CN106784361A - A kind of luminescent device and preparation method thereof - Google Patents
A kind of luminescent device and preparation method thereof Download PDFInfo
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- CN106784361A CN106784361A CN201710076055.4A CN201710076055A CN106784361A CN 106784361 A CN106784361 A CN 106784361A CN 201710076055 A CN201710076055 A CN 201710076055A CN 106784361 A CN106784361 A CN 106784361A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/302—Details of OLEDs of OLED structures
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
The embodiment of the present application provides a kind of luminescent device and preparation method thereof, the particulate contaminant produced in manufacturing process with reducing luminescent device produces bad probability in encapsulation to luminescent layer group, improve device performance and the life-span of luminescent device, make luminescent device that there is more smooth fine and close encapsulated layer, with more preferable packaging effect.The luminescent device that the embodiment of the present application is provided, including：First substrate, it is arranged on the luminescent layer group above the first substrate, it is arranged on the encapsulated layer above the luminescent layer group, it is arranged on the second substrate above the encapsulated layer, wherein, the encapsulated layer includes the first conductive layer, the second conductive layer and the inorganic and/or organic packages film layer being arranged between first conductive layer and second conductive layer.
Description
Technical field
The application is related to display field, more particularly to a kind of luminescent device and preparation method thereof.
Background technology
Current light-emitting display device mainly includes liquid crystal display (Liquid Crystal Display, LCD), You Jifa
Optical diode shows that (Organic Light-Emitting Diode, OLED), plasma show (Plasma Display
Panel, PDP) and electric ink show etc. various.Wherein, LCD liquid crystal displays, with long lifespan, light efficiency is high, radiation is low, work(
The characteristics of consuming low, gradually instead of traditional radiographic tube display apparatus and forms for the main product in display device in recent years.
OLED display then so that its is frivolous, actively luminous, fast-response speed, wide viewing angle, rich color and high brightness, low-power consumption, resistance to height
The many merits such as low temperature and be known as being the third generation Display Technique after LCD display by industry, can be widely applied to intelligence
The end products such as energy mobile phone, panel computer, TV.
Existing luminescent device, can form particulate contaminant in manufacturing process, and this kind of particulate contaminant can be follow-up
Production process in, make first/second substrate package press when, can cause luminescent device luminescent layer or other functional layers produce
It is bad, finally influence device performance and its life-span of luminescent device.
The content of the invention
The embodiment of the present application provides a kind of luminescent device and preparation method thereof, is produced in manufacturing process with reducing luminescent device
Raw particulate contaminant produces bad probability in encapsulation to luminescent layer group, improves device performance and the longevity of luminescent device
Life.
The luminescent device that the embodiment of the present application is provided, with more smooth fine and close encapsulated layer, with preferably encapsulation effect
Really.
The embodiment of the present application provides a kind of luminescent device, including：First substrate, is arranged on the hair above the first substrate
Photosphere group, is arranged on the encapsulated layer above the luminescent layer group, is arranged on the second substrate above the encapsulated layer, wherein,
The encapsulated layer includes the first conductive layer, the second conductive layer and is arranged at first conductive layer and described the
Inorganic and/or organic packages film layer between two conductive layers.
Preferably, first conductive layer is provided with the first extraction electrode, and second conductive layer is provided with the second extraction
Electrode.
Preferably, second conductive layer is located at the top of first conductive layer, and the encapsulated layer also includes：Positioned at institute
State the cushion between the first conductive layer and the luminescent layer group.
Preferably, the luminescent device also includes：It is arranged on the adhesion layer between the second substrate and the encapsulated layer.
Preferably, the luminescent layer group is specifically included：Anode layer, is arranged on the organic layer above the anode layer, and
It is arranged on the cathode layer above the organic layer.
Preferably, the material of first conductive layer and second conductive layer is Graphene.
Preferably, the material of the organic packages film layer between first conductive layer and second conductive layer is HMDSO
Or SiCN.
