second optical film coating liquid 81 can prevent the intermediate film 72 from melting.

The second optical film coating liquid 81 contains liquid crystal molecules such as lyotropic liquid crystal molecules and thermotropic liquid crystal molecules, and a solvent that dissolves the liquid crystal molecules. For example, water is used as the solvent. An organic solvent may be used as the solvent.

By moving the coating nozzle 80 and the substrate 10 relatively in one direction, shear stress can be applied to the second optical film coating liquid 81 coated on the substrate 10. The acting direction of the shear stress coincides with the relative moving direction of the coating nozzle 80 and the substrate 10. By controlling the action direction of the shear stress, the alignment direction of the liquid crystal molecules can be controlled.

The acting direction of the shear stress in the second optical film forming step S124 is a direction intersecting with the acting direction of the shear stress in the first optical film forming step S121 at an angle of 45°. As a result, the quarter-wave film and the linear polarization film are formed so that their polarization axes intersect at 45 degrees.

In the present embodiment, the slit coater is used for coating the second optical film coating liquid 81, but a dip coater or the like may be used. It suffices that a shear stress can be applied to the second optical film coating liquid 81 and the action direction of the shear stress can be controlled.

As shown in FIG. 20, in the second optical film forming step S124, the liquid film (see FIG. 19) of the second optical film coating liquid 81 applied on the substrate 10 is dried to form the second optical film 82. Form. The solvent is removed from the liquid film of the second optical film coating liquid 81, and the alignment of the liquid crystal molecules is appropriately maintained. The second optical film 82 is, for example, a linear polarization film.

For drying the liquid film of the second optical film coating liquid 81, vacuum drying, natural drying, heat drying, air drying or the like is used. The reduced pressure drying can shorten the processing time more than the natural drying. Further, the reduced-pressure drying can suppress the convection of the liquid film and the disturbance of the alignment of the liquid crystal molecules as compared with the heating drying and the air drying. When the solvent remains after drying under reduced pressure, heat drying may be further performed.

As shown in FIG. 21, in the second optical film forming step S124, only a part 83 of the second optical film 82 may be insolubilized in the cleaning liquid used in the second optical film patterning step S126. This partial insolubilization is performed as needed.

As the cleaning liquid used in the second optical film patterning step S126, the same solvent as the solvent of the second optical film coating liquid 81 may be used, for example, water may be used. In this case, insolubilization in water is performed.

The fixing liquid 120 that makes the part 83 of the second optical film 82 insoluble is ejected from, for example, an inkjet coating nozzle 121. The application nozzle 121 has a plurality of ejection nozzles for ejecting droplets of the fixing liquid 120 on the lower surface.

While the coating nozzle 121 and the substrate 10 are relatively moved, a droplet of the fixing liquid 120 is ejected from the coating nozzle 121, so that the fixing liquid 120 is selectively coated on the part 83 of the second optical film 82. .. As a result, the part 83 of the second optical film 82 is insolubilized.

The fixing liquid 120 replaces a part 83 of the second optical film 82 by, for example, substituting a functional group at the end of the second optical film 82 (for example, a water-soluble functional group such as an OH group) with another functional group. Insolubilize. Further, the fixing liquid 120 may be polymerized by a condensation reaction (for example, a dehydration condensation reaction of an OH group or the like) to insolubilize a part 83 of the second optical film 82. In the latter case, compared with the former case, the polymerization proceeds, and thus the insolubilization is likely to proceed.

The fixing liquid 120 is removed after insolubilizing the part 83 of the second optical film 82. The fixing liquid 120 may contain water or an organic solvent.

The area to which the fixing liquid 120 is applied may be, for example, a pixel area.

In this embodiment, since the fixing liquid 120 is applied only to the part 83 of the second optical film 82, the inkjet type application nozzle 121 is used, but the present invention is not limited to this. For example, only the remaining portion of the second optical film 82 may be covered with a mask, and then the entire substrate 10 may be dipped in the fixing liquid 120 to apply the fixing liquid only to a part 83 of the second optical film 82.

<Protective Film Forming Step of First Embodiment>
In the protective film forming step S125 of FIG. 12, as shown in FIGS. 22 to 23, a protective film coating liquid 91 different from the second optical film coating liquid 81 is coated on the second optical film 82 and dried. As a result, the protective film 92 is formed.

FIG. 22 is a side view showing a liquid film of the protective film coating liquid applied on the second optical film according to the first embodiment. FIG. 23 is a side view showing the protective film formed by drying the liquid film of the coating liquid for protective film according to the first embodiment.

As shown in FIG. 22, in the protective film forming step S125, the protective film coating liquid 91 is applied from the coating nozzle 90 onto the substrate 10 on which the second optical film 82 is formed. The coating nozzle 90 may be an inkjet type, and has a plurality of ejection nozzles for ejecting droplets of the protective film coating liquid 91 on the lower surface.

By ejecting a droplet of the protective film coating liquid 91 from the coating nozzle 90 while relatively moving the coating nozzle 90 and the substrate 10, the protective film coating liquid 91 is discharged onto a part 83 of the second optical film 82. Is selectively applied.

The protective film coating liquid 91 is applied onto the second optical film 82. Therefore, the liquid crystal molecules forming the second optical film 82 may be insoluble in the solvent of the protective film coating liquid 91. The coating of the protective film coating liquid 91 can prevent the second optical film 82 from being melted.

The protective film coating liquid 91 contains an organic material that forms the protective film 92 and a solvent that dissolves the organic material. The organic material forming the protective film 92 includes a polymer insoluble in the cleaning liquid used in the second optical film patterning step S126.

As the protective film coating liquid 91, for example, a thermosetting transparent coating material, a chemical reaction type transparent coating material, a dry curing type transparent coating material, or the like is used. Specifically, oil-based enamel paint, phthalic acid resin paint, etc. are used.

A thermosetting transparent coating material, a chemical reaction type transparent coating material, a dry curing type transparent coating material, and the like are polymerized by heat curing, chemical reaction or dry curing, so that a dense protective film 92 can be formed. Therefore, the insolubility of the protective film 92 in the cleaning liquid used in the second optical film patterning step S126 can be improved.

