TWI759462B - Manufacturing method of organic electroluminescent display - Google Patents

Abstract

The subject of this invention is to provide the organic electroluminescent display provided with the optical member which improves thinning and flexibility. The solution of the present invention is a method of manufacturing an organic electroluminescence display, which comprises coating and drying a coating liquid for an optical film containing liquid crystal molecules and a solvent on a substrate on which organic light emitting diodes are formed in advance, The optical component forming process of forming the optical film with liquid crystal molecular alignment.

Description

Manufacturing method of organic electroluminescent display

The present invention relates to a manufacturing method of an organic electroluminescence display.

In a display using, for example, an organic light emitting diode (OLED: Organic Light Emitting Diode) (hereinafter, referred to as an "organic EL (Electro Luminescence) display"), a circularly polarizing plate for suppressing reflection of external light is used. The circular polarizing plate is produced by laminating a linear polarizing plate and a wavelength plate (phase retardation plate) so that their polarization axes intersect at 45 degrees.

In addition, there is a case where, for example, only the wavelength plate is formed with its polarization axis inclined by 15 degrees or 75 degrees. Therefore, it is necessary to form a polarizing plate or a wavelength plate at an arbitrary angle. In addition, in order to make the polarization axes of the polarizing plates or the wave plates intersect at an arbitrary angle, it is also necessary to separately form the polarizing plates or the wave plates.

Conventionally, such polarizing plates or wave plates have been produced using, for example, a stretched film. The stretched film is a film in which molecules in the material are aligned in one direction by extending and pasting the film in one direction.

However, in recent years, along with thinning of organic electroluminescent displays, thinning of polarizers and wavelength plates has also been demanded. However, when a stretched film is used in the production of a polarizing plate or a wavelength plate, there is a limit to reducing the thickness of the stretched film itself, and a sufficient thin plate cannot be obtained.

Then, thinning is achieved by applying a coating liquid having a predetermined material on a substrate, and forming a polarizer or a wavelength plate having a necessary film thickness. Specifically, for example, a coating liquid having liquid crystallinity as a predetermined material is coated on a substrate, and is cast and aligned. Liquid crystal molecules form supramolecular assemblies in the coating liquid first, and when the coating liquid is flowed while applying shear stress, the long axis direction of the supramolecular assemblies is aligned in the flow direction.

In order to make it possible to apply the coating liquid to the substrate in this way, various apparatuses have been proposed in the past. For example, the polarizing film printing apparatus described in Patent Document 1 includes a table plate for holding a substrate, and a slot die for discharging ink to the substrate. The slot die is moved in the printing direction to apply ink to the substrate. [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2005-62502

[The problem to be solved by the invention]

Developed and reviewed the technology of forming optical components such as circularly polarizing plates by applying coating liquid on substrates and drying them.

Conventionally, the substrate on which the coating liquid for optical members is coated was prepared separately from the substrate on which the organic light emitting diode was formed, and was bonded.

Therefore, the number of parts such as the substrate or the adhesive layer is large, the thinning of the organic electroluminescence display is insufficient, and the flexibility of the organic electroluminescence is insufficient.

The present invention has been made in view of the above-mentioned problems, and its main object is to provide an organic electroluminescence display having an optical member with improved thinning and flexibility. [Means for solving problems]

In order to solve the above-mentioned problems, according to an aspect of the present invention, there is provided a method for manufacturing an organic electroluminescent display, which comprises an optical film comprising liquid crystal molecules and a solvent on a substrate on which organic light emitting diodes are formed in advance. It is coated with a coating liquid and dried to form an optical member forming process of an optical film with liquid crystal molecular alignment. [Effect of invention]

According to an aspect of the present invention, an organic electroluminescent display having an optical member with improved thinning and flexibility can be provided.

Hereinafter, a mode for carrying out the present invention will be described with reference to the accompanying drawings. In each figure, the same or corresponding symbols are attached to the same or corresponding components, and descriptions thereof are omitted.

<Organic Electroluminescence Display> FIG. 1 is a plan view showing an organic electroluminescence display according to an embodiment. In FIG. 1, a circuit for amplifying a unit circuit 11 is shown.

The organic electroluminescence display includes a substrate 10 , a plurality of unit circuits 11 arranged on the substrate 10 , a scanning line driving circuit 14 provided on the substrate 10 , and a data line driving circuit 15 provided on the substrate 10 . The unit circuit 11 is provided in an area surrounded by a plurality of scan lines 16 connected to the scan line driver circuit 14 and a plurality of data lines 17 connected to the data line driver circuit 15 . The unit circuit 11 includes a TFT layer 12 and an organic light emitting diode 13 .

The TFT layer 12 has a plurality of TFTs (Thin Film Transistor). One TFT has a function as a switching element, and the other TFT has a function as a current control element to control the amount of current flowing to the organic light emitting diode 13 . The TFT layer 12 is operated by the scan line driver circuit 14 and the data line driver circuit 15 to supply current to the organic light emitting diode 13 . The TFT layer 12 is provided for each unit circuit 11, and the plurality of unit circuits 11 are independently controlled. In addition, the TFT layer 12 may have a general structure, and is not limited to the structure shown in FIG. 1 .

In addition, the driving method of the organic electroluminescence display is an active matrix method in this embodiment, but a passive matrix method is also acceptable.

FIG. 2 is a cross-sectional view showing an important part of an organic electroluminescent display according to an embodiment. The organic electroluminescent display shown in FIG. 2 is a top emission type, and includes a substrate 10 , an organic light emitting diode 13 , a sealing layer 30 , a touch sensor 40 , and an optical member 50 in sequence. The touch sensor 40 is incorporated into the organic electroluminescent display when the organic electroluminescent display is a touch panel.

The substrate 10 may be any of resin substrates, glass substrates, semiconductor substrates, metal substrates, and the like, but is preferably a resin substrate from the viewpoint of improving flexibility. The substrate 10 may be a laminated substrate of a resin substrate and a glass substrate from the viewpoint of improving flexibility and reducing moisture permeability. The TFT layer 12 is formed on the substrate 10 . On the TFT layer 12, a planarization layer 18 for planarizing the level difference formed by the TFT layer 12 is formed.

The planarization layer 18 has insulating properties. Contact plugs 19 are formed in the contact holes penetrating the planarization layer 18 . The contact plug 19 electrically connects the pixel electrode 21 formed on the flat surface of the planarization layer 18 and the TFT layer 12 . The contact plugs 19 can be formed simultaneously with the same material as the pixel electrodes 21 .

The organic light emitting diode 13 is formed on the flat surface of the planarization layer 18 . The organic light emitting diode 13 has a pixel electrode 21, a counter electrode 22 provided on the opposite side of the substrate 10 with the pixel electrode 21 as a reference, and formed between the pixel electrode 21 and the counter electrode 22 the organic layer 23. By operating the TFT layer 12, a voltage is applied between the pixel electrode 21 and the counter electrode 22, and the organic layer 23 emits light.

The pixel electrode 21 is, for example, a cathode, is formed of a metal material such as aluminum, and reflects light from the organic layer 23 toward the organic layer 23 . The light reflected by the pixel electrode 21 passes through the organic layer 23 or the counter electrode 22 and is extracted outside. The pixel electrodes 21 are provided in each unit circuit 11 .

The counter electrode 22 is, for example, an anode, is formed of a transparent material such as ITO (Indium Tin Oxide), and transmits light from the organic layer 23 . The light transmitted through the counter electrode 22 passes through the sealing layer 30 , the touch sensor 40 , and the optical member 50 and is extracted externally. The counter electrode 22 is common to the plurality of unit circuits 11 .

The organic layer 23 has, for example, an electron injection layer 24 , an electron transport layer 25 , a light emitting layer 26 , a positive hole transport layer 27 , and a positive hole injection layer 28 in this order from the cathode side to the anode side. When a voltage is applied between the cathode and the anode, electrons are injected into the electron injection layer 24 from the cathode, and positive holes are injected into the positive hole injection layer 28 from the anode. The electrons injected into the electron injection layer 24 are transported to the light emitting layer 26 by the electron transport layer 25 . In addition, the positive holes injected into the positive hole injection layer 28 are transported to the light emitting layer 26 by the positive hole transport layer 27 . Then, the positive holes and electrons in the light-emitting layer 26 are recombined, the light-emitting material of the light-emitting layer 26 is excited, and the light-emitting layer 26 emits light. As the light-emitting layer 26 , for example, a red light-emitting layer that emits red light, a green light-emitting layer that emits green light, and a blue light-emitting layer that emits blue light are formed.

The organic layer 23 has, in this embodiment, an electron injection layer 24, an electron transport layer 25, a light emitting layer 26, a positive hole transport layer 27, and a positive hole injection layer 28 in this order from the cathode side to the anode side, but It is sufficient to have at least the light-emitting layer 26 . The organic layer 23 is not limited to the structure shown in FIG. 2 .

The sealing layer 30 is connected with the substrate 10 to seal the organic light emitting diode 13 . As the sealing layer 30 , a silicon oxide layer, a silicon nitride layer, or the like can be used, and it is formed by, for example, low-temperature CVD at a film formation temperature of 100° C. or lower. Alternatively, the sealing layer 30 may be formed by sticking the resin film on which the moisture-proof layer is formed.

The touch sensor 40 detects the contact or proximity of an object such as a finger to the screen of the organic electroluminescence display. The detection method of the touch sensor 40 is not particularly limited, and may be, for example, an electrostatic capacitance method. As the electrostatic capacitance method, there are a surface type electrostatic capacitance method, a projection type electrostatic capacitance method, and the like. As the projected electrostatic capacitance method, there are a self-capacitance method, a mutual capacitance method, and the like. When the mutual capacitance method is used, it is better because it can detect multiple points at the same time.

The touch sensor 40, which will be described in detail later, is formed on the substrate 10 on which the organic light emitting diode 13 is formed in advance. Therefore, compared with the case where the touch sensor 40 is formed on a substrate different from the substrate 10 and is bonded to the substrate 10 in the conventional method, the number of parts such as the substrate and the adhesive layer can be reduced, so that the organic electroluminescent display can be thinned. , The flexibility of the organic electroluminescent display can be improved.

The touch sensor 40 is formed between the organic light emitting diode 13 and the optical member 50 . When the optical member 50 is a circularly polarizing film that suppresses reflection of external light, since the circularly polarizing film is disposed on the light extraction side than the touch sensor 40 , the efficiency of suppressing reflection of external light can be improved.

The optical member 50 is, for example, a circular polarizing film that suppresses reflection of external light, and in this embodiment, has a quarter wavelength film (λ/4 film) as the first optical film and a linear polarizing film as the second optical film. The 1/4 wavelength film and the linear polarizing film are formed so that their polarization axes intersect at 45 degrees. In addition, the number of optical films constituting the optical member 50 is not particularly limited.