The embodiment of the present application also provides a kind of preparation method of luminescent device, including：
Luminescent layer group is formed on the first substrate, and encapsulated layer is formed in the top of the luminescent layer group, wherein, the encapsulation
Layer includes the first conductive layer, the second conductive layer and the nothing being formed between first conductive layer and second conductive layer
Machine and/or organic packages film layer；
Apply the predeterminated voltage of preset duration between first conductive layer and second layer conduction；
Press to form second substrate in the top of the encapsulated layer.
Preferably, second conductive layer is located at the top of first conductive layer, and the encapsulated layer also includes：Positioned at institute
State the cushion between the first conductive layer and the luminescent layer group；
The top in the luminescent layer group forms encapsulated layer, specifically includes：
Cushion is formed in the top of the luminescent layer group；
The first conductive layer is formed on the cushion；
Inorganic and/or organic packages film layer is formed on first conductive layer；
The second conductive layer is formed in described inorganic and/or organic packages film layer top.
Preferably, pressed before forming second substrate in the top of the encapsulated layer, the preparation method also includes：
Adhesion layer is attached on the second substrate.
The embodiment of the present application has the beneficial effect that：Encapsulated layer is set by luminescent layer group, the encapsulated layer includes the
One conductive layer, the second conductive layer and the inorganic and/or organic packages film being arranged between the first conductive layer and the second conductive layer
Layer, the encapsulation effect can with existing inorganic/organic/inorganic laminated packaging structure, also, by second substrate and first
When substrate is pressed, by the first conductive layer and the second conductive layer applied voltage, and then can be by the particulate matter of encapsulated layer
Impurity is burnt, and the particulate contaminant for reducing luminescent device is bad to luminescent layer group and the generation of other functional layers in encapsulation
Probability, improves device performance and the life-span of luminescent device；Meanwhile, the larger current that the first conductive layer and the second conductive layer are produced
Also the inorganic and/or more smooth densification of organic packages film layer of centre can be made, with more preferable packaging effect.
Brief description of the drawings
A kind of structural representation of luminescent device that Fig. 1 is provided for the embodiment of the present application；
The knot of the luminescent device for being provided with the first extraction electrode and the second extraction electrode that Fig. 2 is provided for the embodiment of the present application
Structure schematic diagram；
The luminescent device for being provided with the first extraction electrode and the second extraction electrode that Fig. 3 is provided for the embodiment of the present application is bowed
Depending on structural representation；
The luminescent device that inorganic encapsulated film layer is provided with below the first conductive layer that Fig. 4 the embodiment of the present application is provided
Structural representation；
The structural representation of the luminescent device for being provided with adhesion layer that Fig. 5 is provided for the embodiment of the present application；
A kind of structural representation of luminescent device with specific luminescent layer group that Fig. 6 is provided for the embodiment of the present application；
A kind of preparation method flow chart of luminescent device that Fig. 7 is provided for the embodiment of the present application；
Fig. 8 be the embodiment of the present application in, first substrate top formed anode layer structural representation；
During Fig. 9 is the embodiment of the present application, the structural representation of organic layer and cathode layer is formed in the top of anode layer；
Figure 10 be the embodiment of the present application in, cathode layer top formed cushion structural representation；
Figure 11 be the embodiment of the present application in, cushion top formed the first conductive layer structural representation；
Figure 12 be the embodiment of the present application in, the first conductive layer top formed encapsulation film layer structural representation；
Figure 13 be the embodiment of the present application in, organic packages film layer top formed the second conductive layer structural representation；
Figure 14 be the embodiment of the present application in, the second conductive layer top formed second substrate structural representation.
Specific embodiment
The implementation process of the embodiment of the present invention is described in detail with reference to Figure of description.It should be noted that
Same or similar label represents same or similar element or the element with same or like function from start to finish.Lead to below
It is exemplary to cross the embodiment being described with reference to the drawings, and is only used for explaining the present invention, and is not considered as limiting the invention.