The protective film coating liquid 91 may have the same function as the fixing liquid 120. Partial insolubilization of the second optical film 82 can be promoted. When partially insolubilizing the second optical film 82 by the protective film coating liquid 91, it is not necessary to partially insolubilize the second optical film 82 in the second optical film forming step S124.

For example, the protective film coating liquid 91 replaces the functional group at the end of the second optical film 82 (for example, a water-soluble functional group such as an OH group) with another functional group, so that one of the second optical film 82 The part 83 may be insolubilized. Further, the protective film coating liquid 91 may be polymerized by a condensation reaction (for example, a dehydration condensation reaction of an OH group) to insolubilize a part 83 of the second optical film 82. In the latter case, compared with the former case, the polymerization proceeds, and thus the insolubilization is likely to proceed.

The area where the protective film coating liquid 91 is applied may coincide with the area where the fixing liquid 120 is applied. For example, the area where the protective film coating liquid 91 is applied may be a pixel area on the substrate 10.

As shown in FIG. 23, in the protective film forming step S125, the liquid film (see FIG. 22) of the protective film coating liquid 91 applied on the substrate 10 is dried to form the protective film 92. The solvent is removed from the liquid film of the protective film coating liquid 91 to form the protective film 92.

For drying the liquid film of the protective film coating liquid 91, vacuum drying, natural drying, heat drying, air drying, or the like is used. The reduced pressure drying can shorten the processing time more than the natural drying. When the solvent remains after drying under reduced pressure, heat drying may be further performed.

The protective film 92 is insoluble in the cleaning liquid used in the second optical film patterning step S126. Unlike the second optical film 82, the protective film 92 has isotropic optical characteristics. The visible light transmittance of the protective film 92 is preferably 95% or more. The thickness of the protective film 92 is preferably 10 μm or less. In addition, the residual stress of the protective film 92 is preferably as small as possible in order to suppress the deformation of the optical member.

The protective film 92 covers the main surface of the part 83 of the second optical film 82. The protective film 92 also plays a role of protecting the part 83 of the second optical film 82 so as to prevent the part 83 of the second optical film 82 from being scratched or foreign matter. The pencil hardness of the intermediate film 72 is preferably 2H or more.

Since the remaining portion of the second optical film 82 is removed in the second optical film patterning step S126, scratches and foreign matters do not pose a problem. Further, the foreign matter attached to the protective film 92 can be removed by washing, and the washing does not damage the part 83 of the second optical film 82.

The protective film 92 of the present embodiment is formed by applying the protective film coating liquid 91 onto the second optical film 82 and drying it. However, the protective film 92 is attached to the second optical film 82 in the form of a film. Good.

<Second Optical Film Patterning Step of First Embodiment>
In the second optical film patterning step S126 of FIG. 12, after the protective film forming step S125, the protective film 92 (see FIG. 23) that covers only a part 83 of the second optical film 82 is used as a mask, and the process shown in FIG. As shown, the remaining portion of the second optical film 82 is removed.

FIG. 24 is a side view showing the second optical film in which the portion not covered with the protective film according to the first embodiment is removed. During the second optical film patterning step S126, the part 83 of the second optical film 82 can be protected by the protective film 92, and the shape collapse of the part 83 of the second optical film 82 can be suppressed. Therefore, the quality of the optical member can be improved.

For example, in the second optical film patterning step S126, a cleaning liquid that dissolves the second optical film 82 is used. The cleaning liquid is supplied to the substrate 10 while rotating the substrate 10 with, for example, a spin chuck. The cleaning liquid supplied to the substrate 10 spreads over the entire substrate 10 by centrifugal force and is shaken off from the outer peripheral edge of the substrate 10.

Since the part 83 of the second optical film 82 is covered with the protective film 92, it does not come into contact with the cleaning liquid and does not lose its shape due to the cleaning liquid. On the other hand, the remaining portion of the second optical film 82 comes into contact with the cleaning liquid, and thus is dissolved and removed by the cleaning liquid.

The cleaning liquid is stored in the cleaning tank, and by immersing the substrate 10 in the cleaning liquid in the cleaning tank, the remaining part of the second optical film 82 may be melted and removed while leaving the part 83 of the second optical film 82. Good. The cleaning liquid in the cleaning tank may be stirred by a stirring blade or the like.

In order to ensure that the part 83 of the second optical film 82 remains, the part 83 of the second optical film 82 is not insolubilized in the cleaning liquid in the second optical film forming step S124 and the protective film forming step S125. It is valid. It is possible to prevent the cleaning liquid from being excessively removed due to the wraparound, and it is possible to reliably leave the part 83 of the second optical film 82.

Since the protective film 92 is insoluble in the cleaning liquid, the second optical film 82 does not have to be partially insolubilized in the second optical film forming step S124 and the protective film forming step S125. Patterning is possible. In this case, the number of steps can be reduced.

In the second optical film forming step S124, since the second optical film coating liquid 81 is applied while applying the shearing stress, it is difficult to apply the second optical film coating liquid 81 only to the pixel area. Therefore, it is effective to perform the second optical film patterning step S126.

In the present embodiment, the cleaning liquid is used to remove the remaining portion of the second optical film 82, but the method for removing the remaining portion of the second optical film 82 is not particularly limited. For example, an etching method may be used. The etching may be either wet etching or dry etching.

Hereinafter, the part 83 of the second optical film 82 remaining in the second optical film patterning step S126 is also referred to as “second optical film 83”.

According to the present embodiment, as shown in FIG. 24, the optical member 50 composed of the first optical film 63, the intermediate film 72, the second optical film 83, and the protective film 92 is spaced on the substrate 10. A plurality is formed. Therefore, the optical member 50 can be multifaceted, and the organic EL display 1 can be multifaceted. Further, since the optical member 50 is selectively formed in the pixel area, the terminals provided around the pixel area can properly function.

