KR20190132341A - 도전성 입자, 도전 재료 및 접속 구조체 - Google Patents

도전성 입자, 도전 재료 및 접속 구조체 Download PDF

Info

Publication number
KR20190132341A
KR20190132341A KR1020197007572A KR20197007572A KR20190132341A KR 20190132341 A KR20190132341 A KR 20190132341A KR 1020197007572 A KR1020197007572 A KR 1020197007572A KR 20197007572 A KR20197007572 A KR 20197007572A KR 20190132341 A KR20190132341 A KR 20190132341A
Authority
KR
South Korea
Prior art keywords
particle
electroconductive
electroconductive particle
value
less
Prior art date
Application number
KR1020197007572A
Other languages
English (en)
Korean (ko)
Inventor
유토 도바시
유우스케 고토우
야스유키 야마다
Original Assignee
세키스이가가쿠 고교가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 세키스이가가쿠 고교가부시키가이샤 filed Critical 세키스이가가쿠 고교가부시키가이샤
Publication of KR20190132341A publication Critical patent/KR20190132341A/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
    • C08K13/02—Organic and inorganic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/4827—Materials
    • H01L23/4828—Conductive organic material or pastes, e.g. conductive adhesives, inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Materials Engineering (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR1020197007572A 2017-03-30 2018-03-29 도전성 입자, 도전 재료 및 접속 구조체 KR20190132341A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2017-067415 2017-03-30
JP2017067415 2017-03-30
PCT/JP2018/013194 WO2018181694A1 (ja) 2017-03-30 2018-03-29 導電性粒子、導電材料及び接続構造体

Publications (1)

Publication Number Publication Date
KR20190132341A true KR20190132341A (ko) 2019-11-27

Family

ID=63676476

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020197007572A KR20190132341A (ko) 2017-03-30 2018-03-29 도전성 입자, 도전 재료 및 접속 구조체

Country Status (5)

Country Link
JP (1) JPWO2018181694A1 (ja)
KR (1) KR20190132341A (ja)
CN (1) CN109983543B (ja)
TW (1) TWI780137B (ja)
WO (1) WO2018181694A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019179647A (ja) 2018-03-30 2019-10-17 デクセリアルズ株式会社 導電材料、及び接続体の製造方法
JP2021178913A (ja) * 2020-05-13 2021-11-18 昭和電工マテリアルズ株式会社 導電性接着剤、回路接続構造体の製造方法及び回路接続構造体
WO2023145664A1 (ja) * 2022-01-27 2023-08-03 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013073919A (ja) 2011-09-29 2013-04-22 Nippon Shokubai Co Ltd 導電性微粒子
JP2014080484A (ja) 2012-10-15 2014-05-08 Hitachi Chemical Co Ltd 架橋ポリマー粒子、導電性粒子、異方性導電材料及び回路部材の接続構造体

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4962706B2 (ja) * 2006-09-29 2012-06-27 日本化学工業株式会社 導電性粒子およびその製造方法
KR101469004B1 (ko) * 2010-08-11 2014-12-04 가부시기가이샤 닛뽕쇼꾸바이 중합체 미립자, 도전성 미립자 및 이방성 도전재료
WO2012102199A1 (ja) * 2011-01-25 2012-08-02 株式会社日本触媒 導電性微粒子、樹脂粒子及びそれを用いた異方性導電材料
JP2013004202A (ja) * 2011-06-13 2013-01-07 Sekisui Chem Co Ltd 異方性導電材料及び接続構造体
WO2013021895A1 (ja) * 2011-08-05 2013-02-14 積水化学工業株式会社 導電材料及び接続構造体
KR101716945B1 (ko) * 2012-08-24 2017-03-15 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름 및 그의 제조 방법
WO2014088095A1 (ja) * 2012-12-06 2014-06-12 積水化学工業株式会社 導電材料、接続構造体及び接続構造体の製造方法
JP6212366B2 (ja) * 2013-08-09 2017-10-11 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
KR102401753B1 (ko) * 2014-05-12 2022-05-26 세키스이가가쿠 고교가부시키가이샤 도전성 입자, 도전 재료 및 접속 구조체
JP6739988B2 (ja) * 2015-04-30 2020-08-12 積水化学工業株式会社 基材粒子、基材粒子の製造方法、導電性粒子、導電材料及び接続構造体

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013073919A (ja) 2011-09-29 2013-04-22 Nippon Shokubai Co Ltd 導電性微粒子
JP2014080484A (ja) 2012-10-15 2014-05-08 Hitachi Chemical Co Ltd 架橋ポリマー粒子、導電性粒子、異方性導電材料及び回路部材の接続構造体

Also Published As

Publication number Publication date
TWI780137B (zh) 2022-10-11
CN109983543A (zh) 2019-07-05
CN109983543B (zh) 2021-07-02
WO2018181694A1 (ja) 2018-10-04
JPWO2018181694A1 (ja) 2020-02-06
TW201841170A (zh) 2018-11-16

Similar Documents

Publication Publication Date Title
KR101942602B1 (ko) 도전성 입자, 도전 재료 및 접속 구조체
WO2015037711A1 (ja) 導電性粒子、導電材料及び接続構造体
JP2017069191A (ja) 導電性粒子、導電材料及び接続構造体
KR20190132341A (ko) 도전성 입자, 도전 재료 및 접속 구조체
JP2021036525A (ja) 基材粒子、導電性粒子、導電材料及び接続構造体
JP7335687B2 (ja) 基材粒子、導電性粒子、導電材料及び接続構造体
JPWO2020175691A1 (ja) 導電性粒子、導電材料及び接続構造体
JP7381547B2 (ja) 導電性粒子、導電材料及び接続構造体
JP7144472B2 (ja) 導電性粒子、導電材料及び接続構造体
WO2017051872A1 (ja) 接続構造体の製造方法、導電性粒子、導電フィルム及び接続構造体
JP2017063033A (ja) 導電性粒子、導電フィルム、接続構造体及び接続構造体の製造方法
JP2018137225A (ja) 導電性粒子、導電材料及び接続構造体
JP5996806B2 (ja) 導電性粒子、導電材料及び接続構造体
WO2021182617A1 (ja) 導電性粒子、導電材料及び接続構造体
TWI768068B (zh) 導電性粒子、導電性粒子之製造方法、導電材料及連接構造體
WO2024034386A1 (ja) 導電性粒子、導電材料及び接続構造体
JP6798771B2 (ja) 導電性粒子の製造方法、導電材料の製造方法及び接続構造体の製造方法
JP2020145206A (ja) 導電性粒子、導電材料及び接続構造体
JPWO2020009238A1 (ja) 絶縁性粒子付き導電性粒子、導電材料及び接続構造体

Legal Events

Date Code Title Description
E902 Notification of reason for refusal
E90F Notification of reason for final refusal
E601 Decision to refuse application