Referring to Fig. 1, the embodiment of the present application provides a kind of luminescent device, including：First substrate 1, is set on first substrate 1
The luminescent layer group 2 of side, is arranged on the encapsulated layer 3 of the top of luminescent layer group 2, is arranged on the second substrate 4 of the top of encapsulated layer 3, wherein,
Encapsulated layer 3 includes the first conductive layer 31, the second conductive layer 33 and is arranged between the first conductive layer 31 and the second conductive layer 33
Inorganic and/or organic packages film layer, specifically, could be arranged to organic envelope between the first conductive layer 31 and the second conductive layer 33
Dress film layer 32.
The luminescent device that the embodiment of the present application is provided, by setting encapsulated layer 3 in luminescent layer group 2, the encapsulated layer 3 includes
First conductive layer 31, the second conductive layer 33 and be arranged at inorganic between the first conductive layer 31 and the second conductive layer 33 and/or
Organic packages film layer, this kind of encapsulation layer structure has encapsulation effect, also, is pressed by second substrate 4 and first substrate 1
When, by the first conductive layer 31 and the applied voltage of the second conductive layer 33, and then the particulate contaminant of encapsulated layer can be carried out
Burn, the particulate contaminant for reducing luminescent device produces bad probability in encapsulation to luminescent layer group and other functional layers, carries
The device performance of luminescent device high and life-span；Meanwhile, the larger current that the first conductive layer 31 and the second conductive layer 33 are produced
The inorganic and/or more smooth densification of organic packages film layer of centre can be made, with more preferable packaging effect.
It should be noted that Fig. 1 be it is that the top for being located at the first conductive layer 31 with the second conductive layer 33 is carried out for example,
In the specific implementation, or the first conductive layer 31 is located at the top of the second conductive layer 33, it is not limited herein.In addition, this
The luminescent device that application embodiment is provided is specifically as follows organic electroluminescence device, or liquid crystal display device, also may be used
Think that other include the luminescent device of encapsulation film layer.It is liquid crystal display device for luminescent device, its luminescent layer group can include
Backlight module and liquid crystal cell.
When in liquid crystal display device using the encapsulating structure of the present embodiment, can according to actual needs in liquid crystal cell CELL
After technique, encapsulated layer is disposed between upper cover plate and the color membrane substrates of liquid crystal cell；Can also be will in liquid crystal cell CELL techniques
Encapsulated layer adheres to color membrane substrates lower surface；Meanwhile, easily there are other ranks of particulate contaminant also dependent in Liquid crystal production
Section and position use encapsulated layer.
The embodiment of the present application is illustrated by organic electroluminescence device of luminescent device below.
In the embodiment of the present application, the first conductive layer 31 and the second conductive layer 33 are in first substrate 1 and the pressure of second substrate 4
During conjunction, as the conductive electrode being powered up to other film layers between the first conductive layer 31 and the second conductive layer 33, together
When, the first conductive layer 31 and the second conductive layer 33 in the embodiment of the present application also serve as its of the encapsulated layer 3 of organic luminescent device
Middle two-layer encapsulates film layer, i.e. the first conductive layer 31 and the second conductive layer 33 specially can simultaneously have encapsulation effect and lead
The film layer of electro ultrafiltration.The material of the first conductive layer 31 and the second conductive layer 33 can be with identical, it is also possible to different.
Specifically, the material of the first conductive layer 31 and the second conductive layer 33 is graphene film, it has excellent conduction, leads
Heat and high transmittance.For other film layers between the first conductive layer 31 and the second conductive layer 33, it can be existing skill
The art encapsulation film layer conventional in encapsulation, is specifically as follows inorganic encapsulated film layer, or organic packages film layer, or,
It can be the laminated packaging structure film layer of inorganic and organic superposition.Preferably, if the first conductive layer 31 and the second conductive layer 33 it
Between be the organic packages film layer of individual layer, the material of the organic packages film layer is HMDSO or SiCN, to particulate contaminant planarization and
Covering property is good.For first substrate and the material of second substrate, it is specifically as follows glass, quartzy and various flexible liners
Bottom.