<Summary of Optical Member Forming Step of First Embodiment>
As described above, according to this embodiment, the first optical film forming step S121, the intermediate film forming step S122, and the second optical film forming step S124 are performed in this order. The intermediate film 72 is formed between the first optical film 63 and the second optical film 83. The intermediate film 72 can protect the first optical film 63 so as to prevent the first optical film 63 from being scratched or foreign matter. Therefore, the quality of the optical member 50 can be improved. This is particularly effective when the manufacturing of the optical member 50 is temporarily interrupted on the way and it takes a long time to restart the manufacturing because the risk of scratches and foreign substances is high.

According to the present embodiment, after the intermediate film forming step S122 and before the second optical film forming step S124, the intermediate film 72 that covers only the part 63 of the first optical film 62 is used as a mask, and A first optical film patterning step S123 of removing the remaining part of the first optical film 62 is performed. During the first optical film patterning step S123, the part 63 of the first optical film 62 can be protected by the intermediate film 72, and the shape collapse of the part 63 of the first optical film 62 can be suppressed. Therefore, the quality of the optical member 50 can be improved.

According to this embodiment, in the first optical film patterning step S123, a cleaning liquid that dissolves the first optical film 62 is used. Since the part 63 of the first optical film 62 is covered with the intermediate film 72, it does not come into contact with the cleaning liquid and does not lose its shape due to the cleaning liquid. On the other hand, the remaining portion of the first optical film 62 comes into contact with the cleaning liquid, and thus is dissolved and removed by the cleaning liquid.

According to the present embodiment, in the first optical film forming step S121, only the part 63 of the first optical film 62 is insolubilized in the cleaning liquid used in the first optical film patterning step S123. Therefore, in the first optical film patterning step S123, it is possible to prevent the cleaning liquid from being excessively removed due to the wraparound, and it is possible to reliably leave the part 63 of the first optical film 62.

According to the present embodiment, in the intermediate film forming step S122, only the part 63 of the first optical film 62 is coated with the intermediate film coating liquid 71, so that only the part 63 of the first optical film 62 is made into the first film. It is insolubilized in the cleaning liquid used in the optical film patterning step S123. Therefore, in the first optical film patterning step S123, it is possible to prevent the cleaning liquid from being excessively removed due to the wraparound, and the part 63 of the first optical film 62 can be reliably left.

According to this embodiment, the protective film formation step S125 of forming the protective film 92 that protects the second optical film 83 is performed. The protective film 92 can protect the second optical film 83 so that the second optical film 83 is not scratched or foreign matter is produced after the optical member 50 is manufactured. Therefore, the quality of the optical member 50 can be improved.

According to the present embodiment, after the protective film forming step S125, the protective film 92 that covers only the part 83 of the second optical film 82 is used as a mask to remove the remaining portion of the second optical film 82. The optical film patterning step S126 is performed. During the second optical film patterning step S126, the part 83 of the second optical film 82 can be protected by the protective film 92, and the shape collapse of the part 83 of the second optical film 82 can be suppressed. Therefore, the quality of the optical member 50 can be improved.

According to this embodiment, in the second optical film patterning step S126, a cleaning liquid that dissolves the second optical film 82 is used. Since the part 83 of the second optical film 82 is covered with the protective film 92, it does not come into contact with the cleaning liquid and does not lose its shape due to the cleaning liquid. On the other hand, the remaining portion of the second optical film 82 comes into contact with the cleaning liquid, and thus is dissolved and removed by the cleaning liquid.

According to the present embodiment, in the second optical film forming step S124, only the part 83 of the second optical film 82 is insolubilized in the cleaning liquid used in the second optical film patterning step S126. Therefore, in the second optical film patterning step S126, it is possible to prevent excessive removal due to the wraparound of the cleaning liquid, and it is possible to reliably leave the part 83 of the second optical film 82.

According to the present embodiment, in the protective film forming step S125, by coating the protective film coating liquid 91 only on the part 83 of the second optical film 82, only the part 83 of the second optical film 82 is formed into the second film. It becomes insoluble in the cleaning liquid used in the optical film patterning step S126. Therefore, in the second optical film patterning step S126, it is possible to prevent excessive removal due to the wraparound of the cleaning liquid, and it is possible to reliably leave the part 83 of the second optical film 82.

<Optical Member Forming Step of Second Embodiment>
In the first embodiment, the first optical film patterning step S123 is performed after the intermediate film forming step S122, whereas the intermediate film forming step S122 is performed after the first optical film patterning step S123 in the present embodiment. It makes a difference.

Therefore, unlike the first embodiment, the intermediate film 72 of the present embodiment does not serve as a mask for leaving a part 63 of the first optical film 62 and removing the remaining part of the first optical film 62. The intermediate film 72 of the present embodiment plays a role of protecting the part 63 of the first optical film 62 so that the part 63 of the first optical film 62 is not scratched or foreign matter is attached.

Further, in the first embodiment, the second optical film patterning step S126 is performed after the protective film forming step S125, whereas in the present embodiment, the protective film forming step S125 is performed after the second optical film patterning step S126. The difference is that it is done.

Therefore, unlike the first embodiment, the protective film 92 of the present embodiment does not serve as a mask for leaving the part 83 of the second optical film 82 and removing the remaining part of the second optical film 82. The protective film 92 of the present embodiment plays a role of protecting the part 83 of the second optical film 82 so that the part 83 of the second optical film 82 is not scratched or foreign matter is attached.

Hereinafter, differences will be mainly described with reference to FIG. 25 and the like. FIG. 25 is a flowchart showing the optical member forming process according to the second embodiment. As shown in FIG. 25, the optical member forming step S120 includes a first optical film forming step S121, a first optical film patterning step S123, an intermediate film forming step S122, a second optical film forming step S124, and a second optical film forming step S124. 2 The optical film patterning step S126 and the protective film forming step S125 are included in this order.

