KR20200001976A - 기판 가공 장치에서의 기판 위치 결정 기구 및 기판 위치 결정 방법 - Google Patents

기판 가공 장치에서의 기판 위치 결정 기구 및 기판 위치 결정 방법 Download PDF

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Publication number
KR20200001976A
KR20200001976A KR1020190059361A KR20190059361A KR20200001976A KR 20200001976 A KR20200001976 A KR 20200001976A KR 1020190059361 A KR1020190059361 A KR 1020190059361A KR 20190059361 A KR20190059361 A KR 20190059361A KR 20200001976 A KR20200001976 A KR 20200001976A
Authority
KR
South Korea
Prior art keywords
substrate
board
positioning
scribe
tilted
Prior art date
Application number
KR1020190059361A
Other languages
English (en)
Korean (ko)
Inventor
도시유키 사카이
도루 나루오
Original Assignee
미쓰보시 다이야몬도 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미쓰보시 다이야몬도 고교 가부시키가이샤 filed Critical 미쓰보시 다이야몬도 고교 가부시키가이샤
Publication of KR20200001976A publication Critical patent/KR20200001976A/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B28D5/0029—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rotating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/01—Means for holding or positioning work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/06—Arrangements for feeding or delivering work of other than sheet, web, or filamentary form
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/18—Means for removing cut-out material or waste
    • B26D7/1845—Means for removing cut-out material or waste by non mechanical means
    • B26D7/1854—Means for removing cut-out material or waste by non mechanical means by air under pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F3/00—Severing by means other than cutting; Apparatus therefor
    • B26F3/002—Precutting and tensioning or breaking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037—Controlling or regulating

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
KR1020190059361A 2018-06-28 2019-05-21 기판 가공 장치에서의 기판 위치 결정 기구 및 기판 위치 결정 방법 KR20200001976A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2018-123169 2018-06-28
JP2018123169A JP2020001965A (ja) 2018-06-28 2018-06-28 基板加工装置における基板位置決め機構及び基板位置決め方法

Publications (1)

Publication Number Publication Date
KR20200001976A true KR20200001976A (ko) 2020-01-07

Family

ID=69028631

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020190059361A KR20200001976A (ko) 2018-06-28 2019-05-21 기판 가공 장치에서의 기판 위치 결정 기구 및 기판 위치 결정 방법

Country Status (4)

Country Link
JP (1) JP2020001965A (zh)
KR (1) KR20200001976A (zh)
CN (1) CN110653956A (zh)
TW (1) TW202000615A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102457729B1 (ko) * 2022-07-23 2022-10-21 이경민 유리 가공장치

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011162395A (ja) 2010-02-09 2011-08-25 Mitsuboshi Diamond Industrial Co Ltd 基板加工装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011162395A (ja) 2010-02-09 2011-08-25 Mitsuboshi Diamond Industrial Co Ltd 基板加工装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102457729B1 (ko) * 2022-07-23 2022-10-21 이경민 유리 가공장치

Also Published As

Publication number Publication date
CN110653956A (zh) 2020-01-07
JP2020001965A (ja) 2020-01-09
TW202000615A (zh) 2020-01-01

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