Referring to Fig. 2 and Fig. 3, in being improved at one of the embodiment of the present application, the first conductive layer 31 is provided with conductive with first
First extraction electrode 310 of the electrical connection of layer 31, the second conductive layer 33 is provided with the second extraction electrically connected with the second conductive layer 33
Electrode 330.In the specific implementation, the first extraction electrode 310 and the second extraction electrode 330 are for convenience of the connection being connected with external circuit
Part, the first extraction electrode 310 is specifically as follows the main part by the first conductive layer 31 along flat where the first conductive layer 31
The first extension for extending outwardly out, the second extraction electrode 330 is specifically as follows by the main part edge of the second conductive layer 33
The second extension that plane where second conductive layer 33 is extended outward, the material of the first extraction electrode 310 is conductive with first
The material of layer 31 is identical, and the material of the second extraction electrode 330 is identical with the material of the second conductive layer 33.
As shown in figure 3, the orthographic projection on first substrate 1 of the first extraction electrode 310 and the second extraction electrode 330 are first
Orthographic projection on substrate 1 is not overlapped, i.e. when the first extraction electrode 310 and the second extraction electrode 330 is set, it is necessary to make first
Extraction electrode 310 is shifted to install with the second extraction electrode 330, so that the two easily can be attached with external circuit.
Preferably, referring to Fig. 4, the second conductive layer 33 is located at the top of the first conductive layer 31, and encapsulated layer 3 also includes：It is located at
The cushion 34 set between first conductive layer 31 and luminescent layer group 2.In the embodiment of the present application, by setting cushion 34, can
To avoid leading during directly contact between the first electric layer 31 and luminescent layer group 2, the larger voltage for burning particulate contaminant can be to hair
The film of photosphere group 2 is impacted.
Preferably, the material of cushion 34 is the strong inorganic thin films of water preventing ability such as SiNx, AlOx or SiO or uses this area
Existing other OLED cushion materials.
Referring to Fig. 5, in the further improvement of the embodiment of the present application, luminescent device also includes：Be arranged on second substrate 4 with
Adhesion layer 5 between encapsulated layer 3.For the adhesion layer 5 that the embodiment of the present application is provided, it is mainly used in adhering to two substrates, and
With the oxygen function that blocks water, luminescent layer group can be effectively protected.It is specifically as follows UV curing types, thermohardening type or pressure sensitive
Material, or wherein combination, for example, can also be mating type, pressure-sensitive solidification and the heat cure combination of UV solidifications and heat cure
Type or the mating type of pressure-sensitive solidification and UV solidifications.After first substrate is fitted with second substrate, consolidated by adhesion layer
Change operation, and then complete the making of final display device.The specific material of adhesion layer, for example, can be epoxies polyphosphazene polymer
Compound.
Luminescent layer group used in the embodiment of the present application, referring to Fig. 6, there is provided one implements.Luminescent layer group 2 is specific
Including：Anode layer 21, is arranged on the organic layer 22 of the top of anode layer 21, and the cathode layer 23 for being arranged on the top of organic layer 22.
In the specific implementation, if organic luminescent device is the organic elctroluminescent device driven using thin film transistor (TFT), this Shen
Please the anode layer of embodiment can specifically include tft layer and pixel electrode layer, thin film transistor (TFT) be specifically as follows LTPS
Thin film transistor (TFT), or a-Si thin film transistor (TFT)s, or oxide thin film transistor, pixel electrode layer specifically can be with
It is ito thin film layer.
Referring to Fig. 7, also a kind of preparation method of luminescent device of the embodiment of the present application, including：
Step 101, on the first substrate formation luminescent layer group, encapsulated layer is formed in the top of luminescent layer group, wherein, encapsulation
Layer includes the first conductive layer, the second conductive layer and is formed at inorganic between the first conductive layer and the second conductive layer and/or has
Machine encapsulates film layer.
Preferably, before forming encapsulated layer in luminescent layer group, preparation method also includes：Form inorganic in luminescent layer group
Thinner package film layer, accordingly, encapsulated layer is formed in the top of luminescent layer group, is specifically included：
Cushion is formed in the top of luminescent layer group；
The first conductive layer is formed on the buffer layer；
Inorganic and/or organic packages film layer is formed on the first conductive layer；
The second conductive layer is formed in inorganic and/or organic packages film layer top.
Step 102, between the first conductive layer and the second layer apply preset duration predeterminated voltage.