Note that all steps shown in FIG. 25 may not be performed. For example, as will be described later in detail, the first optical film patterning step S123 and the second optical film patterning step S126 are effective when a plurality of optical members 50 are formed on the substrate 10 at intervals, but It may be omitted when only one member 50 is formed on the substrate 10. The same applies to the partial insolubilization process described later.

Further, steps other than the steps shown in FIG. 25 may be performed. For example, before the first optical film forming step S121, a step of modifying the surface of the substrate on which the first optical film is formed may be performed in order to improve the adhesion of the first optical film to the substrate. .. As the surface modification film, an organic film such as a silane coupling agent or an inorganic film such as silicon nitride may be formed.

Further, a first optical film forming step S121, a first optical film patterning step S123 and an intermediate film forming step S122 shown in FIG. 25, and a second optical film forming step S124, a protective film forming step S125 and a second optical film forming step S124 shown in FIG. The optical film patterning step S126 may be performed in this order.

Furthermore, the first optical film forming step S121, the intermediate film forming step S122 and the first optical film patterning step S123 shown in FIG. 12, and the second optical film forming step S124 and the second optical film patterning step shown in FIG. S126 and the protective film forming step S125 may be performed in this order.

<First Optical Film Forming Step of Second Embodiment>
In the first optical film forming step S121 of FIG. 25, as shown in FIGS. 13 to 14, the first optical film coating liquid 61 containing liquid crystal molecules and a solvent is applied onto the substrate 10 and dried to form a first optical film. The optical film 62 is formed. The first optical film 62 is, for example, a 1/4 wavelength film.

In the first optical film forming step S121 of this embodiment, the process of insolubilizing the part 63 of the first optical film 62 shown in FIG. 15 is not performed. This process is performed in the first optical film patterning step S123.

<First Optical Film Patterning Step of Second Embodiment>
In the first optical film patterning step S123 of FIG. 25, the first optical film 62 is left behind after the first optical film forming step S121 and before the intermediate film forming step S122. Remove the rest of.

For example, in the first optical film patterning step S123, only a portion 63 of the first optical film 62 is insolubilized in the cleaning liquid as shown in FIG. 15, and then the remaining portion of the first optical film 62 is shown as shown in FIG. Is dissolved with a cleaning solution. FIG. 26 is a side view showing the first optical film from which the non-insolubilized portion has been removed according to the second embodiment.

The cleaning liquid is supplied to the substrate 10 while rotating the substrate 10 with, for example, a spin chuck. The cleaning liquid supplied to the substrate 10 spreads over the entire substrate 10 by centrifugal force and is shaken off from the outer peripheral edge of the substrate 10.

Since the part 63 of the first optical film 62 is insolubilized in the cleaning liquid, it does not lose its shape due to the cleaning liquid. On the other hand, since the remaining portion of the first optical film 62 is not insolubilized in the cleaning liquid, it is dissolved in the cleaning liquid and removed.

The cleaning liquid is stored in the cleaning tank, and by immersing the substrate 10 in the cleaning liquid in the cleaning tank, even if a part 63 of the first optical film 62 is left and the remaining part of the first optical film 62 is melted and removed. Good. The cleaning liquid in the cleaning tank may be stirred by a stirring blade or the like.

As shown in FIG. 26, in the present embodiment, before the intermediate film 72 (see FIG. 28) is formed, the part 63 of the first optical film 62 is left and the remaining part of the first optical film 62 is removed. 1 Optical film 62 is patterned.

In the first optical film forming step S121, the first optical film coating liquid 61 is applied while applying a shear stress, so it is difficult to apply the first optical film coating liquid 61 only to the pixel area. Therefore, it is effective to perform the first optical film patterning step S123.

Hereinafter, the part 63 of the first optical film 62 remaining in the first optical film patterning step S123 is also referred to as “first optical film 63”.

<Intermediate film forming step of the second embodiment>
In the intermediate film forming step S122 of FIG. 25, as shown in FIGS. 27 to 28, an intermediate film coating liquid 71 different from the first optical film coating liquid 61 is applied onto the first optical film 63 and dried. Thus, the intermediate film 72 is formed.

FIG. 27 is a diagram showing a liquid film of an intermediate film coating liquid applied on the first optical film according to the second embodiment. FIG. 28 is a diagram showing an intermediate film formed by drying the liquid film of the coating liquid for intermediate film according to the second embodiment.

As shown in FIG. 27, in the intermediate film forming step S122, the intermediate film coating liquid 71 is applied from the application nozzle 70 onto the substrate 10 on which the first optical film 63 is formed. The coating nozzle 70 may be an inkjet type, and has a plurality of discharge nozzles for discharging droplets of the intermediate film coating liquid 71 on the lower surface.

By ejecting a droplet of the intermediate film coating liquid 71 from the coating nozzle 70 while moving the coating nozzle 70 and the substrate 10 relatively, only the first optical film 63 and its vicinity (for example, the pixel area and its vicinity). Only) is coated with the intermediate film coating liquid 71 selectively.

The intermediate film coating liquid 71 is applied onto the first optical film 63. Therefore, the liquid crystal molecules forming the first optical film 63 may be insoluble in the solvent of the intermediate film coating liquid 71. It is possible to prevent the first optical film 63 from being melted by applying the intermediate film coating liquid 71.

The intermediate film coating liquid 71 contains an organic material that forms the intermediate film 72 and a solvent that dissolves the organic material. The organic material forming the intermediate film 72 includes a polymer insoluble in the solvent of the second optical film coating liquid 81 (see FIG. 29) applied on the intermediate film 72.

As the intermediate film coating liquid 71, for example, a thermosetting transparent coating material, a chemical reaction type transparent coating material, a dry curing type transparent coating material, or the like is used. Specifically, oil-based enamel paint, phthalic acid resin paint, etc. are used.

A thermosetting transparent coating material, a chemical reaction type transparent coating material, a dry curing type transparent coating material and the like are polymerized by heat curing, chemical reaction or dry curing, so that a dense intermediate film 72 can be formed.

