CN110635063A - Display panel and preparation method thereof - Google Patents
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- CN110635063A CN110635063A CN201910817560.9A CN201910817560A CN110635063A CN 110635063 A CN110635063 A CN 110635063A CN 201910817560 A CN201910817560 A CN 201910817560A CN 110635063 A CN110635063 A CN 110635063A
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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Abstract
The embodiment of the invention relates to the field of display devices, and particularly discloses a display panel and a preparation method of the display panel. The display panel and the preparation method of the display panel can improve the bending capability of the display panel.
Description
Technical Field
The embodiment of the invention relates to the technical field of display, in particular to a display panel and a preparation method of the display panel.
Background
An OLED (Organic Light-Emitting Diode) is called an Organic electroluminescent Diode. The OLED display technology has many advantages, such as full solid state, active light emission, high contrast, ultra-thin, low power consumption, fast effect speed, wide working range, and easy implementation of flexible display and 3D display, and is currently applied to many display devices, for example, televisions and mobile devices. An AMOLED (active matrix OLED) flexible screen generally adopts Polyimide (PI) to replace a glass substrate to serve as a substrate of a TFT, and a thin film packaging structure (TFE) replaces glass packaging (namely, frit packaging) to isolate water or oxygen in the environment and prevent damage to an OLED device. The packaging structure generally adopts an inorganic/organic laminated structure, and an inorganic film layer is directly connected with a cathode or a light guide-out layer of the OLED device.
The quality of the flexible screen manufactured in the prior art needs to be improved.
Disclosure of Invention
An object of an embodiment of the present invention is to provide a display panel and a method of manufacturing the display panel, which can improve a bending capability of the display panel.
In order to solve the above technical problem, an embodiment of the present invention provides a display panel, which includes a first substrate, a display device layer, an encapsulation layer, a second substrate, and a touch sensor, which are sequentially stacked, wherein the first substrate and the second substrate are made of a flexible material.
The embodiment of the invention also provides a preparation method of the display panel, which comprises the following steps: forming a display device layer on a first substrate; forming an encapsulation layer on the second substrate; forming a touch sensor on one side of the second substrate far away from the packaging layer; and arranging the packaging layer on the display device layer, wherein the first substrate and the second substrate are both made of flexible materials.
In addition, the material of the first substrate is the same as that of the second substrate. By the mode, no matter the display panel is bent inwards or outwards, the first substrate or the second substrate cannot be damaged due to weak bending performance.
In addition, the material of the second substrate is one of CPI, PEN, PET, COP or TAC. Because CPI, PEN, PET, COP or TAC are all transparent materials, the luminous performance of the display device layer positioned below the second substrate can not be influenced by the color of the film layer of the second substrate, and the display effect of the display panel is improved.
In addition, the first substrate has a thickness of 5 to 20 micrometers. By adopting the first substrate with the thickness range, the whole thickness of the display panel can be effectively thinned on the premise of ensuring the action of the first substrate.
In addition, the second substrate has a thickness of 5 to 50 micrometers. By adopting the second substrate with the thickness range, the whole thickness of the display panel can be effectively thinned on the premise of ensuring the action of the second substrate.
In addition, still include the viscose layer, the viscose layer sets up display device layer reaches between the encapsulation layer, preferably, the viscose layer is graphical viscose layer. Through set up the viscose layer between display device layer and packaging layer for lean on the gluing that has strong viscidity to be in the same place between packaging layer and the display device layer, thereby effectually prevented that the display device layer from buckling or droing when tearing the protection film on the packaging layer at display panel, further improved display panel's the ability of buckling, the viscose layer is graphical viscose layer simultaneously, when guaranteeing to glue glutinous effect, can practice thrift the raw materials.
In addition, the material of viscose layer is OCA optical cement or OCR glue. OCA optical cement or OCR glue all have strong viscidity, and the colour is transparent to when reinforcing adhesion between display device layer and the encapsulating layer, make the luminous performance on the display device layer that is located the viscose layer below can not receive the influence of viscose layer rete colour, thereby improved display panel's display effect.
In addition, the second substrate is a patterned substrate, and the shape of the patterned substrate is the same as that of the touch sensor. By the method, the preparation method of the display panel is diversified, and the preparation process is more flexible.