It should be noted that on preset duration and predeterminated voltage, it can in the specific implementation, according to particulate contaminant
Material and the amount of particulate matter properly chosen, at least the particulate contaminant of encapsulated layer can be burnt,
This is not limited.
Step 103, press to form second substrate in the top of encapsulated layer.
Preferably, pressed before forming second substrate in the top of encapsulated layer, preparation method also includes：On second substrate
Adhesion layer is attached, so that second substrate with first substrate when pressing, can be bonded by the adhesion layer and first substrate.
For the adhesion layer that the embodiment of the present application is provided, it is mainly used in adhering to two substrates, and with the oxygen function, Neng Gouyou of blocking water
The protection luminescent layer group of effect.It is specifically as follows UV curing types, thermohardening type or pressure sensitive material, or wherein combination,
For example, can also be mating type, pressure-sensitive solidification and heat cure mating type or pressure-sensitive solidification and the UV solidifications of UV solidifications and heat cure
Mating type.After first substrate is fitted with second substrate, by carrying out curing operation to adhesion layer, and then final display is completed
The making of device.The specific material of adhesion layer, for example, can be epoxies high molecular polymer.
In order to be illustrated to the preparation method of luminescent device that the application is provided in more detail, below in conjunction with accompanying drawing 8 to
The preparation method of the luminescent device that accompanying drawing 13 is provided the embodiment of the present application carries out as described below：
Step one, makes anode layer 21 on first substrate 1.The anode layer 21 specifically can include tft layer with
And ITO pixel electrode layer (not shown)s.Thin film transistor (TFT) is specifically as follows LTPS thin film transistor (TFT)s, or a-Si is thin
Film transistor, or oxide thin film transistor.The structural representation after anode layer 21 is formed on first substrate 1 as schemed
Shown in 8.
Step 2, small molecule organic layer 22 is formed in the top of anode layer 21 by evaporation process, and in organic layer 22
Top forms cathode layer 23.Or organic layer 22 can also be formed by Polymer Solution printing technology, certainly, it should be appreciated that
It is that the organic layer 22 is luminescent device is carried out luminous organic light emitting film.After forming organic layer 22 and cathode layer 23
Schematic diagram is as shown in Figure 9.
Step 3, optionally, buffering is formed in the top of cathode layer 23 by chemical vapour deposition technique or atom deposition method
Layer 34.Specific inorganic encapsulated film can be the strong inorganic thin films of water preventing ability such as SiNx, AlOx or SiO.Form cushion 34
Schematic diagram afterwards is as shown in Figure 10.
Step 4, the top of inorganic encapsulated film layer 34 by chemical vapour deposition technique formed the first conductive layer 31 and
The first extraction electrode 310 electrically connected with the first conductive layer 31, the schematic diagram formed after the first conductive layer 31 is as shown in figure 11.
Step 5, the top of the first conductive layer 31 by chemical vapour deposition technique or IJP printing types formed it is inorganic and/
Or organic packages film layer 32.Preferably, can be adopted as to particulate contaminant planarization and the good film layer of covering property HMDSO or
SiCN is used as organic packages film layer.The schematic diagram formed after inorganic and/or organic packages film layer 32 is as shown in figure 12.
Step 6, using the method identical or different with step 4 inorganic and/or organic packages film layer 32 upper square
Into the second conductive layer 33 and the second extraction electrode 330 electrically connected with the second conductive layer 33.After forming the second conductive layer 33
Schematic diagram is as shown in figure 13.
Step 7, attaches adhesion layer on second substrate.
Step 8, under nitrogen atmosphere, by the first extraction electrode 310 and the second conductive layer 33 to the first conductive layer 31
The second extraction electrode 330 apply preset duration predeterminated voltage so that can between the first conductive layer 31 and the second conductive layer 33
To produce larger transient current, the particulate contaminant between the first conductive layer 31 and the second conductive layer 33 is burnt, dropped
Particulate contaminant is several to weighing wounded for the organic layer of the luminescent layer group of luminescent device and tft layer in low follow-up bonding processes
Rate.