As shown in FIG. 27, the intermediate film coating liquid 71 may be applied so as to cover not only the main surface of the first optical film 63 but also the end surface of the first optical film 63. The first optical film 63 can be protected by the intermediate film 72 so that not only the main surface of the first optical film 63 but also the end surface of the first optical film 63 is not scratched or foreign matter is attached.

The area to which the intermediate film coating liquid 71 is applied may be limited to the pixel area on the substrate 10 and its vicinity.

A mask such as a film may be attached on the substrate 10 in order to limit the area to which the intermediate film coating liquid 71 is applied. A gap may be formed between the mask and the first optical film 63 so as not to damage the first optical film 63 when peeled later.

As shown in FIG. 28, in the intermediate film forming step S122, the liquid film (see FIG. 27) of the intermediate film coating liquid 71 applied on the substrate 10 is dried to form the intermediate film 72. The solvent is removed from the liquid film of the intermediate film coating liquid 71 to form the intermediate film 72.

Unlike the first optical film 63, the intermediate film 72 has isotropic optical characteristics. The visible light transmittance of the intermediate film 72 is preferably 95% or more. The thickness of the intermediate film 72 is preferably 10 μm or less. Further, the residual stress of the intermediate film 72 is preferably as small as possible in order to suppress the deformation of the optical member.

The intermediate film 72 covers not only the main surface of the first optical film 63 but also the end surface of the first optical film 63. The intermediate film 72 plays a role of protecting the first optical film 63 so as to prevent the first optical film 63 from being scratched or foreign matter. The pencil hardness of the intermediate film 72 is preferably 2H or more. This is particularly effective when the manufacturing of the optical member is temporarily interrupted on the way and it takes a long time to restart it, because there is a high risk of scratches and foreign substances.

The intermediate film 72 is formed only on the pixel area on the substrate 10 and in the vicinity thereof, and is formed on the substrate 10 at intervals. If it is not necessary to take out the terminals provided around the pixel area, the intermediate film 72 may be formed on substantially the entire substrate 10. When applying the coating liquid 81 for the second optical film on the intermediate film 72, the alignment controllability of the liquid crystal molecules of the coating liquid 81 for the second optical film is good.

<Second Optical Film Forming Step of Second Embodiment>
In the second optical film forming step S124 of FIG. 25, as shown in FIGS. 29 to 30, a second optical film coating liquid 81 containing liquid crystal molecules and a solvent is applied onto the intermediate film 72 and dried to obtain a second optical film. 2 The optical film 82 is formed. The second optical film 82 is, for example, a linear polarization film.

FIG. 29 is a side view showing the liquid film of the second optical film coating liquid applied on the intermediate film according to the second embodiment. FIG. 30 is a side view showing the second optical film formed by drying the liquid film of the second optical film coating liquid according to the second embodiment.

As shown in FIG. 29, in the second optical film forming step S124, the coating liquid 81 for the second optical film is applied onto the substrate 10 from the application nozzle 80. The coating nozzle 80 is, for example, a slit coater having a slit-shaped discharge port on the lower surface.

The second optical film coating liquid 81 is applied onto the intermediate film 72. Therefore, the organic material forming the intermediate film 72 may be insoluble in the solvent of the second optical film coating liquid 81. The application of the second optical film coating liquid 81 can prevent the intermediate film 72 from melting.

In the present embodiment, the slit coater is used for coating the second optical film coating liquid 81, but a dip coater or the like may be used. It suffices that a shear stress can be applied to the second optical film coating liquid 81 and the action direction of the shear stress can be controlled.

As shown in FIG. 30, in the second optical film forming step S124, the liquid film (see FIG. 29) of the second optical film coating liquid 81 applied on the substrate 10 is dried to form the second optical film 82. Form. The solvent is removed from the liquid film of the second optical film coating liquid 81, and the alignment of the liquid crystal molecules is appropriately maintained. The second optical film 82 is, for example, a linear polarization film.

<Second Optical Film Patterning Step of Second Embodiment>
In the second optical film patterning step S126 of FIG. 25, after the second optical film forming step S124 and before the protective film forming step S125, a part 83 of the second optical film 82 is left and the second optical film 82 is left. Remove the rest of.

For example, in the second optical film patterning step S126, only a part 83 of the second optical film 82 is insolubilized in the cleaning liquid as shown in FIG. 31, and then the remaining part of the second optical film 82 is shown as shown in FIG. Is dissolved with a cleaning solution.

FIG. 31 is a side view showing a partially insolubilized second optical film according to the second embodiment. FIG. 32 is a side view showing the second optical film from which the non-insolubilized portion has been removed according to the second embodiment.

As shown in FIG. 31, in the second optical film patterning step S126, only a part 83 of the second optical film 82 is insolubilized in the cleaning liquid. As the cleaning liquid, the same solvent as the solvent of the second optical film coating liquid 81 may be used, and for example, water may be used. In this case, insolubilization in water is performed.

The fixing liquid 120 that makes the part 83 of the second optical film 82 insoluble is ejected from, for example, an inkjet coating nozzle 121. The application nozzle 121 has a plurality of ejection nozzles for ejecting droplets of the fixing liquid 120 on the lower surface.

While the coating nozzle 121 and the substrate 10 are relatively moved, a droplet of the fixing liquid 120 is ejected from the coating nozzle 121, so that the fixing liquid 120 is selectively coated on the part 83 of the second optical film 82. .. As a result, the part 83 of the second optical film 82 is insolubilized.

The area to which the fixing liquid 120 is applied may be, for example, a pixel area.

As shown in FIG. 32, in the second optical film patterning step S126, only a part 83 of the second optical film 82 is left and the remaining part of the second optical film 82 is removed. A cleaning liquid, for example, is used to remove the remaining portion of the second optical film 82.

The cleaning liquid is supplied to the substrate 10 while rotating the substrate 10 with, for example, a spin chuck. The cleaning liquid supplied to the substrate 10 spreads over the entire substrate 10 by centrifugal force and is shaken off from the outer peripheral edge of the substrate 10.