The optical member 50, which will be described in detail later, is formed on the substrate 10 on which the organic light emitting diode 13 is formed in advance. Therefore, compared with the case where the optical member 50 is formed on a substrate different from the substrate 10 and is bonded to the substrate 10 in the conventional manner, the number of parts such as the substrate and the adhesive layer can be reduced, so that the organic electroluminescence display, the The flexibility of the organic electroluminescent display can be improved.

The optical member 50 is manufactured without using ultraviolet irradiation in order to suppress the deterioration of the organic layer 23 due to ultraviolet rays. In addition, the optical member 50 is manufactured at a temperature of 100° C. or lower in order to suppress deterioration of the organic layer 23 due to heat.

In addition, the organic electroluminescent display 1 shown in FIG. 2 is a top emission type, but a bottom emission type is also acceptable. In the case of the bottom emission method, since the light from the light emitting layer 26 is extracted from the substrate 10 through the pixel electrode 21 , the anode of the transparent electrode is used as the pixel electrode 21 and the cathode of the reflective electrode is used as the counter electrode 22 . In other words, in the case of the bottom emission method, the arrangement of the anode and the cathode is reversed. In addition, in the case of the bottom emission method, the substrate 10 is a transparent substrate. Furthermore, in the case of the bottom emission method, the touch sensor 40 or the optical member 50 is formed on the opposite side to the organic light emitting diode 13 with the substrate 10 as a reference.

<Manufacturing method of organic electroluminescence display> FIG. 3 is a flowchart showing a manufacturing method of an organic electroluminescence display according to an embodiment. As shown in FIG. 3 , the manufacturing method of the organic electroluminescent display includes a touch sensor forming process S110 and an optical member forming process S120. In addition, the touch sensor forming process S110 is performed when the organic electroluminescent display is a touch panel. Hereinafter, each process will be described.

<Touch sensor formation process> The touch sensor formation process S110 is to form the touch sensor 40 on the substrate 10 on which the organic light emitting diodes 13 are pre-formed before the optical member formation process S120. Therefore, compared with the case where the touch sensor 40 is formed on a substrate different from the substrate 10 and is bonded to the substrate 10 in the conventional method, the number of parts such as the substrate and the adhesive layer can be reduced, so that the organic electroluminescent display can be thinned. , The flexibility of the organic electroluminescent display can be improved.

FIG. 4 is a flowchart showing a process for forming a touch sensor according to an embodiment. 5 is a cross-sectional view showing a first metal film formed on a substrate according to an embodiment. 6 is a cross-sectional view showing a photoresist film formed on the first metal film according to an embodiment. 7 is a cross-sectional view showing a photoresist film after exposure and development according to an embodiment. 8 is a cross-sectional view showing the first metal film after etching according to an embodiment. 9 is a cross-sectional view showing the first metal film after removing the photoresist film according to an embodiment. 10 is a cross-sectional view showing an insulating film formed on the first metal film according to an embodiment. 11 is a plan view showing a state in which a part of the second metal film formed on the insulating film is removed according to an embodiment. 5 to 10 are cross-sectional views taken along the line A-A in FIG. 11 . In FIGS. 5 to 11 , illustrations of the organic light emitting diode 13 and the sealing layer 30 shown in FIG. 2 are omitted.

The touch sensor forming process S110 includes a process S111 of forming the light-shielding first metal film 41 on the substrate 10 and a process S112 of selectively removing a part of the first metal film 41 by photolithography and etching. The first metal film 41 is formed on the substrate 10 (more specifically, on the sealing layer 30 , for example) as shown in FIG. 5 . On the first metal film 41, a photoresist film 42 is formed as shown in FIG. 6 . The photoresist film 42 is patterned as shown in FIG. 7 by exposure and development. The photoresist film 42 may be a positive type in which the exposed portion is removed by development, or a negative type in which the exposed portion remains after development. Since the exposure light is blocked by the first metal film 41, the organic light emitting diode 13 is not degraded. After that, using the patterned photoresist film 42 as a mask, a part of the first metal film 41 is selectively removed as shown in FIG. 8 . Part of the first metal film 41 that has been selectively removed is formed into a band shape in plan view as shown by the broken line in FIG. 11 . After that, the photoresist film 42 used for patterning the first metal film 41 is removed as shown in FIG. 9 .

In this specification, the first metal film 41 has light-shielding properties, which means that the transmittance of the first metal film 41 is 5% or less. The transmittance of the first metal film 41 is preferably 3% or less. Here, the transmittance of the first metal film 41 is the rate at which light (eg, light having a wavelength of 365 nm) of the photoresist film 42 formed on the first metal film 41 passes through the first metal film 41 .

In addition, the touch sensor forming process S110 includes a process S113 of forming the insulating film 43 on the partially removed first metal film 41 . The insulating film 43 insulates the first metal film 41 and the second metal film 45 from each other. As the insulating film 43 , a silicon oxide film, a silicon nitride film, or the like can be used, and it is formed by, for example, low-temperature CVD at a film formation temperature of 100° C. or lower.

Furthermore, the touch sensor forming process S110 includes a process S114 of forming the light-shielding second metal film 45 on the substrate 43, and a process S115 of selectively removing a part of the second metal film 45 by photolithography and etching . The formation of the second metal film 45 and the partial removal of the second metal film are performed in the same manner as the formation of the first metal film 41 and the partial removal of the first metal film 41 . Part of the second metal film 45 that has been selectively removed is formed into a strip shape in plan view as shown in FIG. 11 . After that, the photoresist film for patterning the second metal film 45 is removed.

In this specification, the second metal film 45 has light-shielding properties, which means that the transmittance of the second metal film 45 is 5% or less. The transmittance of the second metal film 45 is preferably 3% or less. Here, the transmittance of the second metal film 45 is the rate at which light (eg, light having a wavelength of 365 nm) of the photoresist film formed on the second metal film 45 passes through the second metal film 45 .

Furthermore, the touch sensor forming process S110 includes a process S116 of forming the touch sensor protective film 47 on the second metal film 45 that has been selectively removed. The touch sensor protective film 47 is formed in the same manner as the insulating film 43 . For example, as the touch sensor protective film 47 , a silicon oxide film, a silicon nitride film, or the like can be used, and it is formed by, for example, low-temperature CVD at a film formation temperature of 100° C. or lower.

In this way, the touch sensor 40 composed of the first metal film 41 , the insulating film 43 , the second metal film 45 , and the touch sensor protective film 47 is obtained. The first metal film 41 or the second metal film 45 is formed in a square lattice shape as shown in FIG. 11 so as not to overlap the organic layer 23 of the organic light emitting diode 13 in plan view. One of the first metal film 41 and the second metal film 45 is used as a driving electrode, and the remaining one is used as a receiving electrode. The touch sensor 40 detects the contact or proximity of an object such as a finger to the screen of the organic electroluminescence display by detecting the change of the capacitance between the driving electrode and the signal receiving electrode.

According to the touch sensor formation process S110 of the present embodiment, the organic layer 23 of the organic light emitting diode 13 can be formed on the substrate 10 on which the organic light emitting diode 13 is formed in advance, while suppressing deterioration of the organic layer 23 of the organic light emitting diode 13 due to exposure by the photolithography method. Touch sensor 40 . Compared with the case where the touch sensor 40 is formed on a substrate different from the substrate 10 and is bonded to the substrate 10, the number of parts such as the substrate and the adhesive layer can be reduced, so that the organic electroluminescence display can be thinned, and the thickness of the organic electroluminescent display can be reduced. Improve the flexibility of organic electroluminescent displays.

Since the touch sensor forming process S110 of the present embodiment is performed before the optical member forming process S120 , the touch sensor 40 is formed between the organic light emitting diode 13 and the optical member 50 . When the optical member 50 is a circularly polarizing film that suppresses reflection of external light, since the circularly polarizing film is disposed on the light extraction side than the touch sensor 40 , the efficiency of suppressing reflection of external light can be improved.

<Optical member forming process> In the optical member forming process S120, liquid crystal molecules are formed by coating and drying an optical film coating liquid containing liquid crystal molecules and a solvent on the substrate 10 on which the organic light emitting diodes 13 are formed in advance. Alignment of optical films. The optical member 50 is constituted by an optical film or the like.

The optical member 50 has, for example, a first optical film and a second optical film. One of the first optical film and the second optical film is a retardation film, and the remaining one is a polarizing film.

The optical member 50 is, for example, a circular polarizing film that suppresses reflection of external light, and in this embodiment, has a quarter wavelength film (λ/4 film) as the first optical film and a linear polarizing film as the second optical film. The 1/4 wavelength film and the linear polarizing film are formed so that their polarization axes intersect at 45 degrees. In addition, the number of optical films constituting the optical member 50 is not particularly limited.

According to the optical member forming process S120 of the present embodiment, the optical member 50 is formed on the substrate 10 on which the organic light emitting diode 13 is formed in advance. Therefore, compared with the case where the optical member 50 is formed on a substrate different from the substrate 10 and is bonded to the substrate 10 in the conventional manner, the number of parts such as the substrate and the adhesive layer can be reduced, so that the organic electroluminescence display, the The flexibility of the organic electroluminescent display can be improved.

According to the optical member forming process S120 of the present embodiment, the optical member 50 is manufactured without using ultraviolet irradiation in order to suppress the deterioration of the organic layer 23 due to ultraviolet rays. In addition, the optical member 50 is manufactured at a temperature of 100° C. or lower in order to suppress deterioration of the organic layer 23 due to heat.

<Optical member forming process according to the first embodiment> FIG. 12 is a flowchart showing an optical member forming process according to the first embodiment. The optical component forming process S120, as shown in FIG. 12, includes a first optical film forming process S121, an intermediate film forming process S122, a first optical film patterning process S123, a second optical film forming process S124, and a protective film forming process in sequence. Process S125, and a second optical film patterning process S126. Hereinafter, each process will be described.

In addition, all the processes shown in FIG. 12 may not be performed. For example, as will be described in detail later, the first optical film patterning process S123 or the second optical film patterning process S126 is effective when the optical members 50 are formed on the substrate 10 in plural at intervals, and when the optical members 50 are formed in plural at intervals When only one 50 is formed on the substrate 10, it may be omitted. The same is true for the treatment of partial insolubilization described later.

In addition, a process other than the process shown in FIG. 12 may be performed. For example, before the first optical film forming process S121, in order to improve the adhesion of the first optical film to the substrate 10, the surface (more specifically, the sealing layer) on which the first optical film of the substrate 10 is formed may be performed. 30 or touch sensor protective film 47) surface modification process. As the surface modification film, an organic film such as a silane coupling agent, or an inorganic film such as silicon nitride can be formed.

<The first optical film forming process of the first embodiment> In the first optical film forming process S121 of FIG. 12, as shown in FIG. 13 to FIG. The film coating liquid 61 is applied and dried to form the first optical film 62 . The first optical film 62 is, for example, a 1/4 wavelength film.