In addition, before the disposing the encapsulation layer on the display device layer, the method further includes: coating adhesive on the packaging layer; the disposing the encapsulation layer on the display device layer specifically includes: and bonding the packaging layer on the display device layer through glue. Through the mode, the packaging layer and the display device layer are bonded together by the glue with strong viscosity, so that the display device layer is effectively prevented from falling off when the display panel is bent or the protective film on the packaging layer is torn off, and the bending capacity of the display panel is further improved.
In addition, before the forming of the display device layer on the first substrate, the method further includes: forming a TFT layer on the first substrate; the forming of the display device layer on the first substrate specifically includes: forming the display device layer on the TFT layer. In this way, the pixels in the display device layer can be driven via the TFT layer.
Compared with the prior art, the second substrate is arranged between the packaging layer and the touch sensor, the first substrate and the second substrate are both made of flexible materials, the packaging layer is usually made of rigid materials, and the touch sensor is also made of rigid materials; on the other hand, the encapsulation layer in the prior art is a laminated structure of an inorganic film layer/an organic film layer, and when the encapsulation layer is disposed on the second substrate, the second substrate can be used as the organic film layer of the encapsulation layer, that is, the encapsulation layer in this embodiment may be a single-film structure of an inorganic film layer, so that the thickness of the encapsulation layer is reduced and the encapsulation layer is easy to bend. In addition, because first base plate also is flexible material, thereby form symmetrical structure with the second base plate, be favorable to the stress that balanced display panel received when display panel buckles, because the second base plate of flexible material has additionally been set up promptly, make display panel's overall structure change, thereby can cushion the stress that each rete received when buckling of display panel, and then effectual each rete of avoiding display panel damages because of receiving great stress at display panel's the in-process of buckling, display panel's bending capability has been improved.
Drawings
One or more embodiments are illustrated by way of example in the accompanying drawings, which correspond to the figures in which like reference numerals refer to similar elements and which are not to scale unless otherwise specified.
Fig. 1 is a schematic structural diagram of a display panel according to a first embodiment of the present invention;
fig. 2 is a flowchart of a method of manufacturing a display panel according to a second embodiment of the present invention;
fig. 3 is a flowchart of a method for manufacturing a display panel according to a third embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more apparent, embodiments of the present invention will be described in detail below with reference to the accompanying drawings. However, it will be appreciated by those of ordinary skill in the art that numerous technical details are set forth in order to provide a better understanding of the present invention in its various embodiments. However, the technical solution claimed in the present invention can be implemented without these technical details and various changes and modifications based on the following embodiments.
The first embodiment of the present invention relates to a display panel 100, which is specifically configured as shown in fig. 1, and includes: the display device comprises a first substrate 1, a display device layer 2, a packaging layer 3, a second substrate 4 and a touch sensor 5 which are sequentially stacked, wherein the first substrate 1 and the second substrate 4 are made of flexible materials.
Compared with the prior art, the second substrate 4 is arranged between the packaging layer 3 and the touch sensor 5, the first substrate 1 and the second substrate 4 are both made of flexible materials, the packaging layer 3 is usually made of rigid materials, and the touch sensor 5 is also made of rigid materials, so that the packaging layer 3 cannot be directly contacted with the touch sensor 5, the situation that the touch sensor 5 is easily damaged if the packaging layer 3 made of rigid materials is directly contacted with the touch sensor 5 made of rigid materials when the display panel 100 is bent is avoided, the touch sensor 5 is not easily damaged due to the contact with the second substrate 4 made of flexible materials when the display panel 100 is bent, and the reliability of the display panel 100 is improved; on the other hand, the encapsulation layer 3 in the prior art is a laminated structure of an inorganic film layer/an organic film layer, and when the encapsulation layer 3 is disposed on the second substrate 4, the second substrate 4 can be used as the organic film layer of the encapsulation layer 3, that is, the encapsulation layer 3 in this embodiment can be a single-film structure of an inorganic film layer, so that the thickness of the encapsulation layer 3 is reduced, the encapsulation layer is easy to bend, and the overall thickness of the display panel 100 is also reduced. Meanwhile, the touch sensor 5 in the prior art needs to be fabricated on another substrate, but in the present invention, the touch sensor 5 can be fabricated directly on the second substrate 4 without providing other substrates, and in conclusion, the overall thickness of the display panel 100 can be effectively reduced by such an arrangement. In addition, because first base plate 1 is also flexible material, thereby form symmetrical structure with second base plate 4, be favorable to the stress that balanced display panel 100 received when display panel 100 buckles, in other words, because the second base plate 4 of flexible material has additionally been set up, make display panel 100's overall structure change, thereby can change the stress that each rete received when buckling of display panel 100, and then effectual each rete of avoiding display panel 100 is because of receiving great stress and is damaged in display panel 100's the bending process, display panel 100's bending capability has been improved.