Since the part 83 of the second optical film 82 is insolubilized in the cleaning liquid, it does not lose its shape due to the cleaning liquid. On the other hand, the remaining portion of the second optical film 82 is not insolubilized in the cleaning liquid, and thus is dissolved and removed by the cleaning liquid.

The cleaning liquid is stored in the cleaning tank, and by immersing the substrate 10 in the cleaning liquid in the cleaning tank, even if a part 83 of the second optical film 82 is left and the remaining part of the second optical film 82 is melted and removed. Good. The cleaning liquid in the cleaning tank may be stirred by a stirring blade or the like.

As shown in FIG. 32, in the present embodiment, before the protective film 92 (see FIG. 34) is formed, the part 83 of the second optical film 82 is left and the remaining part of the second optical film 82 is removed. 2 The optical film 82 is patterned.

In the second optical film forming step S124, since the second optical film coating liquid 81 is applied while applying the shearing stress, it is difficult to apply the second optical film coating liquid 81 only to the pixel area. Therefore, it is effective to perform the second optical film patterning step S126.

Hereinafter, the part 83 of the second optical film 82 remaining in the second optical film patterning step S126 is also referred to as “second optical film 83”.

<Protective Film Forming Step of Second Embodiment>
In the protective film forming step S125 of FIG. 25, as shown in FIGS. 33 to 34, a protective film coating liquid 91 different from the second optical film coating liquid 81 is applied onto the second optical film 83 and dried. As a result, the protective film 92 is formed.

FIG. 33 is a side view showing the liquid film of the protective film coating liquid applied on the second optical film according to the second embodiment. FIG. 34 is a side view showing the protective film formed by drying the liquid film of the coating liquid for protective film according to the second embodiment.

As shown in FIG. 33, in the protective film forming step S125, the protective film coating liquid 91 is applied from the application nozzle 90 onto the substrate 10 on which the second optical film 83 is formed. The coating nozzle 90 may be an inkjet type, and has a plurality of ejection nozzles for ejecting droplets of the protective film coating liquid 91 on the lower surface.

By ejecting a droplet of the protective film coating liquid 91 from the coating nozzle 90 while relatively moving the coating nozzle 90 and the substrate 10, only the second optical film 83 and its vicinity (for example, the pixel area and its vicinity). Only), the protective film coating liquid 91 is selectively applied.

The protective film coating liquid 91 is applied onto the second optical film 83. Therefore, the liquid crystal molecules forming the second optical film 83 may be insoluble in the solvent of the protective film coating liquid 91. The coating of the protective film coating liquid 91 can prevent the second optical film 83 from melting.

The protective film coating liquid 91 contains an organic material that forms the protective film 92 and a solvent that dissolves the organic material.

As the protective film coating liquid 91, for example, a thermosetting transparent coating material, a chemical reaction type transparent coating material, a dry curing type transparent coating material, or the like is used. Specifically, oil-based enamel paint, phthalic acid resin paint, etc. are used.

A thermosetting transparent coating material, a chemical reaction type transparent coating material, a dry curing type transparent coating material, and the like are polymerized by heat curing, chemical reaction or dry curing, so that a dense protective film 92 can be formed.

As shown in FIG. 33, the protective film coating liquid 91 may be applied so as to cover not only the main surface of the second optical film 83 but also the end surface of the second optical film 83. The second optical film 83 can be protected by the protective film 92 so that not only the main surface of the second optical film 83 but also the end surface of the second optical film 83 is not scratched or foreign matter is attached.

Although the protective film coating liquid 91 does not cover the end surface of the intermediate film 72 in FIG. 33, it may be applied so as to cover the end surface of the intermediate film 72.

The area to which the protective film coating liquid 91 is applied may be limited to the pixel area on the substrate 10 and its vicinity.

Note that a mask such as a film may be attached to the substrate 10 in order to limit the area to which the protective film coating liquid 91 is applied. A gap may be formed between the mask and the second optical film 83 so as not to damage the second optical film 83 when peeled later.

As shown in FIG. 34, in the protective film forming step S125, the liquid film (see FIG. 33) of the protective film coating liquid 91 applied on the substrate 10 is dried to form the protective film 92. The solvent is removed from the liquid film of the protective film coating liquid 91 to form the protective film 92.

Unlike the second optical film 83, the protective film 92 has isotropic optical characteristics. The visible light transmittance of the protective film 92 is preferably 95% or more. The thickness of the protective film 92 is preferably 10 μm or less. In addition, the residual stress of the protective film 92 is preferably as small as possible in order to suppress the deformation of the optical member.

The protective film 92 covers not only the main surface of the second optical film 83 but also the end surface of the second optical film 83. The protective film 92 plays a role of protecting the second optical film 83 so as to prevent the second optical film 83 from being scratched or foreign matter. The pencil hardness of the protective film 92 is preferably 2H or more.

The protective film 92 is formed only on the pixel area on the substrate 10 and in the vicinity thereof, and a plurality of protective films 92 are formed on the substrate 10 at intervals. If it is not necessary to take out the terminals provided around the pixel area, the protective film 92 may be formed on substantially the entire substrate 10.

The protective film 92 of the present embodiment is formed by applying the protective film coating liquid 91 on the second optical film 83 and drying it. However, the protective film 92 is attached to the second optical film 83 in the form of a film. Good.

According to the present embodiment, as shown in FIG. 34, the optical member 50 composed of the first optical film 63, the intermediate film 72, the second optical film 83, and the protective film 92 is spaced on the substrate 10. A plurality is formed. Therefore, the optical member 50 can be multifaceted, and the organic EL display 1 can be multifaceted. Further, since the optical member 50 is selectively formed in the pixel area and its vicinity, the terminals provided around the pixel area can properly function.

<Summary of Optical Member Forming Step of Second Embodiment>
As described above, according to this embodiment, the first optical film forming step S121, the intermediate film forming step S122, and the second optical film forming step S124 are performed in this order. The intermediate film 72 is formed between the first optical film 63 and the second optical film 83. The intermediate film 72 can protect the first optical film 63 so as to prevent the first optical film 63 from being scratched or foreign matter. Therefore, the quality of the optical member 50 can be improved. This is particularly effective when the manufacturing of the optical member 50 is temporarily interrupted on the way and it takes a long time to restart the manufacturing because the risk of scratches and foreign substances is high.