FIG. 13 is a side view showing a liquid film of the coating liquid for the first optical film applied on the substrate according to the first embodiment. 14 is a side view showing the first optical film formed by drying the liquid film of the coating liquid for the first optical film according to the first embodiment. FIG. 15 is a side view showing a partially insolubilized first optical film according to the first embodiment.

In FIGS. 13 to 15 , illustrations of the organic light emitting diode 13 or the sealing layer 30 and the like shown in FIG. 2 are omitted. In FIGS. 16 to 24 , the organic light-emitting diodes 13 and the sealing layer 30 and the like shown in FIG. 2 are similarly omitted from the drawings.

As shown in FIG. 13 , in the first optical film forming process S121 , the coating liquid 61 for the first optical film is coated on the substrate 10 from the coating nozzle 60 . The coating nozzle 60 is, for example, a slit coating apparatus having a slit-shaped discharge port on the lower surface.

The first coating liquid 61 for an optical film contains liquid crystal molecules such as lyotropic liquid crystal molecules or thermotropic liquid crystal molecules, and a solvent for dissolving the liquid crystal molecules. As a solvent, water etc. can be used, for example. Moreover, as a solvent, an organic solvent can also be used.

By moving the coating nozzle 60 relative to the substrate 10 in one direction, a shear stress can be applied to the coating liquid 61 for the first optical film applied to the substrate 10 . The acting direction of the shear stress corresponds to the relative moving direction of the coating nozzle 60 and the substrate 10 . By controlling the action direction of the shear stress, the alignment direction of the liquid crystal molecules can be controlled.

Moreover, in this embodiment, a slit coating apparatus may be used for the coating of the coating liquid 61 for 1st optical films, and an immersion coating apparatus etc. may be used. Shear stress may be applied to the coating liquid 61 for the first optical film, and the direction of action of the shear stress may be controlled.

As shown in FIG. 14 , in the first optical film forming process S121 , the liquid film (see FIG. 13 ) of the first optical film coating liquid 61 applied on the substrate 10 is dried to form the first optical film 62 . The solvent is removed from the liquid film of the coating liquid 61 for the first optical film, and the alignment of the liquid crystal molecules is appropriately maintained. The first optical film 62 is, for example, a 1/4 wavelength film.

For drying of the liquid film of the coating liquid 61 for the first optical film, drying under reduced pressure, natural drying, heat drying, air drying, or the like can be employed. Compared with natural drying, drying under reduced pressure can shorten the processing time. In addition, drying under reduced pressure is more capable of suppressing convection of the liquid film and more suppressing disorder of alignment of liquid crystal molecules than drying by heating or air drying. When drying under reduced pressure and the solvent remains, heating and drying may be performed further.

As shown in FIG. 15 , in the first optical film forming process S121 , the cleaning solution used in the first optical film patterning process S123 may not dissolve only a part 63 of the first optical film 62 . This part is not dissolved and can be performed as necessary.

In addition, as the cleaning liquid used in the 1st optical film patterning process S123, the same solvent as the coating liquid 61 for 1st optical films can be used, for example, water can be used. In this case, insolubilization with water is performed.

The fixing liquid 110 which does not dissolve the part 63 of the first optical film 62 is discharged from the coating nozzle 111 of the ink jet system, for example. The coating nozzle 111 has a plurality of discharge nozzles that discharge droplets of the fixing liquid 110 downward.

The fixing liquid 110 is selectively applied to a part 63 of the first optical film 62 by discharging droplets of the fixing liquid 110 from the application nozzle 111 while moving the application nozzle 111 relative to the substrate 10 . Thereby, a part 63 of the first optical film 62 is not dissolved.

The fixing solution 110 does not dissolve a part 63 of the first optical film 62 by, for example, substituting a functional group (such as a water-soluble functional group such as an OH group) at the end of the first optical film 62 with another functional group. In addition, the fixing liquid 110 may be polymerized by a condensation reaction (eg, dehydration condensation reaction of OH groups) without dissolving a part 63 of the first optical film 62 . In the latter case, compared with the former case, insolubilization is facilitated due to the progress of polymerization.

The fixing liquid 110 is removed after not dissolving a part 63 of the first optical film 62 . The fixing liquid 110 may contain water or an organic solvent.

The area to which the fixing liquid 110 is applied may be, for example, an area in which pixels such as a plurality of OLEDs are formed (hereinafter, referred to as "pixel area").

In addition, in this embodiment, since the fixing liquid 110 is apply|coated to only a part 63 of the 1st optical film 62, and the application|coating nozzle 111 of an inkjet system is used, this invention is not limited to this. For example, by covering only the remaining part of the first optical film 62 with a mask, and then immersing the entire substrate 10 in the fixing solution 110 , the fixing solution may be applied to only a part 63 of the first optical film 62 .

<Interlayer film formation process of the first embodiment> In the interlayer film formation process S122 of FIG. 12 , as shown in FIGS. 16 to 17 , a coating solution for the interlayer film different from the coating solution for the first optical film 61 is applied. 71 is coated on the first optical film 62 and dried to form an intermediate film 72 .

16 is a side view showing a liquid film of a coating liquid for an intermediate film applied on a first optical film according to the first embodiment. 17 is a side view showing an intermediate film formed by drying the liquid film of the coating liquid for an intermediate film according to the first embodiment.

As shown in FIG. 16 , in the intermediate film forming process S122 , the coating liquid 71 for an intermediate film is applied from the application nozzle 70 on the substrate 10 on which the first optical film 62 is formed. The coating nozzle 70 may be an ink jet method, and has a plurality of discharge nozzles that discharge droplets of the coating liquid 71 for an interlayer film downward.

By moving the coating nozzle 70 relative to the substrate 10 , the coating liquid 71 for an interlayer film is selectively coated on a part 63 of the first optical film 62 by discharging droplets of the coating liquid 71 for an interlayer film from the coating nozzle 70 . .

The coating liquid 71 for intermediate films is applied on the first optical film 62 . Therefore, the liquid crystal molecules forming the first optical film 62 may be insoluble in the solvent of the coating liquid 71 for the interlayer film. The dissolution of the first optical film 62 can be prevented by the application of the coating liquid 71 for an interlayer film.

The coating liquid 71 for an interlayer film contains an organic material forming the interlayer film 72 and a solvent for dissolving the organic material. The organic material forming the intermediate film 72 includes a polymer or the like that is insoluble in the cleaning solution used in the first optical film patterning process S123.

As the coating liquid 71 for an interlayer film, for example, a thermosetting clear coating, a chemical reaction clear coating, a drying curing clear coating, or the like can be used. Specifically, oil-based enamel paint, phthalate resin paint, or the like can be used.

Thermosetting clear paint, chemical reaction type clear paint, drying curing clear paint, etc. are polymerized by thermal curing, chemical reaction, or drying curing, so that a dense intermediate film 72 can be formed. Therefore, the insolubility of the intermediate film 72 to the cleaning solution used in the first optical film patterning process S123 can be improved.

The coating liquid 71 for interlayer films may have the same function as that of the fixing liquid 110 . The insolubility of a part of the first optical film 62 can be promoted. In addition, when a part of the first optical film 62 is insolubilized by the coating liquid 71 for an interlayer film, the part of the first optical film 62 may not be insolubilized in the above-mentioned first optical film forming process S121.

For example, in the coating liquid 71 for an intermediate film, the functional group (for example, a water-soluble functional group such as an OH group) at the end of the first optical film 62 may be replaced with another functional group, so that the first optical film 62 does not dissolve. part 63. In addition, the coating liquid 71 for interlayer films may be polymerized by a condensation reaction (eg, dehydration condensation reaction of OH groups) without dissolving a part 63 of the first optical film 62 . In the latter case, compared with the former case, insolubilization is facilitated due to the progress of polymerization.

The area where the interlayer coating liquid 71 is applied may be the same as the area where the fixing liquid 110 is applied. For example, the area where the coating liquid 71 for an interlayer film is applied may be a pixel area on the substrate 10 .

As shown in FIG. 17 , in the intermediate film forming process S122 , the liquid film (see FIG. 16 ) of the coating liquid for an intermediate film 71 applied on the substrate 10 is dried to form an intermediate film 72 . The intermediate film 72 is formed by removing the solvent from the liquid film of the coating liquid 71 for an intermediate film.

Drying of the liquid film of the coating liquid 71 for an interlayer film can be performed by drying under reduced pressure, natural drying, heating drying, air drying, or the like. Compared with natural drying, drying under reduced pressure can shorten the processing time. When drying under reduced pressure and the solvent remains, heating and drying may be performed further.

The intermediate film 72 is insoluble in the cleaning solution used in the first optical film patterning process S123. The intermediate film 72, unlike the first optical film 62, has optical homogeneity. The visible light transmittance of the intermediate film 72 is preferably 95% or more. In addition, the film thickness of the intermediate film 72 is preferably 10 μm or less. In addition, the residual stress of the intermediate film 72 is preferably as small as possible in order to suppress deformation of the optical member.

The intermediate film 72 covers the main surface of a part 63 of the first optical film 62 . The intermediate film 72 plays a role of protecting the part 63 of the first optical film 62 so as not to damage the part 63 of the first optical film 62 or to prevent adhesion of foreign matter or the like. The pencil hardness of the interlayer film 72 is preferably 2H or more. This is particularly effective when the optical member is temporarily interrupted in the middle of manufacturing and it takes time to restore it, since there is a high risk of damage or adhesion of foreign matter.

In addition, since the remaining portion of the first optical film 62 is removed in the first optical film patterning process S123, damage or foreign matter adhesion does not become a problem. In addition, the foreign matter adhering to the interlayer film 72 can be removed by cleaning, and the part 63 of the first optical film 62 is not damaged by the cleaning.

<The first optical film patterning process of the first embodiment> In the first optical film patterning process S123 of FIG. 12 , after the intermediate film forming process S122 and before the second optical film forming process S124, only the first optical film is used to cover the first optical film. The intermediate film 72 of a part 63 (refer to FIG. 17 ) of the film 62 serves as a mask, and the remaining part of the first optical film 62 is removed as shown in FIG. 18 .

18 is a side view showing the first optical film from which the portion not covered with the interlayer film is removed according to the first embodiment. During the first optical film patterning process S123, a part 63 of the first optical film 62 can be protected by the intermediate film 72, and the shape collapse of the part 63 of the first optical film 62 can be suppressed. Thus, the quality of the optical member can be improved.

For example, in the first optical film patterning process S123, a cleaning solution for dissolving the first optical film 62 is used. The cleaning liquid is supplied to the substrate 10 while rotating the substrate 10 with a spin chuck, for example. The cleaning liquid supplied to the substrate 10 is spread over the entire substrate 10 by centrifugal force, and is thrown out from the outer peripheral edge of the substrate 10 .

Since a part 63 of the first optical film 62 is covered with the intermediate film 72, it does not come into contact with the cleaning liquid and does not cause mold collapse due to the cleaning liquid. On the other hand, since the remaining part of the first optical film 62 is in contact with the cleaning liquid, it is dissolved and removed by the cleaning liquid.