Step 9, the second base that formation is stained with adhesion layer 5 is pressed being formed with the first substrate 1 of the second conductive layer 33
Plate 4.The schematic diagram formed after second substrate 4 is as shown in figure 14.
The embodiment of the present application has the beneficial effect that：The luminescent device that the embodiment of the present application is provided, by luminescent layer group
Upper setting encapsulated layer, the encapsulated layer includes the first conductive layer, the second conductive layer and is arranged at the first conductive layer and the second conduction
Inorganic and/or organic packages film layer between layer, the encapsulation effect can with existing inorganic/organic/inorganic encapsulating structure,
Also, when second substrate and first substrate are pressed, by the first conductive layer and the second conductive layer applied voltage, entering
And the particulate contaminant of encapsulated layer can be burnt, improve display performance and the life-span of OLED display device；Meanwhile, the
The larger current that one conductive layer and the second conductive layer are produced can also make the inorganic and/or more smooth cause of organic packages film layer of centre
It is close, with more preferable packaging effect.
Obviously, those skilled in the art can carry out various changes and modification without deviating from essence of the invention to the present invention
God and scope.So, if these modifications of the invention and modification belong to the scope of the claims in the present invention and its equivalent technologies
Within, then the present invention is also intended to comprising these changes and modification.
Claims (10)
1. a kind of luminescent device, it is characterised in that including：First substrate, is arranged on the luminescent layer group above the first substrate,
The encapsulated layer above the luminescent layer group is arranged on, the second substrate above the encapsulated layer is arranged on, wherein,
The encapsulated layer includes the first conductive layer, the second conductive layer and is arranged at first conductive layer and described second and leads
Inorganic and/or organic packages film layer between electric layer.
2. luminescent device as claimed in claim 1, it is characterised in that first conductive layer is provided with the first extraction electrode,
Second conductive layer is provided with the second extraction electrode.
3. luminescent device as claimed in claim 1, it is characterised in that second conductive layer is located at first conductive layer
Top, the encapsulated layer also includes：Cushion between first conductive layer and the luminescent layer group.
4. luminescent device as claimed in claim 3, it is characterised in that the luminescent device also includes：It is arranged on described second
Adhesion layer between substrate and the encapsulated layer.
5. luminescent device as claimed in claim 1, it is characterised in that the luminescent layer group is specifically included：Anode layer, is arranged on
Organic layer above the anode layer, and it is arranged on the cathode layer above the organic layer.
6. luminescent device as claimed in claim 1, it is characterised in that the material of first conductive layer and second conductive layer
Matter is Graphene.
7. luminescent device as claimed in claim 1, it is characterised in that between first conductive layer and second conductive layer
Organic packages film layer material be HMDSO or SiCN.
8. a kind of preparation method of luminescent device, it is characterised in that the preparation method includes：
Luminescent layer group is formed on the first substrate, and encapsulated layer is formed in the top of the luminescent layer group, wherein, the encapsulated layer bag
Include the first conductive layer, the second conductive layer and be formed at inorganic between first conductive layer and second conductive layer and/
Or organic packages film layer；
Apply the predeterminated voltage of preset duration between first conductive layer and second conductive layer；
Press to form second substrate in the top of the encapsulated layer.
9. preparation method as claimed in claim 8, it is characterised in that second conductive layer is located at first conductive layer
Top, the encapsulated layer also includes：Cushion between first conductive layer and the luminescent layer group；
The top in the luminescent layer group forms encapsulated layer, specifically includes：
Cushion is formed in the top of the luminescent layer group；
The first conductive layer is formed on the cushion；
Inorganic and/or organic packages film layer is formed on first conductive layer；
The second conductive layer is formed in described inorganic and/or organic packages film layer top.
10. preparation method as claimed in claim 8, it is characterised in that press to form the second base in the top of the encapsulated layer
Before plate, the preparation method also includes：
Adhesion layer is attached on the second substrate.
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| CN110635063A (en) * | 2019-08-30 | 2019-12-31 | 昆山工研院新型平板显示技术中心有限公司 | Display panel and preparation method thereof |
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