According to this embodiment, after the first optical film forming step S121 and before the intermediate film forming step S122, a part 63 of the first optical film 62 is left and a remaining part of the first optical film 62 is removed. One optical film patterning step S123 is performed. Therefore, not only the main surface of the first optical film 63 remaining after the first optical film patterning step S123 but also the end surface of the first optical film 63 can be covered with the intermediate film 72.

According to the present embodiment, in the first optical film patterning step S123, only the part 63 of the first optical film 62 is insolubilized in the cleaning liquid that dissolves the first optical film 62, and then the remaining part of the first optical film 62 is removed. Is dissolved with a cleaning solution. Since the part 63 of the first optical film 62 is insolubilized in the cleaning liquid, it does not lose its shape due to the cleaning liquid. On the other hand, the rest of the first optical film 62 is not insolubilized in the cleaning liquid, and thus is dissolved and removed by the cleaning liquid.

According to this embodiment, in the intermediate film forming step S122, the intermediate film 72 is formed so as to cover the main surface of the first optical film 63 and the end surface of the first optical film 63. The intermediate film 72 can protect the first optical film 63 so that the main surface of the first optical film 63 as well as the end surface of the first optical film 63 is not scratched or foreign matter is attached. Therefore, the quality of the optical member 50 can be improved. This is particularly effective when the manufacturing of the optical member 50 is temporarily interrupted on the way and it takes a long time to restart the manufacturing because the risk of scratches and foreign substances is high.

According to this embodiment, the protective film formation step S125 of forming the protective film 92 that protects the second optical film 83 is performed. The protective film 92 can protect the second optical film 83 so that the second optical film 83 is not scratched or foreign matter is produced after the optical member 50 is manufactured. Therefore, the quality of the optical member 50 can be improved.

According to the present embodiment, after the second optical film forming step S124 and before the protective film forming step S125, a part 83 of the second optical film 82 is left and a remaining part of the second optical film 82 is removed. 2 The optical film patterning step S126 is performed. Therefore, it becomes possible to cover not only the main surface of the second optical film 83 left after the second optical film patterning step S126 but also the end surface of the second optical film 83 with the protective film 92.

According to the present embodiment, in the second optical film patterning step S126, only a part 83 of the second optical film 82 is insolubilized in the cleaning liquid that dissolves the second optical film 82, and then the remaining part of the second optical film 82 is removed. Is dissolved with a cleaning solution. Since the part 83 of the second optical film 82 is insolubilized in the cleaning liquid, it does not lose its shape due to the cleaning liquid. On the other hand, the remaining portion of the second optical film 82 is not insolubilized in the cleaning liquid, and thus is dissolved and removed by the cleaning liquid.

According to the present embodiment, in the protective film forming step S125, the protective film 92 is formed so as to cover the main surface of the second optical film 83 and the end surface of the second optical film 83. The protective film 92 can protect the second optical film 83 so that not only the main surface of the second optical film 83 but also the end surface of the second optical film 83 is not scratched or foreign matter is attached. Therefore, the quality of the optical member 50 can be improved. This is particularly effective when the manufacturing of the optical member 50 is temporarily interrupted on the way and it takes a long time to restart the manufacturing because the risk of scratches and foreign substances is high.

<Transformation and improvement>
Although the embodiment of the method for manufacturing the organic EL display has been described above, the present invention is not limited to the above embodiment and the like, and various modifications and improvements are made within the scope of the gist of the present invention described in the claims. Is possible.

For example, the optical member 50 includes the first optical film 63, the intermediate film 72, the second optical film 83, and the protective film 92 in the above embodiment, but the present invention is not limited to this. The optical member 50 only needs to include an optical film in which liquid crystal molecules are aligned, and the number of optical films is not limited.

This application claims priority based on Japanese Patent Application No. 2017-091471 filed with the Japan Patent Office on May 1, 2017, and the entire contents of Japanese Patent Application No. 2017-091471 are incorporated into the present application. To do.

10 Substrate 13 Organic Light Emitting Diode 30 Sealing Layer 40 Touch Sensor 41 First Metal Film 43 Insulating Film 45 Second Metal Film 47 Touch Sensor Protective Film 50 Optical Member 61 First Optical Film Coating Liquid 62 First Optical Film 63 First Optical film 71 Intermediate film coating liquid 72 Intermediate film 81 Second optical film coating liquid 82 Second optical film 83 Second optical film 91 Protective film coating liquid 92 Protective film

Claims (15)