In addition, the first optical film may be dissolved and removed by storing the cleaning solution in the cleaning tank and immersing the substrate 10 in the cleaning solution in the cleaning tank to dissolve and remove the first optical film while leaving a part 63 of the first optical film 62 The remainder of 62. The cleaning liquid in the cleaning tank may be stirred with a stirring blade or the like.

In the above-mentioned first optical film forming process S121 or the above-mentioned intermediate film forming process S122, the part 63 of the first optical film 62 is effective in insolubilizing the cleaning solution so that the part 63 of the first optical film 62 is left securely. of. Excessive removal due to the surrounding of the cleaning liquid can be prevented, and a part 63 of the first optical film 62 can be reliably left.

In addition, since the intermediate film 72 has insolubility with respect to the cleaning solution, in the above-mentioned first optical film forming process S121 or the above-mentioned intermediate film forming process S122, the first optical film 62 can be patterned without partially insolubilizing the first optical film 62. 1 Optical film 62. In this case, the number of processes can be reduced.

In the above-described first optical film forming process S121, since the first optical film coating liquid 61 is applied while applying shear stress, it is difficult to apply the first optical film coating liquid 61 only to the pixel region. Therefore, it is effective to perform the first optical film patterning process S123.

In addition, in this embodiment, although the remaining part of the 1st optical film 62 is removed using the cleaning liquid, the removal method of the remaining part of the 1st optical film 62 is not specifically limited. For example, an etching method can also be used. The etching may be either wet etching or dry etching.

Hereinafter, the part 63 of the first optical film 62 remaining in the first optical film patterning process S123 is also referred to as "the first optical film 63".

<The second optical film formation process of the first embodiment> In the second optical film formation process S124 of FIG. 12 , as shown in FIGS. 19 to 21 , by applying a coating liquid for the second optical film containing liquid crystal molecules and a solvent 81 is coated on the intermediate film 72 and dried to form the second optical film 82 . The second optical film 82 is, for example, a linear polarizing film.

19 to 21 are explanatory side views showing the second optical film forming process according to the first embodiment. 19 is a side view showing a liquid film of the second optical film coating liquid applied on the intermediate film according to the first embodiment. 20 is a side view showing the second optical film formed by drying the liquid film of the coating liquid for the second optical film according to the first embodiment. Fig. 21 is a side view showing a partially insolubilized second optical film according to the first embodiment.

As shown in FIG. 19 , in the second optical film forming process S124 , the second optical film coating liquid 81 is coated on the substrate 10 from the coating nozzle 80 . The coating nozzle 80 is, for example, a slit coating apparatus having a slit-shaped discharge port on the lower surface.

The second optical film coating liquid 81 is applied on the intermediate film 72 . Therefore, the organic material forming the intermediate film 72 may be insoluble in the solvent of the coating liquid 81 for the second optical film. The interlayer film 72 can be prevented from being dissolved by the application of the second optical film coating liquid 81 .

The second coating liquid 81 for optical films contains liquid crystal molecules such as lyotropic liquid crystal molecules or thermotropic liquid crystal molecules, and a solvent for dissolving the liquid crystal molecules. As a solvent, water etc. can be used, for example. Moreover, as a solvent, an organic solvent can also be used.

By moving the coating nozzle 80 relative to the substrate 10 in one direction, shear stress can be applied to the second coating liquid 81 for optical films applied to the substrate 10 . The acting direction of the shear stress corresponds to the relative moving direction of the coating nozzle 80 and the substrate 10 . By controlling the action direction of the shear stress, the alignment direction of the liquid crystal molecules can be controlled.

The direction of action of the shear stress in the second optical film forming process S124 is a direction intersecting at an oblique 45° with respect to the direction of action of the shear stress in the first optical film forming process S121. Thereby, the 1/4 wavelength film and the linear polarizing film are formed so that their polarization axes intersect at 45 degrees.

In addition, in this embodiment, a slit coating apparatus may be used for the coating of the coating liquid 81 for 2nd optical films, and an immersion coating apparatus etc. may be used. Shear stress may be applied to the second coating liquid 81 for optical films, and the direction of action of the shear stress may be controlled.

As shown in FIG. 20 , in the second optical film forming process S124 , the liquid film (see FIG. 19 ) of the second optical film coating liquid 81 applied on the substrate 10 is dried to form the second optical film 82 . The solvent is removed from the liquid film of the coating liquid 81 for the second optical film, and the alignment of the liquid crystal molecules is appropriately maintained. The second optical film 82 is, for example, a linear polarizing film.

Drying of the liquid film of the coating liquid 81 for the second optical film can be performed by drying under reduced pressure, natural drying, heat drying, air drying, or the like. Compared with natural drying, drying under reduced pressure can shorten the processing time. In addition, drying under reduced pressure is more capable of suppressing convection of the liquid film and more suppressing disorder of alignment of liquid crystal molecules than drying by heating or air drying. When drying under reduced pressure and the solvent remains, heating and drying may be performed further.

As shown in FIG. 21, in the second optical film forming process S124, only a part 83 of the second optical film 82 may be insoluble in the cleaning solution used in the second optical film patterning process S126. This part is not dissolved and can be performed as necessary.

Moreover, as the cleaning liquid used in the 2nd optical film patterning process S126, the same solvent as the coating liquid 81 for 2nd optical films can be used, for example, water can be used. In this case, insolubilization with water is performed.

The fixing liquid 120 that does not dissolve the part 83 of the second optical film 82 is discharged from the coating nozzle 121 of the ink jet system, for example. The coating nozzle 121 has a plurality of discharge nozzles that discharge droplets of the fixing liquid 120 downward.

The fixing liquid 120 is selectively applied to a part 83 of the second optical film 82 by discharging the fixing liquid 120 droplets from the application nozzle 121 while moving the application nozzle 121 relative to the substrate 10 . Thereby, a part 83 of the second optical film 82 is not dissolved.

The fixing solution 120 does not dissolve a part 83 of the second optical film 82, for example, by substituting a functional group (such as a water-soluble functional group such as an OH group) at the end of the second optical film 82 with another functional group. In addition, the fixing liquid 120 may be polymerized by a condensation reaction (eg, dehydration condensation reaction of OH groups) without dissolving a part 83 of the second optical film 82 . In the latter case, compared with the former case, insolubilization is facilitated due to the progress of polymerization.

The fixing liquid 120 is removed after not dissolving a part 83 of the second optical film 82 . The fixing solution 120 may contain water or an organic solvent.

The area where the fixing solution 120 is applied may be, for example, a pixel area.

In addition, in this embodiment, since the fixing liquid 120 is apply|coated to only a part 83 of the 2nd optical film 82, and the application|coating nozzle 121 of an inkjet system is used, this invention is not limited to this. For example, by covering only the remaining part of the second optical film 82 with a mask, and then immersing the entire substrate 10 in the fixing solution 120 , the fixing solution may be applied to only a part 83 of the second optical film 82 .

<The protective film forming process of the first embodiment> In the protective film forming process S125 of FIG. 12 , as shown in FIGS. 22 to 23 , by applying a coating liquid for the protective film different from the coating liquid for the second optical film 81 91 is coated on the second optical film 82 and dried to form a protective film 92 .

22 is a side view showing the liquid film of the coating liquid for protective film applied on the second optical film according to the first embodiment. 23 is a side view showing a protective film formed by drying the liquid film of the coating liquid for protective film according to the first embodiment.

As shown in FIG. 22 , in the protective film forming process S125 , the coating liquid 91 for protective films is applied from the application nozzle 90 on the substrate 10 on which the second optical film 82 is formed. The coating nozzle 90 may be an ink jet method, and has a plurality of discharge nozzles that discharge droplets of the coating liquid 91 for protective films downward.

The coating liquid 91 for a protective film is selectively applied to a part 83 of the second optical film 82 by discharging droplets of the coating liquid 91 for a protective film from the coating nozzle 90 while moving the coating nozzle 90 relative to the substrate 10 . .

The coating liquid 91 for protective films is applied on the second optical film 82 . Therefore, the liquid crystal molecules forming the second optical film 82 may be insoluble in the solvent of the coating liquid 91 for protective film. The second optical film 82 can be prevented from being dissolved by the application of the coating liquid 91 for a protective film.

The coating liquid 91 for protective films contains the organic material which forms the protective film 92, and the solvent which melt|dissolves this organic material. The organic material forming the protective film 92 includes a polymer or the like that is insoluble in the cleaning solution used in the second optical film patterning process S126.

As the coating liquid 91 for protective films, for example, a thermosetting clear coating, a chemical reaction type clear coating, a drying curing clear coating, etc. can be used. Specifically, oil-based enamel paint, phthalate resin paint, or the like can be used.

Thermosetting clear coatings, chemical reaction clear coatings, drying curing clear coatings, etc., are polymerized by thermal curing, chemical reaction, or drying curing, so that a dense protective film 92 can be formed. Therefore, the insolubility of the protective film 92 to the cleaning solution used in the second optical film patterning process S126 can be improved.

The coating liquid 91 for protective films may have the same function as the fixing liquid 120 . Part of the second optical film 82 can be promoted to be insolubilized. In addition, when a part of the second optical film 82 is insolubilized by the coating liquid 91 for a protective film, the part of the second optical film 82 may not be insolubilized in the second optical film forming step S124 described above.

For example, in the coating liquid 91 for a protective film, the functional group at the end of the second optical film 82 (for example, a water-soluble functional group such as an OH group) may be replaced with another functional group, so that the second optical film 82 does not dissolve. part 83. In addition, the coating liquid 91 for protective films may be polymerized by condensation reaction (for example, dehydration condensation reaction of OH groups), without dissolving a part 83 of the second optical film 82 . In the latter case, compared with the former case, insolubilization is facilitated due to the progress of polymerization.

The area where the protective film coating liquid 91 is applied may be the same as the area where the fixing liquid 120 is applied. For example, the area where the coating liquid 91 for protective film is applied may be a pixel area on the substrate 10 .

As shown in FIG. 23 , in the protective film forming step S125 , the liquid film (see FIG. 22 ) of the protective film coating liquid 91 applied on the substrate 10 is dried to form the protective film 92 . The solvent is removed from the liquid film of the coating liquid 91 for protective film, and the protective film 92 is formed.

Drying of the liquid film of the coating liquid 91 for a protective film can be performed by drying under reduced pressure, natural drying, heating drying, air drying, or the like. Compared with natural drying, drying under reduced pressure can shorten the processing time. When drying under reduced pressure and the solvent remains, heating and drying may be performed further.

The protective film 92 is insoluble to the cleaning solution used in the second optical film patterning process S126. The protective film 92 is different from the second optical film 82 in that it has optical homogeneity. The visible light transmittance of the protective film 92 is preferably 95% or more. In addition, the film thickness of the protective film 92 is preferably 10 μm or less. In addition, in order to suppress the deformation|transformation of an optical member, the residual stress of the protective film 92 should be as small as possible.