It should be noted that in the present embodiment, the stress condition of each film layer of the display panel 100 can be changed by changing parameters such as the thickness and the young's modulus of each film layer of the display panel 100, so that the film layer, such as the display device layer 2, which is easy to be damaged receives a smaller stress in the bending process of the display panel 100, and thus the bending capability of the display panel 100 is improved by this way.
The following describes the implementation details of the display panel 100 of the present embodiment in detail, and the following is only provided for the convenience of understanding and is not necessary for implementing the present embodiment.
In the present embodiment, the material of the first substrate 1 is the same as that of the second substrate 4. It can be understood that the first substrate 1 and the second substrate 4 have the same material, and in this way, the first substrate 1 or the second substrate 4 cannot be damaged due to the weak bending property no matter whether the display panel 100 is bent inward or outward, specifically, taking the film layer with the largest stress when the display panel is bent inward as the first substrate 1 and the film layer with the largest stress when the display panel is bent outward as the second substrate 4 as an example, because the material of the first substrate 1 is the same as that of the second substrate 4, the damage of the first substrate 1 when the display panel 100 is bent inward is avoided, but the damage of the second substrate 4 when the display panel is bent outward due to the weak bending resistance is avoided; the second substrate 4 is not damaged when the display panel 100 is bent outward, but the first substrate 1 is damaged due to weak bending resistance when the display panel is bent inward. In this embodiment, the material of the first substrate 1 is not necessarily the same as the material of the second substrate 4, and it is only necessary to ensure that the first substrate 1 and the second substrate 4 are not damaged when the display panel 100 is bent inward or outward.
It should be noted that the material of the second substrate 4 in this embodiment is CPI. The CPI is plastic Colorless Polyimide (Colorless Polyimide), has the characteristics of high heat resistance, high reliability, flexure resistance, low density, low dielectric constant, low CTE, easy realization of micro-pattern circuit processing and the like, has larger deformation amount and strong bending performance, and can return to the initial state after being bent for a long time. In this way, the light emitting performance of the display device layer 2 under the second substrate 4 is not affected by the color of the film layer of the second substrate 4, so that the display effect of the display panel 100 is improved. The material of the first substrate 1 comprises plastic and the like, preferably, the material of the first substrate 1 is also CPI, and the defect of light yellow or dark yellow color of the traditional PI film is overcome because the CPI is a transparent material. Note that the material of the first substrate 1 may be PI (polyimide), PEN (polyethylene naphthalate), PET (polyethylene terephthalate), COP (cyclic polyolefin), or TAC (triacetyl cellulose film), and the material of the second substrate 4 may be PI, PEN, PET, COP, or TAC, and the present embodiment does not specifically limit the material of the first substrate 1 and the second substrate 4, and only needs to be a flexible material.
Specifically, the thickness of the first substrate 1 is 5 to 20 micrometers. Second substrate 4 the thickness of the first substrate is 5 to 50 micrometers. It is understood that, since the thickness of the CPI film is smaller than that of the glass substrate, the thickness of the display panel 100 as a whole can be effectively reduced by using the CPI film as the first substrate 1. It should be noted that, the thickness ratio of the first substrate 1 to the second substrate 4 in the present embodiment is not particularly limited, since other layers are attached to the display panel 100, and the optimal layer thickness needs to be determined by the overall matching.
It should be noted that, in order to further improve the bending capability of the display panel 100, a CPI film may be further disposed between the encapsulation layer 3 and the display device layer 2, so that the encapsulation layer 3 and the display device layer 2 may not be in direct contact, and it is avoided that "when the display panel 100 is bent, if the encapsulation layer 3 made of a rigid material is in direct contact with the display device layer 2 made of a rigid material, the display device layer 2 is easily damaged", so that the display device layer 2 is not easily damaged due to the contact with the CPI film made of a flexible material when the display panel 100 is bent, and the reliability of the display panel 100 is further improved.