On a substrate an organic light emitting diode is formed in advance by drying the coated optical film coating solution containing liquid crystal molecules and a solvent, possess an optical member forming step in which the liquid crystal molecules form an optical film that is oriented ,
The optical member forming step,
By applying a first optical film coating liquid containing liquid crystal molecules and a solvent onto the substrate on which the organic light emitting diode is formed in advance and drying the liquid crystal, a first optical film as a phase difference film or a polarizing film is obtained. A first optical film forming step of forming one optical film;
After the step of forming the first optical film, a coating solution for the second optical film containing liquid crystal molecules and a solvent is applied onto the first optical film and dried, whereby the remaining parts of the retardation film and the polarizing film are removed. A second optical film forming step of forming one second optical film;
After the first optical film forming step and before the second optical film forming step, an intermediate film coating solution different from the first optical film coating solution is applied on the first optical film. An intermediate film forming step of forming an intermediate film by drying,
After the intermediate film forming step and before the second optical film forming step, the intermediate film that covers only a part of the first optical film is used as a mask to remove the remaining portion of the first optical film. And a first optical film patterning step for manufacturing the organic EL display. In the first optical film patterning step, using a cleaning liquid dissolving the first optical film, an organic EL display manufacturing method according to claim 1. The method for manufacturing an organic EL display according to claim 2 , wherein in the first optical film forming step, only a part of the first optical film is insolubilized in the cleaning liquid used in the first optical film patterning step. .. In the intermediate film forming step, by applying the intermediate film coating liquid only to the part of the first optical film, only the part of the first optical film is subjected to the first optical film patterning step. the insolubilized to the cleaning liquid used, the method of manufacturing the organic EL display according to claim 2 or 3. On a substrate an organic light emitting diode is formed in advance by drying the coated optical film coating solution containing liquid crystal molecules and a solvent, possess an optical member forming step in which the liquid crystal molecules form an optical film that is oriented ,
The optical member forming step,
A first optical film coating liquid containing liquid crystal molecules and a solvent is applied onto the substrate on which the organic light emitting diode is preliminarily formed, and dried to form a first optical film as a phase difference film or a polarizing film. A first optical film forming step of forming one optical film;
After the step of forming the first optical film, a coating liquid for the second optical film containing liquid crystal molecules and a solvent is applied onto the first optical film and dried, whereby the remaining parts of the retardation film and the polarizing film are removed. A second optical film forming step of forming one second optical film;
After the first optical film forming step and before the second optical film forming step, an intermediate film coating solution different from the first optical film coating solution is applied on the first optical film. An intermediate film forming step of forming an intermediate film by drying,
A first optical film patterning step of leaving a part of the first optical film and removing the remaining part of the first optical film after the first optical film forming step and before the intermediate film forming step. A method of manufacturing an organic EL display having . In the first optical film patterning step, only a portion of the first optical film is insolubilized in a cleaning liquid that dissolves the first optical film, and then the remaining portion of the first optical film is dissolved with the cleaning liquid. The method for manufacturing the organic EL display according to claim 5 . And in the intermediate layer forming step, the forming of the intermediate layer so as to cover the end face of the main surface and the first optical film of the first optical film, a method of manufacturing an organic EL display according to claim 5 or 6. On a substrate an organic light emitting diode is formed in advance by drying the coated optical film coating solution containing liquid crystal molecules and a solvent, possess an optical member forming step in which the liquid crystal molecules form an optical film that is oriented ,
The optical member forming step,
By applying a first optical film coating liquid containing liquid crystal molecules and a solvent onto the substrate on which the organic light emitting diode is formed in advance and drying the liquid crystal, a first optical film as a phase difference film or a polarizing film is obtained. A first optical film forming step of forming one optical film;
After the step of forming the first optical film, a coating solution for the second optical film containing liquid crystal molecules and a solvent is applied onto the first optical film and dried, whereby the remaining parts of the retardation film and the polarizing film are removed. A second optical film forming step of forming one second optical film;
After the first optical film forming step and before the second optical film forming step, an intermediate film coating solution different from the first optical film coating solution is applied on the first optical film. An intermediate film forming step of forming an intermediate film by drying,
After the step of forming the second optical film, a protective film coating liquid different from the second optical film coating liquid is applied onto the second optical film and dried to protect the second optical film. A protective film forming step of forming a film,
A second optical film patterning process of removing the remaining portion of the second optical film by using the protective film covering only a part of the second optical film as a mask after the protective film forming process. Manufacturing method of EL display. The method for manufacturing an organic EL display according to claim 8 , wherein a cleaning liquid that dissolves the second optical film is used in the second optical film patterning step. The method for manufacturing an organic EL display according to claim 9 , wherein in the second optical film forming step, only a part of the second optical film is insolubilized in the cleaning liquid used in the second optical film patterning step. .. In the protective film forming step, by applying the protective film coating solution only to the part of the second optical film, only the part of the second optical film is subjected to the second optical film patterning step. The method for manufacturing an organic EL display according to claim 9 or 10 , wherein the cleaning liquid is insolubilized. On a substrate an organic light emitting diode is formed in advance by drying the coated optical film coating solution containing liquid crystal molecules and a solvent, possess an optical member forming step in which the liquid crystal molecules form an optical film that is oriented ,
The optical member forming step,
By applying a first optical film coating liquid containing liquid crystal molecules and a solvent onto the substrate on which the organic light emitting diode is formed in advance and drying the liquid crystal, a first optical film as a phase difference film or a polarizing film is obtained. A first optical film forming step of forming one optical film;
After the step of forming the first optical film, a coating solution for the second optical film containing liquid crystal molecules and a solvent is applied onto the first optical film and dried, whereby the remaining parts of the retardation film and the polarizing film are removed. A second optical film forming step of forming one second optical film;
After the first optical film forming step and before the second optical film forming step, an intermediate film coating solution different from the first optical film coating solution is applied on the first optical film. An intermediate film forming step of forming an intermediate film by drying,
After the step of forming the second optical film, a protective film coating liquid different from the second optical film coating liquid is applied onto the second optical film and dried to protect the second optical film. A protective film forming step of forming a film,
A second optical film patterning step of leaving a part of the second optical film and removing the remaining part of the second optical film after the second optical film forming step and before the protective film forming step. A method of manufacturing an organic EL display having . In the second optical film patterning step, only a portion of the second optical film is insolubilized in a cleaning liquid that dissolves the second optical film, and then the remaining portion of the second optical film is dissolved by the cleaning liquid. The method for manufacturing an organic EL display according to claim 12 . And in the protective film forming step, the second to form the protective film to cover a main surface and the end face of the second optical film of optical films, a method of manufacturing an organic EL display according to claim 12 or 13. Before the optical member forming step, a touch sensor forming step of forming a touch sensor on the substrate on which the organic light emitting diode is formed in advance,
The touch sensor forming step,
Forming a light-shielding first metal film on the substrate on which the organic light emitting diode is formed in advance;
Selectively removing a portion of the first metal film by photolithography and etching,
Forming an insulating film on the first metal film, a portion of which has been selectively removed;
Forming a light-shielding second metal film on the insulating film;
And a step of selectively removing portions of said second metal film by photolithography and etching, an organic EL display manufacturing method according to any one of claims 1-14.

Images