The protective film 92 covers the main surface of a part 83 of the second optical film 82 . The protective film 92 functions to protect the part 83 of the second optical film 82 so as not to damage the part 83 of the second optical film 82 or to prevent adhesion of foreign matter or the like. The pencil hardness of the interlayer film 72 is preferably 2H or more.

In addition, since the remaining portion of the second optical film 82 is removed in the second optical film patterning process S126, damage or foreign matter adhesion does not become a problem. In addition, the foreign matter adhering to the protective film 92 can be removed by washing, and the part 83 of the second optical film 82 is not damaged by the washing.

In addition, although the protective film 92 of this embodiment is formed by apply|coating and drying the coating liquid 91 for protective films on the 2nd optical film 82, you may stick to the 2nd optical film 82 in the form of a thin film.

<The second optical film patterning process of the first embodiment> In the second optical film patterning process S126 of FIG. 12, after the protective film forming process S125, the protective film 92 covering only a part 83 of the second optical film 82 is used. (Refer to FIG. 23 ) As a mask, the remaining portion of the second optical film 82 is removed as shown in FIG. 24 .

24 is a side view showing the second optical film from which the portion not covered with the protective film is removed according to the first embodiment. During the second optical film patterning process S126, a part 83 of the second optical film 82 can be protected by the protective film 92, and the shape collapse of the part 83 of the second optical film 82 can be suppressed. Thus, the quality of the optical member can be improved.

For example, in the second optical film patterning process S126, a cleaning solution for dissolving the second optical film 82 is used. The cleaning liquid is supplied to the substrate 10 while rotating the substrate 10 with a spin chuck, for example. The cleaning liquid supplied to the substrate 10 is spread over the entire substrate 10 by centrifugal force, and is thrown out from the outer peripheral edge of the substrate 10 .

Since a part 83 of the second optical film 82 is covered with the protective film 92, it does not come into contact with the cleaning liquid, and the cleaning liquid does not cause mold collapse. On the other hand, since the remaining portion of the second optical film 82 is in contact with the cleaning liquid, it is dissolved and removed by the cleaning liquid.

In addition, the second optical film may be dissolved and removed while the part 83 of the second optical film 82 is left by storing the cleaning liquid in the cleaning tank and immersing the substrate 10 in the cleaning liquid in the cleaning tank. The remainder of 82. The cleaning liquid in the cleaning tank may be stirred with a stirring blade or the like.

In the above-mentioned second optical film forming process S124 or the above-mentioned protective film forming process S125, the part 83 of the second optical film 82 is effective in insolubilizing the cleaning solution so that the part 83 of the second optical film 82 is left securely. of. Excessive removal due to the surrounding of the cleaning liquid can be prevented, and a part 83 of the second optical film 82 can be reliably left.

In addition, since the protective film 92 has insolubility with respect to the cleaning solution, in the second optical film forming process S124 or the protective film forming process S125 described above, the second optical film 82 can be patterned without partially insolubilizing the second optical film 82. 2 Optical film 82. In this case, the number of processes can be reduced.

In the above-described second optical film forming process S124, since the second optical film coating liquid 81 is applied while applying shear stress, it is difficult to apply the second optical film coating liquid 81 only to the pixel region. Therefore, it is effective to perform the second optical film patterning process S126.

In addition, in the present embodiment, the remaining portion of the second optical film 82 is removed using a cleaning solution, but the method for removing the remaining portion of the second optical film 82 is not particularly limited. For example, an etching method can also be used. The etching may be either wet etching or dry etching.

Hereinafter, the part 83 of the second optical film 82 left in the second optical film patterning process S126 is also referred to as "the second optical film 83".

According to this embodiment, as shown in FIG. 24 , a plurality of optical members 50 including the first optical film 63 , the intermediate film 72 , the second optical film 83 and the protective film 92 are formed on the substrate 10 at intervals. Thus, the optical member 50 may be multi-chamfered. In addition, since the optical member 50 is selectively formed in the pixel area, the terminals provided around the pixel area can function appropriately.

<Summary of the optical member forming process of the first embodiment> As described above, according to this embodiment, the first optical film forming process S121, the intermediate film forming process S122, and the second optical film forming process S124 are sequentially performed. The intermediate film 72 is formed between the first optical film 63 and the second optical film 83 . The intermediate film 72 protects the first optical film 63 from damage to the first optical film 63 or adhesion of foreign matter or the like. Thus, the quality of the optical member 50 can be improved. When the optical member 50 is temporarily interrupted in the middle of production and it takes time to recover, there is a high risk of damage or adhesion of foreign matter, which is particularly effective.

According to the present embodiment, after the intermediate film forming process S122 and before the second optical film forming process S124, the intermediate film 72 covering only a part 63 of the first optical film 62 is used as a mask, and the first optical film 62 is removed. The remaining part of the first optical film patterning process S123. During the first optical film patterning process S123, a part 63 of the first optical film 62 can be protected by the intermediate film 72, and the shape collapse of the part 63 of the first optical film 62 can be suppressed. Thus, the quality of the optical member 50 can be improved.

According to the present embodiment, in the first optical film patterning process S123, a cleaning solution for dissolving the first optical film 62 is used. Since a part 63 of the first optical film 62 is covered with the intermediate film 72, it does not come into contact with the cleaning liquid and does not cause mold collapse due to the cleaning liquid. On the other hand, since the remaining part of the first optical film 62 is in contact with the cleaning liquid, it is dissolved and removed by the cleaning liquid.

According to the present embodiment, in the first optical film forming process S121, only a part 63 of the first optical film 62 is not dissolved in the cleaning solution used in the first optical film patterning process S123. Therefore, in the first optical film patterning process S123, excessive removal due to the surrounding of the cleaning solution can be prevented, and a part 63 of the first optical film 62 can be reliably left.

According to the present embodiment, in the intermediate film forming process S122, by applying the coating liquid 71 for an intermediate film to only a part 63 of the first optical film 62, the cleaning liquid used in the first optical film patterning process S123 is not only A part 63 of the first optical film 62 is dissolved. Therefore, in the first optical film patterning process S123, excessive removal due to the surrounding of the cleaning solution can be prevented, and a part 63 of the first optical film 62 can be reliably left.

According to the present embodiment, the protective film forming process S125 for forming the protective film 92 for protecting the second optical film 83 is performed. The protective film 92 can protect the second optical film 83 from damage to the second optical film 83 or adhesion of foreign matter or the like after the optical member 50 is manufactured. Thus, the quality of the optical member 50 can be improved.

According to the present embodiment, after the protective film forming process S125, the second optical film patterning in which the protective film 92 covering only a part 83 of the second optical film 82 is used as a mask and the remaining part of the second optical film 82 is removed is performed. Process S126. During the second optical film patterning process S126, a part 83 of the second optical film 82 can be protected by the protective film 92, and the shape collapse of the part 83 of the second optical film 82 can be suppressed. Thus, the quality of the optical member 50 can be improved.

According to the present embodiment, in the second optical film patterning process S126, a cleaning solution for dissolving the second optical film 82 is used. Since a part 83 of the second optical film 82 is covered with the protective film 92, it does not come into contact with the cleaning liquid, and the cleaning liquid does not cause mold collapse. On the other hand, since the remaining portion of the second optical film 82 is in contact with the cleaning liquid, it is dissolved and removed by the cleaning liquid.

According to the present embodiment, in the second optical film forming process S124, only a part 83 of the second optical film 82 is not dissolved in the cleaning solution used in the second optical film patterning process S126. Therefore, in the second optical film patterning process S126, excessive removal due to the surrounding of the cleaning liquid can be prevented, and a part 83 of the second optical film 82 can be reliably left.

According to the present embodiment, in the protective film forming process S125, by applying the protective film coating liquid 91 to only a part 83 of the second optical film 82, the cleaning liquid used in the second optical film patterning process S126 is not only A part 83 of the second optical film 82 is dissolved. Therefore, in the second optical film patterning process S126, excessive removal due to the surrounding of the cleaning liquid can be prevented, and a part 83 of the second optical film 82 can be reliably left.

<Optical member forming process of the second embodiment> Compared with the above-mentioned first embodiment, the first optical film patterning process S123 is performed after the intermediate film forming process S122. In this embodiment, the intermediate film patterning process S123 is performed after the first optical film patterning process S123. The point of the film formation process S122 is different.

Therefore, unlike the first embodiment described above, the intermediate film 72 of the present embodiment does not function as a mask for leaving a part 63 of the first optical film 62 and removing the remaining part of the first optical film 62 . The interlayer film 72 of the present embodiment functions to protect a part 63 of the first optical film 62 from damage to a part 63 of the first optical film 62 or adhesion of foreign matter or the like.

In addition, this embodiment is different in that the second optical film patterning process S126 is performed after the protective film forming process S125 in the first embodiment described above, and the protective film forming process S125 is performed after the second optical film patterning process S126.

Therefore, unlike the first embodiment, the protective film 92 of this embodiment does not function as a mask for leaving a part 83 of the second optical film 82 and removing the remaining part of the second optical film 82 . The protective film 92 of the present embodiment functions to protect a part 83 of the second optical film 82 from damage to the part 83 of the second optical film 82 or adhesion of foreign matter or the like.

Hereinafter, the difference will be mainly described with reference to FIG. 25 and the like. FIG. 25 is a flowchart showing a process for forming an optical member according to the second embodiment. As shown in FIG. 25 , the optical member forming process S120 includes a first optical film forming process S121, a first optical film patterning process S123, an intermediate film forming process S122, a second optical film forming process S124, and a second optical film forming process S124. The film patterning process S126, and the protective film forming process S125.

In addition, all the processes shown in FIG. 25 may not be performed. For example, as will be described in detail later, the first optical film patterning process S123 or the second optical film patterning process S126 is effective when the optical members 50 are formed on the substrate 10 in plural at intervals, and when the optical members 50 are formed in plural at intervals When only one 50 is formed on the substrate 10, it may be omitted. The same is true for the treatment of partial insolubilization described later.

In addition, a process other than the process shown in FIG. 25 may be performed. For example, before the 1st optical film formation process S121, in order to improve the adhesiveness of the 1st optical film with respect to a board|substrate, the process of surface-modifying the surface on which the 1st optical film of a board|substrate is formed may be performed. As the surface modification film, an organic film such as a silane coupling agent, or an inorganic film such as silicon nitride can be formed.

Furthermore, the first optical film forming process S121 shown in FIG. 25 , the first optical film patterning process S123 and the intermediate film forming process S122 , and the second optical film forming process S124 shown in FIG. 12 , The protective film forming process S125 and the second optical film patterning process S126 are performed.

Furthermore, the first optical film forming process S121 shown in FIG. 12 , the intermediate film forming process S122 , the first optical film patterning process S123 , and the second optical film forming process S124 shown in FIG. 25 , The second optical film patterning process S126 and the protective film forming process S125.