It will be appreciated that a TFT layer 6 is also included, the TFT layer 6 being disposed between the first substrate 1 and the display device layer 2. Specifically, the TFT layer 6 includes an active layer, a gate insulating layer, a gate electrode, an interlayer insulating layer, a source electrode, and a drain electrode. The active layer is disposed on the first substrate 1, the gate insulating layer is disposed on the active layer, the gate electrode is disposed on the gate insulating layer, and the interlayer insulating layer is disposed on the gate electrode. One end of the source electrode is connected with one end of the drain electrode through the active layer, and the other end of the source electrode and the other end of the drain electrode respectively penetrate through the gate insulating layer and the interlayer insulating layer in sequence and extend into the planarization layer. The planarization layer has a via hole therein through which the anode of the display device layer 2 is electrically connected to the source or drain electrode (the source or drain electrode being connected may be selected depending on whether the TFT is of the N-type or P-type).
It should be mentioned that the display device further comprises an adhesive layer 7, and the adhesive layer 7 is disposed between the display device layer 2 and the packaging layer 3. Specifically, when the display panel 100 is bent or the protective film on the encapsulation layer 3 is torn off, since the adhesion between the encapsulation layer 3 and the evaporated cathode or lithium fluoride is not good, that is, the interface bonding between the encapsulation layer 3 and the film layer of the display device layer 2 is not good, which easily causes the encapsulation layer 3 to carry the cathode metal layer of the display device layer 2 or even the evaporation material of the display device layer 2, resulting in the failure of the display device, therefore, by disposing the adhesive layer 7 between the display device layer 2 and the encapsulation layer 3, the encapsulation layer 3 and the display device layer 2 are bonded together by the adhesive with strong adhesion, thereby effectively preventing the display device layer 2 from falling off when the display panel 100 is bent or the protective film on the encapsulation layer 3 is torn off, and further improving the bending capability of the display panel 100.
Preferably, in the present embodiment, the material of the adhesive layer 7 is a pressure-sensitive adhesive, which is a kind of adhesive having sensitivity to pressure, and the peeling force of the general pressure-sensitive adhesive (the peeling force after the adhesive tape is pressed and adhered to the adhered surface) < the cohesive force of the adhesive (the acting force between the pressure-sensitive adhesive molecules) < the adhesive base force of the adhesive (the adhesive force between the adhesive and the base material), so that the pressure-sensitive adhesive does not come unstuck during use. More preferably, the material of viscose layer 7 in this embodiment is OCA optical cement or OCR glue, and OCA optical cement or OCR glue all has strong viscidity, and the colour is transparent to when reinforcing the adhesion between display device layer 2 and the encapsulated layer 3, make the luminous performance on display device layer 2 that is located viscose layer 7 below can not receive the influence of 7 rete colours of viscose layer, thereby improved display panel 100's display effect. It should be understood that the material of the adhesive layer 7 is not limited in this embodiment, and other adhesives capable of adhering the display device layer 2 and the encapsulation layer 3 are within the scope of the present embodiment. It is to be understood that the adhesive layer 7 in this embodiment is a patterned adhesive layer, and preferably, the patterned adhesive layer has the same shape as the display device layer 2. In this way, the production cost of the display panel 11 can be reduced while the display device layer 2 and the encapsulation layer 3 are firmly bonded.
Preferably, the second substrate 4 in this embodiment is a patterned substrate, and the shape of the patterned substrate is the same as that of the touch sensor 5. Through the arrangement of the structure, the second substrate 4 can be patterned firstly in the preparation process of the display panel 100, and then the metal film is directly plated on the patterned substrate to form the touch sensor 5, so that the preparation method of the display panel 100 is diversified, and the preparation process is more flexible.
A second embodiment of the present invention relates to a method for manufacturing a display panel, and a specific flow of the present embodiment is shown in fig. 2, including:
s201: a display device layer is formed on the first substrate.
Regarding step S201, specifically, before forming the display device layer 2 on the first substrate 1, the method further includes: the TFT layer 6 is formed on the first substrate 1, and in this embodiment, the TFT layer 6 may be formed on the first substrate 1 by a photolithography technique, which is as follows: 1. plating a metal film on the first substrate 1; 2. coating a layer of photoresist on the surface of the metal film; 3. exposing and developing the photoresist to obtain a patterned photoresist; 4. the exposed metal film (i.e., the metal film without the photoresist thereon) is etched, which may be wet etching or dry etching, and then the patterned photoresist layer is removed after etching, so as to obtain the TFT layer 6.