<The first optical film forming process of the second embodiment> In the first optical film forming process S121 of FIG. 25 , as shown in FIGS. The coating liquid 61 for optical films is apply|coated and dried, and the 1st optical film 62 is formed. The first optical film 62 is, for example, a 1/4 wavelength film.

In the 1st optical film formation process S121 of this embodiment, the process of insolubilizing a part 63 of the 1st optical film 62 shown in FIG. 15 is not performed. This treatment is performed in the first optical film patterning process S123.

<The first optical film patterning process of the second embodiment> In the first optical film patterning process S123 of FIG. 25, after the first optical film forming process S121 and before the intermediate film forming process S122, the first optical film is left A part 63 of 62 is removed, and the remaining part of the first optical film 62 is removed.

For example, in the first optical film patterning process S123, as shown in FIG. 15, only a part 63 of the first optical film 62 is not dissolved in the cleaning solution, and then the first optical film 62 is dissolved in the cleaning solution as shown in FIG. 26. the remainder of the . Fig. 26 is a side view showing the first optical film from which the portion that is not insoluble has been removed according to the second embodiment.

The cleaning liquid is supplied to the substrate 10 while rotating the substrate 10 with a spin chuck, for example. The cleaning liquid supplied to the substrate 10 is spread over the entire substrate 10 by centrifugal force, and is thrown out from the outer peripheral edge of the substrate 10 .

The part 63 of the first optical film 62 is not dissolved by the cleaning solution, and therefore does not collapse due to the cleaning solution. On the other hand, since the remaining portion of the first optical film 62 is not insoluble to the cleaning liquid, it is dissolved and removed by the cleaning liquid.

In addition, the first optical film may be dissolved and removed by storing the cleaning solution in the cleaning tank and immersing the substrate 10 in the cleaning solution in the cleaning tank to dissolve and remove the first optical film while leaving a part 63 of the first optical film 62 The remainder of 62. The cleaning liquid in the cleaning tank may be stirred with a stirring blade or the like.

As shown in FIG. 26 , in this embodiment, before forming the intermediate film 72 (see FIG. 28 ), a part 63 of the first optical film 62 is left, the remaining part of the first optical film 62 is removed, and the first optical film 62 is patterned membrane 62.

In the above-described first optical film forming process S121, since the first optical film coating liquid 61 is applied while applying shear stress, it is difficult to apply the first optical film coating liquid 61 only to the pixel region. Therefore, it is effective to perform the first optical film patterning process S123.

Hereinafter, the part 63 of the first optical film 62 remaining in the first optical film patterning process S123 is also referred to as "the first optical film 63".

<Interlayer film formation process of the second embodiment> In the interlayer film formation process S122 of FIG. 25 , as shown in FIGS. 27 to 28 , by applying a coating solution for the interlayer film different from the coating solution 61 for the first optical film 71 is coated on the first optical film 63 and dried to form an intermediate film 72 .

FIG. 27 shows a liquid film of a coating liquid for an intermediate film applied on the first optical film according to the second embodiment. FIG. 28 shows an intermediate film formed by drying the liquid film of the coating liquid for an intermediate film according to the second embodiment.

As shown in FIG. 27 , in the intermediate film forming process S122 , the coating liquid 71 for an intermediate film is coated from the coating nozzle 70 on the substrate 10 on which the first optical film 63 is formed. The coating nozzle 70 may be an ink jet method, and has a plurality of discharge nozzles that discharge droplets of the coating liquid 71 for an interlayer film downward.

By moving the coating nozzle 70 relative to the substrate 10 , droplets of the coating liquid 71 for interlayer film are discharged from the coating nozzle 70 , and only the first optical film 63 and its vicinity (for example, only the pixel area and its vicinity) are applied. ) selectively coats the coating liquid 71 for an intermediate film.

The coating liquid 71 for an intermediate film is coated on the first optical film 63 . Therefore, the liquid crystal molecules forming the first optical film 63 may be insoluble in the solvent of the coating liquid 71 for the interlayer film. The dissolution of the first optical film 63 can be prevented by the application of the coating liquid 71 for an interlayer film.

The coating liquid 71 for an interlayer film contains an organic material forming the interlayer film 72 and a solvent for dissolving the organic material. The organic material forming the intermediate film 72 includes a polymer or the like that is insoluble in the solvent of the second optical film coating liquid 81 (see FIG. 29 ) applied on the intermediate film 72 .

As the coating liquid 71 for an interlayer film, for example, a thermosetting clear coating, a chemical reaction clear coating, a drying curing clear coating, or the like can be used. Specifically, oil-based enamel paint, phthalate resin paint, or the like can be used.

Thermosetting clear paint, chemical reaction type clear paint, drying curing clear paint, etc. are polymerized by thermal curing, chemical reaction, or drying curing, so that a dense intermediate film 72 can be formed.

As shown in FIG. 27 , the coating liquid 71 for an intermediate film can be applied to cover not only the main surface of the first optical film 63 but also the end surface of the first optical film 63 . The first optical film 63 can be protected by the intermediate film 72 , and not only the main surface of the first optical film 63 but also the end surfaces of the first optical film 63 can be protected from damage or adhesion of foreign matter.

The area where the interlayer coating liquid 71 is applied can be limited to the pixel area on the substrate 10 and its vicinity.

Moreover, since the area where the coating liquid 71 for interlayer films is applied is limited, a mask such as a film may be pasted on the substrate 10 . This mask may form a gap with the first optical film 63, and the first optical film 63 may not be damaged when peeled off later.

As shown in FIG. 28 , in the intermediate film forming process S122 , the liquid film (see FIG. 27 ) of the coating liquid for intermediate film 71 applied on the substrate 10 is dried to form the intermediate film 72 . The intermediate film 72 is formed by removing the solvent from the liquid film of the coating liquid 71 for an intermediate film.

Unlike the first optical film 63, the intermediate film 72 has optical homogeneity. The visible light transmittance of the intermediate film 72 is preferably 95% or more. In addition, the film thickness of the intermediate film 72 is preferably 10 μm or less. In addition, the residual stress of the intermediate film 72 is preferably as small as possible in order to suppress deformation of the optical member.

The intermediate film 72 covers not only the main surface of the first optical film 63 but also the end surface of the first optical film 63 . The intermediate film 72 plays a role of protecting the first optical film 63, and prevents the first optical film 63 from being damaged or foreign substances from adhering. The pencil hardness of the interlayer film 72 is preferably 2H or more. This is particularly effective when the optical member is temporarily interrupted in the middle of manufacturing and it takes time to restore it, since there is a high risk of damage or adhesion of foreign matter.

The intermediate film 72 is formed only in the pixel region and its vicinity on the substrate 10 , and a plurality of intermediate films 72 are formed on the substrate 10 with intervals therebetween. In addition, when it is not necessary to take out the terminals provided in the periphery of the pixel region, the intermediate film 72 may be formed on approximately the entirety of the substrate 10 . When the coating liquid 81 for 2nd optical films is apply|coated on the intermediate film 72, the liquid crystal molecular alignment control property of the coating liquid 81 for 2nd optical films is good.

<The second optical film forming process of the second embodiment> In the second optical film forming process S124 of FIG. 25 , as shown in FIGS. 29 to 30 , by applying a coating solution for the second optical film containing liquid crystal molecules and a solvent 81 is coated on the intermediate film 72 and dried to form the second optical film 82 . The second optical film 82 is, for example, a linear polarizing film.

Fig. 29 is a side view showing a liquid film of the second optical film coating liquid applied on the intermediate film according to the second embodiment. 30 is a side view showing the second optical film formed by drying the liquid film of the coating liquid for the second optical film according to the second embodiment.

As shown in FIG. 29 , in the second optical film forming process S124 , the coating liquid 81 for the second optical film is coated on the substrate 10 from the coating nozzle 80 . The coating nozzle 80 is, for example, a slit coating apparatus having a slit-shaped discharge port on the lower surface.

The second optical film coating liquid 81 is applied on the intermediate film 72 . Therefore, the organic material forming the intermediate film 72 may be insoluble in the solvent of the coating liquid 81 for the second optical film. The interlayer film 72 can be prevented from being dissolved by the application of the second optical film coating liquid 81 .

In addition, in this embodiment, a slit coating apparatus may be used for the coating of the coating liquid 81 for 2nd optical films, and an immersion coating apparatus etc. may be used. Shear stress may be applied to the second coating liquid 81 for optical films, and the direction of action of the shear stress may be controlled.

As shown in FIG. 30 , in the second optical film forming process S124 , the liquid film (see FIG. 29 ) of the second optical film coating liquid 81 applied on the substrate 10 is dried to form the second optical film 82 . The solvent is removed from the liquid film of the coating liquid 81 for the second optical film, and the alignment of the liquid crystal molecules is appropriately maintained. The second optical film 82 is, for example, a linear polarizing film.

<The second optical film patterning process of the second embodiment> In the second optical film patterning process S126 of FIG. 25, after the second optical film forming process S124 and before the protective film forming process S125, the second optical film is left A part 83 of 82 is removed, and the remaining part of the second optical film 82 is removed.

For example, in the second optical film patterning process S126, as shown in FIG. 31, only a part 83 of the second optical film 82 is not dissolved in the cleaning solution, and then the second optical film 82 is dissolved in the cleaning solution as shown in FIG. 32. the remainder of the .

Fig. 31 is a side view showing a partially insoluble second optical film according to the second embodiment. Fig. 32 is a side view showing the second optical film according to the second embodiment from which the portion that is not insoluble has been removed.

As shown in FIG. 31, in the second optical film patterning process S126, only a part 83 of the second optical film 82 is not dissolved by the cleaning solution. As the cleaning liquid, the same solvent as that of the second optical film coating liquid 81 can be used, and for example, water can be used. In this case, insolubilization with water is performed.

The fixing liquid 120 that does not dissolve the part 83 of the second optical film 82 is discharged from the coating nozzle 121 of the ink jet system, for example. The coating nozzle 121 has a plurality of discharge nozzles that discharge droplets of the fixing liquid 120 downward.

The fixing liquid 120 is selectively applied to a part 83 of the second optical film 82 by discharging the fixing liquid 120 droplets from the application nozzle 121 while moving the application nozzle 121 relative to the substrate 10 . Thereby, a part 83 of the second optical film 82 is not dissolved.

The area where the fixing solution 120 is applied may be, for example, a pixel area.

As shown in FIG. 32 , in the second optical film patterning process S126 , only a part 83 of the second optical film 82 is left, and the remaining part of the second optical film 82 is removed. For the removal of the remaining portion of the second optical film 82, for example, a cleaning solution can be used.

The cleaning liquid is supplied to the substrate 10 while rotating the substrate 10 with a spin chuck, for example. The cleaning liquid supplied to the substrate 10 is spread over the entire substrate 10 by centrifugal force, and is thrown out from the outer peripheral edge of the substrate 10 .

A part 83 of the second optical film 82 is not dissolved by the cleaning solution, and therefore does not collapse due to the cleaning solution. On the other hand, since the remaining portion of the second optical film 82 is not insoluble to the cleaning liquid, it is dissolved and removed by the cleaning liquid.

In addition, the second optical film may be dissolved and removed while the part 83 of the second optical film 82 is left by storing the cleaning liquid in the cleaning tank and immersing the substrate 10 in the cleaning liquid in the cleaning tank. The remainder of 82. The cleaning liquid in the cleaning tank may be stirred with a stirring blade or the like.

As shown in FIG. 32, in this embodiment, before forming the protective film 92 (see FIG. 34), a part 83 of the second optical film 82 is left, the remaining part of the second optical film 82 is removed, and the second optical film 82 is patterned membrane 82.

In the above-described second optical film forming process S124, since the second optical film coating liquid 81 is applied while applying shear stress, it is difficult to apply the second optical film coating liquid 81 only to the pixel region. Therefore, it is effective to perform the second optical film patterning process S126.

Hereinafter, the part 83 of the second optical film 82 left in the second optical film patterning process S126 is also referred to as "the second optical film 83".

<Protective film forming process of the second embodiment> In the protective film forming process S125 of FIG. 25, as shown in FIGS. 33 to 34, a coating liquid for a protective film different from the coating liquid for a second optical film 81 is applied. 91 is coated on the second optical film 83 and dried to form a protective film 92 .

33 is a side view showing the liquid film of the coating liquid for protective film applied on the second optical film according to the second embodiment. 34 is a side view showing a protective film formed by drying the liquid film of the coating liquid for protective film according to the second embodiment.

As shown in FIG. 33 , in the protective film forming process S125 , the coating liquid 91 for a protective film is applied from the application nozzle 90 on the substrate 10 on which the second optical film 83 is formed. The coating nozzle 90 may be an ink jet method, and has a plurality of discharge nozzles that discharge droplets of the coating liquid 91 for protective films downward.

By moving the coating nozzle 90 relative to the substrate 10 , droplets of the coating liquid 91 for protective film are discharged from the coating nozzle 90 , and only the second optical film 83 and its vicinity (for example, only the pixel area and its vicinity) are applied. ) selectively coat the coating liquid 91 for protective films.

The coating liquid 91 for protective films is applied on the second optical film 83 . Therefore, the liquid crystal molecules forming the second optical film 83 may be insoluble in the solvent of the protective film coating liquid 91 . The second optical film 83 can be prevented from being dissolved by the coating of the protective film coating liquid 91 .

The coating liquid 91 for protective films contains the organic material which forms the protective film 92, and the solvent which melt|dissolves this organic material.

As the coating liquid 91 for protective films, for example, a thermosetting clear coating, a chemical reaction type clear coating, a drying curing clear coating, etc. can be used. Specifically, oil-based enamel paint, phthalate resin paint, or the like can be used.

Thermosetting clear coatings, chemical reaction clear coatings, drying curing clear coatings, etc., are polymerized by thermal curing, chemical reaction, or drying curing, so that a dense protective film 92 can be formed.

As shown in FIG. 33 , the protective film coating liquid 91 can be applied to cover not only the main surface of the second optical film 83 but also the end surface of the second optical film 83 . The second optical film 83 can be protected by the protective film 92 so that not only the main surface of the second optical film 83 but also the end surface of the second optical film 83 is not damaged or adhered by foreign matter or the like.

In addition, although the coating liquid 91 for protective films does not cover the end surface of the intermediate film 72 as shown in FIG. 33, you may apply and cover the end surface of the intermediate film 72.

The area where the coating liquid 91 for protective film is applied can be limited to the pixel area on the substrate 10 and its vicinity.

In addition, since the area where the coating liquid 91 for protective films is applied is limited, a mask such as a film may be attached to the substrate 10 . This mask may form a gap with the second optical film 83, and the second optical film 83 may not be damaged when peeled off later.

As shown in FIG. 34 , in the protective film forming step S125 , the liquid film (see FIG. 33 ) of the protective film coating liquid 91 applied on the substrate 10 is dried to form the protective film 92 . The solvent is removed from the liquid film of the coating liquid 91 for protective film, and the protective film 92 is formed.

The protective film 92 is different from the second optical film 83 in that it has optical homogeneity. The visible light transmittance of the protective film 92 is preferably 95% or more. In addition, the film thickness of the protective film 92 is preferably 10 μm or less. In addition, in order to suppress the deformation|transformation of an optical member, the residual stress of the protective film 92 should be as small as possible.

The protective film 92 covers not only the main surface of the second optical film 83 but also the end surface of the second optical film 83 . The protective film 92 functions to protect the second optical film 83 so as not to damage the second optical film 83 or to prevent foreign matter and the like from adhering. The pencil hardness of the protective film 92 is preferably 2H or more.

The protective film 92 is formed only in the pixel region and its vicinity on the substrate 10 , and a plurality of protective films 92 are formed at intervals on the substrate 10 . In addition, when it is not necessary to take out the terminals provided around the pixel region, the protective film 92 may be formed on approximately the entirety of the substrate 10 .

In addition, although the protective film 92 of this embodiment is formed by apply|coating and drying the coating liquid 91 for protective films on the 2nd optical film 83, you may stick to the 2nd optical film 83 in the form of a thin film.

According to this embodiment, as shown in FIG. 34 , a plurality of optical members 50 including the first optical film 63 , the intermediate film 72 , the second optical film 83 and the protective film 92 are formed on the substrate 10 at intervals. Thus, the optical member 50 may be multi-chamfered. Furthermore, since the optical member 50 is selectively formed in the pixel region and its vicinity, the terminals provided around the pixel region can function appropriately.

<Summary of the optical member forming process of the second embodiment> As described above, according to this embodiment, the first optical film forming process S121, the intermediate film forming process S122, and the second optical film forming process S124 are sequentially performed. The intermediate film 72 is formed between the first optical film 63 and the second optical film 83 . The intermediate film 72 protects the first optical film 63 from damage to the first optical film 63 or adhesion of foreign matter or the like. Thus, the quality of the optical member 50 can be improved. When the optical member 50 is temporarily interrupted in the middle of production and it takes time to recover, there is a high risk of damage or adhesion of foreign matter, which is particularly effective.

According to the present embodiment, after the first optical film forming process S121 and before the intermediate film forming process S122, the first optical film patterning in which part 63 of the first optical film 62 is left and the remaining part of the first optical film 62 is removed is performed Process S123. Therefore, the intermediate film 72 can be made to cover not only the main surface of the first optical film 63 left after the first optical film patterning process S123 , but also the end surface of the first optical film 63 .

According to the present embodiment, in the first optical film patterning process S123, only a part 63 of the first optical film 62 is not dissolved in the cleaning solution for dissolving the first optical film 62, and then the first optical film 62 is dissolved with the cleaning solution the remainder of the . The part 63 of the first optical film 62 is not dissolved by the cleaning solution, and therefore does not collapse due to the cleaning solution. On the other hand, since the remaining portion of the first optical film 62 is not insoluble to the cleaning liquid, it is dissolved and removed by the cleaning liquid.

According to the present embodiment, in the intermediate film forming step S122 , the intermediate film 72 is formed so as to cover the main surface of the first optical film 63 and the end surface of the first optical film 63 . The intermediate film 72 can protect not only the main surface of the first optical film 63 but also the end surface of the first optical film 63 from damage or adhesion of foreign matter or the like. Thus, the quality of the optical member 50 can be improved. When the optical member 50 is temporarily interrupted in the middle of production and it takes time to recover, there is a high risk of damage or adhesion of foreign matter, which is particularly effective.

According to the present embodiment, the protective film forming process S125 for forming the protective film 92 for protecting the second optical film 83 is performed. The protective film 92 can protect the second optical film 83 from damage to the second optical film 83 or adhesion of foreign matter or the like after the optical member 50 is manufactured. Thus, the quality of the optical member 50 can be improved.

According to the present embodiment, after the second optical film forming process S124 and before the protective film forming process S125, the second optical film patterning in which part 83 of the second optical film 82 is left and the remaining part of the second optical film 82 is removed is performed Process S126. Therefore, the protective film 92 can cover not only the main surface of the second optical film 83 left after the second optical film patterning process S126 , but also the end surface of the second optical film 83 .

According to the present embodiment, in the second optical film patterning process S126, only a part 83 of the second optical film 82 is not dissolved in the cleaning solution for dissolving the second optical film 82, and then the second optical film 82 is dissolved with the cleaning solution the remainder of the . A part 83 of the second optical film 82 is not dissolved by the cleaning solution, and therefore does not collapse due to the cleaning solution. On the other hand, since the remaining portion of the second optical film 82 is not insoluble to the cleaning liquid, it is dissolved and removed by the cleaning liquid.

According to this embodiment, in the protective film forming step S125 , the protective film 92 is formed so as to cover the main surface of the second optical film 83 and the end surface of the second optical film 83 . The protective film 92 can protect not only the main surface of the second optical film 83 but also the end surface of the second optical film 83 from damage or adhesion of foreign matter and the like. Thus, the quality of the optical member 50 can be improved. When the optical member 50 is temporarily interrupted in the middle of production and it takes time to recover, there is a high risk of damage or adhesion of foreign matter, which is particularly effective.

<Modifications and Improvements> The embodiments of the organic electroluminescence display have been described above, but the present invention is not limited to the above-described embodiments and the like, and various modifications are possible within the scope of the gist of the present invention described in the scope of claims. , improve.

For example, the optical member 50 includes the first optical film 63, the intermediate film 72, the second optical film 83, and the protective film 92 in the above-described embodiment, but the present invention is not limited to this. It is sufficient that the optical member 50 includes an optical film in which liquid crystal molecules are aligned, and the number of the optical films is not limited.