Note that the display device layer 2 includes a planarization layer, a pixel defining layer, an organic light emitting layer, a cathode, and an anode. The planarization layer may be an organic layer formed of acryl, Polyimide (PI), benzocyclobutene (BCB), or the like. The anode may be formed of an indium tin oxide transparent conductive film and may include other various functional layers, such as at least one of a Hole Injection Layer (HIL), a Hole Transport Layer (HTL), an Electron Transport Layer (ETL), and an Electron Injection Layer (EIL). The cathode is a transparent electrode, and a film layer formed of a compound such as lithium (Li), calcium (Ca), lithium fluoride/calcium (LiF/Ca), lithium fluoride/aluminum (LiF/Al), aluminum (Al), magnesium (Mg), or a combination thereof.
S202: an encapsulation layer is formed on the second substrate.
In step S202, specifically, in this embodiment, the encapsulation layer 3 may be formed by a coating method such as CVD (chemical vapor deposition) or sputtering, and the encapsulation layer 3 plays a role of isolating water and oxygen, and can effectively prevent air from contacting the display device layer 2.
S203: and forming a touch sensor on one side of the second substrate far away from the packaging layer.
In step S203, specifically, the second substrate includes two opposite sides, the encapsulation layer 3 is disposed on one side of the second substrate, and the touch sensor 5 is disposed on the other side of the second substrate, that is, the touch sensor 5 and the encapsulation layer 3 are disposed on different sides of the second substrate 4. In addition, the touch sensor 5 may be formed on the second substrate 4 by a photolithography technique in the embodiment as follows: 1. plating a metal film on the second substrate 4; 2. coating a layer of photoresist on the surface of the metal film; 3. exposing and developing the photoresist to obtain a patterned photoresist; 4. and etching the exposed metal film (i.e. the metal film without the photoresist thereon), which can be wet etching or dry etching, and removing the patterned photoresist layer after etching to obtain the touch sensor 5.
S204: an encapsulation layer is disposed on the display device layer.
Compared with the prior art, the second substrate 4 is arranged between the packaging layer 3 and the touch sensor 5, the first substrate 1 and the second substrate 4 are both made of flexible materials, the packaging layer 3 is usually made of rigid materials, and the touch sensor 5 is also made of rigid materials, so that the packaging layer 3 cannot be directly contacted with the touch sensor 5, the situation that the touch sensor 5 is easily damaged if the packaging layer 3 made of rigid materials is directly contacted with the touch sensor 5 made of rigid materials when the display panel 100 is bent is avoided, the touch sensor 5 is not easily damaged due to the contact with the second substrate 4 made of flexible materials when the display panel 100 is bent, and the reliability of the display panel 100 is improved; on the other hand, the encapsulation layer 3 in the prior art is a laminated structure of an inorganic film layer/an organic film layer, and when the encapsulation layer 3 is disposed on the second substrate 4, the second substrate 4 can be used as the organic film layer of the encapsulation layer 3, that is, the encapsulation layer 3 in the present embodiment is a single-film structure of an inorganic film layer, so that the thickness of the encapsulation layer 3 is reduced and the encapsulation layer is easily bent. In addition, because first base plate 1 also is flexible material, thereby form symmetrical structure with second base plate 4, be favorable to balancing the stress that display panel 100 received when display panel 100 buckles, because the second base plate 4 of flexible material has additionally been set up promptly, make display panel 100's overall structure change, thereby can change the stress that each rete received when buckling of display panel 100, and then effectual each rete of avoiding display panel 100 damages because of receiving great stress at display panel 100's the in-process of buckling, display panel 100's bending capability has been improved.
A third embodiment of the present invention relates to a method for manufacturing a display panel 100, which is further improved from the second embodiment, and the method is specifically improved in that before the disposing the encapsulation layer 3 on the display device layer 2, the method further includes: coating adhesive on the packaging layer 3; the disposing the encapsulation layer 3 on the display device layer 2 specifically includes: the encapsulation layer 3 is bonded to the display device layer 2 by means of glue. By the method, the adhesion between the packaging layer 3 and the display device layer 2 is increased, and the display device layer 2 is prevented from falling off when the display panel 100 is bent, so that the bending capability of the display panel 100 is further improved.
As shown in fig. 3, a specific flow of the present embodiment includes:
s301: a display device layer is formed on the first substrate.
S302: an encapsulation layer is formed on the second substrate.
S303: and forming a touch sensor on one side of the second substrate far away from the packaging layer.
Steps S301 to S303 of the present embodiment are similar to steps S201 to S203 of the second embodiment, and are not repeated herein to avoid repetition.
S304: and coating adhesive on the packaging layer.
As to step S304, specifically, the adhesive may be applied on the encapsulation layer 3 by spin coating or slit coating. Spin coating is a short name for spin coating, is a commonly used preparation method in organic light emitting diodes, and is mainly provided with a spin coater. The spin coating method includes: the method comprises three steps of material preparation, high-speed rotation and film volatilization, wherein the thickness of a formed film is controlled by controlling the glue homogenizing time, the rotating speed, the dropping amount, the concentration and the viscosity of a used solution, and the main advantages of spin coating are that a coating with high density is easy to obtain and the thickness of the coating is relatively uniform; the slit coating technology is short for slit die coating technology, and has the advantages of high coating uniformity, wide applicable coating viscosity range, high coating speed and suitability for large-area coating.
S305: the encapsulation layer is bonded to the display device layer by glue.
Compared with the prior art, the second substrate 4 is arranged between the packaging layer 3 and the touch sensor 5, the first substrate 1 and the second substrate 4 are both made of flexible materials, the packaging layer 3 is usually made of rigid materials, and the touch sensor 5 is also made of rigid materials, so that the packaging layer 3 cannot be directly contacted with the touch sensor 5, the situation that the touch sensor 5 is easily damaged if the packaging layer 3 made of rigid materials is directly contacted with the touch sensor 5 made of rigid materials when the display panel 100 is bent is avoided, the touch sensor 5 is not easily damaged due to the contact with the second substrate 4 made of flexible materials when the display panel 100 is bent, and the reliability of the display panel 100 is improved; on the other hand, the encapsulation layer 3 in the prior art is a laminated structure of an inorganic film layer/an organic film layer, and when the encapsulation layer 3 is disposed on the second substrate 4, the second substrate 4 can be used as the organic film layer of the encapsulation layer 3, that is, the encapsulation layer 3 in the present embodiment is a single-film structure of an inorganic film layer, so that the thickness of the encapsulation layer 3 becomes thin and the encapsulation layer is easy to bend. In addition, because first base plate 1 is also flexible material, thereby form symmetrical structure with second base plate 4, be favorable to the stress that balanced display panel 100 received when display panel 100 buckles, in other words, because the second base plate 4 of flexible material has additionally been set up, make display panel 100's overall structure change, thereby can change the stress that each rete received when buckling of display panel 100, and then effectual each rete of avoiding display panel 100 is because of receiving great stress and is damaged in display panel 100's the bending process, display panel 100's bending capability has been improved.
It will be understood by those of ordinary skill in the art that the foregoing embodiments are specific examples for carrying out the invention, and that various changes in form and details may be made therein without departing from the spirit and scope of the invention in practice.
Claims (10)
1. The display panel is characterized by comprising a first substrate, a display device layer, an encapsulation layer, a second substrate and a touch sensor which are sequentially stacked, wherein the first substrate and the second substrate are made of flexible materials.
2. The display panel according to claim 1, wherein the first substrate is made of the same material as the second substrate.
3. The display panel according to claim 1 or 2, wherein the material of the second substrate is one of CPI, PEN, PET, COP or TAC.
4. The display panel according to any one of claims 1 to 3, wherein the first substrate has a thickness of 5 to 20 μm.
5. The display panel according to any one of claims 1 to 3, wherein the second substrate has a thickness of 5 to 50 micrometers.
6. The display panel of claim 1, further comprising an adhesive layer disposed between the display device layer and the encapsulation layer, preferably wherein the adhesive layer is a patterned adhesive layer.
7. The display panel of claim 6, wherein the adhesive layer is made of OCA (optically clear adhesive) or OCR (optical clear adhesive).
8. The display panel according to any one of claims 1 to 3, wherein the second substrate is a patterned substrate, and a shape of the patterned substrate is the same as a shape of the touch sensor.
9. A method for manufacturing a display panel, comprising:
forming a display device layer on a first substrate;
forming an encapsulation layer on the second substrate;
forming a touch sensor on one side of the second substrate far away from the packaging layer;
and arranging the packaging layer on the display device layer, wherein the first substrate and the second substrate are both made of flexible materials.
10. The method for manufacturing a display panel according to claim 9, further comprising, before the disposing the encapsulation layer on the display device layer:
coating adhesive on the packaging layer;
the disposing the encapsulation layer on the display device layer specifically includes:
and bonding the packaging layer on the display device layer through glue.
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| CN201910817560.9A CN110635063A (en) | 2019-08-30 | 2019-08-30 | Display panel and preparation method thereof |
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| CN201910817560.9A CN110635063A (en) | 2019-08-30 | 2019-08-30 | Display panel and preparation method thereof |
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