10‧‧‧Substrate 13‧‧‧Organic light emitting diode 30‧‧‧Sealing layer 40‧‧‧Touch sensor 41‧‧‧First metal film 43‧‧‧Insulating film 45‧‧‧Second metal layer 47 ‧‧‧Touch sensor protective film 50‧‧‧Optical member 61‧‧‧Coating solution for 1st optical film 62‧‧‧First optical film 63‧‧‧First optical film 71‧‧‧Coating solution for interlayer film 72‧‧‧Interlayer film 81‧‧‧Coating solution for second optical film 82‧‧‧Second optical film 83‧‧‧Second optical film 91‧‧‧Coating solution for protective film92‧‧‧Protective film

FIG. 1 is a plan view showing an organic electroluminescent display according to an embodiment. FIG. 2 is a cross-sectional view showing an important part of an organic electroluminescent display according to an embodiment. FIG. 3 is a flow chart showing a method of manufacturing an organic electroluminescent display according to an embodiment. FIG. 4 is a flowchart showing a process for forming a touch sensor according to one embodiment. Fig. 5 is a cross-sectional view showing a first metal film formed on a substrate according to an embodiment. FIG. 6 is a cross-sectional view showing a photoresist film formed on the first metal film according to an embodiment. 7 is a cross-sectional view showing a photoresist film after exposure and development according to one embodiment. FIG. 8 is a cross-sectional view showing the first metal film after etching according to an embodiment. FIG. 9 is a cross-sectional view showing the first metal film after removing the photoresist film according to one embodiment. Fig. 10 is a cross-sectional view showing an insulating film formed on the first metal film according to an embodiment. FIG. 11 is a plan view showing a state in which a part of the second metal film formed on the insulating film is removed according to one embodiment. Fig. 12 is a flowchart showing the optical member forming process according to the first embodiment. Fig. 13 is a side view showing the liquid film of the coating liquid for the first optical film applied on the substrate according to the first embodiment. Fig. 14 is a side view showing the first optical film formed by drying the liquid film of the coating liquid for the first optical film according to the first embodiment. Fig. 15 is a side view showing a partially insolubilized first optical film according to the first embodiment. Fig. 16 is a side view showing a liquid film of a coating liquid for an intermediate film applied on the first optical film according to the first embodiment. Fig. 17 is a side view showing the interlayer film formed by drying the liquid film of the coating liquid for interlayer film according to the first embodiment. Fig. 18 is a side view showing the first optical film according to the first embodiment from which the portion not covered with the interlayer film is removed. Fig. 19 is a side view showing the liquid film of the second optical film coating liquid applied on the intermediate film according to the first embodiment. Fig. 20 is a side view showing the second optical film formed by drying the liquid film of the coating liquid for the second optical film according to the first embodiment. Fig. 21 is a side view showing a partially insolubilized second optical film according to the first embodiment. Fig. 22 is a side view showing the liquid film of the coating liquid for protective film applied on the second optical film according to the first embodiment. Fig. 23 is a side view showing a protective film formed by drying the liquid film of the coating liquid for protective film according to the first embodiment. Fig. 24 is a side view showing the second optical film from which the portion not covered with the protective film is removed according to the first embodiment. Fig. 25 is a flowchart showing the optical member forming process according to the second embodiment. Fig. 26 is a side view showing the first optical film according to the second embodiment from which the portion that is not insoluble has been removed. Fig. 27 is a side view showing the liquid film of the coating liquid for the interlayer film applied on the first optical film according to the second embodiment. Fig. 28 is a side view showing an interlayer film formed by drying the liquid film of the coating liquid for interlayer film according to the second embodiment. Fig. 29 is a side view showing the liquid film of the second optical film coating liquid applied on the intermediate film according to the second embodiment. Fig. 30 is a side view showing the second optical film formed by drying the liquid film of the coating liquid for the second optical film according to the second embodiment. Fig. 31 is a side view showing a partially insoluble second optical film according to the second embodiment. Fig. 32 is a side view showing the second optical film according to the second embodiment from which the portion that is not insoluble has been removed. Fig. 33 is a side view showing the liquid film of the coating liquid for protective film applied on the second optical film according to the second embodiment. Fig. 34 is a side view showing a protective film formed by drying the liquid film of the coating liquid for protective film according to the second embodiment.

10‧‧‧Substrate

12‧‧‧TFT Layer

13‧‧‧Organic Light Emitting Diodes

18‧‧‧Planarization layer

19‧‧‧Contact plug

21‧‧‧Pixel electrode

22‧‧‧Counter electrode

23‧‧‧Organic layer

24, 25‧‧‧Electron injection layer

26‧‧‧Light Emitting Layer

27‧‧‧Positive hole transport layer

28‧‧‧Positive hole injection layer

30‧‧‧Sealing layer

40‧‧‧Touch Sensor

41‧‧‧First Metal Film

43‧‧‧Insulating film

45‧‧‧Second metal layer

47‧‧‧Touch Sensor Protective Film

50‧‧‧Optical Components

63‧‧‧First Optical Film

72‧‧‧Interlayer

83‧‧‧Second Optical Film

92‧‧‧Protective film

Claims (16)

A method for manufacturing an organic electroluminescent display, which is characterized by the step of coating and drying an optical film coating liquid containing liquid crystal molecules and a solvent on a substrate on which organic light emitting diodes are formed in advance to form alignment of liquid crystal molecules The optical member forming process of the optical film; the aforementioned optical member forming process comprises: by coating and drying the first optical film coating liquid containing liquid crystal molecules and a solvent on the aforementioned substrate on which the organic light emitting diodes are formed in advance , forming a first optical film forming process as one of the retardation film and the polarizing film; The second optical film forming process is to coat and dry the first optical film with a coating liquid to form the second optical film that is the remaining one of the retardation film and the polarizing film; the optical member forming process is the After the first optical film forming process and before the second optical film forming process, a coating liquid for an intermediate film different from the coating liquid for the first optical film is applied and dried on the first optical film. And the intermediate film forming process for forming the intermediate film; the optical member forming process, after the intermediate film forming process and before the second optical film forming process, has the use of the intermediate film covering only a part of the first optical film as a The first optical film patterning process of masking and removing the remaining part of the first optical film. The method for manufacturing an organic electroluminescent display according to the first item of the claimed scope, wherein in the patterning process of the first optical film, a cleaning solution for dissolving the first optical film is used. The method for manufacturing an organic electroluminescent display according to the claim 2, wherein in the first optical film forming process, the cleaning solution used in the first optical film patterning process only does not dissolve the first optical film. 1. The aforementioned portion of the optical film. The method for producing an organic electroluminescent display according to claim 2 or 3, wherein in the intermediate film forming process, the intermediate film coating solution is applied only to the part of the first optical film, and The cleaning solution used in the patterning process of the first optical film does not dissolve only the part of the first optical film. A method for manufacturing an organic electroluminescent display, which is characterized by the step of coating and drying an optical film coating liquid containing liquid crystal molecules and a solvent on a substrate on which organic light emitting diodes are formed in advance to form alignment of liquid crystal molecules The optical member forming process of the optical film; the above-mentioned optical member forming process comprises: by forming the organic light emitting diode on the aforementioned substrate in advance, the package is The first optical film forming process of forming the first optical film as one of the retardation film and the polarizing film by coating and drying the coating liquid for the first optical film containing the liquid crystal molecules and the solvent; After the optical film formation process, a coating liquid for a second optical film containing liquid crystal molecules and a solvent is applied on the first optical film and dried to form a second remaining one of the retardation film and the polarizing film. The second optical film forming process of the optical film; the optical member forming process is after the first optical film forming process and before the second optical film forming process, by applying a different coating solution for the first optical film. The interlayer film coating liquid is coated and dried on the first optical film to form the interlayer film forming process; the optical component forming process is after the first optical film forming process and before the interlayer film forming process. and having a first optical film patterning process for leaving a part of the first optical film and removing the remaining part of the first optical film. The method for manufacturing an organic electroluminescent display according to the claim 5, wherein in the first optical film patterning process, the cleaning solution for dissolving the first optical film only does not dissolve the first optical film. After that, the remaining portion of the first optical film is dissolved in the cleaning solution. The organic electroluminescent display as described in item 5 or 6 of the scope of the patent application The manufacturing method, wherein in the intermediate film forming process, the intermediate film is formed so as to cover the main surface of the first optical film and the end surface of the first optical film. The method for manufacturing an organic electroluminescent display according to any one of the claims 1 to 3, 5 and 6, wherein the optical member forming process is performed after the second optical film forming process. A protective film forming process in which the coating liquid for a protective film of the coating liquid for the second optical film is coated on the second optical film and dried to form a protective film that protects the second optical film. A method for manufacturing an organic electroluminescent display, which is characterized by the step of coating and drying an optical film coating liquid containing liquid crystal molecules and a solvent on a substrate on which organic light emitting diodes are formed in advance to form alignment of liquid crystal molecules The optical member forming process of the optical film; the aforementioned optical member forming process comprises: by coating and drying the first optical film coating liquid containing liquid crystal molecules and a solvent on the aforementioned substrate on which the organic light emitting diodes are formed in advance , forming a first optical film forming process of a first optical film as one of a retardation film and a polarizing film; and by forming a second optical film containing liquid crystal molecules and a solvent after the aforementioned first optical film forming process A second optical film forming process of coating and drying the first optical film with a coating solution to form the second optical film remaining as the retardation film and the polarizing film; The aforementioned optical member formation process is performed after the aforementioned first optical film formation process and before the aforementioned second optical film formation process. An intermediate film forming process for coating and drying an optical film to form an intermediate film; the aforementioned optical member forming process, after the aforementioned second optical film forming process, has protection by applying a coating solution different from the aforementioned second optical film A protective film forming process in which a coating solution for film is applied on the second optical film and dried to form a protective film protecting the second optical film; A second optical film patterning process in which the protective film covering a part of the second optical film is used as a mask, and the remaining part of the second optical film is removed. The method for manufacturing an organic electroluminescent display according to the claim 9 of the claimed scope, wherein in the patterning process of the second optical film, a cleaning solution for dissolving the second optical film is used. The method for manufacturing an organic electroluminescent display according to claim 10, wherein in the second optical film forming process, the cleaning solution used in the second optical film patterning process only does not dissolve the first optical film. 2. The aforementioned portion of the optical film. The method for producing an organic electroluminescent display according to claim 10, wherein in the protective film forming process, the protective film coating solution is applied only to the part of the second optical film, and the protective film is not applied to the protective film. The cleaning solution used in the second optical film patterning process does not dissolve only the aforementioned part of the second optical film. The method for manufacturing an organic electroluminescent display according to the claim 8, wherein the optical member forming process is performed after the second optical film forming process and before the protective film forming process, and the second optical member is left behind. A second optical film patterning process in which part of the film is removed and the remaining part of the second optical film is removed. The method for manufacturing an organic electroluminescent display according to claim 13, wherein in the second optical film patterning process, the cleaning solution for dissolving the second optical film only does not dissolve the second optical film. After that, the remaining portion of the second optical film is dissolved in the cleaning solution. The method for manufacturing an organic electroluminescent display according to the claim 13, wherein the protective film is formed in the process to cover the main part of the second optical film. The said protective film is formed so that the surface and the edge surface of the said 2nd optical film may be formed. The method for manufacturing an organic electroluminescent display according to any one of the claims 1 to 3, 5 and 6, wherein before the optical member forming process, the substrate having the organic light emitting diodes formed in advance is provided. Above, a touch sensor formation process for forming a touch sensor; the touch sensor formation process includes a process of forming a light-shielding first metal film on the substrate on which the organic light emitting diodes are formed in advance, using photo-etching A process of selectively removing a part of the first metal film by the method and an etching method, a process of forming an insulating film on the partially removed first metal film, and forming a light-shielding second metal film on the insulating film The process of metal film and the process of selectively removing a part of the second metal film by photolithography and etching.

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